JPH11266070A - Method for manufacturing transfer member and printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a transfer member and a method for manufacturing a printed wiring board, in which the adhesion between an adhesive layer and a conductive layer formed by an electrodeposition method is enhanced. SOLUTION: A step of forming an electrically insulating mask pattern on the surface of the conductive substrate, and a conductive layer made of copper or a copper alloy in a non-mask portion on the side of the substrate on which the mask pattern is formed Forming, and adjusting the roughness of the surface of the patterned conductive layer, forming a barrier conductive layer on the roughness adjusted surface of the conductive layer, the patterned Forming a pressure-sensitive adhesive layer on the barrier conductive layer by an electrodeposition method.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a transfer member having a fine pattern, a method for manufacturing the same, a printed wiring board, and a method for manufacturing a printed wiring board.

[0002]

2. Description of the Related Art Due to the dramatic development of technology in the electric field, high-density mounting techniques such as miniaturization of semiconductor packages and bare chip mounting, as typified by CSP, are rapidly advancing. Along with this, printed wiring boards are also being changed from single-sided wiring to double-sided wiring, and are becoming more multilayered and thinner and lighter.

[0003] As a method of manufacturing such a printed wiring board, a subtractive method and an additive method are generally used.

[0004] The subtractive method is typically a method of forming a conductive circuit by etching a copper clad laminate after forming an etching resist. Although this method is technically almost completed and low in cost, the formation of a fine pattern is limited due to restrictions such as the thickness of the copper foil during etching.

On the other hand, in the additive method, typically, after a catalyst nucleus is provided on a substrate, a plating resist is formed,
This is a method of forming a conductor circuit by performing electroless copper plating. This method can form a fine pattern, but requires cost reduction and further improvement in reliability.

The single-sided or double-sided printed wiring boards produced by these methods are further laminated under pressure together with a prepreg to produce a multilayer substrate. In such a multilayer substrate, the conductor circuits of each layer are usually connected by forming through-holes subjected to electroless plating or the like after the multilayering at once, but the accuracy of the through-holes is further increased. Improvement is required.

In recent years, a multilayer printed wiring board of a build-up type, which is formed by stacking circuit patterns on the surface of a core substrate via an insulating layer, has been attracting attention as satisfying the above requirements. In the multilayer printed wiring board of this build-up system, the wiring density is improved even when the wiring pitch is the same, since the wiring is not hindered by the through holes, as compared with the conventional multilayer substrate using the through holes. However, it is difficult to correct a defect in an intermediate step, and the process is complicated, which hinders a reduction in manufacturing cost.

In order to solve such a problem, there is provided a multilayer printed wiring board having a substrate and a plurality of wiring pattern layers sequentially transferred onto the substrate, wherein each wiring pattern layer comprises a conductive layer and a conductive layer. A device having an insulating resin layer fixed to a lower wiring pattern layer and a method for manufacturing the same have been proposed (Japanese Patent Application Laid-Open No. Hei 8-116172).

FIG. 1 shows a typical example of a method for manufacturing such a transfer member and a printed wiring board. First, a conductive substrate 1 is prepared as shown in FIG. 1A, and a mask pattern 2 is formed on the conductive substrate 1 as shown in FIG. 1B.
Next, patterning is performed as shown in FIG.
Further, as shown in FIG. 1D, a conductive layer 4 is formed on the non-mask portion 3 by electrolytic plating or the like. Further, as shown in FIG. 1E, an adhesive layer 5 is formed on the conductive layer pattern by an electrodeposition method or the like. The transfer member manufactured in this manner is then transferred to the transfer-receiving substrate 6 as shown in FIG. 1 (f), and a printed wiring board as shown in FIG. 1 (g) is manufactured.

However, in this method, the adhesiveness between the adhesive layer and the conductive layer may be low, and peeling occurs between the adhesive layer and the conductive layer during production or use of the printed wiring board. There was something.

