JPH11267967A - Lapping device of disc-like thin plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To lap the whole surfaces of both sides of a disc-like thin plate by lapping both sides of the rotating disc-like thin plate thin plate in the presence of a lapping solution supplied while pressurizing first and second lapping machines to both the sides of the thin plate. SOLUTION: A rotating force imparting means 2 is rotated by a driving motor 23, and one truncated conical wheel 21 is rotated to impart a rotating force to a disc-like thin plate nipped between one truncated conical wheel 21 and the other conical wheel 12, whereby the thin plate 1 is rotated. A lapping solution supplying means 7 supplies a lapping solution containing abrasive grains among each lapping surface of first and second lapping machines 31, 32 and both sides of the disc-like thin plate 1 from distributing holes 72 formed in the opposed shaft ends of tool spindles 41, 42 through a supplying passage 73 and a concentric passage 74 formed concentrically within the tool spindles 41, 42. The lapping machine 3 is rotated to lap the whole surface of both sides of the rotating disc-like thin plate to which the lapping solutions is supplied.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a compact disk-shaped lap which is capable of lapping the entire surface of a rotating disk-shaped plate by rotating a lapping machine having a lap surface smaller in diameter than the disk-shaped thin plate. Related to the device.

[0002]

2. Description of the Related Art As shown in FIG. 5, a pair of lapping machines UL and DL are provided concentrically facing each other, and a plurality of disc-shaped carriers C are provided in the facing space of these lapping machines. The outer periphery of the wafer W is guided to a plurality of round holes H formed in the carrier C so that the upper and lower surfaces of the wafer W to be wrapped are moved upward and downward from the upper and lower surfaces of the carrier C. It is configured to protrude.

The movable upper lapping machine UL is lowered with respect to the lower lapping machine DL fixed in the vertical direction, and the upper and lower lapping machines UL,
The upper and lower surfaces of the wafer W are pressed and held by the DL, and the lapping liquid is interposed between the upper and lower lapping machines UL and DL and the upper and lower surfaces of the wafer W at the same time. In this state, the upper and lower lapping machines UL,
The batch-type wrap is such that the DL is rotated in the same direction and the carrier C is rotated in the opposite direction to wrap the upper and lower surfaces of the wafer W.

[0004]

The above-described conventional lapping apparatus is used for processing a wafer W having a diameter of 200 mm or less. However, when the lapping apparatus is applied to processing of a large-diameter wafer having a diameter of 300 mm or 400 mm, the lapping apparatus is not used. Since the diameters of the UL and DL boards are very large, the flatness of the lap surface of the lapping machine cannot be maintained with high accuracy, and the device becomes large, and it is difficult to put it into practical use due to bearings, rotational accuracy and other reasons. There was a problem of becoming.

[0005] The inventors of the present invention have developed a technical aspect of the present invention in which a rotating lapping machine having a lap surface having a diameter smaller than that of a disk-shaped thin plate enables lapping of the entire surface of the rotating disk-shaped thin plate. As a result of focusing on the idea and conducting further research and development, the present inventors have attained the present invention which achieves the object of making the lapping apparatus compact, relaxing the requirements for bearings and rotational accuracy, and alleviating the cleaning work of the lapping liquid.

[0006]

A lapping device for a disk-shaped thin plate according to the present invention (a first invention according to claim 1) is provided on a base, and is arranged on a first horizontal axis so as to be first and second, respectively. A pair of tool heads that support the second tool spindle rotatably and include spindle rotating means for rotating these tool spindles, and are fixed to opposing ends of the first and second tool spindles, respectively, to be machined. First and second lapping machines having a smaller diameter than the diameter of the disk-shaped thin plate and having a lapping surface formed on the opposite end face;
Guide means for guiding the outer periphery of the disc-shaped thin plate so as to rotatably hold the disc-shaped thin plate around a second horizontal axis eccentric to the first horizontal axis, and the disc-shaped guide having an outer periphery guided by the guide means Rotating force applying means for applying a rotational force to the disk-shaped thin plate for rotating the thin plate around the second horizontal axis, and a disk-shaped member held between the lap surfaces of the first and second lapping disks The first and the second for clamping the thin plate
Pressing force applying means for moving one of the tool spindles relative to the other on the first horizontal axis and pressing the lap surfaces of the first and second lapping machines against both surfaces of the disc-shaped thin plate;
And a lap liquid supply means for supplying a lap liquid between each lap surface of the second lapping machine and the disk-shaped thin plate.

