JPH11238465A - Female mold for producing thick film pattern, method for producing the same, and method for producing thick film pattern - Google Patents

Abstract

(57) Abstract: A female mold for producing a thick film pattern for accurately forming a thick film pattern on a substrate while maintaining a high use efficiency of a thick film pattern forming material, a method for producing the same, and a method thereof. It is an object of the present invention to provide a method of manufacturing a thick film pattern using the female mold. A method for manufacturing a thick film pattern by filling a female mold 20 having a desired pattern formed on a predetermined substrate 10 with a thick film pattern forming material 40a and then removing the female mold 20 is provided. The material constituting the female mold 20 is a kneaded mixture of ceramic powder and resin, and the content of the ceramic powder is from 10% by weight to 90% by weight.
The resin composition had a combustion decomposition temperature of 600 ° C. or lower, and the resin composition was a female mold 20 for producing a thick film pattern, which was of an ultraviolet or electron beam curing type. Female mold 2 by sandblasting or photolithography
0 is a method for manufacturing a female mold for forming a thick film pattern formed on the substrate 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of forming an insulating or conductive thick film pattern used for a plasma display, for example.

[0002]

2. Description of the Related Art Conventionally, in the process of manufacturing a plasma display, in forming a thick film pattern having a width of about 100 .mu.m and a height of about 100 to 200 .mu.m, for example, a low melting point lead glass which is There has been known a method in which a paste obtained by kneading an inorganic pigment with a predetermined resin is patterned on a predetermined glass substrate by screen printing, and then fired to form ribs on the substrate.

In this screen printing, a predetermined film thickness cannot be obtained by one printing, and printing must be repeated a plurality of times in order to obtain a predetermined film thickness. However, the essential principle of screen printing is that printing is performed while the plate is constantly deformed.If printing is performed repeatedly, printing misalignment due to irreversible deformation of the plate occurs. Cheap. For these reasons, the conventional screen printing method is extremely inefficient in production.

Further, it is difficult to increase the area due to problems such as distortion of the screen plate, and the line width accuracy is impaired due to problems such as the fluidity of the paste used for printing and the resolution of the screen plate. is there.

[0005] As a method for solving these problems, a pattern forming material is solid-coated on a substrate, masked into a predetermined pattern shape by a resist mask, and an abrasive is sprayed to scrape off the excess pattern forming material. A method for obtaining a predetermined thick film pattern, a so-called sand blast method, has been proposed in, for example, Japanese Patent Laid-Open No. 4-58438.

However, as a result, this method is a method in which most of the pattern forming material is shaved off to form a pattern, and the utilization efficiency of the pattern forming material is low, that is, it is uneconomical. This is because most of the mixture of the expensive and harmful low melting point lead glass powder, which is the main component of the thick film pattern (rib) forming material, and the abrasive for sandblasting becomes waste. ) Is also difficult in practice.

On the other hand, as a method of using a thick film pattern (rib) forming material with high utilization efficiency, for example, (Arimoto et al.
VOL. 93 NO. 429 p. 68 [1994])
As described in the above, a female mold of a pattern made of only an ultraviolet curable resin, which is inexpensive compared with the above thick film pattern (rib) forming material, is formed by photolithography, and the thickness of the female mold is reduced in the concave portion of the female mold. After filling the film pattern forming material and then drying, and then removing only the female mold with a strong alkaline solution and the like, and firing the pattern forming material,
There is a method for obtaining a desired thick film pattern.

However, in the method proposed above, since the material for forming the thick film pattern when the female mold is removed is simply in a dry state, the material for forming the thick film pattern may be peeled off when the female mold is removed. Was a cause of defects in the thick film pattern.

That is, the cause of the defect in this case is to remove the female mold before firing the pattern forming material. Therefore, in order to solve this problem, the pattern forming material is fired before removing the female mold, that is, the thick film pattern forming material is fired as it is without removing the female mold, and the female is formed in the same step as the firing step. The resin forming the mold should be eliminated by its combustion, but as a result of studying this method, the female mold consisting only of the ultraviolet-curing resin shrinks due to the thermal crosslinking reaction during firing, and thus occurs in the female mold. There is a problem that the pattern formed by the filled thick film pattern forming material is broken by heat shrinkage stress.

[0010]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and it is an object of the present invention to maintain a high utilization efficiency of a material for forming a thick film pattern while maintaining a high utilization efficiency. An object of the present invention is to provide a female mold for forming a thick film pattern for accurately forming a thick film pattern thereon without pattern destruction or the like, a method of manufacturing the same, and a method of manufacturing a thick film pattern using the female mold.

[0011]

In order to achieve the above object, the present invention first provides a method of forming a thick film pattern forming material on a female mold having a desired pattern formed on a predetermined substrate. In a method for producing a thick film pattern by filling and then removing the female mold, the material constituting the female mold comprises a kneaded product of ceramic powder and resin, and the content of the ceramic powder is 10%. It is a female mold for producing a thick film pattern, characterized in that the content is from 90% by weight to 90% by weight.

According to the second aspect of the present invention, the temperature of combustion decomposition of the resin kneaded with the ceramic powder is 6
The female mold for producing a thick film pattern according to claim 1, wherein the temperature is not higher than 00 ° C.

According to a third aspect of the present invention, the resin kneaded with the ceramic powder is an ultraviolet curable resin or an electron beam curable resin. It is a type.

Further, in the invention of claim 4, according to the first aspect,
Or a kneaded product of a ceramic powder and a resin constituting the female mold for producing a thick film pattern according to 2 above, coated and dried on the substrate to form a negative pattern having a desired thick film pattern and having sandblast resistance. A female mold is formed on a substrate by a sand blast method in which an abrasive is sprayed through a resist mask.

[0015] According to the invention of claim 5, in claim 3,
A kneaded product of a ceramic powder and a resin constituting a female mold for producing a thick film pattern according to the above is applied on the substrate, dried, and irradiated with ultraviolet light through a photomask having an opening of a negative pattern of a desired thick film pattern. Alternatively, the method is a method of manufacturing a female mold for producing a thick film pattern, wherein a female mold is formed on a substrate by a photolithography method of irradiating an electron beam and removing an uncured portion with a developing solution.

Further, according to the present invention, a thick film pattern forming material is filled in a female mold of a desired pattern formed on a predetermined substrate, and then the female mold is removed to form a thick film pattern. The method for producing a thick film pattern by using the female mold for producing a thick film pattern according to claim 1, 2 or 3, after filling the material for forming a thick film pattern, baking, and then washing. This is a method for producing a thick film pattern, characterized by removing the female mold.

[0017]

Embodiments of the present invention will be described with reference to the drawings. The female mold for producing a thick film pattern of the present invention is:
As shown in FIG. 1, a female mold (20) for producing a desired thick film pattern on a predetermined substrate (10), wherein the female mold (20) has a thickness on the substrate (10). The same height as the film pattern, formed as a negative of the thick film pattern, and formed on the female mold (2) formed on the substrate (10).
0) is composed of a kneaded product of a ceramic powder and a resin, wherein the content of the ceramic powder is from 10% by weight to 90% by weight, and the combustion decomposition temperature of the resin kneaded with the ceramic powder is in the air. It is characterized by being at most 600 ° C.

According to a fourth aspect of the present invention, as shown in FIG. 4, a kneaded product of a ceramic powder and a resin constituting the female mold (20) for producing a thick film pattern is coated on the substrate (10). An abrasive is sprayed through a resist mask (60) having a negative pattern of a desired thick film pattern and having a sandblast resistance by drying, and a portion other than the resist portion (60a) of the resist mask (60). A female mold (20) for forming a thick film pattern as shown in FIG. 1 is formed on a substrate (10) by a sand blast method of removing a coating film (20a) of a female rib (20) corresponding to 60b). This is a method for manufacturing the mold (20).