[0011]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a transfer method for a transfer device which has improved adhesion between an adhesive layer and a conductive layer. An object is to provide a member, a method for manufacturing the same, a printed wiring board, and a method for manufacturing the same.

[0012]

Means for Solving the Problems The present inventors have solved the above-mentioned problems by a combination of manufacturing after adjusting the surface roughness of the conductive layer to a specific range and providing a barrier conductive layer. I found that. That is, the method for manufacturing a transfer member of the present invention, for a conductive substrate having conductivity on at least one surface, a step of forming an electrically insulating mask pattern on the conductive surface of the substrate,
A step of forming a conductive layer made of copper or a copper alloy on a non-mask portion of the substrate on which a mask pattern is formed, a step of adjusting the roughness of the surface of the patterned conductive layer, Forming a barrier conductive layer on the surface of which roughness has been adjusted, and forming an adhesive layer on the patterned barrier conductive layer by an electrodeposition method; On a substrate, at least the conductive layer,
A transfer layer is formed by laminating the barrier conductive layer and the adhesive layer.

[0013] The method for manufacturing a printed wiring board according to the present invention further comprises a step of adjusting the roughness of the surface of the patterned conductive layer with respect to the patterned conductive layer made of copper or a copper alloy; A step of forming a barrier conductive layer on the surface of the conductive layer with roughness adjusted, and a step of forming an adhesive layer on the patterned barrier conductive layer by an electrodeposition method,
At least the conductive layer formed by the above steps,
A step of transferring a transfer layer formed by laminating the barrier conductive layer and the adhesive layer onto a substrate to be integrally wired.

Further, in another method of manufacturing a printed wiring board according to the present invention, the step of adjusting the roughness of the surface of the conductive layer with respect to the conductive layer made of copper or a copper alloy includes the steps of: A step of forming a barrier conductive layer on the adjusted surface, a step of forming an adhesive layer on the barrier conductive layer by an electrodeposition method, and at least the conductive layer and the barrier conductive layer formed by the above steps. Transferring a transfer layer formed by laminating a layer and the adhesive layer onto a substrate to be integrally wired; forming a mask pattern on the surface of the conductive layer after the transfer; and The method includes a step of etching the conductive layer and the barrier conductive layer into a mask pattern shape through a pattern, and a step of removing the mask pattern after the etching.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Transfer member and printed wiring board
Manufacturing Method A method for manufacturing a transfer member and a printed wiring board according to the present invention will be described with reference to FIG. First, FIG.
A conductive substrate 1 shown in FIG. 2A is prepared, and a mask 2 is formed on the conductive substrate 1 as shown in FIG. Further, as shown in FIG. 2C, a mask pattern 2 and a non-mask portion 3 are formed by performing patterning. Next, as shown in FIG.
Is formed, and the surface roughness of the conductive layer 4 is adjusted as shown in FIG. Further, a barrier conductive layer 7 is formed on the pattern of the conductive layer 4 as shown in FIG.
As shown in FIG. 7, the adhesive layer 5 is formed on the pattern of the barrier conductive layer 7.
Is formed to produce a transfer member.

A typical example of the transfer member of the present invention is shown in FIG.
As schematically shown in (g), on the surface of the conductive substrate 1,
A transfer layer is formed by laminating a mask pattern 2 having an arbitrary pattern, a conductive layer 4, a barrier conductive layer 7, and an adhesive layer 5 on a non-mask portion 3 in that order. Thereafter, the transfer member of the present invention is typically pressure-bonded to the transfer-receiving substrate 6 as shown in FIG.
Then, the transfer layer (wiring pattern) composed of the adhesive layer 5 is transferred to the transfer-receiving substrate 6, whereby the printed wiring board shown in FIG.

Further, another method of manufacturing a printed wiring board according to the present invention will be described with reference to FIG.

