JPH11228261A - Material for heat sink and its production - Google Patents
Material for heat sink and its productionInfo
- Publication number
- JPH11228261A JPH11228261A JP3537898A JP3537898A JPH11228261A JP H11228261 A JPH11228261 A JP H11228261A JP 3537898 A JP3537898 A JP 3537898A JP 3537898 A JP3537898 A JP 3537898A JP H11228261 A JPH11228261 A JP H11228261A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- heat sink
- weight
- average particle
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 239000000843 powder Substances 0.000 claims abstract description 42
- 239000000919 ceramic Substances 0.000 claims abstract description 24
- 239000002131 composite material Substances 0.000 claims abstract description 22
- 239000002245 particle Substances 0.000 claims abstract description 18
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 13
- 239000000956 alloy Substances 0.000 claims abstract description 13
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000011230 binding agent Substances 0.000 claims abstract description 7
- 239000011159 matrix material Substances 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 239000011369 resultant mixture Substances 0.000 abstract 1
- 230000035939 shock Effects 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 14
- 229910000838 Al alloy Inorganic materials 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000005470 impregnation Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 238000007088 Archimedes method Methods 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacture Of Alloys Or Alloy Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ヒートシンク用材
料及びその製造方法に関し、特に金属−セラミックス複
合材料を用いたヒートシンク用材料及びその製造方法に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink material and a method of manufacturing the same, and more particularly, to a heat sink material using a metal-ceramic composite material and a method of manufacturing the same.
【０００２】[0002]
【従来の技術及び発明が解決しようとする課題】従来、
ヒートシンクに用いられる材料としては、Ｃｕあるいは
Ｃｕを主成分とする合金が主流であった。しかしなが
ら、この材料では、ヒートシンクと接合される部材にセ
ラミックスなどの低熱膨張の材料が使用されると、熱膨
張係数の大きなヒートシンクとの間でマッチングが悪く
なり、歪を発生するという問題があった。また、軽量化
を図るためにヒートシンクを薄板形状にすると、剛性が
不足し、たわみが発生することがあった。2. Description of the Related Art
As a material used for the heat sink, Cu or an alloy containing Cu as a main component was mainly used. However, in this material, when a material having a low thermal expansion such as ceramics is used for a member to be joined to the heat sink, there is a problem that matching between the heat sink and the heat sink having a large thermal expansion coefficient is deteriorated and distortion occurs. . Further, if the heat sink is made thin in order to reduce the weight, rigidity may be insufficient and bending may occur.
【０００３】そのため、熱膨張の小さいセラミックスが
ヒートシンクの材料として用いられるようになった。こ
の材料は、熱膨張が小さい上に剛性が高いので、歪は勿
論たわみの問題も発生しない。しかしながら、この材料
は脆性材料であるため衝撃に弱く、振動などが発生する
環境下にあっては破損することすらあった。For this reason, ceramics having a small thermal expansion have been used as a material for a heat sink. Since this material has a small thermal expansion and a high rigidity, there is no problem of distortion as well as deflection. However, since this material is a brittle material, it is vulnerable to impact, and may even be damaged in an environment where vibration or the like occurs.
【０００４】本発明は、上述したヒートシンク用材料が
有する課題に鑑みなされたものであって、その目的は、
歪、たわみは勿論衝撃にも強いヒートシンク用材料を提
供し、その製造方法をも提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the heat sink material, and has the following objects.
It is an object of the present invention to provide a heat sink material that is resistant not only to distortion and deflection but also to impact, and to provide a method of manufacturing the same.
【０００５】[0005]
【課題を解決するための手段】本発明者等は、上記目的
を達成するため鋭意研究した結果、ヒートシンクの材料
として金属−セラミックス複合材料を用いれば、歪、た
わみは勿論衝撃にも強いヒートシンク用材料が得られる
との知見を得て本発明を完成するに至った。Means for Solving the Problems The present inventors have conducted intensive studies to achieve the above object. As a result, if a metal-ceramic composite material is used as the material of the heat sink, the heat sink is resistant not only to distortion and deflection but also to impact. The knowledge that a material can be obtained has led to the completion of the present invention.