Further, the invention according to claim 5 is characterized in that a kneaded product of a ceramic powder and a resin composition curable by ultraviolet light or electron beam constituting the female mold (20) for producing a thick film pattern is provided.
As shown in FIG. 5, the photomask is applied to the substrate (10), dried, and irradiated with an ultraviolet ray or an electron beam through a photomask (70) having a negative pattern opening of a desired thick film pattern. Opaque part (70a) of (70)
1 is removed by a photolithography method in which an uncured portion (20b) of the female mold (20) corresponding to FIG.
This is a method for manufacturing a female mold (20) for producing a thick film pattern, in which a female mold (20) as shown in FIG. 1 is formed on a substrate (10).

Further, according to the invention of claim 6, the concave portion (5) of the female mold (20) for manufacturing a thick film pattern shown in FIG.
0), as shown in FIG.
0a), and then removing the female mold (20) to form a thick film pattern (40) as shown in FIG.
Is formed on the substrate (10).

Hereinafter, the materials and the like according to the present invention will be described in more detail. Examples of the ceramic powder according to the present invention include SiO ₂ , Al ₂ O ₃ , SiO, CaO, Z
Examples include inorganic oxides such as rO ₂ , MgO, and TiO ₂ , but are not limited thereto.

The proportion of the ceramic powder in the female rib material is preferably from 10% by weight to 90% by weight. When the proportion of the ceramic powder is 10% by weight or less, it is difficult to relax the heat shrinkage stress of the female mold in the firing process.
If the content is 90% by weight or more, uniform mixing with the resin is difficult, so that a female mold that can withstand practical use cannot be formed.

As the resin to be kneaded with the ceramic powder, for example, when the present invention is applied to a plasma display, soda lime glass or the like is often used as a substrate. It is preferable to use an easily flammable resin that can be decomposed in air at 600 ° C. or lower, and examples thereof include ethyl cellulose and polymethyl methacrylate, but are not limited thereto.

In the case where the kneaded substance of the ceramic powder and the resin is applied to the method for producing a female mold by the photolithography method according to the fifth aspect of the present invention, the resin composition may be ultraviolet (UV) or electron beam (EB). And a resin containing a mixture of the above resins and a reaction initiator and the like.

As described above, in the present invention, first, the female mold (2) for manufacturing a thick film pattern formed on the substrate (10) in advance is used.
0) is filled with a required amount of the thick film pattern forming material (40a) to form a desired thick film pattern (40), so that the use efficiency of the expensive thick film pattern forming material (40a) is high and economical effects are obtained. is there.

A thick film pattern forming material (40a) is filled into a thick film pattern manufacturing female mold (20) formed on a predetermined substrate (10), and then the female mold (20) is removed. In the method of manufacturing a thick film pattern, since the material constituting the female mold is a kneaded product of ceramic powder and resin, the thermal shrinkage stress of the female mold generated during the substrate firing process is alleviated by the ceramic powder, and therefore, during firing. Of the thick film pattern forming material (40a) can be suppressed, and a highly accurate thick film pattern (40) can be manufactured.

The ceramic powder, which is one component of the material forming the female mold, remains on the substrate (10) even after firing, but since the resin serving as the binder has disappeared, washing with water or the like is performed. Can be easily removed.

In any of the methods for manufacturing the female mold (20) for producing a thick film pattern by the sandblasting method and the photolithography method, it is possible to use only resin and a single ceramic powder as waste.
Recycling becomes easy as a female material.

As described above, it is possible to form a thick film pattern with high accuracy while maintaining a high use efficiency of the thick film pattern forming material.

[0030]

Next, the present invention will be described in detail with reference to examples. <Example 1> SiO ₂ powder AKP-50 in (Sumitomo Chemical Co., Ltd.) 45 parts by weight, ethyl cellulose (manufactured by Kanto Chemical Co., Inc.)
Then, 12 parts by weight of a 10% carbitol solution was added, and the mixture was kneaded with a three-roll mill to form a paste, thereby preparing a female mold forming material.

The above-obtained female mold forming material was applied to a thickness of 2.8.
mm glass substrate (10) using a blade coater.
0 μm thick, and dried with a hot air dryer at 100 ° C.
After drying for a minute, a paste layer of the material for forming the female mold (20) was obtained.

After drying, as shown in FIG.
0) A dry film resist BF- having a sandblast resistance is formed on the coating film (20a) made of the above-mentioned female mold forming material.
603 (manufactured by Tokyo Ohka Kogyo Co., Ltd.) at 105 ° C and 2.5 kg /
Laminated under the condition of cm ² , and the pitch 420
A photomask on which a stripe pattern opening having a width of 300 μm and a width of 300 μm is formed is brought into close contact with the photomask, and exposed to 300 mj / cm ² using an ultra-high pressure mercury lamp.
% Sodium carbonate aqueous solution was sprayed onto the exposed dry film resist using a spray gun to develop a resist mask (60) having a resist stripe pattern having a pitch of 420 μm and a width of 300 μm.

Subsequently, as shown in FIG. 4, an abrasive (Al2O3400) is sprayed using a sandblasting device to cut and remove the paste layer in the portion (60b) of the resist mask (60) other than the resist portion (60a). Then, a female rib (20) for forming a thick film pattern as shown in FIG. 1 was formed on the glass substrate (10).

The recess (5) of the female mold (20) formed above
0) Paste ELD-5 for thick film pattern (rib) of plasma display using urethane rubber squeegee
06B (manufactured by Okuno Pharmaceutical Co., Ltd.) and dried.

Substrate (10) filled with this paste
Was immersed in a 1% aqueous solution of sodium hydroxide to remove the resist portion (60a) of the resist mask (60).
At this time, the excess paste attached to the dry film resist was also removed at the same time. After washing and drying, the resin constituting the female mold (20) for producing a thick film pattern was decomposed and disappeared by baking for 30 minutes in a baking furnace at 580 ° C. so that only the ceramic powder remained.

After firing, the substrate is taken out of the firing furnace and washed with water to remove the ceramic powder attached to the substrate (10), thereby forming a desired thick film pattern (40) as shown in FIG. ).

The thick film pattern (4
In 0), although a slight volume reduction was observed due to firing, a highly accurate stripe pattern having a height of 180 μm and a width of 100 μm could be obtained.

Example 2 SiO ₂ powder AKP-50
(Sumitomo Chemical Co., Ltd.) 45 parts by weight of 10% carbitol solution of hydroxypropyl cellulose (Kanto Chemical Co., Ltd.)
2 parts by weight, dipentaerythritol and hexaacrylate: 2 parts by weight of Anilox M400 (manufactured by Toagosei Co., Ltd.) and 0.2 parts by weight of 2-2-dimethoxy-2-phenylacetophenone were added and kneaded with a three-roll mill to form a paste. A UV-curable female mold-forming material was prepared.

The paste obtained above was 2.8 mm thick.
30 μm using a blade coater on the glass substrate (10)
It was applied thickly and dried with a hot air drier at 90 ° C. for 20 minutes to obtain a paste layer of the female (20) material.

Subsequently, as shown in FIG. 5, a photomask (70) in which a stripe pattern opening having a pitch of 420 μm and a width of 300 μm is formed is brought into close contact with the dried paste layer. Using a high-pressure mercury lamp, exposure to ultraviolet light of 300 mJ / cm ² was performed. Thereafter, pure water was sprayed using a spray gun to remove the paste layer of the uncured portion (20b), and the pitch was 420 μm and the width was as shown in FIG. A stripe pattern of a 300 μm female rib (20) forming material was formed on the glass substrate (10).

The recess (5) of the female mold (20) formed above
0) was filled with silver paste NP-4002 (produced by Noritake Co., Ltd.) for electrodes of a plasma display using a urethane rubber squeegee, and dried. The silver paste adhering to the surface of the mold rib (20) is removed by polishing, and
The resin constituting the female mold (20) for producing a thick film pattern was decomposed and disappeared by baking in a baking furnace for 30 minutes to leave only the ceramic powder.

After firing, the substrate (10) is taken out of the firing furnace and washed with water to remove the ceramic powder attached to the substrate (10) and the like, thereby forming a desired thick film pattern (40) as shown in FIG. It could be formed on a glass substrate (10).

In the thick film pattern (40) composed of the obtained silver paste, although a slight volume reduction was observed due to firing,
A stripe pattern having a height of 15 μm and a width of 100 μm was obtained.

[0044]

As described above, the present invention has the following effects. That is, the formation of the thick film pattern using the female mold for manufacturing a thick film pattern of the present invention is performed by first filling a required amount of the material for forming a thick film pattern into the female mold for manufacturing a thick film pattern formed in advance on a substrate. Thus, an expensive thick film pattern forming material can be used with high efficiency and economical effect.

Further, a method for forming a thick film pattern in which a thick film pattern forming material is filled in a female mold for producing a thick film pattern formed on a predetermined substrate, and thereafter the female mold is removed is provided. Since the material to be formed is composed of a kneaded product of ceramic powder and resin, the thermal shrinkage stress of the female die generated during the substrate firing process is alleviated by the ceramic powder, thereby suppressing the pattern breakage of the thick film pattern forming material during firing. A high-precision thick film pattern can be manufactured.

Also, since the method of manufacturing a female mold for producing a thick film pattern by the sandblasting method or the photolithography method is employed, it is possible to use only resin and a single ceramic powder as waste, and to recycle as a female material. This has the effect of facilitating use. Therefore, the present invention exhibits an excellent practical effect in forming a thick film pattern for applications such as plasma display.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a female mold for producing a thick film pattern according to an embodiment of the present invention in a side cross section.

FIG. 2 is an explanatory view showing a form in which a thick film pattern forming material is filled in a female mold for producing a thick film pattern according to the present invention in a side cross section.

FIG. 3 is an explanatory view showing a thick-film pattern on a substrate obtained by a method of manufacturing a thick-film pattern according to the present invention in a side cross section.

FIG. 4 is an explanatory view showing a part of a manufacturing process of a female mold for manufacturing a thick film pattern according to the present invention in a side cross section.

FIG. 5 is an explanatory view showing a part of another manufacturing process of the female mold for manufacturing a thick film pattern according to the present invention in a side cross section.

[Explanation of symbols]

 10 {substrate 20} female mold for thick film pattern production 20a {female type coating film 20b} uncured portion 20c {cured portion 40} thick film pattern 40a {thick film pattern forming material 60} Resist mask 60a {resist part 60b} part other than resist part 70 {photo mask 70a} opaque part of photo mask

Claims (6)

[Claims] 1. A method of manufacturing a thick film pattern by filling a female mold having a desired pattern formed on a predetermined substrate with a thick film pattern forming material and then removing the female mold. Characterized in that the material constituting (1) is a kneaded product of ceramic powder and resin, and the content of the ceramic powder is from 10% by weight to 90% by weight. 2. The female mold for producing a thick film pattern according to claim 1, wherein a temperature of combustion decomposition of the resin kneaded with the ceramic powder is 600 ° C. or less in air. 3. The female mold for producing a thick film pattern according to claim 1, wherein the resin kneaded with the ceramic powder is an ultraviolet curable resin or an electron beam curable resin. 4. A kneaded product of a ceramic powder and a resin constituting the female mold for producing a thick film pattern according to claim 1 or 2, which is coated on the substrate and dried to obtain a negative mold having a desired thick film pattern. A method for producing a female mold for producing a thick film pattern, comprising: forming a female mold on a substrate by a sandblast method of spraying an abrasive through a resist mask having a pattern and having sandblast resistance. 5. A kneaded product of a ceramic powder and a resin constituting the female mold for producing a thick film pattern according to claim 3, which is applied on the substrate and dried to form a negative pattern opening of a desired thick film pattern. A female mold for producing a thick film pattern, wherein a female mold is formed on a substrate by a photolithography method of irradiating an ultraviolet ray or an electron beam through a photomask having a portion and removing an uncured portion with a developing solution. Manufacturing method. 6. A method for producing a thick film pattern by filling a female mold of a desired pattern formed on a predetermined substrate with a thick film pattern forming material and then removing the female mold. Using the female mold for producing a thick film pattern described in 1, 2, or 3, after filling the material for forming a thick film pattern, baking, and then washing, the female mold for producing a thick film pattern is removed. Method for producing a thick film pattern.