First, the conductive layer 4 shown in FIG. 3A is prepared, and the surface roughness is adjusted to obtain the surface roughness adjusting conductive layer 4 shown in FIG. 3B. In FIG. 3B,
The surface roughness of the lower surface is adjusted. Next, as shown in FIG. 3C, a barrier conductive layer 7 is formed on the roughness adjusting surface of the conductive layer 4, and as shown in FIG.
The adhesive layer 5 is formed thereon, and a transfer layer formed by laminating the conductive layer 4, the barrier conductive layer 7, and the adhesive layer 5 is formed. Further, as shown in FIG. 3E, the transfer layer is pressed against the transfer substrate 6, and the conductive layer 4 and the barrier conductive layer 7 are fixed to the transfer substrate 6 by the adhesive layer 5. Then, FIG.
As shown in FIG. 3F, a mask pattern 2 is formed on the conductive layer 4, and as shown in FIG. Then, as shown in FIG. 3 (h), the mask pattern 2 is removed to manufacture a printed wiring board.

Hereinafter, the method for manufacturing the transfer member and the printed wiring board of the present invention will be described in further detail.

Transfer Layer The transfer layer is a main part common to all of the present invention, and at least a conductive layer whose surface roughness is adjusted, a barrier conductive layer and an adhesive layer are laminated in this order. It is. In the transfer layer of the present invention, irregularities corresponding to the irregularities on the surface of the conductive layer occur on the surface of the barrier conductive layer facing the adhesive layer, so that an anchor is provided between the barrier conductive layer and the adhesive layer. It is considered that the effect works and thereby the adhesion is improved. In addition, since the material of the barrier conductive layer is generally a material having higher adhesiveness to the adhesive layer than the conductive layer, the structure of this transfer layer is transferred by the synergistic effect of both sides of the shape and the material. It also has the effect of increasing the adhesion of the entire layer. With such a transfer layer, the peel strength is 0.5 kg / cm or more, and in a preferred embodiment, it is 1.0 kg / cm.
An adhesion strength of at least kg / cm can be obtained.

Hereinafter, description will be made in order.

Adjustment of Surface Roughness of Conductive Layer The surface roughness of the conductive layer of the transfer member of the present invention is not particularly limited. The surface roughness after the roughness adjustment is preferably Rmax 0.5 to 5 μm, more preferably Rmax 1 to 5 μm, particularly preferably Rmax 2 to 5 in order to obtain sufficient adhesion.
μm, and the center line average roughness Ra is 0.1 to 1.0 μm.
The thickness of the conductive layer after the roughness adjustment is generally 5 to 50 μm to prevent an increase in conductor resistance and to ensure accuracy during etching.
m, preferably 5 to 25 μm, more preferably 10 μm
And

The method used for adjusting the roughness is not particularly limited as long as the above-mentioned preferable roughness can be obtained, but is preferably a chemical etching method, more preferably a micro-etching method, further preferably a formic acid-based method. This is a micro-etching method. Particularly preferably, when the etchant is sprayed, both chemical and physical effects can be used, so that a suitable roughness adjustment can be performed.

The micro-etching is a treatment for roughening the surface of copper or the like, and is capable of performing both immersion and spray treatments. There are things. The processing temperature is from room temperature to about 50 ° C., and the processing time is from about 30 seconds to about 10 minutes. In the present invention, it is preferable to perform a spray treatment using a formic acid-based microetchant.

Formation of Conductive Layer The method and material for forming the conductive layer are not limited, as long as they can be used for ordinary wiring boards. A typical example is a method in which a conductive layer is formed on a non-mask portion by an electrodeposition method. The formation of the conductive layer by the electrodeposition method can be performed according to a known plating method. The material for forming the conductive layer is preferably a material on which a conductive thin film is formed by an electrodeposition method, and examples thereof include copper, silver, gold, nickel, chromium, zinc, tin, and platinum.

