JPH1126673A - Method for manufacturing lead frame - Google Patents
Method for manufacturing lead frameInfo
- Publication number
- JPH1126673A JPH1126673A JP9195042A JP19504297A JPH1126673A JP H1126673 A JPH1126673 A JP H1126673A JP 9195042 A JP9195042 A JP 9195042A JP 19504297 A JP19504297 A JP 19504297A JP H1126673 A JPH1126673 A JP H1126673A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- lead frame
- lead
- bath
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】
【課題】 厳しい腐食環境下で使用しても錆びが発生せ
ず、半導体装置の信頼性が長期にわたってすぐれ、半田
濡れ性、ワイヤ−ボンディング性ともすぐれ、封止樹脂
との密着性もよいリードフレームを製造する。
【解決手段】 少なくともインナーリード２及びアウタ
ーリード３に、めっきを複数層形成するリードフレーム
６の製造方法において、リードフレーム６に下地めっき
後、Ａｕめっき浴にＡｇ又はＡｇ化合物を添加したＡ
ｕ、Ａｇ混合めっき浴中で表層にＡｕ−Ａｇ合金フラッ
シュめっきを形成する。他の要旨は、前記下地めっきの
後、Ａｕめっき浴でめっきし、該Ａｕめっきの前又は後
でＡｇめっき浴に浸漬し表層にＡｕ−Ａｇ合金フラッシ
ュめっきを形成する。
(57) [Problem] To provide no rust even when used in a severe corrosive environment, to have excellent reliability of semiconductor devices for a long period of time, to have excellent solder wettability and wire-bonding properties, and to have good sealing resin. A lead frame with good adhesion is manufactured. SOLUTION: In a method for manufacturing a lead frame 6 in which a plurality of layers of plating are formed on at least an inner lead 2 and an outer lead 3, after plating the lead frame 6 with a base, Ag or an Ag compound is added to an Au plating bath.
An Au-Ag alloy flash plating is formed on the surface layer in a u, Ag mixed plating bath. The other point is that after the base plating, plating is performed in an Au plating bath, and before or after the Au plating is immersed in an Ag plating bath to form Au-Ag alloy flash plating on the surface layer.
Description
【０００１】[0001]
【発明の属する技術分野】本発明はリードフレームの製
造方法に関する。The present invention relates to a method for manufacturing a lead frame.
【０００２】[0002]
【従来の技術】リードフレームは耐食性、ワイヤ−ボン
ディング及び半田付け性等を具備させるためにＡｕ、Ａ
ｇ又はＰｄ等がめっきされている。Ａｕ、Ａｇめっきは
前記各特性を付与させる作用効果があるが、コスト高に
なりこれは工業生産では大きな問題である。2. Description of the Related Art In order to provide corrosion resistance, wire-bonding and solderability, a lead frame is made of Au, A, or the like.
g or Pd is plated. Au and Ag plating have the effect of imparting each of the above properties, but increase the cost, which is a major problem in industrial production.
【０００３】またＡｇめっきはマイグレ−ションを誘発
させる原因となるので、特に多ピンフレ−ムでは問題が
あり、一方、Ｐｄめっきは加熱作用を受けた際に半田濡
れ性に僅かに難点があると言われている。Also, Ag plating causes migration, so there is a problem particularly with multi-pin frames, while Pd plating has a slight difficulty in solder wettability when subjected to a heating action. It is said.
【０００４】前記Ｐｄめっきの問題を改良するものとし
て、Ｐｄめっきを施した上面の少なくともアウターリー
ドにＡｕ又はＡｇを０．１μｍ以下に薄くめっきするこ
とが例えば特開平４−１１５５５８で提案されている。In order to improve the problem of the Pd plating, it has been proposed, for example, in Japanese Patent Application Laid-Open No. 4-115558 that at least the outer leads on the upper surface of the Pd plating be plated with Au or Ag thinly to 0.1 μm or less. .
【０００５】[0005]
【この発明が解決しようとする課題】これではそれ相応
の作用効果があるが、しかし、腐食環境下で継続的に使
用した場合、例えば路面凍結防止剤が撒かれた路面を走
行する自動車や、あるいは多湿の工場等で使用される半
導体装置には、錆びが生じる問題があり、半導体装置の
長期にわたる信頼性に課題がある。また、封止樹脂との
密着性が十分でない問題がある。The present invention has a corresponding function and effect. However, when used continuously in a corrosive environment, for example, an automobile running on a road surface covered with a road surface deicing agent, Alternatively, a semiconductor device used in a humid factory or the like has a problem of rusting, and has a problem in long-term reliability of the semiconductor device. In addition, there is a problem that the adhesion to the sealing resin is not sufficient.