According to a second aspect of the present invention, in the first aspect of the present invention, the first horizontal axis is eccentrically disposed below the second horizontal axis. And a lap liquid scattering prevention cover which surrounds the outer periphery of each of the first and second lapping machines except for the lower part thereof and is arranged in close contact with the disc-shaped thin plate.

According to a third aspect of the present invention, in the first or second aspect of the present invention, the rotational force applying means is provided outside the lap liquid scattering prevention cover. It comprises a conical wheel support mechanism for rotatably supporting a pair of frusto-conical wheels holding both end surfaces of the disc-shaped thin plate, and a drive motor for driving the frusto-conical wheels.

According to a fourth aspect of the present invention, there is provided a disk-shaped thin plate wrapping apparatus according to any one of the first to third aspects, wherein the conical wheel supporting mechanism is provided with the one truncated cone. A movable support for rotatably supporting the vehicle and moving toward the other frusto-conical wheel; and a movable support for pressing the one frusto-conical wheel toward the other frusto-conical wheel. Pressurizing means for moving the section.

According to a fifth aspect of the present invention, there is provided a disk-shaped thin plate wrapping apparatus according to any one of the first to fourth aspects, wherein the guiding means is constituted by a plurality of rollers. The apparatus is provided with a retreat mechanism for retreating a guide roller disposed at an upper portion from a processing position when a disc-shaped thin plate is carried in.

[0011]

According to the first aspect of the present invention, there is provided a disk-shaped thin plate lap apparatus according to the first aspect, wherein the rotational force applying means rotationally drives the disk-shaped thin plate around the first horizontal axis.
The main shaft rotating means drives the first and second lapping machines having a wrap surface smaller in diameter than the disc-shaped thin plate to rotate the first and second lapping machines on both surfaces of the rotating disc-shaped thin plate. Since the lapping process is performed on both surfaces of the disc-shaped thin plate in the presence of the lapping liquid supplied by pressurizing the disc, the lapping process can be performed on all surfaces of both surfaces of the disc-shaped thin plate, and the lapping device can be made compact. Thus, there is an effect that the requirements for bearings and rotational accuracy are eased.

[0012] In a second aspect of the present invention, the first and second lapping machines of the second aspect of the present invention are arranged such that the first and second lapping machines are arranged along the second horizontal axis which is the axis of the disc-shaped thin plate. Since the lap liquid scattering prevention cover is disposed eccentrically downward, surrounds the outer periphery of each of the first and second lapping machines except for the lower part thereof, and is in close contact with the disk-shaped thin plate, the lapping liquid is scattered. And the effect of alleviating the cleaning operation of the lapping liquid.

[0013] In a third aspect of the present invention, there is provided a disk-shaped thin plate wrapping device according to any one of the first and second aspects, wherein the pair of cutting devices driven by the driving motor constituting the rotating force applying means. Since the rotation is imparted by sandwiching both end surfaces of the disc-shaped thin plate outside the lap liquid scattering prevention cover by the conical wheel, the disc-shaped thin plate is rotated without the lap liquid containing abrasive powder interposed therebetween. This has the effect of enabling rotational drive.

A fourth aspect of the present invention is the disk-shaped thin plate wrapping device according to any one of the first to third inventions, wherein the one of the first and second movable portions is rotatably supported by the movable support portion during processing. The frusto-conical wheel is moved toward the other frusto-conical wheel by moving the movable support portion by the pressurizing means. By retracting the one frusto-conical wheel, the effect of enabling the loading and unloading of the disc-shaped thin plate before and after lapping is achieved.

According to a fifth aspect of the present invention, there is provided the disk-shaped thin plate wrapping apparatus according to any one of the first to fourth aspects, wherein the guiding roller is disposed at an upper part of the plurality of guiding rollers constituting the guiding means. Is retracted from the processing position when the disk-shaped thin plate is carried in by the retracting mechanism,
There is an effect that the disk-shaped thin plate can be loaded and unloaded before and after lapping.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention are described below.
This will be described with reference to the drawings.

(Embodiment) As shown in FIG. 1 to FIG. 3, a disk-shaped thin plate 1 as a work rotatably supported and a disk-shaped thin plate 1 are provided. A rotational force applying means 2 for rotationally driving, a lapping machine 3 having a lap surface 30 having a diameter smaller than the diameter of the disk-shaped thin plate 1 and being eccentrically disposed;
And a main shaft rotating means 4 for lapping the entire surface of the rotating disk-shaped thin plate.

As shown in FIG. 2, a pair of tool heads 40 are provided on a base 100, are aligned on a first horizontal axis, and have a plurality of first and second tool spindles 41, 42 facing each other. The two motors 4A, which are rotatably supported by the bearings and serve as a spindle rotating means 4 for rotating the tool spindles 41 and 42,
4B.

As shown in FIGS. 1 and 2, the lapping machine 3 is fixed to opposed ends of the first and second tool spindles 41 and 42 which are arranged in series on the first horizontal axis. A lap surface 30 having a diameter smaller than the diameter of the disk-shaped thin plate 1 to be processed, set to be equal to or larger than the radius of the disk-shaped thin plate 1 and extending substantially in an annular shape and formed in the axial direction is formed on the opposite end surface. First and second lapping machines 31, 32 provided.

As shown in FIGS. 1 and 2, the guide means 5 includes the first and second tool spindles 41 and 42 and the first and second lapping machines in which the first and second lapping machines are coaxially arranged in series. The disk-shaped thin plate 1 is disposed perpendicularly to a second horizontal axis that is eccentric upward with respect to the horizontal axis, and can rotate the disk-shaped thin plate 1 around the second horizontal axis by contacting the outer peripheral wall of the disk-shaped thin plate 1. And a plurality of guide rollers 50 arranged at predetermined angular intervals and supported at a predetermined angle, and configured to guide the outer periphery of the disk-shaped thin plate 1 in order to hold it.

The rotational force applying means 2 is shown in FIGS.
The plurality of rollers 5 of the guiding means 5 as shown in FIG.
0, a conical wheel support mechanism 2 for rotatably supporting a pair of truncated conical wheels 21 for holding both end surfaces of the disk-shaped thin plate 1 on a horizontal plane including a substantially center of the disk-shaped thin plate 1 whose outer periphery is supported and guided by the reference numeral 0
2 and a drive motor 23 for driving the frusto-conical wheel 21. The drive motor 23 is configured to apply a rotational force to the disk-shaped thin plate 1 to rotate around the second horizontal axis. I have.

That is, the rotational force applying means 2 is fixed to the other end of a shaft having one frustoconical wheel 21 fixed to one shaft end from a pulley 24 disposed at the shaft end of the drive motor 23. The pulley 25 is driven to rotate via a belt 26, whereby the one of the truncated conical wheels 21 rotates.
The disk-shaped thin plate 1 held between the other frusto-conical wheel 21 is rotated by applying a rotational force.

The pressurizing means 6 applies the first and second tool spindles 4 to hold the disc-shaped thin plate 1 held between the lap surfaces of the first and second lapping machines 31, 32.
1 and 42 are moved relative to the other on the first horizontal axis, and the air cylinder 60 presses the lap surfaces of the first and second lapping machines 31 and 32 against both surfaces of the disc-shaped thin plate 1. Be composed.

That is, the pressurizing means 6 is provided with the first tool spindle 4 having the first lapping machine 31 fixed to the shaft end.
The first lapping machine is configured such that a sleeve 61 rotatably supporting the first lapping machine by a plurality of bearings can be moved on a guide member 62 provided on the base 100 via a stroke bearing. It is configured to allow 31 linear reciprocations.

The lap liquid supply means 7 is connected to the first and second tool spindles 41 and 42 via a coaxial passage 74 formed coaxially in the first and second tool spindles 41 and 42. 42, the first and second lapping machines 31,
A lap liquid (slurry) containing abrasive grains is supplied between each of the lap surfaces 30 of 32 and both surfaces of the disc-shaped thin plate 1.

As shown in FIGS. 1 and 2, the lap liquid scattering prevention cover 8 is constituted by a brush-like member.
Since the first horizontal axis is eccentrically arranged below the second horizontal axis, the first and second lapping machines 3
1 and 32, surrounding the upper and outer peripheries except for the lower part of each, and extending in parallel with the disc-shaped thin plate 1 at a certain interval in close contact with the disc-shaped thin plate 1; It is arranged on both sides of the thin plate 1 so as to face each other. A water supply hole 71 to which water is supplied is opened between the plurality of lap liquid scattering prevention covers 8 arranged in parallel at a predetermined interval.

The pressurizing means 9 constitutes a part of a conical wheel support mechanism 22, rotatably supports the other truncated conical wheel 21 located on the lower side in FIG. 3, and uses a hinge pin 221 as an axis. By moving the swingable movable support 220 toward the one frusto-conical wheel 21,
The other frusto-conical wheel 21 is configured to be pressed toward one frusto-conical wheel 22. The pressurizing means 9
Has an air cylinder 222 that presses the movable support 220 against a spring (not shown) acting in the opening direction.

Further, one of the conical wheels 21 which is rotated by the pulley 25 is rotatably supported, and
Is reciprocated linearly in the thickness direction (vertical direction in FIG. 3) of the disk-shaped thin plate 1 along the guide rail 27 so as to swingably support the disk-shaped thin plate 1. The pressure holding position is configured to be adjustable.

The retracting mechanism 91 includes a plurality of guide rollers 50 which are arranged above the disc-shaped thin plate 1 among the plurality of rollers 50 constituting the guide means 5 and an L for rotatably supporting the rollers. Housing 92 with letter-shaped cross section
The guide roller 50 is configured to swing back and forth in FIG. 1 with the rear end of the housing 92 as a fulcrum by an air cylinder 93 and to be disposed above when the disk-shaped thin plate 1 is loaded. It is retracted from the position.

In the disk-shaped thin plate wrapping device of the present embodiment having the above-described structure, the one of the frusto-conical wheels is rotated by the rotational force applying means 2 via the belt 26 by the drive motor 23. The disc-shaped thin plate 1 sandwiched between the other frusto-conical wheel 21 by the rotation of
Is given a rotating force to rotate.

The lapping liquid supply means 7 is connected to the first passage via the supply passage 73 and the coaxial passage 74 formed coaxially in the first and second tool spindles 41 and 42.
The first and second lapping machines 31 and 32 are formed from distribution holes 72 formed in opposed shaft ends of the second tool spindles 41 and 42.
The lapping liquid containing abrasive grains is supplied between each lap surface of the above and both surfaces of the disc-shaped thin plate 1.

The diameter of the disk-shaped thin plate 1 is smaller than the diameter of the disk-shaped thin plate 1 by the two opposed motors 4A and 4B as the main shaft rotating means 4, and is disposed eccentrically downward with respect to the disk-shaped thin plate 1. The lapping machine 3 having the lapping surface 30 having a diameter of 30 mm is rotated to drive the lapping machine 3 to lap the entire surface of both surfaces of the disc-shaped thin plate to which the lapping liquid is supplied and rotated. It is.

In the disc-shaped thin plate wrapping apparatus of the present embodiment having the above-mentioned action, the rotating force applying means 2 drives the rotatably supported disc-shaped thin plate 1 to rotate, and the main spindle rotating means 4 The lapping machine 3 provided with a lap surface having a smaller diameter than the disc-shaped thin plate 1 is driven to rotate, so that the whole surface of the rotating disc-shaped thin plate 1 can be lapped.

The disk-shaped thin plate wrapping device of the present embodiment
The lapping machine 3 is provided with a lap surface having a smaller diameter than the disc-shaped thin plate 1. The lapping process is performed on all surfaces of both surfaces of the disc-shaped thin plate 1 which is rotating. At the same time, there is an effect that requirements for bearings and rotational accuracy are eased.

That is, in the disc-shaped thin plate lapping device of the present embodiment, the diameter of the lap surface 30 of the lapping machine 3 is
Since it is set to be equal to or larger than the radius of the disc-shaped thin plate 1, the compact lapping machine 3 enables lapping of the entire surface of the disc-shaped thin plate 1 and makes the lapping machine 3 and the entire lapping apparatus compact. Thus, there is an effect that the requirements for bearings and rotational accuracy are relaxed, and lapping of the disk-shaped thin plate 1 having a larger diameter than that of the above-described conventional apparatus is enabled.

Further, in the disc-shaped thin plate lapping apparatus of the present embodiment, the rotational force applying means 2 drives the disc-shaped thin plate 1 to rotate around the first horizontal axis, and the main spindle rotating means 4
However, the first and second lapping machines 31, 32 each having a lap surface smaller in diameter than the disc-shaped thin plate 1 are driven to rotate, and the first and second lapping plates are rotated with respect to both surfaces of the rotating disc-shaped thin plate 1. Since lapping is performed on both surfaces of the disk-shaped thin plate 1 in the presence of the lapping liquid supplied by pressurizing the lapping disks 31 and 32, lapping of all surfaces on both surfaces of the disk-shaped thin plate 1 is enabled. At the same time, there is an effect that the whole wrapping device is made compact and the requirements for bearings and rotational accuracy are eased.

Further, in the disk-shaped thin plate wrapping apparatus of the present embodiment, the first and second lapping plates 31, 32 are the cores of the disk-shaped thin plate 1 which is rotatably disposed vertically. 2, the lap liquid scattering prevention cover 8 is disposed eccentrically below the horizontal axis, surrounds the outer periphery of each of the first and second lapping machines 31 and 32 except for the lower part, and is in close contact with the disc-shaped thin plate 1. Therefore, the lapping liquid is dropped onto the lower lapping liquid collecting tray T, and the lapping liquid is scattered upward and the lapping liquid adhered to the disk-shaped thin plate 1 accompanying the rotation of the disk-shaped thin plate 1 is removed. In order to prevent the entrainment by the brush-like lap liquid scattering prevention cover 8, it is possible to prevent the used lap liquid from being mixed into the new lap liquid and to prevent the guide roller 50 from being unevenly worn, and to improve the working environment. To an effect of alleviating the cleaning of the lap solution after the end of work.

Further, in the disk-shaped thin plate wrapping device of the present embodiment, the drive motor 23 constituting the rotational force applying means is provided.
The lap liquid scattering prevention cover 8 is driven by the pair of truncated cone wheels 21 driven through the belt 26 by the
In the vicinity of a horizontal plane including substantially the center of the disk-shaped thin plate 1 above the outside of the disk-shaped thin plate 1, rotation is applied by sandwiching both end surfaces of the vertically disposed disk-shaped thin plate 1, so that the lapping liquid does not intervene. Under the environment, the disk-shaped thin plate 1 can be driven to rotate, and with the rotation of the frusto-conical wheel 21, the frustum of the frustum-cone 21
This has the effect of preventing uneven wear and damaging the surface of the disk-shaped thin plate 1.

Further, the disk-shaped thin plate wrapping device of the present embodiment is provided with the other frusto-conical wheel 21 which is rotatably supported by the movable supporting portion 220 during processing.
The one of the frusto-conical wheels 2 is moved by moving the movable support portion 220 by the air cylinder 222 of the pressurizing means 9.
1, the disk-shaped thin plate 1 is pressed and rotated during processing. At the time of non-machining, the unillustrated spring is moved to the movable
Oscillates in the backward direction. For this reason, there is an effect that it is possible to take out the lap-processed disk-shaped thin plate at the time of non-processing and to mount the disk-shaped thin plate before the lap processing.

Further, in the disk-shaped thin plate wrapping device of the present embodiment, the guide roller 50 and the housing 92 which are arranged above the plurality of guide rollers 50 constituting the guide means 5 are moved by the retracting mechanism 91 to the disk. Since the plate-shaped thin plate 1 is swung and retracted from the processing position when it is loaded, there is an effect that the disk-shaped thin plate 1 can be loaded and unloaded before and after lapping.

Further, in the disc-shaped thin plate lapping apparatus of the present embodiment, the lapping liquid supply means 7 includes the supply passage 73,
The first and second lapping machines 31, 32 are formed through the coaxial passages 74 formed coaxially in the first and second tool spindles 41, 42 from the distribution holes 72 formed at the shaft ends.
Since the lap liquid is supplied to both surfaces of the disc-shaped thin plate 1 facing the respective lap surfaces 31 and 32, the effect of enabling simultaneous lapping and uniform lapping of both surfaces of the disc-shaped thin plate 1 is achieved. .

In the lapping apparatus for a disk-shaped thin plate according to the present embodiment, the disk-shaped thin plate 1 is disposed vertically and lapping is performed, so that unnecessary stress does not act on the disk-shaped thin plate during lapping. This has the effect of promoting the fall of the lapping liquid onto the lapping liquid recovery tray T.

Further, in the disc-shaped thin plate lapping apparatus of the present embodiment, the pressing force applying means 6 comprises the first lapping board 31.
Only the disc-shaped thin plate 1 is configured to be capable of reciprocating motion to realize the pressing force required for lapping the disc-shaped thin plate 1, so that there is an effect that the configuration can be simplified and the cost can be reduced.

Further, in the disk-shaped thin plate lapping apparatus of this embodiment, even if the lap shafts 41 and 42 generate heat and are thermally displaced in the axial direction, the lap pressing force is applied to the pressing force applying means 6 (cylinder 6
The effect is determined only by the supply pressure to 0) and is not affected by the thermal displacement of the lap shaft.

Further, the disk-shaped thin plate wrapping device of the present embodiment surrounds the outer peripheries above and on both sides of the first and second lapping disks 31, 32, and is in close contact with the vertical disk-shaped thin plate 1. A plurality of the lap liquid scattering prevention covers 8 are extended and juxtaposed in a substantially U-shape at regular intervals, and the water supply hole 71 is opened between them to supply water, fall down and wash away. This has the effect of promoting the effect of preventing the lapping liquid from scattering.

The above-described embodiments are exemplifications for explanation, and the present invention is not limited to these embodiments. Those skilled in the art will recognize from the claims, the detailed description of the invention, and the drawings. Modifications and additions are possible without departing from the technical idea of the present invention.

In the above-described embodiment, for example, unnecessary or unbalanced stress due to gravity does not act on the disc-shaped thin plate during lapping, and the disc-shaped thin plate is vertically arranged from the viewpoint of promoting the fall of the lapping liquid. The present invention is not limited to these examples, and the present invention is not limited to these. For example, an embodiment in which the disk-shaped thin plate is disposed horizontally and both upper and lower surfaces are lapped. Can do that.

In the above-described embodiment, as an example, a lower guide roll serving as a guide means is disposed below the lapping plate so as to rotatably support the disk-shaped thin plate from the viewpoint of reliable support of the disk-shaped thin plate. However, the present invention is not limited to these. For example, as shown in FIG. 4, a guide means may be provided on the side of a lap liquid scattering prevention cover disposed around the lap board. It is possible to adopt an embodiment in which a lower guide roll is disposed so that all guide rolls are not exposed to the lapping liquid.

In the above-described embodiment, as an example, from the viewpoint of simplifying the configuration and enabling cost reduction, the pressure applying means 6 is configured so that only the first lapping machine 31 can reciprocate, and The example in which the pressing force required for the lapping process is realized on the thin plate 1 has been described. However, the present invention is not limited thereto. For example, the first and second tool spindles and the first and second tool spindles may be used. An embodiment in which both of the second lapping machines can be moved in the axial direction to enable uniform lapping of both surfaces of the disc-shaped thin plate 1 can be adopted.

In the above-described embodiment, the first and second tool spindles 4 are used, for example, from the viewpoint of enabling simultaneous lapping and uniform lapping of both surfaces of the disc-shaped thin plate 1.
Each of the lap surfaces 31 of the first and second lapping machines 31 and 32 is provided from a plurality of lapping liquid supply holes 71 through the coaxial passage 74 formed in the first and second 42 and the distribution hole 72 formed in the shaft end. , 32 has been described as an example in which the lapping liquid is supplied to both surfaces of the disk-shaped thin plate 1, but the present invention is not limited thereto. It is possible to adopt an embodiment in which the lap liquid is supplied to both surfaces of the disc-shaped thin plate 1 from above or another place.

In the above-described embodiment, an example in which the brush-like lap liquid scattering prevention cover 8 is used has been described as an example. However, the present invention is not limited to this, and the left and right lapping machines can be formed using air. It is possible to adopt an embodiment in which air is blown around the outer periphery to form an air curtain to prevent scattering of the lapping liquid.

[Brief description of the drawings]

FIG. 1 is a partially cut-away sectional view taken along line AA in FIG. 2 showing a disk-shaped thin plate wrapping device according to an embodiment of the present invention.

FIG. 2 is a front view showing a disk-shaped thin plate wrapping device of the embodiment.

FIG. 3 is a partially enlarged plan view showing a part of the disk-shaped thin plate lap device of the present embodiment in an enlarged manner.

FIG. 4 is a partially cutaway cross-sectional view showing a main part of a disk-shaped thin plate lap apparatus according to another embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a conventional disk-shaped thin plate wrapping device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Disc-shaped thin plate 2 Torque applying means 3 Lapping machine 4 Spindle rotating means 30 Lapping surface

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Morito Abe 1-1-1, Asahi-cho, Kariya-shi, Aichi Toyota Machine Works Co., Ltd. (72) Inventor Hideki Iwai 1-1-1, Asahi-cho, Kariya-shi, Aichi Toyota Inside Machine Co., Ltd. (72) Inventor Yutaka Inada 1-1-1, Asahi-machi, Kariya City, Aichi Prefecture Toyota Machine Works Co., Ltd. (72) Inventor Minami Minami 555 Nakanoya, Annaka City, Gunma Prefecture 1 Supermarket Co., Ltd. Inside Silicon Research Laboratory (72) Inventor Toshifumi Ishikawa 555 Nakanoya, Annaka-shi, Gunma 1 Inside Super Silicon Research Laboratories

Claims (5)

[Claims] 1. A pair of main shaft rotating means provided on a base, the main shaft rotating means being arranged on a first horizontal axis to rotatably support first and second tool main shafts, respectively, and drivingly driving these tool main shafts. A tool head; first and second lapping machines fixed to opposed ends of the first and second tool spindles, respectively, and having a smaller diameter than the diameter of the disk-shaped thin plate to be machined and having a wrap surface formed on the opposed end face; Guide means for guiding the outer periphery of the disc-shaped thin plate so as to be rotatable about a second horizontal axis eccentric to the first horizontal axis; and the disc whose outer periphery is guided by the guide means. Force applying means for applying a rotational force to the disk-shaped thin plate for rotating the thin plate about the second horizontal axis, and a disk held between the lap surfaces of the first and second lapping disks To clamp the thin plate Pressing force applying means for moving one of the tool spindles relative to the other on the first horizontal axis and pressing the lap surfaces of the first and second lapping machines against both surfaces of the disc-shaped thin plate; A lapping apparatus for a disc-shaped thin plate, comprising lap liquid supply means for supplying a lap liquid between each lap surface of the first and second lapping machines and the disk-shaped thin plate. 2. The disk according to claim 1, wherein the first horizontal axis is eccentrically arranged below the second horizontal axis, and surrounds an outer periphery of each of the first and second lapping machines except for a lower part thereof. A lapping device for a disk-shaped thin plate, comprising a lap liquid scattering prevention cover arranged in close contact with the thin plate. 3. The conical wheel support according to claim 1, wherein the rotational force applying means rotatably supports a pair of truncated conical wheels that sandwich both end surfaces of the disc-shaped thin plate outside the lap liquid scattering prevention cover. A disk-shaped thin plate lap device comprising a mechanism and a drive motor for driving said frusto-conical wheel. 4. The conical wheel support mechanism according to claim 1, wherein the conical wheel support mechanism rotatably supports the one truncated conical wheel.
A movable supporting portion movable toward the other frusto-conical wheel, and pressurizing means for moving the movable supporting portion to press the one frusto-conical wheel toward the other frusto-conical wheel; A disk-shaped thin plate wrapping device comprising: 5. A retracting mechanism according to claim 1, wherein said guide means comprises a plurality of rollers, and a retracting mechanism for retracting a guide roller disposed at an upper portion from a processing position when the disc-shaped thin plate is carried in. A disk-shaped thin plate wrapping device, comprising: