JPH1126559A - Multiple sensors - Google Patents

Abstract

(57) [Summary] The present invention can reduce the cost of a multiple sensor that requires an address display and display the multiple sensor on either the front or back side. It is an object of the present invention to provide a multiple sensor having a feature that can display an address even when attached to a device and has a feature that makes an address easily visible. The present invention relates to a multiple sensor formed by arranging a plurality of sensors in parallel, wherein an address indicating an address of each sensor is provided on a side surface of the case holding the sensors on the sensor parallel side. The code is formed directly,
Further, the address code is directly formed on both sides of the case on the sensor parallel side, a predetermined number of the address code is formed to be larger than other codes, and the case corresponds to the address code. A scale is formed on the detection side of the side surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to, for example, a plurality of transmission type photoelectric sensors for detecting an object which are arranged side by side to form a multiple type, and for example, a plurality of aligned and stored wafers can be detected. Related to a simple multiple sensor.

[0002]

2. Description of the Related Art As an example of the above-mentioned multiple sensor, there is a wafer sensor for detecting a wafer used in a process of manufacturing a semiconductor integrated circuit.
No. 307, Tokuhei 6-11070).

[0003] In this type of wafer sensor, a plurality of pairs of light emitters and light receivers are arranged to face each other so as to sandwich a wafer and protrude from a case body. Such a wafer sensor monitors the presence / absence of a wafer for each lot in the manufacturing process and checks the number of wafers to be supplied to the next process.

As shown in FIG. 1, when the above-described wafer 10 is transferred to each step, the wafer 10 is stored in a wafer carrier 11 and transferred. The wafer carriers 11 are separated from each other by a predetermined distance and arranged in a row. A container formed so as to be placed and housed therein. The bottom is opened so that a part of the wafer 10 can be seen. And is provided so as to detect the inner wear 10 from the bottom of the wafer carrier 11.

The upper and lower edges 14, 14 of the above-mentioned wafer carrier 11 correspond to the storage positions of the wafers 10.
For example, if there are 25 storage positions, numbers 1 to 25 are assigned as address numbers (signs) A, and the side of the wafer sensor 12 described above corresponds to the address number A of the wafer carrier 11 described above. It is desirable to form an address number. When the wear sensor 12 is mounted on the elevating base 13 and its position is adjusted, the operator can easily confirm which one of the wafer sensors 12 corresponds to the wafer 10 at which address of the wafer carrier 11. Because you can.

FIG. 2 shows an example in which an address number B is formed on the wafer sensor 12 described above.
Is printed on the film 15 and the film 15 is attached to the side surface of the wafer sensor 12 on the sensor parallel side.

However, as shown by the phantom line in FIG. 1, some users work by mounting the wafer sensor 12 on the opposite side (left side in FIG. 1) with respect to the elevating base 13 for installation and workability of the apparatus. There are cases.

Therefore, it is necessary to form the address number B of the wafer sensor on both side surfaces.
If the above-mentioned film 15 is pasted as it is, the address number B is reversed as shown in the film 15a on the left side of FIG. 2, so that a film on which the address number for the left side in the figure is printed is required separately. Providing two types of addressing films in this way not only increases the cost, but also causes a problem in that the right and left films are incorrectly attached when these are attached.

[0009]

SUMMARY OF THE INVENTION According to the present invention, an address can be displayed at a reduced cost for a multiple sensor which requires an address display. It is an object of the present invention to provide a multiple sensor having a feature in which an address can be displayed even if the device is attached to a detection device and the address is easy to see.

[0010]

SUMMARY OF THE INVENTION The present invention is a multiple sensor formed by arranging a plurality of sensors in parallel.
On the side of the case holding the sensor on the sensor parallel side,
It is a multiple sensor in which an address code indicating the address of each sensor is directly formed.

Further, according to the present invention, the address code is directly formed on both side surfaces of the case on the sensor parallel side, and a predetermined number of the address codes is formed larger than other codes. A scale is formed on the detection side of the side of the case in correspondence with the address code, and furthermore, the wafer sensor is configured to detect aligned wear using these multiple sensors.

[0012]

According to the present invention, an address code is formed on a mold for molding a case of a multiple sensor with resin. Alternatively, since it is formed directly on the case, for example, by printing on the case by a printing means, the cost can be reduced, and furthermore, erroneous address assignment can be prevented. Further, there is no occurrence of displacement, and the quality is stabilized. Further, when address codes are formed on the above-mentioned mold, the number of assembling steps can be reduced.

Further, by forming address codes on both side surfaces of the case, the mounting surface can be selected when mounting to a device for detecting a multiple sensor, so that mounting adjustment is easy.

Further, by forming a predetermined number of address codes larger than the other codes, and by forming a scale on the detection side of the case side surface in correspondence with the address code, the address code is easy to see, and the scale is easy to read. This makes it easier to confirm the correspondence with the object to be detected, facilitates the work of mounting the multiple sensors and adjusting the position thereof, and furthermore, when used as a wafer sensor, can further exert the above-described effects.

[0015]

An embodiment of the present invention will be described below with reference to the drawings. The drawing shows a wafer sensor 12 as an example of a multiple sensor. In FIG. 3, the above-described wafer sensor 12 includes a case 20, a plurality of detection arms 21 projecting upward from the upper end of the case 20, and a photoelectric sensor. The light projecting unit and the light receiving unit constituting the sensor are housed inside the case, and the detection arm 21 guides the light emitted from the light projecting unit to a detection area outside the case 20, and transmits the light transmitted through the detection area. To the light receiving section.

In order to detect the wafers 10 stored in the wafer carrier 11 shown in FIG. 1, the detection arms 21 described above are arranged in an array (parallel shape) corresponding to the storage intervals. It is formed in a comb shape, and the space between the detection arms 21 is set as a detection area.

Therefore, the number of stored wafers 10 is 25
In the case of a single wafer, the above-described detection area is set at 25 locations, 26 detection arms 21 are arranged, and a position corresponding to the wafer 10 is provided between the detection arms 21. After setting, the address numbers B are sequentially displayed in numerical order from the left side in the figure on the side surface of the case 20 on the side where the detection arms 21 are arranged in parallel, corresponding to the address number (code) A of the wafer carrier 11 described above. Also, in this display,
Number "1""5""10" every 5th of the number of address numbers
Are formed larger than the characters of the other numbers.

Further, corresponding to the above address position,
A scale C is provided in a scale shape near the detection arm 21 on the side surface of the case 20, and the scale corresponding to the address number B of the large character is formed longer than the other scales.

The above-mentioned address number B and scale C are formed in a mold for molding the case 20 with resin, and are formed by resin molding of the case 20. In the figure, 22 is a cable for inputting and outputting a control signal and a detection signal, and 23 is a connector connected to the end thereof.

FIG. 4 shows the back side of the wafer sensor 12 shown in FIG.
And the scale C are formed by the same forming method. However, the address numbers B are sequentially displayed from the right side in the figure, and are formed such that the address positions on the front side shown in FIG.

FIG. 5 shows a cross section taken along the line Y--Y in FIG. 4, wherein the case 20 comprises a case body 24 and a case cover 25, and the base of the detection arm 21 is the case body 24.
And a light emitting unit 26 and a light receiving unit 2
7 is fitted and held.

The light projecting section 26 is, for example, a light emitting diode as a light projecting element, and its light projecting surface is directed toward the light projecting window 27 of the detection arm 21. The light receiving unit 28 is, for example, a photodiode serving as a light receiving element, and has its light receiving surface facing the light receiving window 29 of the detection arm 21.

The detection arm 21 is connected to a substrate 30 mounted inside the case 20, and the above-mentioned light projecting unit 26 and light receiving unit 28 are connected to a detection circuit formed on the substrate 30.

FIG. 6 shows a perspective view of the above-described detection arm 21. As shown, the detection arm 21 includes two element storage portions 31, 32, a case body attachment portion 33, and two parallel extending members. It is composed of arms 34 and 35 and a tip 36 connecting the tips of the two arms, which are integrally formed of black opaque synthetic resin. Further, the above-mentioned light projecting portion 26 is press-fitted and held in the element housing portion 31, and the light receiving portion 28 is press-fitted and held in the element housing portion 32 by fitting a cylindrical shield member 37.

On the inner surface 36a of the distal end portion 36 of the detection arm 21, the first and second reflection surfaces 39 and 40 inclined at 45 degrees with respect to the optical axes of the light projecting portion 26 and the light receiving portion 28 are integrally formed. Is formed.

The first reflecting surface 39 forms the outward light path R1 so that the light projected from the light projecting section 26 is bent in the vertical direction toward the detection area, and travels toward the detection area. The second reflection surface 40 is a light of a return light path R3 which is reflected by a reflection part of another detection arm (not shown) provided opposite to the detection arm 21 and whose return light path R2 is transmitted through the detection area. Is vertically bent toward the light receiving unit 28 and reflected toward the light receiving unit 28.

Further, the portion of the case main body attaching portion 33 shown on the lower right side of the two-dot chain line XX in FIG.
The arm portion 34, which is fitted and mounted in a mounting groove (not shown) of the detection arm 21 formed on the front surface of the case main body 24 and is shown on the upper left side of the two-dot chain line XX,
35 and the tip portion 36 are provided to protrude forward from the front surface of the case 20.

The detection arm 21 configured as described above,
In order to form one transmission type photoelectric sensor with the pair of the light projecting unit 26 and the light receiving unit 28 and configure the wafer sensor 12, these transmission type photoelectric sensors are arranged in an array (parallel). At this time, the detection arms 21 are arranged and mounted so that the front and back sides are aligned, and the detection arms are opposed to each other across the detection area to form the forward light path R1, the return light path R2, and the return light path R3.

When the thus constructed wafer sensor 12 is mounted on the elevating base 13 shown in FIG. 1, the direction of the arrangement of the numbers of the address numbers B of the wafer sensors 12 is matched with the address number A of the wafer carrier 11. In this mounting, even if the wafer sensor 12 is mounted on the right or left side in FIG. 1, the address number B of the wafer sensor 12 can be confirmed because it is formed on both side surfaces thereof.

Therefore, according to the display of the address of the wafer sensor 12, since the mounting surface of the lifting base 13 is not selected, the mounting adjustment by the user becomes easy.

The address number B is stamped on a mold for molding the case 20 with resin to form the address number B.
Since it is formed directly on the case 20, the cost can be reduced, and furthermore, erroneous address assignment can be prevented.
Further, there is no displacement, the quality is stable, and the number of assembling steps can be reduced.

Further, "1" and "5" of the address number B
A predetermined number, such as "10", "15", "20", or "25", is formed to be larger than other numbers, and a scale C is formed in a scale corresponding to the address number B;
In addition, by forming the scale C corresponding to the above-described large character number long, the address becomes easy to see, and the scale C makes it easy to confirm the correspondence with the wafer 10.

The address number B and the scale C are
It may be formed by printing directly on the case 20 by a printing unit.
Further, the address number B is not a number, but may be another code such as an English character. The configuration of the present invention is not limited to the configuration of the above-described embodiment, but is applied based on the technical idea of the invention described in the claims.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a state where a wafer sensor is attached to a detection device.

FIG. 2 is a perspective view of a wafer sensor showing a problem.

FIG. 3 is a front side view of the wafer sensor.

FIG. 4 is a back side front view of the wafer sensor.

FIG. 5 is a sectional view taken along line YY of FIG. 4;

FIG. 6 is a perspective view of a detection arm.

[Explanation of symbols]

 12 wafer sensor 20 case 21 detection arm 26 light emitting unit 28 light receiving unit B address number C scale

Claims (5)

[Claims] 1. A multiple sensor formed by arranging a plurality of sensors in parallel, wherein an address code indicating the address of each sensor is directly written on a side surface of the case holding the sensors on the sensor parallel side. The formed multiple sensor. 2. The multiple sensor according to claim 1, wherein the address code is formed directly on both side surfaces of the case on the sensor parallel side. 3. The multiple sensor according to claim 1, wherein a predetermined number of codes of the address code are formed larger than other codes. 4. A multiple sensor according to claim 1, wherein a scale is formed on a detection side of a case side surface corresponding to the address code. 5. A wafer sensor for detecting wear arranged using the multiple sensor according to claim 1, 2, 3, or 4.