Formation of Barrier Conductive Layer In general, when copper or the like is used for the conductive layer in the above-mentioned transfer member, a phenomenon in which metal ions such as copper are eluted into the insulating resin, so-called ion migration, occurs, and If the insulating resin layer is relatively thin at about 10 μm in a humid environment, there is a possibility that the insulating property is adversely affected.
In the transfer member of the present invention, a barrier conductive layer for preventing such ion migration is provided between the copper plating layer and the adhesive layer. As a material for forming this layer, preferably, a metal having a stable oxide film and hardly causing ion migration, specifically, nickel, a tin-nickel alloy, chromium, or the like can be used. The thickness of this layer is not particularly limited, but is preferably about 0.5 to 1.0 μm. The method for forming this layer is not particularly limited, but preferably, an electrodeposition method, an electroless plating method, an evaporation method, a sputtering method, or the like can be used, and the electrodeposition method is particularly preferable.

As a preferable plating condition, it is preferable to use a plating solution having a composition for roughening the plating surface. For example, in the case of nickel plating, the addition amount of a leveling agent may be reduced, or NiC ₂ may be excessively added.

The surface roughness of the barrier conductive layer is preferably Rmax in order to obtain sufficient adhesion by the anchor effect.
0.01 to 0.5 μm, more preferably Rmax 0.1 to 5
μm.

Further, a plurality of barrier conductive layers may be formed.

Formation of Adhesive Layer The adhesive layer used in the transfer member of the present invention can be typically formed on the surface of the barrier conductive layer by an electrodeposition method. The electrodeposition method is conventionally used as, for example, electrodeposition coating, and can be performed using an ionic electrodeposition liquid containing a film-forming material. Electrodeposition in the present invention can be performed according to a known electrodeposition method.

The material of the adhesive layer used in the transfer member of the present invention exhibits adhesive properties at room temperature or by heating. The transfer member is pressed against the substrate to be transferred, and the conductive layer is adhered. There is no particular limitation as long as it can be fixed to the substrate to be transferred by the attachment layer. Preferably, the adhesive layer is an insulator in order to provide insulation between the wirings and between the transferred substrate and the wirings after the transfer. It is also preferable to use a substance that can be contained in the electrodeposition solution and electrodeposited, for example, an ionic polymer compound.

Preferred ionic polymer compounds for forming the insulating adhesive layer contained in the electrodeposition solution include, for example,
Examples include natural resins, acrylic resins, polyester resins, alkyd resins, maleated oil resins, polybutadiene resins, epoxy resins, polyamide resins, and polyimide resins. As the anionic polymer compound, those having an anionic group such as a carboxyl group,
Examples of the cationic polymer compound include those having a cationic group such as an amino group. In the present invention, an optimal ionic polymer compound can be appropriately selected according to the performance required for the adhesive layer. In addition, if necessary, a rosin-based compound,
A terpene-based or petroleum resin-based tackifier can be used.

The above-mentioned polymer compound can be electrodeposited in a state of being neutralized by an alkaline substance or an acidic substance and solubilized in water, or in a state of being dispersed in water. The anionic polymer compound can be neutralized with, for example, amines such as trimethylamine, diethylamine and dimethylethanolamine, and inorganic alkalis such as ammonia and potassium hydroxide. The cationic polymer compound can be neutralized with, for example, an acid such as acetic acid, formic acid, propionic acid, and lactic acid.

The thickness of the pressure-sensitive adhesive layer is not particularly limited as long as the pressure-sensitive adhesive property and the required insulating property are satisfied, but it is generally 1 to 100 μm, preferably 10 to 100 μm.
５０50 μm.

The material of the conductive substrate in the transfer member of the conductive substrate present invention is not limited in particular as long as it has at least one surface conductive. Such materials include, for example, various metal plates and various insulators coated with metal, such as copper, nickel, stainless steel, iron, aluminum, 42 alloy, and resin films metallized with sputtering or the like. Can be. Preferably,
Copper, nickel, chromium, gold,
A material capable of depositing silver, platinum, tin, solder, and the like and capable of separating the deposited metal layer from the conductive substrate, specifically, for example, stainless steel, a titanium-based material, or the like is preferable.