【０００６】即ち本発明は、（１）Ｓｉの含有量が５〜
２０重量％で、Ｍｇの含有量が２重量％以下のアルミニ
ウムまたはその合金から成るマトリックス中に、粉末充
填率が６０体積％以上で、平均粒径が１０〜７０μｍの
ＳｉＣ粉末またはＡｌＮ粉末を分散させた１５０Ｗ／ｍ
Ｋ以上の熱伝導率を有する金属−セラミックス複合材料
から成ることを特徴とするヒートシンク用材料（請求項
１）とし、また、（２）１０〜７０μｍの平均粒径を有
するＳｉＣまたはＡｌＮ粉末に、無機バインダーを加え
て混合し、その混合物を成形し、得られた成形物を焼成
してプリフォームを形成した後、該プリフォームにＳｉ
を５〜２０重量％、Ｍｇを２重量％以下含む溶融された
アルミニウムまたはその合金を高圧で含浸させることを
特徴とするヒートシンク用材料の製造方法（請求項２）
とすることを要旨とする。以下さらに詳細に説明する。That is, according to the present invention, (1) the content of Si is 5 to 5.
Disperse SiC powder or AlN powder having a powder filling rate of 60% by volume or more and an average particle size of 10 to 70 μm in a matrix made of aluminum or an alloy thereof containing 20% by weight and containing 2% by weight or less of Mg. 150W / m
A heat sink material (Claim 1) comprising a metal-ceramic composite material having a thermal conductivity of K or more, and (2) SiC or AlN powder having an average particle size of 10 to 70 μm, An inorganic binder was added and mixed, the mixture was molded, and the obtained molded product was fired to form a preform.
A method for producing a heat sink material comprising impregnating molten aluminum or an alloy thereof containing 5 to 20% by weight of Mg and 2% by weight or less of Mg at a high pressure (claim 2).
The gist is that This will be described in more detail below.
【０００７】上記ヒートシンク用材料としては、Ｓｉの
含有量が５〜２０重量％で、Ｍｇの含有量が２重量％以
下のアルミニウムまたはその合金から成るマトリックス
中に、粉末充填率が６０体積％以上で、平均粒径が１０
〜７０μｍのＳｉＣ粉末またはＡｌＮ粉末を分散させた
１５０Ｗ／ｍＫ以上の熱伝導率を有する金属−セラミッ
クス複合材料から成る材料とした（請求項１）。ヒート
シンク用材料が金属−セラミックス複合材料から成ると
したのは、この複合材料が金属に比べて熱膨張が小さい
こと、剛性も高いこと、セラミックスに比べ耐衝撃性に
優れていることなどで金属またはセラミックスの欠点を
是正できることによる。[0007] As the heat sink material, a matrix containing aluminum or an alloy thereof having a Si content of 5 to 20% by weight and a Mg content of 2% by weight or less has a powder filling rate of 60% by volume or more. And the average particle size is 10
A material made of a metal-ceramic composite material having a thermal conductivity of 150 W / mK or more in which SiC powder or AlN powder of about 70 μm is dispersed (Claim 1). The reason why the heat sink material is made of a metal-ceramic composite material is that the composite material has a smaller thermal expansion than a metal, a higher rigidity, and a higher impact resistance than a ceramic. This is due to the ability to correct the disadvantages of ceramics.
