JPH11241155A - シール部材および真空装置 - Google Patents

シール部材および真空装置

Info

Publication number
JPH11241155A
JPH11241155A JP10046504A JP4650498A JPH11241155A JP H11241155 A JPH11241155 A JP H11241155A JP 10046504 A JP10046504 A JP 10046504A JP 4650498 A JP4650498 A JP 4650498A JP H11241155 A JPH11241155 A JP H11241155A
Authority
JP
Japan
Prior art keywords
sealing
ring
resistant polymer
vacuum
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP10046504A
Other languages
English (en)
Japanese (ja)
Inventor
Masanori Ono
真徳 小野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to JP10046504A priority Critical patent/JPH11241155A/ja
Priority to PCT/JP1999/000901 priority patent/WO1999044221A1/fr
Publication of JPH11241155A publication Critical patent/JPH11241155A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
JP10046504A 1998-02-27 1998-02-27 シール部材および真空装置 Withdrawn JPH11241155A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP10046504A JPH11241155A (ja) 1998-02-27 1998-02-27 シール部材および真空装置
PCT/JP1999/000901 WO1999044221A1 (fr) 1998-02-27 1999-02-26 Joint etanche et chambre a vide

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10046504A JPH11241155A (ja) 1998-02-27 1998-02-27 シール部材および真空装置

Publications (1)

Publication Number Publication Date
JPH11241155A true JPH11241155A (ja) 1999-09-07

Family

ID=12749089

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10046504A Withdrawn JPH11241155A (ja) 1998-02-27 1998-02-27 シール部材および真空装置

Country Status (2)

Country Link
JP (1) JPH11241155A (fr)
WO (1) WO1999044221A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150076132A (ko) * 2013-12-26 2015-07-06 램 리써치 코포레이션 하부 전극 어셈블리용 에지 시일
JP2022535508A (ja) * 2019-05-24 2022-08-09 アプライド マテリアルズ インコーポレイテッド 結合層の保護が改善された基板支持キャリア

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030047881A1 (en) * 2001-09-13 2003-03-13 Worm Steven Lee Sealing system and pressure chamber assembly including the same
US9869392B2 (en) 2011-10-20 2018-01-16 Lam Research Corporation Edge seal for lower electrode assembly
US9859142B2 (en) 2011-10-20 2018-01-02 Lam Research Corporation Edge seal for lower electrode assembly

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57196535A (en) * 1981-05-28 1982-12-02 Toshiba Corp Semiconductor device for electric power
JPS58199529A (ja) * 1982-05-17 1983-11-19 Hitachi Ltd プラズマエツチング装置
GB8713241D0 (en) * 1987-06-05 1987-07-08 Vg Instr Group Bakeable vacuum systems
JP2976329B2 (ja) * 1988-01-11 1999-11-10 忠弘 大見 薄膜形成装置のシール機構
US5246782A (en) * 1990-12-10 1993-09-21 The Dow Chemical Company Laminates of polymers having perfluorocyclobutane rings and polymers containing perfluorocyclobutane rings
US5722668A (en) * 1994-04-29 1998-03-03 Applied Materials, Inc. Protective collar for vacuum seal in a plasma etch reactor
US5746434A (en) * 1996-07-09 1998-05-05 Lam Research Corporation Chamber interfacing O-rings and method for implementing same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150076132A (ko) * 2013-12-26 2015-07-06 램 리써치 코포레이션 하부 전극 어셈블리용 에지 시일
KR20220024367A (ko) * 2013-12-26 2022-03-03 램 리써치 코포레이션 하부 전극 어셈블리용 에지 시일
JP2022535508A (ja) * 2019-05-24 2022-08-09 アプライド マテリアルズ インコーポレイテッド 結合層の保護が改善された基板支持キャリア

Also Published As

Publication number Publication date
WO1999044221A1 (fr) 1999-09-02

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Legal Events

Date Code Title Description
A300 Application deemed to be withdrawn because no request for examination was validly filed

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20050510