Although the thickness of the conductive substrate is not particularly limited,
Generally, about 0.05 to 1.0 mm is preferable.

Formation of Mask Pattern The method and material for forming an electrically insulating mask pattern used in the present invention are not particularly limited as long as they can pattern an insulating layer. This method includes, for example, photoresist, screen printing, and precision dispensing. Among them, it is preferable to use a photoresist that is advantageous for forming a fine pattern. Further, since acid resistance, solvent resistance, voltage resistance, and the like may be required in a later step, it is more preferable to use one having such characteristics. Particularly preferred specific examples include a cyclized rubber-based photoresist, a thermosetting acrylic-based resist, a melamine-based resist, and a water-soluble colloid-based photoresist.

The electrically insulating mask pattern used in the present invention is typically formed as follows. A mask is formed by a known method on the surface of the conductive substrate whose roughness has been adjusted.
Next, the mask pattern is irradiated with ultraviolet rays through a photomask of a predetermined pattern, and is exposed and developed. Thus, a mask pattern of a predetermined pattern and a non-mask portion are formed on the surface of the conductive substrate.

In the embodiment of the present invention in which the pattern is formed by etching after transfer, the mask pattern need not be insulative. As such a material, any material having etching resistance may be used, and a material having high adhesion to copper and a copper alloy is preferable. Specific examples include water-soluble colloid-based photoresists such as casein and PVA, acrylic-based resists, cyclized rubber-based photoresists, novolak-based photoresists, and dorafilm resists.

Transfer Method Transfer is performed by pressing a transfer member against a transfer substrate. The pressure bonding method includes a roll press, a flat press, a vacuum pressure bonding, etc., and depending on the viscoelasticity of the adhesive layer,
After press bonding while heating and holding for several minutes, the press is released. After the pressure bonding, the conductive member, the barrier conductive layer, and the adhesive layer are transferred to the transfer substrate by peeling the transfer member from the transfer substrate.

Etching Method In the present invention, when a pattern is formed by etching after transfer, etching is generally performed using an etching solution having a corrosive property to the metal. For example,
Examples of the etching solution for copper include a ferric chloride solution, a cupric chloride solution, and an ammonia alkaline etchant. In the present invention, since the metal layer is formed from two layers of copper or a copper alloy and a barrier conductive layer, etching with a ferric chloride solution is preferable. Processing temperature is 30 ~
Etching becomes possible by dipping or showering at 70 ° C. and a concentration of 38 to 50 Be ′.

In the present invention, patterning can be performed before the transfer layer is formed or after the transfer layer is formed. However, when it is necessary to obtain a finer printed wiring board, the transfer layer is formed. It is preferable to perform patterning before.

[0043]

EXAMPLES Example 1 (1) Formation of a patterned conductive layer A thin plate (0.1 mm thick) of stainless steel (SUS304CSP (H)) was used as a conductive substrate, and a cyclized rubber-based negative mold was formed thereon. Photoresist (OMR8 manufactured by Tokyo Ohka Kogyo Co., Ltd.)
535 cP) was applied to a thickness of about 2 μm and prebaked in a clean oven at 85 ° C. for 30 minutes. Thereafter, using a photomask having a predetermined pattern, exposure is performed under the following conditions, developed with a developing solution (OMR developing solution manufactured by Tokyo Ohka Kogyo Co., Ltd.), and rinsed (OAM developing solution manufactured by Tokyo Oka Kogyo Co., Ltd.)
(MR rinse solution). Then, this is placed at 145 ° C.
Was post-baked in a clean oven for 30 minutes to form a mask pattern. Exposure conditions Contact exposure machine Dainippon Screen Mfg. Co., Ltd. P-202-G Vacuum evacuation 30 seconds Exposure time 30 count

The conductive substrate on which the mask pattern was formed was immersed in a copper sulfate plating bath having the following composition in opposition to the phosphorous-containing copper anode, and the conductive substrate was used as a cathode and 2 A / dm ² by a DC power supply. At a current density of 25 minutes. As a result, a conductive layer made of copper plating having a thickness of 10 μm was formed on the non-mask portion of the conductive substrate. Composition of copper sulfate plating bath (bath temperature 25 ° C.) CuSO ₄ .5H ₂ O 75 g / l H ₂ SO ₄ 180 g / l HCl 0.15 ml / l (60 ppm as Cl ⁻ ) Cu-Board HA MU 10 ml / l (EBARA (Eugerite Co., Ltd.)

(2) Roughness adjustment of conductive layer surface For the conductive substrate on which the copper plating pattern layer was formed,
The micro-etching process was performed under the following conditions, and the substrate was sufficiently washed with water. As a result, the copper plating surface had a very fine surface shape. Micro-etching treatment condition Spray treatment equipment EX-42E (manufactured by Yoshitani Co., Ltd.) Micro-etching agent CZ-5452B (manufactured by MEC Corporation) Stock solution Liquid temperature 35 ° C. Spray pressure 0.5 kgf / cm ² Processing time 1 minute

(3) Formation of Barrier Conductive Layer The conductive substrate is immersed in a nickel plating bath having the following composition facing the electrolytic nickel anode, and the conductive substrate is used as a cathode at a current of 1 A / dm. The current was passed at a current density of ² for 5 minutes. As a result, a conductive barrier layer made of nickel plating having a thickness of 1 μm was formed on the roughened copper plating layer of the conductive substrate. Composition of Watt nickel plating bath (bath temperature 50 ° C., pH 2.8) NiSO ₄ .6H ₂ O 200 g / l NiCl ₂ .6H ₂ O 120 g / l H ₃ BO ₃ 6 g / l

(4) Formation of Viscous Adhesive Layer (Preparation of Anionic Electrodeposition Solution) (i) Production of Polyimide Varnish A 1-liter three-neck separable flask was equipped with a stainless steel squirrel stirrer, nitrogen inlet tube and stop. A reflux condenser equipped with a beaded condenser tube was mounted on a trap with a cock. While flowing in a nitrogen stream, the separable flask was placed in a silicone bath equipped with a temperature controller and heated. The reaction temperature was indicated by bath temperature.

3,4,3'4'-benzophenonetetracarboxylic dianhydride (hereinafter referred to as BTDA) 32.2.
2 g (0.1 mol), bis (4- (3-aminophenoxy) phenyl) sulfone (m-BAPS) 21.63 g
(0.1 mol), 1.5 g of valerolactone (0.015
Mol), 2.4 g (0.03 mol) of pyridine, 200 g of N-methyl-2-pyrrolidone (hereinafter referred to as NMP) and 30 g of toluene, and the mixture was stirred at room temperature for 30 minutes (200 rpm) in a silicon bath while passing nitrogen through. The temperature was raised to 180 ° C., and the reaction was carried out for 1 hour with stirring at 200 rpm. Remove 15 ml of toluene-water distillate, air-cool,
6.11 g (0.05 mol) of BTDA, 15.216 g (0.1%) of 3,5 diaminobenzoic acid (hereinafter referred to as DABz).
1 mol), 119 g of NMP and 30 g of toluene,
After stirring at room temperature for 30 minutes (200 rpm), then
The temperature was raised to 80 ° C and the mixture was heated and stirred, and the toluene-water distillate was 15m.
l was removed. Thereafter, while removing the toluene-water distillate outside the system, the mixture was heated to 180 ° C. and stirred for 3 hours to terminate the reaction. A polyimide varnish of 20% was obtained. Acid equivalent (1
The polymer amount per COOH was 1554) was 70. (Ii) Preparation of electrodeposition solution 3SN (NM) was added to 100 g of a 20% concentration polyimide varnish.
P: tetrahydrothiophene-1,1-dioxide =
1: 3 (weight) mixed solution) 150 g, benzyl alcohol 75 g, methylmorpholine 5.0 g (neutralization ratio 200
%) And 30 g of water were added and stirred to prepare an aqueous electrodeposition solution.
The obtained aqueous electrodeposition solution had a polyimide content of 7.4% and a pH of 7.4.
8. It was a dark reddish brown transparent liquid.

(Electrodeposition) The above-mentioned conductive substrate was immersed in the above-mentioned anionic insulating electrodeposition solution facing a stainless steel cathode (SUS430MA). The power was supplied for 3 minutes.
After washing with water, it was dried on a hot plate at 80 ° C. for 3 minutes. As a result, a thickness of 10 μm was formed on the barrier conductive layer of the conductive substrate.
Of the above block polyimide was formed.

(5) Transfer The transfer member is made of a 25 μm thick stainless steel foil (SUS
304TA) at 160 ° C. under a pressure of 1 kgf / cm ² , and the conductive substrate was peeled off and transferred.
Thereafter, for the purpose of curing the adhesive layer, curing was performed for 1 hour in a 350 ° C. clean oven with nitrogen flow. The peel strength of the printed wiring board thus obtained was measured under the following conditions, and as a result, a value of 0.89 kg / cm was obtained.

Example 2 (1) Roughness Adjustment of Copper Foil Surface Rolled copper foil (35 μm thick, manufactured by Japan Energy Co., Ltd.) was subjected to microetching under the following conditions.
Washed thoroughly with water. As a result, the copper plating surface had a very fine surface shape. Micro-etching treatment condition Spray treatment equipment EX-42E (manufactured by Yoshitani Co., Ltd.) Micro-etching agent CZ-5452B (manufactured by MEC Corporation) Stock solution Liquid temperature 35 ° C. Spray pressure 0.5 kgf / cm ² Processing time 1 minute

(2) Formation of Barrier Conductive Layer The conductive substrate was immersed in a nickel plating bath having the following composition facing the electrolytic nickel anode, and the conductive substrate was used as a cathode at a current of 1 A / dm. The current was passed at a current density of ² for 5 minutes. As a result, a barrier conductive layer made of nickel plating having a thickness of 1 μm was formed on the roughness-adjusted copper plating layer of the conductive substrate. Composition of Watt nickel plating bath (bath temperature 50 ° C., pH 2.8) NiSO ₄ .6H ₂ O 200 g / l NiCl ₂ .6H ₂ O 120 g / l H ₃ BO ₃ 6 g / l

(3) Formation of adhesive layer The same as in Example 1.

(4) Transfer The transfer layer was placed on a 25 μm-thick polyimide film (Kapton, manufactured by DuPont) at 160 ° C. under a pressure of 1 kgf / c.
Transfer was performed by pressing under the condition of m ² . Thereafter, for the purpose of curing the adhesive layer, curing was performed for 1 hour in a 350 ° C. clean oven with nitrogen flow.

(5) Wiring formation by etching On the transfer layer (conductive layer) after the transfer, a water-soluble negative type photoresist (FR-14 manufactured by Fuji Pharmaceutical Co., Ltd.) is applied to a thickness of about 3 μm. 3 in a 60 ° C clean oven
Prebaked for 0 minutes. Thereafter, exposure was performed using a photomask having a predetermined pattern under the following conditions, and development was performed with water. Next, this was post-baked in a clean oven at 150 ° C. for 30 minutes to form a resist pattern. Exposure conditions Contact exposure machine Dainippon Screen Mfg. Co., Ltd. P-202-G Vacuum evacuation 30 seconds Exposure time 345 count

Next, the conductive barrier layer made of rolled copper foil and nickel plating was etched into the wiring pattern shape through the resist pattern under the following conditions, washed sufficiently with water, and dried. The peel strength of the wiring pattern thus obtained was measured under the following conditions, and as a result, 1.125 kg / cm
Was obtained. Etching conditions (bath temperature 25 ° C) Etching equipment EX-42E (manufactured by Yoshitani Co., Ltd.) Etchant Ferric chloride 42Be 'Liquid temperature 50 ° C Spray pressure 3 kgf / cm ² Processing time 1 minute

Comparative Example 1 A wiring pattern was prepared and the peel strength was measured in the same manner as in Example 1 except that the microetching process was not performed on the conductive layer. As a result, it was 0.35 kg / cm, and sufficient adhesion could not be obtained.

Comparative Example 2 A wiring pattern was prepared and the peel strength was measured in the same manner as in Example 2, except that the microetching treatment was not performed on the conductive layer. As a result, it was 0.27 kg / cm, and sufficient adhesion could not be obtained.

[0059]

According to the present invention described above, after the surface roughness of copper and copper alloy is adjusted, a barrier conductive layer is formed, whereby the conductive layer and the adhesive layer can be separated. Can be improved in adhesion.

[Brief description of the drawings]

FIG. 1 is a schematic explanatory view of a conventional method for manufacturing a transfer member and a printed wiring board.

FIG. 2 is a schematic explanatory view showing an example of a method for manufacturing a transfer member and a printed wiring board according to the present invention.

FIG. 3 is a schematic explanatory view showing an example of another method for manufacturing a printed wiring board of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Conductive substrate 2 Mask pattern 3 Non-mask part 4 Conductive layer 5 Adhesive layer 6 Transfer receiving substrate 7 Barrier conductive layer

Claims (10)

[Claims] A step of forming an electrically insulating mask pattern on the conductive surface of the substrate on a conductive substrate having conductivity on at least one surface; and forming a mask pattern on the substrate. Forming a conductive layer made of copper or a copper alloy on the non-mask portion on the side; adjusting the roughness of the surface of the patterned conductive layer; and adjusting the roughness of the conductive layer. Forming a barrier conductive layer on the patterned barrier conductive layer by an electrodeposition method, and forming at least the conductive layer on the conductive substrate. Forming a transfer layer formed by laminating the barrier conductive layer and the adhesive layer. 2. The method for producing a transfer member according to claim 1, wherein the roughness of the surface of the conductive layer is adjusted using a micro-etching method. 3. The method for manufacturing a transfer member according to claim 1, wherein the formation of the barrier conductive layer is performed using a nickel plating method. 4. A transfer member manufactured by using the method according to claim 1. 5. A printed wiring board manufactured by using the method according to claim 1. 6. A step of adjusting the roughness of the surface of the patterned conductive layer with respect to the patterned conductive layer made of copper or a copper alloy; A step of forming a barrier conductive layer, a step of forming an adhesive layer on the patterned barrier conductive layer by an electrodeposition method, and at least the conductive layer formed by the above steps,
Transferring a transfer layer formed by laminating the barrier conductive layer and the adhesive layer onto a substrate to be integrally wired. 7. A step of adjusting the roughness of the surface of the conductive layer with respect to the conductive layer made of copper or a copper alloy; and a step of forming a barrier conductive layer on the surface of the conductive layer whose roughness has been adjusted. And a step of forming an adhesive layer on the barrier conductive layer by an electrodeposition method; and at least the conductive layer formed by the above steps,
Transferring a transfer layer formed by laminating the barrier conductive layer and the adhesive layer onto a substrate to be integrally wired; and forming a mask pattern on the surface of the conductive layer after the transfer. And a step of etching the conductive layer and the barrier conductive layer into a mask pattern shape via the mask pattern; and after the etching, removing the mask pattern. Manufacturing method of printed wiring board. 8. The method for manufacturing a printed wiring board according to claim 6, wherein the roughness of the surface of the conductive layer is adjusted using a micro-etching method. 9. The method for manufacturing a printed wiring board according to claim 6, wherein the formation of the barrier conductive layer is performed using a nickel plating method. 10. A printed wiring board manufactured by using the method according to claim 6. Description: