JPH1126566A - Semiconductor wafer packaging container - Google Patents

Abstract

(57) [Problem] To easily remove a wafer cassette from a container main body, have excellent sealing performance, and further reduce the risk of semiconductor wafer contamination without any reduction in strength. The present invention provides a semiconductor wafer packaging container. A semiconductor wafer packaging container (10) has a first opening / closing member.
(11), a second opening / closing member (12), and a wafer cassette (13) for supporting a plurality of semiconductor wafers in parallel. The wafer cassette (13) has a holding plate portion (13b) formed at the center of the left and right side surfaces, and the holding plate portion (13b) corresponds to a holding portion of the present invention for inserting a finger portion of a robot or a finger of an operator. Gripping hole (13
e) is formed. When the wafer cassette (13) is housed in the second opening / closing member (12) and the container body is in an open state, the second opening / closing member (12) holds the holding recess of the wafer cassette (13). The hole (13e) is provided in the second opening / closing member (1
It is formed to be completely exposed to the outside from the opening edge of 2).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer packaging container provided with a container body comprising first and second opening / closing members for storing and safely transporting semiconductor wafers without damage and contamination. The present invention relates to a semiconductor wafer packaging container capable of smoothly removing a wafer cassette from a packaging container by an automatic machine.

[0002]

2. Description of the Related Art A conventional semiconductor wafer packaging container is a container body comprising a wafer cassette for supporting a plurality of semiconductor wafers in parallel, and first and second opening / closing members such as a bottom case and a lid for accommodating and holding the wafer cassette. , A wafer pressing member and the like. As a general material of the wafer carrier, polycarbonate, polybutylene, or polypropylene is used, and the lid and the bottom case are made of polypropylene or polycarbonate. Further, polyethylene, polypropylene, thermoplastic elastomer, or the like is used for the wafer pressing member.

[0003] The semiconductor wafer is manufactured by thinly slicing a single crystal such as silicon. The semiconductor wafer is highly brittle and has a great influence on physical properties due to contamination. Every effort must be made to prevent it. The semiconductor wafer packaging container not only prevents damage to the wafer due to external impact, but also contamination by particles generated by friction with the wafer pressing member in the container, or intrusion of outside air due to a pressure difference or deformation between the inside and outside of the container. In order to avoid contamination by water, ensure the stability of wafer support during storage and prevent contact friction with the wafer pressing member, etc., and the toughness, impact resistance and airtightness of the container body consisting of the bottom case and lid It is strictly required to ensure the performance.

As shown in FIG. 6, a conventional semiconductor wafer packaging container includes a container body including a bottom case 1 and a lid 2, a wafer cassette 3 housed inside the container main body, and a lid Wafer pressing member 5 attached to the center of the back surface of the second case 2 and the left and right side walls of the bottom case body 1
And a gasket that hermetically seals when the opening of the bottom case 1 is closed by the lid 2. The peripheral edges of the openings of the bottom case body 1 and the lid body 2 are substantially rectangular, and an engaging member 6 for closing and engaging the bottom case body 1 and the lid body 2 is provided at the center of the short edge. Body 1
And the lid 2 are formed integrally with each other. Support grooves are formed in parallel on the arc-shaped inner peripheral wall of the wafer cassette 3, and a plurality of semiconductor wafers are accommodated and supported in the support grooves. In this state, the wafer cassette 3 is housed inside the bottom case body 1, covered with the lid body 2, and
To close. A wafer pressing member 4 having a plurality of support grooves having the same form as the support grooves is attached to the center of the back surface of the lid 2. When closing the semiconductor wafer, the opposing peripheral edges of the plurality of semiconductor wafers housed and supported in the support grooves of the wafer cassette 3 are simultaneously accommodated in the respective support grooves of the wafer pressing member 4 and pressed, so that the semiconductor wafer in the container is pressed. Is firmly supported without rattling.

[0005]

In order to individually extract semiconductor wafers from such a wafer packaging container, first, the wafer cassette 3 accommodating and supporting the semiconductor wafers must be removed from the bottom case body 1. At this time, the lower half of the wafer cassette 3 has a bottom case body 1.
And more than half of the side wall plate formed at the center of the left and right sides of the wafer cassette 3 is housed inside the bottom case body 1. The grip formed at the center of the side wall plate is not completely exposed to the outside. Therefore, at the time of unloading work from the bottom case body 1, the gripping portion of the wafer cassette 3 cannot be reliably gripped with the robot finger or the operator's finger, and the gripping becomes unstable, making it difficult to work.
The wafer cassette 3 may be accidentally dropped and the semiconductor wafer may be damaged, or a finger of an operator or a robot may touch the wafer and contaminate the wafer, or the wafers may come into contact with each other and be damaged.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is easy to take out a wafer cassette from a container body, and it is excellent in sealing performance, and further, there is no reduction in strength. It is another object of the present invention to provide a semiconductor wafer packaging container in which the risk of contamination of a semiconductor wafer is reduced.

[0007]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a container main body comprising a first opening / closing member and a second opening / closing member, which are main components of the present invention, and a plurality of semiconductor wafers housed inside the container main body. A semiconductor wafer packaging container made of a synthetic resin comprising a wafer cassette supported in parallel;
Opening and closing member, when the wafer cassette is housed in the second opening and closing member and the container body is in an open state,
This is achieved by a semiconductor wafer packaging container, characterized in that a grip portion formed at the center of the left and right side surfaces of the wafer cassette is completely exposed to the outside from the opening edge of the second opening / closing member.

When the semiconductor wafer packaging container opens the first opening / closing member and removes the wafer cassette from the second opening / closing member, the grip portion of the wafer cassette is completely removed from the opening edge of the second opening / closing member to the outside. Since it is exposed, the grip portion can be securely gripped, and the removal operation can be easily performed. In addition, since the wafer cassette can be stably gripped, there is no possibility that the cassette is accidentally dropped and the semiconductor wafer is damaged, and since the supporting posture of the wafer is stabilized, the wafers are not contacted with each other and damaged. There is no.

In order to secure the stable holding of the semiconductor wafer in the semiconductor wafer packaging container, the second
It is preferable that a wafer pressing member that grips the periphery of the semiconductor wafer at at least three places is attached to at least the left and right side walls and / or the center side wall of the opening / closing member. Further, the wafer pressing member is attached to each of the left and right side walls and the center side wall, and further,
It is preferable that a wafer pressing member that grips the peripheral edge of the semiconductor wafer at at least one point is attached to the left and right side walls and / or the central side wall portion of the first opening / closing member.

[0010] This point grip means that the periphery of a semiconductor wafer is
For example, the semiconductor wafer is gripped at almost one point by a V-shaped gripping seat, and the semiconductor wafer by the wafer pressing member is drastically compared with a conventional case where the periphery of the semiconductor wafer is linearly gripped over a wide range. Pollution can be reduced. By holding the semiconductor wafer at at least three points by the wafer pressing member attached to the inner wall surface of the second opening / closing member, the semiconductor wafer can be secured in an upright posture without tilting, and adjacently arranged semiconductor wafers To completely prevent contact. When the second opening / closing member is closed by the first opening / closing member to grip the semiconductor wafer in the upright posture, the wafer is held by the holding seat opposite to the wafer pressing member mounted inside the first opening / closing member. And the wafer is not contaminated or damaged by contact with the peripheral portion of the gripping seat.

When the peripheral edges of the openings of the first and second opening / closing members have a substantially rectangular shape, the first and second opening / closing members are closed at the center of the long edge and engaged. Preferably, a member is formed. The engaging member is connected to the first
And the second opening / closing member, or the first and second opening / closing members.
It is formed separately from the opening and closing member. Further, it is preferable that a wafer cassette guide surface is formed above the palm mounting surface and continuous with the palm mounting surface.

Here, a bulging portion for accommodating a holding portion formed at the center of the left and right side surfaces of the wafer cassette is formed on a short side wall of the container body. In order to use the upper surface of the bulging portion as the palm resting surface, an engaging member is formed at the center of the short edge of the opening. However, in the case of a packaging container for storing particularly large semiconductor wafers, as in the present invention, the height of the opening edge of the second opening / closing member is lowered so as to completely expose the gripping portion of the wafer cassette to the outside. In addition, the distance between the upper surface of the bulging portion of the first opening / closing member and the engaging member is increased, and a finger is placed on the engaging member with the palm placed on the upper surface of the bulging portion. It will be difficult to do. However, as described above, since the bulging portion is formed to accommodate the grip portion of the wafer cassette,
It is not possible to change the design such as lowering the bulging portion downward.

Therefore, the present inventors have further studied and found that a cassette guide rib for positioning and guiding with respect to the wafer cassette when the first opening / closing member is closed is provided with the first guide member.
It is formed from the opening edge of the front and rear inner wall surfaces on the long edge side of the opening / closing member to the center side wall edge, and if the rib forming space is used, a palm mounting surface that can secure a sufficient area for mounting the palm is formed. It was found that the position could be freely formed without any restriction.

When a palm resting surface is formed at an appropriate position above the engaging member formed on the first opening / closing member, the first opening / closing member is put on the second opening / closing member. Since the first opening / closing member can be pressed toward the second opening / closing member by pressing a palm against the palm mounting surface when engaging with the engaging member, even if a large-sized wafer is accommodated. Engagement operation is reliably performed even for a heavy container.

Further, by forming a fastening member at the center of the long edge of the rectangular opening, the fastening size of the fastening member can be increased, and the first and second opening / closing members can be made stronger. And a synergistic special operation and effect, such as a reliable hermetic seal being made possible. The design is simplified by eliminating the conventional cassette guide ribs and forming an inclined cassette guide surface continuous with the palm mounting surface on the front and rear inner wall surfaces of the cassette, thereby simplifying the design and forming the first opening / closing member. It will be easier. Further, the cassette guide surface guides the upper edge of the wafer cassette when the second opening / closing member is covered by the first opening / closing member, and automatically moves the upper edge of the wafer cassette to a predetermined fixed position of the first opening / closing member. Position. Therefore, the first opening / closing member does not tilt or shift left and right and back and forth to contact the semiconductor wafer in the wafer cassette, thereby preventing the wafer from being contaminated or damaged.

The center of the side wall of the first opening / closing member constitutes a top plate, and the center of the side wall of the second opening / closing member forms the bottom of the container body. It is preferable that the bottom of the second opening / closing member has a rectangular block-shaped protrusion or a fitting recess in which four corners of the bottom are fitted to each other. In this case, a plurality of wafer packaging containers can be stably stacked by placing the bottom of another packaging container on the top plate of the wafer packaging container.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be specifically described below with reference to the drawings. FIG. 1 is an exploded perspective view showing a typical embodiment of the present invention before assembling a semiconductor wafer packaging container. The semiconductor wafer packaging container 10 of the present invention is used when storing, moving, and transporting a large number of semiconductor wafers that are neatly stored and supported in a wafer cassette.
1, reference numeral 11 denotes a first opening / closing member, 12 denotes a second opening / closing member, 13 denotes a wafer cassette, 14 denotes a wafer pressing member for the first opening / closing member, 15 denotes a pressing member for the second opening / closing member,
16 is a gasket.

The wafer cassette 13 includes front and rear plate portions 13a, 13a having substantially the same shape as the semiconductor wafer.
3b, 13b, the bottom surface is opened at the center, and connected by bottom wall portions 13c arranged on the left and right of the center opening. From the central opening of the bottom wall portion 13c, a portion of the wafer pressing member 15 to be described later that grips the wafer is exposed. Numerous wafer support grooves 13d for supporting a semiconductor wafer are formed on the inner surfaces of the gripping plate portion 13b and the bottom wall portion 13c, and the semiconductor wafer is inserted into each of the wafer support grooves 13d.
It is held upright without being in contact with each other substantially parallel to 3a and 13a. Further, on the outer surface of the gripping plate portion 13b, a gripping recessed hole 13e which is a gripping portion into which a finger portion of a robot or a finger of an operator is inserted is formed.

The first and second opening / closing members 11 and 12 have a rectangular opening periphery, and a gasket fitting groove 12a is formed in the opening peripheral end surface of the second opening / closing member 12, and the gasket 16 is fitted therein. You. Since the gasket 16 is not substantially different from the conventional gasket, its detailed description is omitted. The peripheral edge of the opening of the first opening / closing member 11 is a flat surface 11 for closing the upper part of the gasket fitting groove 12a.
a, and the gasket is hermetically sealed by pressure bonding with the flat surface 11a. A gasket fitting groove may be formed around the opening edge of the first opening / closing member 11 in the same manner as the second opening / closing member 12, and the gasket 16 may be fitted therein to hermetically seal.

The opening / closing members 11 and 12 have an inner surface shape such that the wafer cassette 13 can be accommodated therein in a loosely fitted state. As shown in FIG. 2, the height of the second opening / closing member 12 is the same as that of the holding recess 13 formed in the center of the left and right side surfaces of the wafer cassette 13.
The dimension e is set to a dimension that is completely exposed to the outside from the opening edge of the second opening / closing member 12, and is lower than the second opening / closing member of the conventional semiconductor wafer packaging container. Therefore, when the first opening / closing member 11 is opened and the wafer cassette 13 is taken out from the second opening / closing member 12,
The gripping hole 13e of b is completely exposed to the outside, and the finger portion of the robot or the finger of the worker can be reliably inserted into the gripping hole 13e. Therefore, the wafer cassette 1
The cassette 13 can be pulled up while holding the cassette 3 stably, and the cassette 13 is mistakenly dropped.
There is no risk of damaging the semiconductor wafer. Also,
Since the supporting posture of the wafer is stabilized by holding the cassette 13 stably, the wafers do not come into contact with each other and are not contaminated.

Further, the first opening / closing member 11 has a dimension approximately half the dimension of the long edge 11b from the center of the long edge 11b of the rectangular opening, and a flange 11c as an engaging member is integrally formed. The flange 11c is formed with a plurality of engagement holes 11d. A palm mounting surface 11e is formed at a position above the flange 11c, and a cassette guide surface 11j that is inclined so that front and rear inner wall surfaces following the palm mounting surface 11e narrow toward the top plate portion 11f. Has formed. The cassette guide surface 11j is connected to the first opening / closing member 1
The upper edge of the wafer cassette 13 is guided when the second opening / closing member 12 is put on by 1 and the upper edge of the wafer cassette 13 is automatically positioned at a predetermined fixed position of the first opening / closing member 11. In the center of the opening long edge 12b of the second opening / closing member 12, the engaging hole 11 of the flange 11c is provided.
At the position corresponding to d, an engagement projection 12c is provided to protrude. The palm placement surface 11e and the cassette guide surface 11j
In the conventional first opening / closing member, the cassette guide rib formed on the back surface of the side wall is eliminated, and the space is formed using the space for forming the cassette guide rib. Therefore, the palm mounting surface 1
In forming the cassette guide surface 1e and the cassette guide surface 11j, no special new space is required.

As described above, in the present embodiment, the second
Since the height of the opening / closing member 12 has been reduced, the upper surface of the bulging portion formed on the short side wall of the first opening / closing member 11 for accommodating the gripping plate portion 13b of the wafer cassette 13 and the end of the first opening / closing member 11 The distance from the edge becomes long, and the upper surface of the bulging portion cannot be used as the palm resting surface. Therefore, when the fastening member is formed at the short edge of the rectangular opening, the first opening / closing member 11
Can not be pressed strongly, and the first opening / closing member 11 cannot be closed smoothly. Such inconvenience does not occur.

The first opening / closing member 11 and the second opening / closing member 1
To close 2, the first opening / closing member 11 is fitted to the second opening / closing member 12 from outside. At this time, the upper edge portion of the wafer cassette 13 housed in the second opening / closing member is
The first opening / closing member 11 is guided by the wafer cassette guide surface 11j of the first opening / closing member 11 so that the first opening / closing member 11
The first opening / closing member 11 does not contact the semiconductor wafer accommodated and supported in the wafer cassette 13 and does not contaminate or damage the wafer.

After the first opening / closing member 11 is put on the second opening / closing member 12, the palm rest surface 11 of the first opening / closing member 11 is placed.
e, a finger is placed on the edge of the flange 11c, and the palm placing surface 11e is pressed while slightly opening the flange 11c outward to push the first opening / closing member 11 downward. Further, the first and second opening / closing members 1 are pressed by pressing the flange 11c inward to engage the engaging projections 12c with the engaging holes 11d of the flange 11c.
1 and 12 are engaged and fixed to each other. As described above, since the palm placing surface 11e is formed on the first opening / closing member 11, it is easy to apply a force when pushing down the first opening / closing member 11 downward, and the work can be easily performed. In addition, the flange 11
Since c is formed at the long edge portion 11b of the rectangular opening, its size can be increased, the fastening distance increases, the fastening strength increases, and the hermetic sealing performance is significantly improved. A rectangular block-shaped projection 11g is formed adjacent to four corners of the top plate 11f of the first opening / closing member 11, while the projection 11g is formed at four corners of the bottom plate 12e of the second opening / closing member 12. A fitting concave portion 12g into which is fitted is formed. Therefore, when multiple semiconductor wafer packaging containers are stacked,
The protruding portion 11g and the fitting concave portion 12g are fitted to each other, so that a stable laminated state can be obtained without shifting back and forth and right and left.

Further, a plurality of pins 11h for fixing a wafer pressing member 14 for the first opening / closing member 11, which will be described later, are provided on the inner surface of the top plate 11f, which is the central side wall of the first opening / closing member 11. An engaging projection 11i is provided so as to protrude. On the other hand, the opposite left and right side wall portions 12 c of the second opening / closing member 12,
A groove 12d for fixing a wafer pressing member 15 for the first opening / closing member 12, which will be described later, is fixed to 12c, and the wafer pressing member 15 is also fixed to a bottom plate portion 12e which is a central side wall of the second opening / closing member. Pins 12f are formed respectively.

Wafer pressing member 14 for first opening / closing member 11
The left and right are formed on an inclined plate 14b along the inner surface of the first opening / closing member 11 with a center connecting plate 14a having substantially the same shape as the top plate 11f of the first opening / closing member 11 interposed therebetween. The center connecting plate 14a and the inclined plate 14b are provided with a pin insertion hole 1 at a position corresponding to the pin 11h of the first opening / closing member 12.
4c is formed, and at the end of the inclined plate 14b, an engaging portion 14d capable of engaging with the engaging protrusion 11i is formed. Further, at the center of the inner surface of the left and right inclined plates 14b, a large number of substantially triangular gripping seats 14e each having a V-shaped groove formed at the top are arranged in a row so as to grip the peripheral edge of the semiconductor wafer at one point.

Wafer pressing member 15 for second opening / closing member 12
Are divided into a bottom pressing member 15a attached to the bottom plate 12e of the second opening / closing member 12 and a side wall pressing member 15b attached to the left and right side wall portions 12c. As shown in FIG. 3, the bottom pressing member 15a has the second
A pin insertion hole for engaging with a pin 12f formed in a bottom plate 12e of the opening / closing member 12 is formed.
e is positioned and fixed. The side wall pressing member 1
5b has its peripheral wall 15c engaged with the groove 12d of the second opening / closing member 12. At the center of the inner surface of the bottom pressing member 15a and the side wall pressing member 15b, a plurality of substantially triangular gripping seats 14e each having a V-shaped groove formed at the top so as to grip the peripheral edge of the semiconductor wafer at one point are arranged. ing. In addition,
In this embodiment, the wafer pressing member 15 is divided into three parts, each of which must be attached to the second opening / closing member 12. The height of the second opening / closing member 12 (depth) is as described above. Since it is set lower than before, the mounting work is easy to perform.

In order to store the semiconductor wafers in the semiconductor wafer packaging container 10 of the present invention having such a configuration, the wafer cassette 13 for supporting the semiconductor wafers in parallel is stored in the second opening / closing member 12. At this time, the semiconductor wafer is gripped by the gripping seats 14e and 15d of the wafer pressing members 14 and 15, and is separated from the support of the wafer cassette 13. In the present invention, the gripping seats 14e and 15d for gripping the semiconductor wafer of the wafer pressing members 14 and 15 are shaped to point grip the periphery of the semiconductor wafer, and the contact area of the semiconductor wafer by the wafer pressing members 14 and 15 is reduced. This is greatly reduced as compared with the case where the peripheral edge is held linearly over a wide range as in the related art. Therefore, the risk of contamination of the semiconductor wafer by the wafer pressing member is further reduced.

In the second opening / closing member 12, since the semiconductor wafer is firmly held at three points by the V-grooves of the holding seats 15d formed on the three pressing members 15, the semiconductor wafer W shown in FIG. The semiconductor wafer does not swing back and forth as in the case where is gripped at two points, and is stably gripped in a predetermined posture. Therefore, even when the first opening / closing member 11 is opened and the semiconductor wafer is held only by the second opening / closing member 12 when the wafer cassette supporting the semiconductor wafer is housed or taken out of the container body, a plurality of semiconductor wafers may be stored. Are held in parallel at equal intervals, so that there is no possibility that the semiconductor wafers come into contact with each other and become contaminated or damaged.

After that, the first opening / closing member 11 is covered with the second opening / closing member 12 and closed. At this time, since the semiconductor wafers are aligned in a predetermined posture, the first opening / closing member 11 is mounted inside the first opening / closing member 11. Semiconductor wafer pressing member 14
Is automatically guided to the bottom of the holding seat 14e in the V-groove, so that the periphery of the wafer can be reliably held, and the semiconductor wafer is not damaged at the periphery of the holding seat 14e.

FIG. 4 is an exploded perspective view of a semiconductor wafer packaging container 20 according to a second embodiment of the present invention. The semiconductor wafer packaging container 20 has a substantially disk shape. The packaging container 20 includes a first opening / closing member 21, a second opening / closing member 22, and a wafer cassette 23.

The first opening / closing member 21 comprises a top plate 21a and a first peripheral wall 21b, and the second opening / closing member 22 comprises a bottom plate 22a and a second peripheral wall 22b. An engaging flange 21c is integrally protruded from an end edge of the first peripheral wall portion 21b of the first opening / closing member 21, and a vertically extending insertion / removal hole 21d is formed at an extending base end of the flange 21c. An engaging hole 21e is formed at the free end of 21c. On the other hand, from the edge of the second peripheral wall portion 22b of the second opening / closing member 22, a protruding portion 22d that can be inserted into and removed from the insertion hole 21d.
Is extended, and a plurality of engaging projections 22e that can be engaged with the engaging hole 21e are protruded from an end of the peripheral wall portion 22b. Further, a gasket fitting groove 22c is formed on the opening end surface of the second opening / closing member 22, and an opening edge of the first opening / closing member 21 is fitted into the fitting groove 22c via a gasket (not shown). You.

The first opening / closing member 21 and the second opening / closing member 22
In order to open and close the semiconductor wafer packaging container 20 by storing a wafer cassette containing semiconductor wafers, the first opening / closing member 21 on the top plate side is moved with respect to the second opening / closing member 22 on the bottom plate side.
The protrusion 22d of the second opening / closing member 22 is
Is horizontally slid while being inserted into the insertion hole 21d. The protrusion 22d and the insertion / removal hole 21d restrict vertical displacement of the first and second opening / closing members 21 and 22, and the first opening / closing member 21 is not inclined to come into contact with the internal semiconductor wafer. Absent.

When the first opening / closing member 21 is opened, a hand is applied to the tip of the flange 21c of the first opening / closing member 21 while holding the top of the protruding portion 22d of the second opening / closing member 22 with a palm or a finger. Then, the first opening / closing member 21 is moved in the horizontal direction, and is separated from the second opening / closing member 21. As described above, when the semiconductor wafer packaging container 20 is opened, the protruding portion 22d extending in the left-right opening / closing direction can be used as described above, and the first opening / closing member 21 on the top plate side has no bottom plate portion. Since the frictional resistance does not occur between the first opening / closing member 21 and the mounting surface of the container 20, the second opening / closing member 22 is dragged by the first opening / closing member 21 and moves when the first opening / closing member 21 is pulled. However, the first opening / closing member can be removed smoothly.

The peripheral wall 21b of the first opening / closing member 21 is provided with wafer pressing members 21f at two locations on the inner surface thereof.
Wafer pressing members 22f are integrally formed at three locations on the inner surface of the peripheral wall portion 22b of the opening / closing member 22, respectively.
At the center of the wafer pressing members 21f and 22f, a number of substantially triangular gripping seats 14e each having a V-shaped groove formed at the top so as to grip the peripheral edge of the semiconductor wafer at one point are arranged in line. As described above, since the wafer pressing members 21f and 22f of the present wafer packaging container 20 also grip the peripheral edge of the semiconductor wafer in a point contact state by the V-grooves, the wafer pressing members 21f and 22f have the same shape.
Low risk of contamination by 22f.

The wafer cassette 23 has almost the same structure as that of the first embodiment described above, and has an upper frame portion 23a and a bottom plate portion 23b having substantially the same shape as the semiconductor wafer, and a grip formed at the center of the left and right side surfaces. It has plate portions 23c, 23c, and a side wall portion 23d formed at an intermediate position between the left and right gripping plate portions 23c, 23c. Numerous wafer support grooves 23e for supporting a semiconductor wafer are formed on the inner surfaces of the gripping plate portion 23c and the side wall portion 23d.
The semiconductor wafer is inserted into 3e, and is held substantially in parallel with the bottom plate 23b without contacting each other. Further, a gripping recessed hole 23f into which a finger of a robot or a finger of an operator is inserted is formed on an outer surface of the gripping plate 23c.

Further, the semiconductor wafer packaging container 2 of the present embodiment
0 is set so that the first peripheral wall portion 21b covers at least 1/2 of the periphery of the top plate portion 21a, and the second peripheral wall portion 22b is smaller in size than the second peripheral wall portion 22b. When the wafer cassette 23 is stored in the second opening / closing member 22, as shown in FIG. 5, the holding recessed hole 23f of the wafer cassette 23 is completely exposed to the outside from the edge of the second peripheral wall portion 22b. Has formed. Therefore, when the wafer cassette 23 is stored in or taken out of the second peripheral wall portion 22b, an operator's finger or a finger portion of a robot can be reliably inserted into the holding recessed hole 23f. Since the work can be performed while being held stably, the wafer cassette 23 is accidentally dropped,
The semiconductor wafer will not be damaged, or will not be contaminated or damaged by contact with the semiconductor wafer.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a semiconductor wafer packaging container showing a typical embodiment of the present invention.

FIG. 2 is a perspective view showing a state where a wafer cassette is stored in a second opening / closing member of the semiconductor wafer packaging container.

FIG. 3 is a perspective view of a wafer pressing member of the present invention.

FIG. 4 is an exploded perspective view of a semiconductor wafer packaging container showing another exemplary embodiment of the present invention.

FIG. 5 shows a second example of the semiconductor wafer packaging container in FIG.
It is a perspective view showing the state where a wafer cassette was stored in an opening and closing member.

FIG. 6 is an exploded perspective view of a conventional semiconductor wafer packaging container.

FIG. 7 is an explanatory diagram showing a state where a semiconductor wafer is held at two points.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Semiconductor wafer packaging container 11 1st opening / closing member 11a Flat surface 11b Long edge 11c Flange 11d Engagement hole 11e Palm mounting surface 11f Top plate 11g Projection 11h Pin 11i Engagement projection 11j Cassette guide surface 12 Second opening / closing member 12a Gasket fitting groove 12b Opening long edge 12c Engagement projection 12d Groove 12e Bottom plate 12f Pin 12g Fitting concave 13 Wafer cassette 13a Front and rear plate 13b Gripping plate 13c Bottom wall 13d Wafer support groove 13e Gripping concave 14 1 Wafer pressing member for opening / closing member 14a Central connecting plate 14b Inclined plate 14c Pin insertion hole 14d Engagement portion 14e Gripping seat 15 Pressing member for second opening / closing member 15a Bottom pressing member 15b Side wall pressing member 15c Peripheral wall portion 15d Grip seat 16 Gasket 20 Semiconductor wafer packaging container 21 First Opening / closing member 21a Top plate portion 21b First peripheral wall portion 21c Engagement flange 21d Insertion / removal hole 21e Engagement hole 21f Wafer pressing member 21g Gripping seat 22 Second opening / closing member 22a Bottom plate portion 22b Second peripheral wall portion 22c Gasket fitting groove 22d Projection Part 22e Engagement projection 22f Wafer pressing member 22g Gripping seat 23 Wafer cassette 23a Upper frame part 23b Bottom plate part 23c Gripping plate part 23d Side wall part 23e Wafer support groove 23f Holding concave hole

Continuing on the front page (72) Inventor Toshiharu Abegawa 1200 Manda, Hiratsuka-shi, Kanagawa Prefecture, Komatsu Seisakusho Research Center (72) Inventor Satoshi Fukuhara 1200 Manda, Hiratsuka-shi, Kanagawa Prefecture Komatsu Seisakusho Research Headquarters (72) Inventor Akira Sumitani 1200 Manda, Hiratsuka-shi, Kanagawa Prefecture, Komatsu Seisakusho Research Center (72) Inventor Haruhito Akimoto 1200 Manda, Hiratsuka-shi, Kanagawa Prefecture Komatsu Seisakusho Research Headquarters (72) Inventor, Manabu Sotooka 1200 Manda, Hiratsuka-shi, Kanagawa Prefecture, Komatsu Ltd.

Claims (9)

[Claims] 1. A synthetic resin semiconductor wafer comprising: a container main body including a first opening / closing member and a second opening / closing member; and a wafer cassette housed inside the container main body and supporting a plurality of semiconductor wafers in parallel. In the packaging container, the second opening / closing member is formed at the center of the left and right side surfaces of the wafer cassette when the wafer cassette is stored in the second opening / closing member and the container body is in an open state. A semiconductor wafer packaging container, wherein a grip portion is formed so as to be completely exposed to the outside from an opening edge of the second opening / closing member. 2. The semiconductor device according to claim 1, wherein the second opening / closing member is provided with a wafer pressing member for gripping the peripheral edge of the semiconductor wafer at at least three places on at least the left and right side walls and / or the central side wall. Semiconductor wafer packaging container. 3. The wafer pressing member is attached to each of the left and right side walls and the center side wall, and further includes at least one peripheral edge of the semiconductor wafer on the left and right side walls and / or the center side wall of the first opening / closing member. 3. The semiconductor wafer packaging container according to claim 2, further comprising a wafer pressing member which is point-held by said step. 4. A peripheral edge of an opening of each of the first and second opening / closing members is substantially rectangular, and an engaging member for closing and engaging the first and second opening / closing members is provided at the center of a long edge thereof. The semiconductor wafer packaging container according to claim 1, comprising: 5. The semiconductor wafer packaging container according to claim 4, wherein said engaging member is formed integrally with said first and second opening / closing members. 6. The semiconductor wafer packaging container according to claim 4, wherein said engaging member is formed separately from said first and second opening / closing members. 7. The semiconductor wafer packaging container according to claim 4, wherein a palm mounting surface is formed at a position above the engaging member of the first opening / closing member. 8. The semiconductor wafer packaging container according to claim 7, wherein a wafer cassette guide surface is formed above the palm mounting surface, the wafer cassette guiding surface being continuously inclined from a deep edge of the palm mounting surface to a central side wall portion. 9. A top plate portion of the first opening / closing member, wherein a center side wall portion of the first opening / closing member forms a top plate portion, and a center side wall portion of the second opening / closing member forms a bottom portion of the container body. 2. The semiconductor wafer packaging container according to claim 1, wherein the bottom of the second opening / closing member has a rectangular block-shaped protrusion or fitting recess in which four corners of each other are fitted to each other.