【０００６】本発明は、耐食性がすぐれ腐食環境下で使
用しても錆びが発生せず、半導体装置の信頼性が長期に
わたってすぐれ、併せて半田濡れ性、ワイヤ−ボンディ
ング性ともすぐれ、封止樹脂との密着性もよいリードフ
レームを製造することを目的とする。The present invention has excellent corrosion resistance, does not rust even when used in a corrosive environment, has excellent reliability over a long period of time in a semiconductor device, has excellent solder wettability, excellent wire-bonding properties, and has a sealing resin. To manufacture a lead frame having good adhesion to the lead frame.
【０００７】[0007]
【課題を解決するための手段】本発明の要旨は、少なく
ともインナーリード及びアウターリードに、めっきを複
数層形成するリードフレームの製造方法において、リー
ドフレームに下地めっきした後、Ａｕめっき浴にＡｇ又
はＡｇ化合物を添加した、好ましくはＡｇ当量で２０〜
５００ＰＰＭ添加したＡｕ、Ａｇ混合めっき浴中で表層
にＡｕ−Ａｇ合金フラッシュめっきを形成するリードフ
レームの製造方法にある。他の要旨は、リードフレーム
を下地めっきの後、Ａｕめっき浴でめっきし、該Ａｕめ
っきの前又は後でＡｇめっき浴に浸漬し表層にＡｕ−Ａ
ｇ合金フラッシュめっきを形成するリードフレームの製
造方法にある。The gist of the present invention is to provide a method for manufacturing a lead frame in which a plurality of layers of plating are formed on at least an inner lead and an outer lead. Ag compound is added, preferably 20 to
The present invention relates to a method for manufacturing a lead frame in which an Au-Ag alloy flash plating is formed on a surface layer in a mixed plating bath of Au and Ag to which 500 PPM is added. Another gist is that the lead frame is plated in an Au plating bath after the base plating, and immersed in an Ag plating bath before or after the Au plating to form Au-A on the surface layer.
g manufacturing method for manufacturing a lead frame for forming an alloy flash plating.
【０００８】[0008]
【発明の実施の形態】次に、本発明の実施の形態につい
て述べる。リードフレームは銅薄板、あるいは鉄−Ｎｉ
薄板等を素材としてプレス法又はエッチング法により、
あるいは前記プレス法とエッチング法の併用により形成
され、図１に示すようにパッド１の周辺にインナーリー
ド２が形成され、該インナーリード２に連なってアウタ
ーリード３が形成されている。４はタイバ−、５はサポ
−トバ−である。該リードフレーム６に下地めっきを施
す。Next, an embodiment of the present invention will be described. Lead frame is copper thin plate or iron-Ni
By using a thin plate or the like as a material by pressing or etching,
Alternatively, an inner lead 2 is formed around the pad 1 as shown in FIG. 1, and an outer lead 3 is formed so as to be continuous with the inner lead 2 as shown in FIG. 4 is a tie bar and 5 is a support bar. The lead frame 6 is plated with a base.
【０００９】下地めっきとして、例えばＮｉめっき、あ
るいはＰｄめっきが行われるが、これに先立って脱脂、
洗浄、酸洗等の前処理が施される。Ｎｉめっきは例えば
塩化Ｎｉ浴、硫化Ｎｉ浴等でなされ、０．２〜３．０μ
ｍ厚み形成される。めっきの厚みは素材の材質、リード
フレームへの要求度、上層のめっき金属等により適宜に
定められる。As the base plating, for example, Ni plating or Pd plating is performed, but prior to this, degreasing,
Pretreatments such as washing and pickling are performed. The Ni plating is performed in, for example, a Ni chloride chloride bath, a Ni sulfide bath, or the like.
m thickness. The thickness of the plating is appropriately determined depending on the material of the material, the required degree of the lead frame, the plating metal of the upper layer, and the like.
【００１０】前記Ｎｉめっきした後、本発明のＡｕ−Ａ
ｇ合金フラッシュめっきを行ってもよいし、又は、Ｐｄ
めっきあるいはＰｄ合金めっきを施してからＡｕ−Ａｇ
合金フラッシュめっきを行ってもよい。また、前記Ｎｉ
めっきはせずにＰｄあるいはＰｄ合金をめっきした後、
Ａｕ−Ａｇ合金フラッシュを行ってもよい。なお、前記
Ｐｄ合金めっきとしてはＰｄ−Ｎｉ、Ｐｄ−Ｃｕ等がな
される。After the Ni plating, the Au-A of the present invention
g alloy flash plating or Pd
Au-Ag after plating or Pd alloy plating
Alloy flash plating may be performed. In addition, the Ni
After plating Pd or Pd alloy without plating,
An Au-Ag alloy flash may be performed. Note that Pd-Ni, Pd-Cu, or the like is used as the Pd alloy plating.
【００１１】Ａｕ−Ａｇ合金フラッシュめっきは、Ａｕ
めっき浴にＡｇ又はＡｇ化合物例えばシアン化Ａｇを添
加したＡｕ−Ａｇ混合めっき浴でリードフレーム６を電
気めっきし少なくともインナーリード２、アウターリー
ド３の表層に当該Ａｕ−Ａｇ合金フラッシュを形成す
る。なお、めっきは電気めっきに限らず、無電解めっ
き、化学めっき等が採用できる。Au-Ag alloy flash plating is performed by Au
The lead frame 6 is electroplated in an Au-Ag mixed plating bath in which Ag or an Ag compound, for example, Ag cyanide is added to the plating bath, and the Au-Ag alloy flash is formed on at least the surface layers of the inner leads 2 and the outer leads 3. The plating is not limited to electroplating, and electroless plating, chemical plating and the like can be adopted.
【００１２】前記Ａｕめっき浴へのＡｇ又はＡｇ化合物
の添加量はＡｇ当量で２０〜５００ＰＰＭとする。その
理由は添加量が少ないとＡｕ−Ａｇ合金めっきによる耐
食性の向上作用が得られないので２０ＰＰＭ以上とす
る。一方、その添加量が余りにも多くなると多ピン品で
はマイグレ−ションのおそれがあるので５００ＰＰＭ以
下とする。The amount of Ag or Ag compound added to the Au plating bath is 20 to 500 PPM in terms of Ag equivalent. The reason is that if the addition amount is small, the effect of improving the corrosion resistance by the Au-Ag alloy plating cannot be obtained, so that the content is set to 20 PPM or more. On the other hand, if the addition amount is too large, migration may occur in a multi-pin product.
【００１３】前記Ａｕ−Ａｇ混合めっき浴によるＡｕ−
Ａｇ合金フラッシュめっき厚みは規定の必要はないが例
えば０．０００２〜１．０μｍである。また、Ａｕ−Ａ
ｇ合金フラッシュにより耐食性がＡｕあるいはＡｇ単独
めっきに比較し格段に向上するのは、ＮｉめっきやＰｄ
めっき等を行っていると言ってもミクロ的にみるとこれ
らめっき層には空孔が点在しているのを、Ａｕ−Ａｇ合
金めっきが入り込んで塞ぎ大気と完全に遮断するため
と、さらに該合金特有の耐食性向上作用のためと本発明
者達は考えている。The Au-Ag in the Au-Ag mixed plating bath is used.
The thickness of the Ag alloy flash plating need not be specified, but is, for example, 0.0002 to 1.0 μm. Also, Au-A
Corrosion resistance significantly improved by g alloy flash compared to Au or Ag single plating is due to Ni plating or Pd
Even though it is said that plating is performed, when microscopically viewed, these plating layers are dotted with vacancies because Au-Ag alloy plating enters and blocks and completely shuts off from the atmosphere. The present inventors consider that the alloy has an effect of improving corrosion resistance peculiar to the alloy.
【００１４】次に、実施例について述べる。実施例では
銅薄板を素材として図１に示すリードフレームを製作
し、表１に示すめっき層をパッド、インナーリード、ア
ウターリードにそれぞれ形成した。表層のＡｕ−Ａｇ合
金フラッシュめっきは、Ａｇ添加量を６０ＰＰＭとした
Ａｕ−Ａｇ混合めっき浴で行った。Next, an embodiment will be described. In the example, a lead frame shown in FIG. 1 was manufactured using a copper thin plate as a raw material, and plating layers shown in Table 1 were formed on pads, inner leads, and outer leads, respectively. The Au-Ag alloy flash plating of the surface layer was performed in an Au-Ag mixed plating bath in which the added amount of Ag was 60 PPM.
【００１５】[0015]
【表１】 [Table 1]
【００１６】めっきしたリードフレームについて耐食
性、半田濡れ性、及びボンディングしたワイヤ−のプル
強さを試験し、その結果を表２に示す。The plated lead frames were tested for corrosion resistance, solder wettability, and pull strength of the bonded wires, and the results are shown in Table 2.
【００１７】[0017]
【表２】 [Table 2]
【００１８】これらの試験結果から明らかなように、本
発明によるリードフレームは、耐食性が特にすぐれ、半
田濡れ性も安定的にすぐれ、また、ワイヤ−プル強さが
高くボンディング性も極めて良好であることが実証され
た。As is clear from the test results, the lead frame according to the present invention has particularly excellent corrosion resistance, excellent solder wettability, and high wire-pull strength and extremely good bonding properties. This has been proven.
【００１９】リードフレームの最表層に行うＡｕ−Ａｇ
合金フラッシュめっきは、Ａｕめっき浴でＡｕめっき
し、次いで、Ａｇめっき浴に浸漬しても形成され、Ａｕ
−Ａｇ混合めっき浴でめっきしたのと同じような効果が
得られる。また、前記Ａｕ−Ａｇ合金フラッシュめっき
は、Ａｇめっき液に浸漬した後に、Ａｕめっき浴でめっ
きしても同じように形成される。Au-Ag performed on the outermost layer of the lead frame
Alloy flash plating is also formed by Au plating in an Au plating bath and then immersion in an Ag plating bath.
An effect similar to that obtained by plating with a -Ag mixed plating bath can be obtained. Also, the Au-Ag alloy flash plating is formed in the same manner by immersion in an Ag plating solution and then plating in an Au plating bath.
【００２０】[0020]
【発明の効果】本発明によると前記のように耐食性がす
ぐれ腐食環境下で使用しても錆びが発生が無く、半導体
装置の信頼性が長期にわたって確保され、併せて半田濡
れ性、ワイヤ−ボンディング性ともすぐれたリードフレ
ームが得られる。また、前記実施例には示さなかったが
封止樹脂との密着性が良好である。According to the present invention, as described above, corrosion resistance is excellent, no rust occurs even when used in a corrosive environment, the reliability of the semiconductor device is ensured for a long time, solder wettability, wire bonding, and the like. A lead frame with excellent properties can be obtained. In addition, although not shown in the above Examples, the adhesion to the sealing resin is good.
【図面の簡単な説明】[Brief description of the drawings]
【図１】本発明が適用されるリードフレームの１例を示
す図。FIG. 1 is a diagram showing an example of a lead frame to which the present invention is applied.
【符号の説明】 １ パッド ２ インナーリード ３ アウターリード[Explanation of symbols] 1 pad 2 inner lead 3 outer lead
Claims (5)
リードに、めっきを複数層形成するリードフレームの製
造方法において、リードフレームに下地めっきした後、
Ａｕめっき浴にＡｇ又はＡｇ化合物をした添加したＡｕ
−Ａｇ混合めっき浴中でＡｕ−Ａｇ合金フラッシュめっ
きを形成することを特徴するリードフレームの製造方
法。In a method for manufacturing a lead frame, wherein a plurality of layers of plating are formed on at least an inner lead and an outer lead, the lead frame is subjected to base plating,
Au added with Ag or Ag compound in Au plating bath
-A method for manufacturing a lead frame, comprising forming an Au-Ag alloy flash plating in an Ag mixed plating bath.
リードに、めっきを複数層形成するリードフレームの製
造方法において、リードフレームに直接又はＮｉめっき
し、Ｐｄ又はＰｄ合金をめっきし、その表層に、Ａｕめ
っき浴にＡｇ又はＡｇ化合物を添加したＡｕ−Ａｇ混合
めっき浴中でめっきしＡｕ−Ａｇ合金フラッシュめっき
を形成することを特徴とするリードフレームの製造方
法。2. A lead frame manufacturing method in which at least an inner lead and an outer lead are formed with a plurality of plating layers, a lead frame is plated directly or with Ni, Pd or a Pd alloy is plated, and the surface layer is plated with an Au plating bath. Plating in an Au-Ag mixed plating bath in which Ag or an Ag compound is added to form an Au-Ag alloy flash plating.
物の添加量がＡｇ当量にて２０〜５００ＰＰＭのＡｕ−
Ａｇ混合浴でめっきすることを特徴とする請求項１又は
請求項２記載のリードフレームの製造方法。3. The amount of Ag or Ag compound added to the Au plating bath is 20 to 500 PPM in terms of Ag equivalent.
3. The method for manufacturing a lead frame according to claim 1, wherein plating is performed in an Ag mixed bath.
リードに、めっきを複数層形成するリードフレームの製
造方法において、リードフレームに下地めっきした後、
Ａｕめっき浴でめっきし、該Ａｕめっきの前又は後でＡ
ｇめっき浴に浸漬しＡｕ−Ａｇ合金フラッシュめっきを
形成することを特徴とするリードフレームの製造方法。4. A lead frame manufacturing method in which a plurality of layers of plating are formed on at least an inner lead and an outer lead.
Plating in an Au plating bath, before or after the Au plating
A method for manufacturing a lead frame, comprising immersing in a plating bath to form an Au-Ag alloy flash plating.
リードに、めっきを複数層形成するリードフレームの製
造方法において、リードフレームに直接又はＮｉめっき
し、Ｐｄ又はＰｄ合金をめっきし、その後、Ａｕめっき
浴でめっきし、該Ａｕめっきの前又は後でＡｇめっき浴
に浸漬しＡｕ−Ａｇ合金フラッシュめっきを形成するこ
とを特徴とするリードフレームの製造方法。5. A method for manufacturing a lead frame in which at least an inner lead and an outer lead are formed with a plurality of layers of plating, wherein the lead frame is plated directly or with Ni, plated with Pd or a Pd alloy, and then plated with an Au plating bath. And a method of manufacturing a lead frame, comprising immersing in an Ag plating bath before or after the Au plating to form an Au-Ag alloy flash plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9195042A JPH1126673A (en) | 1997-07-03 | 1997-07-03 | Method for manufacturing lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9195042A JPH1126673A (en) | 1997-07-03 | 1997-07-03 | Method for manufacturing lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1126673A true JPH1126673A (en) | 1999-01-29 |
Family
ID=16334586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9195042A Pending JPH1126673A (en) | 1997-07-03 | 1997-07-03 | Method for manufacturing lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1126673A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010040679A (en) * | 2008-08-01 | 2010-02-18 | Kyushu Hitachi Maxell Ltd | Semiconductor device and its production process |
| JP2012241260A (en) * | 2011-05-23 | 2012-12-10 | Kanto Gakuin | Electrolysis palladium phosphorus alloy plating liquid, plated film, and plated product |
-
1997
- 1997-07-03 JP JP9195042A patent/JPH1126673A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010040679A (en) * | 2008-08-01 | 2010-02-18 | Kyushu Hitachi Maxell Ltd | Semiconductor device and its production process |
| JP2012241260A (en) * | 2011-05-23 | 2012-12-10 | Kanto Gakuin | Electrolysis palladium phosphorus alloy plating liquid, plated film, and plated product |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5436082A (en) | Protective coating combination for lead frames | |
| US8564107B2 (en) | Lead frame and method for manufacturing the same | |
| KR100371567B1 (en) | Ag pre-plated lead frame for semiconductor package | |
| JP2543619B2 (en) | Lead frame for semiconductor device | |
| JP5863174B2 (en) | Manufacturing method of semiconductor device | |
| CA2118758C (en) | Lead frame for integrated circuits | |
| JPH09266280A (en) | Lead frame for mounting semiconductor devices | |
| US5958607A (en) | Lead frame for semiconductor device | |
| JPH118341A (en) | Lead frame for semiconductor device | |
| CN100483707C (en) | Lead frame for semiconductor device | |
| JPS6243343B2 (en) | ||
| KR100378489B1 (en) | Ag or Ag-alloy plated Lead frame for semiconductor package and the method of manufacturing the same | |
| US20030137032A1 (en) | Pre-finished leadframe for semiconductor devices and method fo fabrication | |
| JPH1126673A (en) | Method for manufacturing lead frame | |
| US6545342B1 (en) | Pre-finished leadframe for semiconductor devices and method of fabrication | |
| US20050184366A1 (en) | Lead frame and method for manufacturing semiconductor package with the same | |
| JPH0241591B2 (en) | ||
| KR100231832B1 (en) | Semiconductor lead frame with multi-plating layer | |
| JP3757539B2 (en) | Stem for semiconductor device | |
| JPH09283688A (en) | Copper coated lead frame material | |
| KR100464905B1 (en) | Leadframe Surface Treatment | |
| JPH1084065A (en) | Conductive materials for electronic components | |
| KR20030063835A (en) | Multi-layer plating lead frame and method of manufacturing the same | |
| JPS6142941A (en) | Lead frame for semiconductor | |
| KR100209264B1 (en) | Semiconductor lead frame |