JPH1124251A - Dry film, method for producing the same, transfer method and transfer apparatus for dry film - Google Patents

Abstract

(57) [Problem] To enable peeling of a base film without causing damage or chipping on a transfer medium and a transfer-receiving medium. SOLUTION: A cutting line a is previously inserted into a protective film Fc of a dry film F composed of a base film Fa, a material layer Fb, and a protective film Fc, or a cutting line is inserted into the protective film in parallel during lamination. After transferring the dry film F while leaving a part of the protective film Fc, the remaining part of the protective film Fc is used as a trigger for peeling the base film Fa. Since there is no need to create a trigger by using a roller or a needle, scratches and chips are not generated on the transfer medium or the transfer-receiving medium.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a general dry film resist used as an etching mask for forming a pattern, a plasma display panel (PDP),
The present invention relates to a dry film used for forming an insulating pattern and a conductive pattern in a field emission display (FED), a liquid crystal display (LCD), a fluorescent display, a hybrid integrated circuit, and the like, particularly, a barrier, an electrode, and a dielectric layer in a PDP. And a dry film suitably used for forming a fluorescent screen.

[0002]

2. Description of the Related Art In general, a dry film is composed of a base film, a material layer and a protective film. At the time of use, the protective film is firstly peeled off, and if necessary, laminated while being heated and pressurized while being heated. ,
By peeling the base film from the material layer, the material layer is transferred onto the transfer medium. However, the base film and the material layer are strongly adhered to each other so as not to peel when the protective film is first peeled off. Can not do it. Therefore, conventionally, using a roller of metal, resin, rubber, etc., or using a device arranged so that the axial direction of the roller has an angle with respect to the moving direction of the roller, or squeezing the edge of the base film, The edge of the base film was plucked with a sharp needle to create a trigger for peeling. After that, the base film was peeled off by blowing air onto the end of the dry film, which had been triggered, or the base film was peeled off with an adhesive tape.

[0003]

However, when the base film is peeled off by the above-described method, the material layer as the transfer medium, the glass substrate as the transfer medium, the layer formed on the lower portion, and the layer to be etched are formed. There has been a problem that the surface of the layer or the like is scratched or chipped. In particular, when the material layer is not formed of a photosensitive material, such scratches and chips remain on the product as a final laminate, which causes a problem in appearance or characteristics. Further, even in the case of a photosensitive material, there is a problem that the cleanness is reduced because the missing material layer scatters in the apparatus.

The present invention has been made in view of such problems, and an object of the present invention is to make it possible to peel off a base film without causing scratches or chips on a transfer medium or a transfer-receiving medium. An object of the present invention is to provide a dry film, and also provide a manufacturing method thereof and a transfer method using the same.

[0005]

In order to achieve the above object, a dry film of the present invention comprises a dry film comprising a base film, a material layer and a protective film,
A cutting line is provided along an end of the protective film.

[0006] The dry film having the above structure is manufactured by forming a material layer on a base film, laminating a protective film on the material layer, and forming a cutting line at an end of the protective film.

The above-mentioned dry film is obtained by peeling off the protective film while leaving the outer end portion from the cutting line, laminating the dry film on a transfer-receiving medium in a state where the end portion of the protective film is left, and then removing the end of the protective film. By peeling the base film together with the portion and the material layer on the end portion, the base film can be transferred to the transfer-receiving medium. The transfer method includes a mechanism for holding the winding of the dry film, a mechanism for stacking the dry film on the medium to be transferred while feeding the dry film from the winding, and a mechanism outside the cutting line between the mechanisms. This is performed by using a device provided with a mechanism for peeling off the protective film while leaving the end portion.

[0008] When using a dry film comprising a base film, a material layer, and a protective film and having no cutting line in advance, a cutting line is formed along the edge of the protective film, and an outer end portion from the cutting line is cut. The protective film is peeled off, and the dry film is laminated on the medium to be transferred while leaving the end portion of the protective film, and then the base film is peeled off together with the end portion of the protective film and the material layer on the end portion. It can be transferred to a transfer receiving medium. And
This transfer method includes a mechanism for holding the winding of the dry film, a mechanism for laminating the dry film on the medium to be transferred while feeding the dry film from the winding, and a mechanism along the edge of the protective film between the mechanisms. This is performed by using an apparatus provided with a mechanism for inserting a cutting line and a mechanism for peeling off the protective film while leaving an outer end portion from the cutting line.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION As the base film, a material which is not affected by a solvent used for forming a material layer and which does not shrink or stretch due to heat treatment during drying or transfer of the material layer is preferable. . Specifically, polyethylene terephthalate (PET), 1,4 polycyclohexylene dimethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polystyrene (P
S), polypropylene (PP), polysulfone, aramid, polycarbonate (PC), polyvinyl alcohol (PVA), cellophane, cellulose derivatives such as cellulose acetate, polyethylene (PE), polyvinyl chloride, nylon, polyimide, ionomer, etc. A sheet, a metal sheet such as aluminum, copper, and invar, a ceramic sheet, a laminated sheet thereof, or the like is used.

On the other hand, the protective film is preferably made of a material having a lower adhesiveness to the material layer than the base film. When a material of the same kind as the above-mentioned base film is used, it is desirable to carry out a release treatment with silicone or the like. When a PET film is used as the base film, it is preferable to select a material having low affinity with the material layer, such as polyethylene (PE) or polypropylene (PP).

The method for producing a dry film according to the present invention is as follows. First, die coat on the base film,
The material for forming the material layer is applied by a coating method such as blade coating, roll coating, gravure reverse coating, and gravure direct coating, and dried. Then
The protective film is laminated on the material layer. If cutting lines are formed on the protective film in a dry film state, 0.5 to 2.0 c from the end immediately after lamination.
It is preferable to form a cutting line by applying a cutter or the like to a part of m (usually about 1 cm). In addition, this cutting line may cut not only the protective film but also the material layer together. The formation of such a cutting line is not essential as described later, and the cutting may be performed while cutting so as to leave an end when the protective film is separated.

The dry film of the present invention may be in the form of a sheet or a roll which has been wound up. However, when a cutting line is formed in advance in the roll-shaped dry film, a cutter is applied to the end like a slit. However, it is preferable that the base film is wound while being cut in such a manner that the cutter blade is inserted by the thickness of the protective film or by the thickness of the protective film and the material layer so as not to cut the base film.

There are two methods for transferring a dry film according to the present invention. The first method is a method using a dry film on which a cutting line has been formed in advance. In this case, the protective film is peeled off leaving only the end portion on the material layer, and the dry film in this state is transferred. The base film is peeled with a peeling device by blowing air to the end of the base film while heating, if necessary, or the base film is peeled with a cellophane tape. The second method is a method using a dry film on which a cutting line is not formed. In this case, a cutter or the like is applied at the time of peeling the protective film so that only the end is left on the material layer while the protective film is removed. It is peeled off, and then transferred onto the material to be transferred in the same manner as in the first method.

FIG. 1 is a schematic diagram showing an example of an apparatus for performing a first transfer method. This transfer apparatus is configured to wind a dry film F including a base film Fa, a material layer Fb, and a protective film Fc. And a mechanism for laminating the dry film F on the transfer medium 12 while feeding out the dry film F from the winding 11 (the laminate rolls 13 and 14 performing thermocompression bonding in this example), and a mechanism between the mechanisms. And a mechanism for peeling off the protective film Fc leaving the outer end portion from the cutting line a. A combination of the guide rod 15 and the winding shaft 16 may be used as a mechanism for peeling the protective film Fc as shown in the figure. In FIG. 1, the cutting line a is provided on both sides of the dry film F, but may be provided on only one side.

FIG. 2 is a schematic structural view showing an example of an apparatus for performing the second transfer method. This transfer apparatus includes a mechanism for holding the winding 11 of the dry film F, and a mechanism for transferring the dry film F from the winding 11. A mechanism for laminating the dry film F on the medium to be transferred 12 while being fed (lamination rolls 13 and 14 for thermocompression bonding in this example), and a cutting line b between the mechanisms along the end of the protective film Fc. Mechanism and the protective film F leaving the outer end portion from the cutting line b.
A mechanism for separating c is provided. As a mechanism for inserting the cutting line b, a circular cutter 17 as shown in the figure may be used. In FIG. 2, two cutters 17 are arranged to form cutting lines b on both sides of the dry film F. However, only one cutter 17 is used and cutting lines b are formed only on one side.
May be formed.

FIG. 3 is a schematic structural view showing another example of an apparatus for performing the second transfer method. This transfer apparatus includes a mechanism for inserting a cutting line along the edge of the protective film Fc, and a cutting line. A mechanism for peeling off the protective film Fc while leaving the outer end portion is integrated. That is, the circular cutter 17 into which the cutting line is inserted has a role of a guide when peeling the protective film Fc, so that the cutting and peeling of the protective film Fc are performed simultaneously. Also in this case, the cutter 17
And the cutting line may be inserted only on one side.

FIG. 4 is a sectional view showing a state before and after the base film is peeled off. In either transfer method,
The transfer-receiving medium 1 is kept in a state where the end portion of the protective film Fc is left.
Since the dry film F is laminated on the transfer medium 2, a band-shaped protective film Fc is interposed between the material layer Fb and the transfer medium 12 at the end portion as shown in FIG. Therefore, the end portion of the protective film Fc and the material layer F on the end portion
4b by peeling the base film Fa together with
The material layer Fb can be transferred to the transfer medium as shown in FIG. When the dry film F is laminated on the transfer medium 12 while leaving the end portion of the protective film Fc only on one side, a strip-shaped protective film is formed between the material layer Fb and the transfer medium 12 at one end. Since Fc is interposed, peeling is performed with this side as an edge.

The dry film of the present invention is used for transferring its material layer onto a material to be transferred such as a substrate. By subjecting this transferred material layer to pattern processing, various thick films are formed on the material to be transferred. A pattern can be formed.
In particular, it is suitably used for forming a barrier, an electrode, a dielectric layer, and a phosphor screen in a PDP. Hereinafter, an application example of the PDP will be described as an example.

In general, a PDP has a structure in which a pair of electrodes arranged regularly on two opposing glass substrates are provided, and a gas mainly composed of Ne, Xe, or the like is sealed between the electrodes. Then, by applying a voltage between these electrodes and generating a discharge in a minute cell around the electrodes,
Each cell emits light to perform display. In order to display information, regularly arranged cells are selectively caused to emit light. There are two types of PDPs, a direct current type (DC type) in which the electrodes are exposed to the discharge space, and an alternating current type (AC type) in which the electrodes are covered with an insulating layer. And a refresh driving method and a memory driving method.

FIG. 5 shows an example of the configuration of an AC type PDP. This figure shows the front plate and the back plate separated from each other. As shown in the figure, two glass substrates 1 and 2 are arranged in parallel and opposed to each other, and both become the back plate. The barriers 3 provided on the glass substrate 2 in parallel to each other are held at a constant interval. The barrier 3 may be white in order to increase the brightness or black in order to improve the contrast. In order to take advantage of both, a structure in which a black barrier is formed on the front plate side of the white barrier. Is said to be particularly preferable. On the back side of the glass substrate 1 serving as a front plate, composite electrodes composed of a sustain electrode 4 which is a transparent electrode and a bus electrode 5 which is a metal electrode are formed in parallel with each other, and a dielectric layer 6 is covered thereover. And a protective layer 7 (MgO
Layer) is formed. On the front side of the glass substrate 2 serving as a back plate, address electrodes 8 are formed parallel to each other and located between the barriers 3 so as to be orthogonal to the composite electrodes, and a dielectric layer 9 is formed thereon. The phosphor 10 is provided so as to cover the wall surface of the barrier 3 and the cell bottom surface. The AC type PDP is of a surface discharge type, and has a structure in which an AC voltage is applied between composite electrodes on a front panel to discharge by an electric field leaking into a space. In this case, since the alternating current is applied, the direction of the electric field changes according to the frequency. Then, the phosphor 10 emits light by the ultraviolet light generated by the discharge, and the light transmitted through the front plate is visually recognized by the observer.

In the above-mentioned AC type PDP, electrodes, barriers, dielectric layers, and phosphors are formed in a thick film pattern on a glass substrate at the time of manufacturing the PDP. A method of transferring the material layer of the dry film of the invention and patterning the same can be employed.

When a barrier is formed using the dry film of the present invention, a dry film in which a material layer made of a barrier material and a protective film are laminated on a base film is used. Then, after transferring the material layer onto the substrate, patterning is performed by a sand blast method or the like. Alternatively, a photosensitive barrier material may be used for the material layer, and patterning may be performed by a photolithography method.

As the barrier material, a glass frit containing a low melting point glass frit containing PbO as a main component, a refractory filler for stabilizing the shape at the time of firing and a binder resin is used. Further, a solvent, an additive and the like are added as necessary.

As the low melting glass, Pb is used as a main component.
In order to provide an effect of preventing phase separation of glass, containing 50% or more of O, adjusting the softening point, and adjusting the thermal expansion coefficient to the glass substrate, Al ₂ O ₃ , B ₂ O ₃ , S
Those containing iO ₂ , MgO, CaO, SrO, BaO and the like are generally used. Also, its softening point is 350-
At 650 ° C., the coefficient of thermal expansion α ₃₀₀ is 60 × 10 ⁻⁷ / ° C. to 1
The thing of 00 × 10 ⁻⁷ / ° C. is preferable. As the refractory filler, those which do not soften at a sintering temperature of about 500 to 600 ° C. can be widely used, and ceramic powders such as alumina, magnesia, calcia, cordierite, silica, mullite, zircon, zirconia, etc., which can be obtained at low cost, The body is preferably used. Then, a dark pigment is added to make the barrier light-blocking. Co-Cr-Fe, Co-Mn-Fe, Co-Fe-M
n-Al, Co-Ni-Cr-Fe, Co-Ni-Mn
-Cr-Fe, Co-Ni-Al-Cr-Fe, Co-
Mn-Al-Cr-Fe-Si or the like is used. on the other hand,
To make the barrier light reflective, a light colored pigment is added.
As the light pigment, titania (TiO ₂ ) or the like is used.

The content of the low melting point glass in the inorganic component is 50.
~ 80% by weight is preferred. If the amount is too large, the shape retention due to firing is difficult. Further, it is not preferable because the debinding property is impaired and the denseness is deteriorated. If too little,
The gap between the refractory fillers cannot be filled sufficiently, and the mechanical strength after firing decreases at the same time as the compactness deteriorates,
Chipping occurs during panel sealing.

The binder resin is required to burn / decompose / vaporize at a low temperature, and that no carbides remain in the barrier.
Ethyl cellulose, methyl cellulose, nitrocellulose, cellulose acetate, cellulose propionate, cellulose resin such as cellulose butyrate, or methyl methacrylate, ethyl methacrylate, normal butyl methacrylate, isobutyl methacrylate,
An acrylic resin made of a polymer or copolymer such as isopropyl methacrylate, 2-ethylmethyl methacrylate, or 2-hydroxyethyl methacrylate is preferably used. Alternatively, a photosensitive binder resin can be used, and a prepolymer, an oligomer, and / or a monomer having a polymerizable unsaturated bond in a molecule can be appropriately mixed and used. For example, unsaturated polyesters such as a condensate of an unsaturated dicarboxylic acid and a polyhydric alcohol, acrylates, methacrylates, and the like are used. In the case of an ultraviolet curable type, those obtained by adding a photoinitiator are used. These binder resins are preferably added in an amount of about 1.0 to 20% by weight based on the inorganic component. However,
If the addition ratio of the binder resin is too high, the flexibility increases, and the grinding speed by sandblasting becomes slow. Therefore, when forming by the sandblasting method, the temperature at which the binder resin is burned off and the glass frit does not completely fuse. It is preferable to perform preliminary calcination at a temperature and then perform sandblasting.

Further, as additives, a plasticizer, a surfactant, an antifoaming agent, an antioxidant and the like are used as required.
Of these, phthalates, sebacates, phosphates, adipic esters, glycolates, citrates, and the like are generally used as plasticizers. The amount of the plasticizer is preferably 5 to 30% by weight based on the weight of the inorganic component. However, if the addition rate of the plasticizer is too high, the flexibility of the resin increases, and the grinding speed by sandblasting becomes slow.When forming by the sandblasting method, the temperature at which the plasticizer burns off and the glass frit is completely fused. It is preferable to perform a preliminary calcination at a temperature at which the blasting is not performed, and then perform a sand blast treatment.

The solvent used for the barrier material paste is preferably a good solvent for the binder resin to be used, and terpionel, butyl carbitol acetate and the like are suitably used. The selection of the solvent is made mainly in consideration of the volatility of the solvent and the solubility of the binder resin used. If the solubility of the solvent in the binder resin is low, the viscosity of the coating liquid becomes high even at the same solid content ratio, causing a problem that coating suitability is deteriorated. If the content of the solvent is too small, the viscosity of the rib material paste becomes too high, and it is difficult to remove bubbles in the paste,
It is not preferable because problems such as poor smoothness of the coated surface due to poor leveling occur. Conversely, if too large, the sedimentation of the dispersed particles becomes faster, and it becomes difficult to stabilize the composition of the rib material, and a large amount of energy and time is required for drying. Is 5 to 40% by weight.

When an electrode is formed by using the dry film of the present invention, a dry film in which a material layer made of an electrode material and a protective film are laminated on a base film is used. Then, after transferring the material layer onto the substrate, patterning is performed by a sand blast method or the like. Alternatively, a photosensitive electrode material may be used for the material layer, and patterning may be performed by a photolithography method.

The electrode material is composed of an inorganic component composed of the low melting point glass frit, a conductive powder and a thermoplastic resin, and contains an additive such as a thickener if necessary. As the low melting point glass frit, the above-mentioned materials are used, and particularly, those having an average particle diameter of 0.3 to 5 μm are preferably used. Also, as the conductive powder, gold, silver,
Copper, nickel, aluminum and the like are used, and those having an average particle size of 0.1 to 5 μm are preferably used. Conductive powder 1
It is preferable to add 2 to 20 parts by weight of the low melting point glass frit to 00 parts by weight. As the binder resin, any of the above-mentioned materials can be used, and it is preferable to add 3 to 50% by weight, more preferably 5 to 30% by weight, in the electrode forming paste.

Similarly, when a dielectric layer is formed using the dry film of the present invention, a dry film in which a material layer made of a dielectric material and a protective film are laminated on a base film is used. However, if the dielectric layer is a pattern that does not form only the electrode terminal extraction part on the outer periphery of the substrate, patterning by sandblasting or the like is not necessary after transferring the material layer onto the substrate, and patterning is performed by cutting at the cutting line. Can be. In addition, cutting lines are not necessary on four sides, prepare a dry film of the required width in advance,
After the alignment and transfer onto the substrate, patterning can be performed by cutting one end. Also, when forming the cutting lines, if the cutting lines are formed on the dielectric material layer together with the protective film, being careful not to cut the base film, the edge of the material layer may be roughened when the base film is peeled off. A clean cross section can be obtained without any. As the dielectric material, the same material as the above-described barrier material can be used.

When a fluorescent screen is formed using the dry film of the present invention, a dry film in which a material layer made of a fluorescent screen material and a protective film are laminated on a base film is used. The phosphor screen material is composed of a phosphor and a binder resin that can be used for the barrier, to which a plasticizer or the like is added as necessary. Then, lamination is performed on the substrate on which the barrier is formed while heating as necessary, and after filling a material layer between the barriers, patterning is performed by a sandblast method or the like, or patterning is performed by using a photosensitive material by a photolithography method. Alternatively, a mask material may be provided in a non-formed portion between barriers in advance, and only necessary cells may be filled.

The phosphor is contained in an amount of 1 to 50 parts by weight, preferably 10 to 30 parts by weight, based on 100 parts by weight of the binder resin. If it exceeds 50 parts by weight, it is difficult to form a dry film, and if it is less than 1 part by weight, the luminance of the phosphor screen is insufficient. The plasticizer is used in an amount of 0 to 90 with respect to the binder resin.
Parts by weight can be added. Increasing the amount of plasticizer in the material facilitates firing.

When an etching resist or a sand blast mask is formed using the dry film of the present invention, a dry film in which a material layer made of a photoresist material and a protective film are laminated on a base film is used. This can be used by cutting lines into a commercially available dry film resist or the like.

[0035]

【Example】

(Embodiment 1) In this embodiment, a dry film in which a material layer made of a dielectric material and a protective film are laminated on a base film is used. Specifically, after a mixture of the following composition A is mixed and dispersed by a bead mill using ceramic beads, it is comma-coated on a PET film (base film), dried at 100 ° C., and then subjected to a PET release treatment. A film (protective film) was laminated to form a dry film having a dielectric material layer with a thickness of 180 μm.

<Composition A> Glass frit {main component: Bi ₂ O ₃ , ZnO ₂ , B ₂ O ₃ (alkali-free), average particle size 3 μm} 70 parts by weight ・ TiO ₂ 3 parts by weight ・ Al ₂ O ₃ 7 parts by weight-10 parts by weight of n-butyl methacrylate / hydroxyethylhexyl methacrylate copolymer (8/2)-7 parts by weight of benzyl butyl phthalate-20 parts by weight of propylene glycol monomethyl ether

Then, the dry film was positioned and laminated on a glass substrate on which a base layer and electrodes had been previously formed while peeling off the protective film.
That is, lamination was performed by a hot roll using an auto cut laminator (“ACL-900” manufactured by Asahi Kasei Corporation) equipped with a mechanism for cutting a protective film, with a preheat temperature of 60 ° C. and a lami roll temperature of 120 ° C. Actually, a device in which a circular cutter is disposed between the dry film unwinding mechanism and the protective film winding mechanism as shown in FIG. 2 is used so as not to cut the dry film base film produced above. While controlling the cutter, a cutting line was inserted at a position of 1 cm from the end of the protective film, and the protective film was continuously peeled off while leaving the end from the cut line.

In this embodiment, an apparatus provided with a mechanism for inserting a cutting line and a mechanism for separating a protective film is used separately. However, an apparatus for simultaneously cutting and winding the protective film as shown in FIG. 3 is used. May be used.

Next, using the remaining portion of the protective film as a trigger, the base film was peeled off by blowing air from the side, and baked at a peak temperature of 570 ° C. to form a dielectric layer. The dielectric layer produced in this manner had no scratches or chips at the ends and had a sufficient function as a dielectric layer.

(Embodiment 2) In this embodiment, a dry film in which a cutting line is previously formed in a protective film is used. Specifically, first, a mixture of the following composition B was mixed and dispersed by a bead mill using ceramic beads.
PE coated on an ET film (base film) by die coating, dried at 120 ° C., and then release-treated
Laminating T film (protective film)
A dry film having a barrier material layer of 80 μm was formed. Next, when cutting the dry film according to the width of the substrate to be transferred, while controlling the cutter so as not to cut the base film, a cutting line of the release-treated protective film is inserted at a position of 1 cm from the cutting portion. Thus, a dry film of the present invention was produced.

<Composition B> 65 parts by weight of glass frit (“MB-008” manufactured by Matsunami Glass Industry) 10 parts by weight of α-alumina RA-40 (manufactured by Iwatani Chemical Industry) ・ Dipiroxide Side Black # 9510 (Dainichisei) 10 parts by weight ・ Ethyl cellulose 4 parts by weight ・ Bis (2-ethylhexyl) phthalate 4 parts by weight ・ Dimethyl phthalate 8.5 parts by weight ・ Propylene glycol monomethyl ether 5 parts by weight ・ Isopropyl alcohol 20 parts by weight

Then, the above-prepared dry film was laminated on a substrate in which an underlayer and an electrode were previously formed on a glass substrate. Specifically, while using an auto cut laminator (“ACL-900” manufactured by Asahi Kasei Corporation) so as to peel off the protective film so as to leave an end portion from the cutting line, a preheat temperature of 60 ° C. and a ramirole temperature of 120 are used. The laminate was formed by a hot roll at a temperature of ° C.
Then, triggered by the remaining part of the protective film,
The base film was peeled off by blowing air from the side, and the plasticizer was removed by heating at 200 ° C. for 20 minutes to form a barrier layer on the substrate.

Next, a commercially available negative-type dry film resist (“NCP225” manufactured by Nippon Synthetic Chemical Industry, 25 μm)
Similarly, a cutting line was cut in the protective film of m), the protective film was peeled off leaving a part thereof, and the protective film was laminated on the barrier layer formed above with a hot roll at 120 ° C. With the base film still formed on the dry film resist, a line pattern mask having a line width of 80 μm and a pitch of 220 μm was aligned and arranged, and after irradiating with ultraviolet light, the remaining portion of the protective film was used as a trigger for the base. The film was peeled off and spray-developed using a 1% by weight aqueous solution of sodium carbonate to form a sandblasting mask.

Subsequently, the barrier layer at the opening of the resist pattern was sandblasted by a sandblasting device. After patterning the barrier layer in this manner, the sand blast mask is sprayed off using a 2% by weight aqueous solution of sodium hydroxide, washed with water, dried at 80 ° C. for 15 minutes, and baked at a peak temperature of 570 ° C. Formed a barrier.

Then, R, G, and B phosphor screens are formed between the barriers, and an electrode, a dielectric layer, and MgO are formed on another glass substrate.
A front plate having a layer formed thereon was prepared, sealed together with the front plate, and then filled with a rare gas to produce an AC type PDP.

[0046]

According to the present invention, a cutting line is previously formed in a dry film protective film composed of a base film, a material layer, and a protective film, or a cutting line is formed in a protective film in parallel with lamination. After transferring the dry film while leaving a part of the protective film, the part of the remaining protective film is used as a trigger when peeling off the base film, so there is no need to create a trigger with rollers or needles Therefore, various functional layers such as electrodes, dielectrics, barriers, and fluorescent screens having good appearance without causing scratches or chips on a material layer as a transfer medium or a glass substrate as a medium to be transferred are formed. Can be. In addition, since there is a certain trigger, so-called peeling error does not occur, which can contribute to stabilization of the manufacturing process.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram illustrating an example of an apparatus that performs a first transfer method.

FIG. 2 is a schematic configuration diagram illustrating an example of an apparatus that performs a second transfer method.

FIG. 3 is a schematic configuration diagram illustrating another example of an apparatus that performs a second transfer method.

FIG. 4 is a cross-sectional view showing a state before and after peeling a base film.

FIG. 5 is a structural diagram showing one configuration example of an AC type plasma display panel in a state where a front plate and a back plate are separated.

[Explanation of symbols]

 Reference numerals 1 and 2 Glass substrate 3 Barrier 4 Sustain electrode 5 Bus electrode 6 Dielectric layer 7 Protective layer 8 Address electrode 9 Dielectric layer 10 Phosphor F Dry film Fa Base film Fb Material layer Fc Protective film 11 Winding 12 Transfer medium 13 , 14 Laminating roll 15 Guide rod 16 Winding shaft

Claims (12)

[Claims] 1. A dry film comprising a base film, a material layer and a protective film, wherein a cutting line is provided along an end of the protective film. 2. The dry film according to claim 1, wherein the material layer comprises an inorganic powder containing at least glass frit and a binder resin. 3. The dry film according to claim 2, wherein the material layer is formed of an insulating material. 4. The dry film according to claim 2, wherein the material layer is formed of a barrier material of a plasma display panel. 5. The dry film according to claim 2, wherein the material layer is formed of an electrode material. 6. The dry film according to claim 1, wherein the material layer comprises a phosphor and a binder resin. 7. The dry film according to claim 1, wherein the material layer is formed of a photosensitive resin. 8. A method for producing a dry film comprising a base film, a material layer and a protective film, wherein a cutting line is provided along an edge of the protective film, wherein a material layer is formed on the base film, A method for producing a dry film, comprising: laminating a protective film on a material layer; and forming a cutting line at an end of the protective film. 9. A method for transferring a material layer of a dry film comprising a base film, a material layer and a protective film and having a cutting line provided along an edge of the protective film, wherein an outer end portion from the cutting line is transferred. After leaving the protective film peeled off and laminating the dry film on the transfer receiving medium while leaving the end portion of the protective film, peeling off the base film together with the end portion of the protective film and the material layer on the end portion. Characteristic dry film transfer method. 10. An apparatus for transferring a material layer of a dry film comprising a base film, a material layer and a protective film and provided with a cutting line along an edge of the protective film, and holding the winding of the dry film. A mechanism, a mechanism for laminating the dry film on the medium to be transferred while unwinding the dry film from the take-up, and a mechanism for separating the protective film while leaving the outer end portion from the cutting line are arranged between the mechanisms. A dry film transfer device, characterized in that: 11. A method for transferring a material layer of a dry film comprising a base film, a material layer, and a protective film, wherein a cutting line is formed along an edge of the protective film, and an outer end portion is cut from the cutting line. Peel off the protective film leaving
A method of transferring a dry film, comprising: laminating a dry film on a medium to be transferred while leaving an end portion of the protective film, and then peeling off a base film together with an end portion of the protective film and a material layer on the end portion. . 12. A device for transferring a material layer of a dry film comprising a base film, a material layer and a protective film, comprising a mechanism for holding up the winding of the dry film, and a device for transferring while feeding the dry film from the winding. A mechanism for laminating a dry film on a medium, a mechanism for inserting a cutting line along the edge of the protective film between the mechanisms, and a mechanism for peeling off the protective film while leaving the outer end portion from the cutting line are arranged. A dry film transfer device, characterized in that it is installed.