JPH11239965A - 化学的機械的研磨及び化学的機械的研磨システムを使用する集積回路の製造方法 - Google Patents

化学的機械的研磨及び化学的機械的研磨システムを使用する集積回路の製造方法

Info

Publication number
JPH11239965A
JPH11239965A JP34087098A JP34087098A JPH11239965A JP H11239965 A JPH11239965 A JP H11239965A JP 34087098 A JP34087098 A JP 34087098A JP 34087098 A JP34087098 A JP 34087098A JP H11239965 A JPH11239965 A JP H11239965A
Authority
JP
Japan
Prior art keywords
substrate
carrier
support
inner support
chemical mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP34087098A
Other languages
English (en)
Japanese (ja)
Inventor
Annette Margaret Crevasse
マーガレット クリヴァッセ アネット
William Graham Easter
グラハム イースター ウィリアム
John Albert Maze Iii
アルバート メイツ，サード ジョン
John Thomas Sowell
トーマス ソウェル ジョン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia of America Corp
Original Assignee
Lucent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/980,943 external-priority patent/US5951382A/en
Priority claimed from US08/982,109 external-priority patent/US5967885A/en
Application filed by Lucent Technologies Inc filed Critical Lucent Technologies Inc
Publication of JPH11239965A publication Critical patent/JPH11239965A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP34087098A 1997-12-01 1998-12-01 化学的機械的研磨及び化学的機械的研磨システムを使用する集積回路の製造方法 Pending JPH11239965A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US08/980943 1997-12-01
US08/980,943 US5951382A (en) 1997-12-01 1997-12-01 Chemical mechanical polishing carrier fixture and system
US08/982,109 US5967885A (en) 1997-12-01 1997-12-01 Method of manufacturing an integrated circuit using chemical mechanical polishing
US08/982109 1997-12-01

Publications (1)

Publication Number Publication Date
JPH11239965A true JPH11239965A (ja) 1999-09-07

Family

ID=27130610

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34087098A Pending JPH11239965A (ja) 1997-12-01 1998-12-01 化学的機械的研磨及び化学的機械的研磨システムを使用する集積回路の製造方法

Country Status (3)

Country Link
EP (1) EP0923122B1 (de)
JP (1) JPH11239965A (de)
KR (1) KR100495717B1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100876381B1 (ko) * 2000-07-31 2008-12-29 가부시키가이샤 에바라 세이사꾸쇼 기판 고정 장치 및 기판 폴리싱 장치

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6224472B1 (en) * 1999-06-24 2001-05-01 Samsung Austin Semiconductor, L.P. Retaining ring for chemical mechanical polishing

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63283859A (ja) * 1987-05-13 1988-11-21 Hitachi Ltd ウェハ研磨用治具
US5695392A (en) * 1995-08-09 1997-12-09 Speedfam Corporation Polishing device with improved handling of fluid polishing media

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100876381B1 (ko) * 2000-07-31 2008-12-29 가부시키가이샤 에바라 세이사꾸쇼 기판 고정 장치 및 기판 폴리싱 장치

Also Published As

Publication number Publication date
KR100495717B1 (ko) 2005-09-30
EP0923122A2 (de) 1999-06-16
EP0923122A3 (de) 1999-12-29
EP0923122B1 (de) 2011-09-07
KR19990062593A (ko) 1999-07-26

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