JPH11219836A - Adjustment method of inductance component - Google Patents

Abstract

An object of the present invention is to provide an inductance adjusting method capable of easily performing coarse adjustment and / or fine adjustment of an inductance component of an inductor conductor film. A U-shaped strip conductor film having one end connected to a ground potential and the other end connected to a signal potential is formed on a dielectric substrate, and the U-shaped strip is formed. Trimming grooves 21 and 22 for reducing the conductor width at the end on a straight line x crossing the vicinity of both ends of the conductor film 2
Is formed to adjust the inductor component.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for adjusting an inductance component of an inductor conductor film for deriving a predetermined inductance component such as a strip line or a microstrip line.

[0002]

2. Description of the Related Art Generally, an oscillation circuit for mobile communication equipment, such as a cellular phone, is a voltage controlled oscillation circuit combining a resonance circuit section using a microstrip line, a negative resistance circuit section and an amplification circuit section. Is widely used.

FIG. 3 is a circuit example of a voltage controlled oscillator circuit.

The voltage-controlled oscillation circuit includes a resonance circuit A including a resonance element R, a negative resistance circuit section B including active elements, and an amplification circuit C.

The resonance circuit section A includes a resonance element R such as a microstrip line (inductor conductor film) and a varicap diode C whose capacitance changes according to a control voltage.
V, a capacitor C ₃ for determining a variable range of the oscillation frequency, a clap capacitor C ₅ , a microstrip line L _1, and the like.

[0006] The first transistor to Q ₁ negative resistance circuit portion B is primarily for oscillation consists like bypass capacitor C _9, the first transistor Q ₁ is the bypass capacitor C ₉
The collector is grounded through. The amplification circuit section C mainly includes a second transistor Q ₂ for amplification, a bypass capacitor C ₈ , a microstrip line L _{2, and the} like. The second transistor Q ₂ for amplification is a bypass capacitor C ₈
The base is grounded through.

A signal of a predetermined frequency amplified by the _second amplification transistor Q ₂ is derived from the collector of the second transistor Q ₂ .

In the above-mentioned oscillation circuit, the initial frequency is rarely adjusted to a design value due to the characteristic tolerance of each circuit component and the variation in the formation of the conductor film of the microstrip line.

Therefore, usually, a part of the microstrip line is usually trimmed to adjust the inductance component, thereby adjusting the initial oscillation frequency.

[0010]

However, when coarse adjustment and fine adjustment are performed on a microstrip line, a coarse adjustment stub or a fine adjustment stub is formed on the microstrip line, and coarse adjustment and fine adjustment are performed. A predetermined stub was cut as required for adjustment.

A method of directly forming a trimming groove in an inductor conductor film is also known. For example, a plurality of trimming grooves are provided depending on a predetermined position between a signal potential end and a ground potential end of the inductor conductor film. Although the grooves were formed, for example, when forming the trimming grooves in different portions, it was necessary to perform the trimming means a plurality of times, and the trimming operation was very difficult.

The present invention has been devised to solve the above-mentioned problem, and an object of the present invention is to provide an inductance adjusting method which can easily adjust an inductance component of an inductor conductor film.

[0013]

According to the present invention, a U-shaped inductor conductor film having one end connected to a ground potential and the other end connected to a signal potential is formed on a dielectric substrate. And a trimming groove for reducing the conductor width is formed on the same straight line connecting the vicinity of both ends.

The term "both ends of the inductor conductor film" means both ends of the portion where the inductor conductor film defines the inductor component, and the vicinity of both ends of the inductor conductor film defines the inductor component from both ends. This is an area closer to a part.

[0015]

According to the present invention, one end of the inductor conductor film is at the signal potential and the other end is at the ground potential. And both ends are U-shaped in the same direction.

Then, with such an inductor conductor film,
A trimming groove for adjusting the inductance component is formed on a straight line connecting both ends of the U-shaped inductor conductor film.

Therefore, by cutting a part of the signal potential side end (high impedance side) which is one end side of the inductor conductor film, a small change in inductance component occurs, and the other end portion of the inductor conductor film is cut off. By cutting off a part of a certain ground potential side end (low impedance side), a large change in inductance component becomes possible.

That is, in the adjustment of the inductance component, by selecting the end to be cut, the coarse adjustment and / or the fine adjustment of the inductance component can be performed.

In addition, since the formation positions of both trimming grooves are arranged on a straight line, in trimming the inductor conductor film, for example, laser scanning only needs to be performed once, and the inductance component can be quickly and easily adjusted. Can be adjusted.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for adjusting an inductance component according to the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view of an inductor conductor film to which the method of adjusting an inductance component according to the present invention is applied. For example, the inductor film is used for the resonance element of the resonance circuit section A shown in FIG.

In FIG. 1, reference numeral 1 denotes a dielectric substrate;
Is a U-shaped inductor conductor film, 3 is a ground potential side end, 4 is a signal potential side end, C ₄ is a parallel additional capacitance, and C ₅ is a clap capacitor.

The dielectric substrate 1 is a ceramic substrate having a predetermined dielectric constant such as alumina or barium titanate, or a glass-epoxy substrate, and a U-shaped inductor conductor film 2 made of Ag or Cu is formed on the surface thereof. It is formed by printing a paste, baking, etching a conductive film, or the like.

Although not shown, a ground conductor film is formed on the back surface of the dielectric substrate 1. Then, the ground potential side end 3 of the U-shaped inductor conductor film 2
Are connected to this ground potential via via-hole conductors or through-hole conductors penetrating through the thickness direction of the dielectric substrate 1.

On the surface of the dielectric substrate 1, a predetermined arrangement pattern connected to the signal potential side end 4 of the inductor conductor film 2 and an electrode pad for mounting a predetermined electronic component are formed.

Then, on the surface of the dielectric substrate 1, electronic components for achieving the predetermined circuit of FIG. 3 are mounted.

In particular, in the present invention, the parallel additional capacitance C
₄ is connected across the signal potential side end 3 and the ground potential side end ₄ of the inductor conductor film 2.

The parallel additional capacitor C ₄ is provided for a distributed constant type resonance circuit constituted by an inductance component of the inductor conductor film 2 itself and a capacitance component generated between the inductor conductor film 2 and the ground conductor film. , And capacitive components are connected in parallel.

This parallel additional capacitance C ₄ is for reducing the shape of the inductor conductor film 2. That is, there is a negative correlation between the resonance frequency in the distributed constant type resonance circuit portion and the inductor conductor film 2, and if the resonance frequency becomes higher,
The inductor conductor film 2 becomes shorter.

Therefore, when a small resonance circuit is to be formed, the inductor conductor film 2 may be shortened, but the resonance frequency becomes a value sufficiently higher than the design value. In this state, by connecting the parallel additional capacitor C _4, has a short inductor conductor film 2, to lower the high resonant frequency than the resonant frequency of a predetermined value, it can be controlled to a predetermined value.

According to the present invention, as described above, the trimming grooves 21 and 22 for adjusting the inductance component are formed on the U-shaped inductor conductor film 2 by the conductor portion 2A near the signal potential side end 3 and the ground potential side. Conductor portion 2B near end 4
Is formed in a portion on a straight line X penetrating through.

The trimming grooves 21 and 2 are made of YA
It is formed by scanning a part of the inductor conductor film 2 while irradiating a G laser or the like so as to reduce the conductor width. That is, the conductor film portion scanned while being irradiated is burned off. In addition, it is formed by mechanical deletion other than the irradiation of the YAG laser. As a result, trimming grooves 21 and 22 are formed.

The formation of the trimming groove 21 formed in the conductor portion 2B near the ground potential side end 4 of the U-shaped inductor conductor film 2 allows the U-shaped inductor conductor film 2 to be formed on the high impedance side of the inductor conductor film 2. Therefore, the amount of increase in the inductance component is relatively large, and the amount of decrease in the resonance frequency is relatively large.

On the other hand, the U-shaped inductor conductor film 2
By the formation of the trimming groove 22 formed in the conductor portion 2A close to the signal potential side end 3, the increase amount of the inductance component becomes relatively small, and the decrease fluctuation amount of the resonance frequency becomes relatively small.

That is, when coarse adjustment is performed to increase the inductance component of the inductor conductor film 2,
A trimming groove 21 may be formed in the conductor portion 2B near the ground potential side end 4 of the U-shaped inductor conductor film 2. In the case of fine adjustment, the U-shaped inductor conductor film 2
Trimming groove 2 in the conductor portion 2A near the signal potential side end 3
2 may be formed.

In addition, the trimming grooves 21 and 22 are formed on a straight line X connecting the conductor portion 2A near the signal potential side end 3 and the conductor portion 2B near the ground potential side end 4 of the U-shaped inductor conductor film 2. Therefore, for example, it can be formed by one scanning control of laser irradiation. For example, when performing trimming while monitoring the oscillation frequency, the adjustment can be performed very easily.

Moreover, the coarse adjustment and the fine adjustment of the inductance component can be selectively and very easily performed.

FIG. 2 shows that, as described above, the conductor portion 2A near the signal potential side end 3 and the conductor portion 2B near the ground potential side end 4B of the U-shaped inductor conductor film 2 have trimming grooves 21 of the same length. And FIG. 22 are characteristic diagrams showing the amount of frequency fluctuation when forming the data.

The characteristics shown in FIG. 2 are, for example, that the conductor width of the inductor conductor film 2 is 0.8 mm and the length of the entire conductor is 10.0 m.
m, the trimming grooves 21 and 22 are located 1.0 mm closer to the center from both ends 3 and 4 of the inductor conductor film 2.
Is formed at a length of 0.5 mm.

That is, as shown in FIG.
1 enables a maximum adjustment of −45 MHz and a coarse adjustment of 90 MHz / mm, and the formation of the trimming groove 22 allows a maximum of −15 MHz.
Adjustment of z is possible, and fine adjustment of 30 MHz / mm is possible.

[0041]

As described above, according to the present invention, a trimming groove is formed in a straight line connecting near both ends of a U-shaped inductor conductor film.

Thus, the coarse adjustment and / or the fine adjustment of the inductance component of the inductor conductor film can be performed, and the two trimming grooves are arranged in a straight line. The trimming means can be formed by one scan, and the adjustment can be performed quickly and easily.

[Brief description of the drawings]

FIG. 1 is a plan view of an inductor conductor film using an inductance component adjusting method of the present invention.

FIG. 2 is a characteristic diagram showing a change amount of a coarse adjustment and a fine adjustment in the inductance component adjusting method of the present invention.

FIG. 3 is a circuit diagram of a voltage-controlled oscillation circuit including an inductor conductor film in a resonance circuit unit.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Dielectric substrate 2 ... Inductor conductor film 3 ... Ground potential side end 4 ... Signal potential side end

Claims (1)

[Claims] 1. A U-shaped inductor conductor film having one end connected to a ground potential and the other end connected to a signal potential is formed on a dielectric substrate. A trimming groove for reducing a conductor width is formed on the same straight line connecting the vicinity of the part.