【０００８】その複合材料中の金属をアルミニウムまた
はその合金としたのは、それら金属の熱伝導率が特に高
く、熱膨張係数も従来のＣｕ合金より小さくできること
による。そして、それら金属中のＳｉの含有量を５〜２
０重量％とし、Ｍｇの含有量を２重量％以下としたの
は、Ｓｉの含有量が５重量％より少ないと、複合材料の
熱膨張係数が大きくなり、２０重量％より多いと、アル
ミニウム合金の延性が失われて複合材料が脆くなり、ま
た、Ｍｇの含有量が２重量％より多いと、複合材料の熱
伝導率が低下するので、いずれも好ましくないことによ
る。[0008] The reason why the metal in the composite material is aluminum or its alloy is that the metal has a particularly high thermal conductivity and the coefficient of thermal expansion can be smaller than that of a conventional Cu alloy. Then, the content of Si in these metals is reduced to 5 to 2
The reason why the content of Mg is set to 0% by weight and the content of Mg is set to 2% by weight or less is that when the content of Si is less than 5% by weight, the thermal expansion coefficient of the composite material becomes large, and when the content is more than 20% by weight, the aluminum alloy becomes When the content of Mg is more than 2% by weight, the thermal conductivity of the composite material is reduced.
【０００９】一方、セラミックス粉末をＳｉＣ粉末また
はＡｌＮ粉末としたのは、それら粉末の熱伝導率が特に
高いためである。そして、それらセラミックス粉末の充
填率を６０体積％以上としたのは、６０体積％より低い
と、複合材料の剛性が低下し、さらに熱膨張係数も高く
なって好ましくないことによる。また、その平均粒径を
１０〜７０μｍとしたのは、１０μｍより細かいと、形
成するプリフォーム中の粉末粒子間の間隙が狭くなり、
マトリックスであるアルミニウムまたはその合金の含浸
が難しくなり、７０μｍより粗いと、複合材料の強度が
低下することによる。On the other hand, the reason why the ceramic powder is SiC powder or AlN powder is that those powders have particularly high thermal conductivity. The reason why the filling rate of the ceramic powder is set to 60% by volume or more is that if it is lower than 60% by volume, the rigidity of the composite material is reduced, and the thermal expansion coefficient is undesirably increased. Further, the average particle diameter is set to 10 to 70 μm, if it is smaller than 10 μm, the gap between the powder particles in the preform to be formed becomes narrow,
It is difficult to impregnate the matrix aluminum or its alloy, and if it is coarser than 70 μm, the strength of the composite material is reduced.
【００１０】その複合材料の熱伝導率を室温で１５０Ｗ
／ｍＫ以上としたのは、実用化されているセラミックス
製のヒートシンクの熱伝導率が、１５０Ｗ／ｍＫ程度で
あるので、これ以上の値であれば十分満足できることに
よる。The thermal conductivity of the composite material is 150 W at room temperature.
The reason why the value is set to / mK or more is that the thermal conductivity of a ceramic heat sink that is put into practical use is about 150 W / mK, and a value higher than this value can be sufficiently satisfied.
【００１１】このヒートシンク用材料の製造方法として
は、１０〜７０μｍの平均粒径を有するＳｉＣ粉末また
はＡｌＮ粉末に、無機バインダーを加えて混合し、その
混合物を成形し、得られた成形体を焼成してプリフォー
ムを形成した後、該プリフォームにＳｉを５〜２０重量
％、Ｍｇを２重量％以下含む溶融されたアルミニウムま
たはその合金を高圧で含浸させることとする製造方法と
した（請求項２）。溶融された金属を高圧法で含浸させ
るのは、ヒートシンクとしての特性がマトリックスであ
る金属の組成に大きく影響されるため、どんな組成の金
属でも含浸させることのできる高圧法が好ましいことに
よる。As a method for producing this heat sink material, an inorganic binder is added to and mixed with SiC powder or AlN powder having an average particle size of 10 to 70 μm, the mixture is molded, and the obtained molded body is fired. After forming the preform, the preform is impregnated with molten aluminum or an alloy thereof containing 5 to 20% by weight of Si and 2% by weight or less of Mg at a high pressure. 2). The reason why the molten metal is impregnated by the high-pressure method is that a high-pressure method capable of impregnating a metal of any composition is preferable since the properties as a heat sink are greatly affected by the composition of the metal as the matrix.
【００１２】[0012]
【発明の実施の形態】本発明のヒートシンク用材料の製
造方法をさらに詳細に述べると、先ずセラミックス粉末
として平均粒径が１０〜７０μｍのＳｉＣ粉末またはＡ
ｌＮ粉末を用意する。それら粉末に無機バインダーを加
え混合し、得られた混合物はそのまま、あるいは必要に
応じて乾燥し、それを成形用の型に充填し、プレス成形
する方法、あるいは無機バインダー及び溶媒を加え混合
し、得られた懸濁液をフィルターなどでプレスする方法
で成形し、その成形体を焼成してプリフォームを形成す
る。BEST MODE FOR CARRYING OUT THE INVENTION The method for manufacturing a heat sink material according to the present invention will be described in more detail. First, as a ceramic powder, SiC powder having an average particle size of 10 to 70 μm or AC powder is used.
Prepare 1N powder. An inorganic binder is added to and mixed with the powder, and the resulting mixture is dried as it is or if necessary, filled with a molding die, press-molded, or mixed with an inorganic binder and a solvent, The obtained suspension is molded by a method of pressing with a filter or the like, and the molded body is fired to form a preform.
【００１３】次いで、形成したプリフォームにアルミニ
ウムまたはその合金を高圧で含浸させる。その方法は、
例えば、アルミニウム鋳造用の金型内にプリフォームを
セットし、その金型を予熱し、別に７００〜８５０℃の
温度で溶融したアルミニウムまたはその合金を前記した
金型内に注入し、５０ＭＰａ以上の圧力で高圧鋳造して
セラミックス粒子間に金属を含浸させ、冷却してヒート
シンク用の金属−セラミックス複合材料を作製する。Next, the formed preform is impregnated with aluminum or its alloy at high pressure. The method is
For example, a preform is set in a mold for casting aluminum, the mold is preheated, and aluminum or an alloy thereof melted at a temperature of 700 to 850 ° C. is separately injected into the mold described above, and a pressure of 50 MPa or more is set. A metal is impregnated between ceramic particles by high pressure casting under pressure, and cooled to produce a metal-ceramic composite material for a heat sink.
【００１４】以上の方法で金属−セラミックス複合材料
を作製すれば、歪、たわみは勿論衝撃にも強く、しかも
１５０Ｗ／ｍＫ以上の熱伝導率を有するヒートシンク用
の材料が得られる。When the metal-ceramic composite material is manufactured by the above-described method, a heat sink material having a thermal conductivity of 150 W / mK or more, which is resistant to not only distortion and deflection but also impact, can be obtained.
【００１５】[0015]
【実施例】以下、本発明の実施例を比較例と共に具体的
に挙げ、本発明をより詳細に説明する。EXAMPLES Hereinafter, the present invention will be described in more detail with reference to Examples of the present invention and Comparative Examples.
【００１６】（実施例１〜３） （１）プリフォームの形成 ＳｉＣ粉末（信濃電気精錬社製、平均粒径２０μｍ）ま
たはシリカコーティングしたＡｌＮ粉末（ダウケミカル
社製、平均粒径２０μｍ）１００重量部に無機バインダ
ー（アルミナゾル、日産化学社製）を２重量部、水を３
０重量部加え、混合し、混合した懸濁液をフィルタープ
レスした後、成形し、得られた成形体を１０００℃で５
時間加熱して縦１００×横１００×厚さ３０ｍｍのプリ
フォームを得た。なお、粉末充填率の増減は、プレス圧
を加減することで調整した。(Examples 1 to 3) (1) Formation of Preform 100 weight of SiC powder (Shinano Electric Refining Co., Ltd., average particle size 20 μm) or silica-coated AlN powder (Dow Chemical Co., Ltd., average particle size 20 μm) 2 parts by weight of an inorganic binder (alumina sol, manufactured by Nissan Chemical Industries, Ltd.) and 3 parts by weight of water
0 parts by weight were added, mixed, and the mixed suspension was subjected to filter press, and then molded.
The preform was heated for 100 hours to obtain a preform of 100 × 100 × 30 mm. In addition, the increase or decrease of the powder filling rate was adjusted by adjusting the press pressure.
【００１７】（２）金属−セラミックス複合材料の作製 このプリフォームを８００℃に加熱し、それを３００℃
に予熱した鋳造用金型内にセットし、別に８５０℃で溶
融した８４％Ａｌ−１５％Ｓｉ−１％Ｍｇ組成のアルミ
ニウム合金を金型内に注入し、窒素雰囲気中で５０ＭＰ
ａの圧力でアルミニウム合金をプリフォームに含浸さ
せ、冷却してヒートシンク用の金属−セラミックス複合
材料を作製した。(2) Preparation of Metal-Ceramic Composite Material This preform is heated to 800 ° C. and heated to 300 ° C.
An aluminum alloy having a composition of 84% Al-15% Si-1% Mg melted at 850 ° C. was poured into the mold, and was then heated to 50MP in a nitrogen atmosphere.
The preform was impregnated with the aluminum alloy at the pressure of a and cooled to produce a metal-ceramic composite material for a heat sink.
【００１８】（３）評価 得られたプリフォームの嵩比重をアルキメデス法で測定
し、セラミックス粉末の充填率を求めた。また、得られ
た複合材料から３×４×４０ｍｍの試験片を切り出し、
その試験片で曲げ強度をＪＩＳ Ｒ１６０１で、ヤング
率をＪＩＳ Ｒ１６０２で、熱膨張係数をＴＭＡ３００
（セイコー電子工業社製）を用いてＪＩＳ Ｒ１６１８
で測定し、さらに、レーザーフラッシュ（理学電機社
製）を用いて熱伝導率をＪＩＳ Ｒ１６１１で、アイゾ
ットインパクトテスター（東洋精機製作所製）を用いて
衝撃値をＪＩＳ Ｋ７１１０で測定した。さらにまた、
複合材料を切断し、その切断面を目視観察し、アルミニ
ウム合金の含浸状態を調べた。それらの結果を表１に示
す。(3) Evaluation The bulk specific gravity of the obtained preform was measured by the Archimedes method, and the filling rate of the ceramic powder was determined. Further, a 3 × 4 × 40 mm test piece was cut out from the obtained composite material,
The test piece had a bending strength of JIS R1601, a Young's modulus of JIS R1602, and a thermal expansion coefficient of TMA300.
(Manufactured by Seiko Denshi Kogyo KK) using JIS R1618
Further, the thermal conductivity was measured in accordance with JIS R1611 using a laser flash (manufactured by Rigaku Denki) and the impact value was measured in accordance with JIS K7110 using an Izod impact tester (manufactured by Toyo Seiki Seisaku-sho, Ltd.). Furthermore,
The composite material was cut, the cut surface was visually observed, and the impregnation state of the aluminum alloy was examined. Table 1 shows the results.
【００１９】（比較例１〜７）比較のために、比較例１
では、セラミックス粉末の種類を本発明の範囲外にした
他は、比較例２では、ＳｉＣ粉末の充填率を本発明の範
囲外にした他は、比較例３、４では、ＳｉＣ粉末の平均
粒径を本発明の範囲外にした他は、比較例５、６では、
アルミニウム合金中のＳｉの含有量を本発明の範囲外に
した他は、比較例７では、アルミニウム合金中のＭｇの
含有量を本発明の範囲外にした他は実施例１と同様にプ
リフォームを形成し、複合材料を作製し、評価した。そ
れらの結果を表１に示す。(Comparative Examples 1 to 7) For comparison, Comparative Example 1
In Comparative Example 2, the average particle size of the SiC powder was changed in Comparative Examples 3 and 4, except that the filling rate of the SiC powder was set out of the range of the present invention, except that the type of the ceramic powder was out of the range of the present invention. Except that the diameter was out of the range of the present invention, in Comparative Examples 5 and 6,
In Comparative Example 7, except that the content of Si in the aluminum alloy was out of the range of the present invention, the same as in Example 1, except that the content of Mg in the aluminum alloy was out of the range of the present invention. Was formed, and a composite material was prepared and evaluated. Table 1 shows the results.
【００２０】[0020]
【表１】 [Table 1]
【００２１】表１から明らかなように、実施例１〜３に
おいては、いずれもセラミックス粉末の充填率と平均粒
径が本発明の範囲内にあり、さらにアルミニウム合金中
のＳｉとＭｇの含有量も本発明の範囲内にあるので、ア
ルミニウム合金の含浸に不良なものは認められず、ま
た、その材料特性の値がいずれも優れた値を示してい
た。このことは、得られた複合材料が、ヒートシンク用
の材料として十分な特性を有していることを示してい
る。As is clear from Table 1, in Examples 1 to 3, the packing ratio and average particle size of the ceramic powder are all within the range of the present invention, and the contents of Si and Mg in the aluminum alloy Since these were also within the scope of the present invention, no impairment was observed in the impregnation of the aluminum alloy, and the values of the material properties were all excellent. This indicates that the obtained composite material has sufficient properties as a material for a heat sink.
【００２２】これに対して比較例１では、セラミックス
粉末がＡｌ2Ｏ3粉末であるため、熱伝導率が極めて低
く、熱膨張係数も大きかった。また、比較例２では、Ｓ
ｉＣ粉末の含有率が６０体積％より低いため、剛性を示
すヤング率が低下し、熱膨張係数も大きくなった。さら
に、比較例３では、ＳｉＣ粉末の平均粒径が１０μｍよ
り細かすぎたので、含浸不良が認められ、比較例４で
は、ＳｉＣ粉末の平均粒径が粗すぎたので、強度が低下
した。さらにまた、比較例５では、Ｓｉの含有量が少な
すぎたので、熱膨張係数が大きくなり、比較例６では、
Ｓｉの含有量が多すぎたので、衝撃値が低くなった。そ
してまた、比較例７では、Ｍｇの含有量が多すぎたの
で、熱伝導率が低くなった。On the other hand, in Comparative Example 1, since the ceramic powder was Al 2 O 3 powder, the thermal conductivity was extremely low and the coefficient of thermal expansion was large. In Comparative Example 2, S
Since the content of the iC powder was lower than 60% by volume, the Young's modulus indicating rigidity decreased, and the coefficient of thermal expansion also increased. Furthermore, in Comparative Example 3, impregnation failure was recognized because the average particle size of the SiC powder was too finer than 10 μm, and in Comparative Example 4, the strength was reduced because the average particle size of the SiC powder was too coarse. Furthermore, in Comparative Example 5, since the content of Si was too small, the coefficient of thermal expansion increased, and in Comparative Example 6,
The impact value was low because the content of Si was too large. Further, in Comparative Example 7, since the content of Mg was too large, the thermal conductivity was low.
【００２３】[0023]
【発明の効果】以上の通り、本発明によれば、歪、たわ
みは勿論衝撃にも強いヒートシンク用の材料を得ること
ができるようになった。このことにより、組み合わせ部
品とも問題なく接合できるようになり、電気、通信、自
動車分野などで用いられるヒートシンクに幅広い適用が
可能となった。As described above, according to the present invention, it is possible to obtain a material for a heat sink that is resistant not only to distortion and deflection but also to impact. As a result, it has become possible to join the combined parts without any problem, and it has become possible to widely apply the present invention to heat sinks used in the fields of electricity, communication, and automobiles.
Claims (2)
の含有量が２重量％以下のアルミニウムまたはその合金
から成るマトリックス中に、粉末充填率が６０体積％以
上で、平均粒径が１０〜７０μｍのＳｉＣ粉末またはＡ
ｌＮ粉末を分散させた１５０Ｗ／ｍＫ以上の熱伝導率を
有する金属−セラミックス複合材料から成ることを特徴
とするヒートシンク用材料。1. The method according to claim 1, wherein the content of Si is 5 to 20% by weight,
In a matrix made of aluminum or an alloy thereof containing 2% by weight or less of SiC powder or AC having a powder filling rate of 60% by volume or more and an average particle size of 10 to 70 μm.
A heat sink material comprising a metal-ceramic composite material having a thermal conductivity of 150 W / mK or more in which 1N powder is dispersed.
ＣまたはＡｌＮ粉末に、無機バインダーを加えて混合
し、その混合物を成形し、得られた成形物を焼成してプ
リフォームを形成した後、該プリフォームにＳｉを５〜
２０重量％、Ｍｇを２重量％以下含む溶融されたアルミ
ニウムまたはその合金を高圧で含浸させることを特徴と
するヒートシンク用材料の製造方法。2. Si having an average particle size of 10 to 70 μm.
An inorganic binder is added to and mixed with C or AlN powder, the mixture is molded, and the obtained molded product is fired to form a preform.
A method for producing a heat sink material, comprising: impregnating molten aluminum or an alloy thereof containing 20% by weight and 2% by weight or less of Mg at a high pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3537898A JPH11228261A (en) | 1998-02-03 | 1998-02-03 | Material for heat sink and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3537898A JPH11228261A (en) | 1998-02-03 | 1998-02-03 | Material for heat sink and its production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11228261A true JPH11228261A (en) | 1999-08-24 |
Family
ID=12440245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3537898A Pending JPH11228261A (en) | 1998-02-03 | 1998-02-03 | Material for heat sink and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11228261A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1114807A4 (en) * | 1999-06-14 | 2002-02-06 | Sumitomo Electric Industries | COMPOSITE MATERIAL AND SEMICONDUCTOR DEVICE INCLUDING SAME |
| WO2002077304A1 (en) * | 2001-03-26 | 2002-10-03 | Kabushiki Kaisha Toyota Jidoshokki | Heat dissipation member for electronic apparatus and method for producing the same |
| WO2002077303A1 (en) * | 2001-03-26 | 2002-10-03 | Kabushiki Kaisha Toyota Jidoshokki | Method for manufacturing radiating member for electronic equipment |
| WO2009141266A1 (en) * | 2008-05-21 | 2009-11-26 | Epcos Ag | Electric component arrangement comprising a varistor and a semiconductor component |
-
1998
- 1998-02-03 JP JP3537898A patent/JPH11228261A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1114807A4 (en) * | 1999-06-14 | 2002-02-06 | Sumitomo Electric Industries | COMPOSITE MATERIAL AND SEMICONDUCTOR DEVICE INCLUDING SAME |
| WO2002077304A1 (en) * | 2001-03-26 | 2002-10-03 | Kabushiki Kaisha Toyota Jidoshokki | Heat dissipation member for electronic apparatus and method for producing the same |
| WO2002077303A1 (en) * | 2001-03-26 | 2002-10-03 | Kabushiki Kaisha Toyota Jidoshokki | Method for manufacturing radiating member for electronic equipment |
| US7364632B2 (en) | 2001-03-26 | 2008-04-29 | Kabushiki Kaisha Toyota Jidoshokki | Radiator member for electronic appliances and processes for producing the same |
| WO2009141266A1 (en) * | 2008-05-21 | 2009-11-26 | Epcos Ag | Electric component arrangement comprising a varistor and a semiconductor component |
| US8378455B2 (en) | 2008-05-21 | 2013-02-19 | Epcos Ag | Electronic component arrangement comprising a varistor and a semiconductor component |
| KR101529364B1 (en) * | 2008-05-21 | 2015-06-16 | 에프코스 아게 | Electric component arrangement comprising a varistor and a semiconductor component |
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