JPH1126893A - Printed wiring board - Google Patents

Abstract

(57) [Problem] To provide a printed wiring board which can easily confirm the engraved position of a V-groove and has high electrical reliability after V-cut processing. SOLUTION: Terminals 31a and 31b and a connection part 31 are provided.
c, terminals 32a, 32b,
The conductive pattern 32 including the connecting portion 32c is formed so as to oppose each other with the predetermined line 10 therebetween and to have a mirror image relationship with each other with the predetermined line 10 therebetween. The connecting portion 31c is in contact with a boundary line 10b between the circuit pattern forming region 1a and the V groove allowable displacement region 10a, and the connecting portion 32c is in contact with a boundary line 10c between the circuit pattern forming region 1a and the V groove allowable displacement region 10a. . Further, when the V-groove is engraved beyond the shift allowable region 10a of the V-groove, the conductive patterns 31, 32 are formed at positions where the connection portions 31c or 32c are disconnected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board capable of easily detecting a shift of a V-groove in the printed wiring board.

[0002]

2. Description of the Related Art Conventionally, a plurality of circuit patterns are formed on a single insulating substrate, and the insulating substrate is divided for each region (hereinafter, referred to as a "circuit pattern forming region") in which each circuit pattern is formed. A V-cut method for obtaining a printed wiring board is known. In the V-cut method, a V-shaped groove having a V-shaped cross section is engraved on a predetermined line for dividing the insulating substrate, and the insulating substrate is divided along the V-shaped groove. The V-grooves are engraved on the front and back of the insulating substrate at positions corresponding to each other. In recent years, electronic devices have tended to be lighter, thinner and smaller, and the size and shape of each component to be mounted are required to be accurate. Therefore, in the V-cut method, which is the final step in the manufacture of a printed wiring board, the V-groove must be formed at an accurate position.

As a method for confirming the engraved position of such a V-groove, a visual inspection and an electric inspection are known. As a visual inspection, there is known a method in which a copper foil pattern having a predetermined width is formed on a part of a predetermined line, and a remaining shape of the copper foil after a V groove is carved is visually checked. Also, as an electrical inspection, when inspecting a circuit pattern with an electrical inspection machine,
At the same time, a method of confirming the engraved position of the V groove is known.
That is, a copper foil pattern having a predetermined width over substantially the entire area on the predetermined line and having a plurality of terminals at predetermined positions is formed,
After the V-groove is engraved, when electrically inspecting the circuit pattern, the probe of the fixture set in the electric inspection machine is applied to the terminals, and the continuity and non-conduction between those terminals are checked to check the V-groove. This is a method of checking the engraving position.

[0004]

However, in each of the above-mentioned inspection methods, since a copper foil pattern for confirming the engraving position of the V-groove is formed over the predetermined line, the V-groove is engraved and the V-groove is formed. When the printed wiring board is divided along the groove, the surface almost perpendicular to the surface of the insulating substrate in the remaining copper foil pattern,
It is exposed as a surface adjacent to the side surface of the divided printed wiring board. Since the solder resist mask is not applied to the side surface of the printed wiring board, when mounting electronic components by solder dip, the solder becomes small balls on the surface almost perpendicular to the surface of the insulating substrate of the remaining copper foil pattern. To adhere. Since this solder ball is peeled off by a slight vibration, it has a problem that it adheres to an electronic component and causes a problem such as a short circuit.

The present invention has been made to solve the above problems, and provides a printed wiring board in which a copper foil pattern for confirming a position where a V-groove is carved does not have an adverse effect after the carving of the V-groove. It is intended to be.

[0006]

A printed wiring board according to the present invention is located between a plurality of circuit pattern formation regions and a plurality of circuit pattern formation regions, and is provided with a V-cut for V-cut processing.
In a printed wiring board having a shift allowable region of a V-groove including a planned line in which a groove is engraved, a connecting portion that connects a pair of terminals and a pair of terminals and is formed at a position closer to the planned line than the pair of terminals. At least one conductive pattern for confirming the V groove engraving position is formed on both sides of the predetermined line,
The connection portion is in contact with a boundary between the circuit pattern formation region and the shift allowable region of the V groove.

Preferably, when the V-groove is engraved beyond the deviation allowable region of the V-groove, a connection pattern is formed at a position where the connection portion is removed and the pair of terminals is non-conductive.

Further, the printed wiring board according to the present invention has a V-groove formed between a circuit pattern formation region and a V-groove including a predetermined line on which a V-groove for V-cut processing is to be cut. In a printed wiring board having a shift allowable area, a conductive pattern for connecting a pair of terminals and a pair of terminals and having a connecting portion formed closer to a predetermined line than the pair of terminals for confirming a V-groove engraving position. Are formed on both sides of the predetermined line, respectively, and the connecting portion is in contact with the boundary line between the circuit pattern forming region and the V groove allowable deviation region, and the V groove is engraved in the V groove deviation allowable region. It is characterized by the following.

[0009]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of the printed wiring board according to the first embodiment of the present invention. Printed wiring board 1
Has three scheduled lines 10 extending in parallel in the vertical direction at a predetermined pitch, and one scheduled line 20 extending in the horizontal direction.
The V-groove displacement allowable region 10a has a predetermined width around the planned line 10 and extends along the planned line 10. The V-groove deviation allowable region 20a has a predetermined width around the planned line 20. It extends along the scheduled line 20. The shift allowable region 10a of the V-groove and the shift allowable region 20a of the V-groove are hatched for convenience of explanation. Circuit pattern formation region 1a
Are defined by a V-groove shift allowable region 10a and a V-groove shift allowable region 20a, and are arranged in a matrix. In other words, the shift allowable regions 10a and 20 of the V groove
“a” is located between the plurality of circuit pattern formation regions 1a, and includes predetermined lines 10 and 20, respectively.

In FIG. 1, a conductive pattern 31 is formed on the left side of the planned line 10, and a conductive pattern 32 is formed on the right side of the planned line 10. Conduction patterns 31, 32
Are formed near both ends of the scheduled line 10, that is, near the upper end and the lower end of the printed wiring board 1. In FIG. 1, a conductive pattern 41 is formed above the planned line 20, and a conductive pattern 42 is formed below the planned line 20. The conduction patterns 41, 42
The printed wiring board 1 is formed near both ends, that is, near the right end and the left end of the printed wiring board 1.

FIG. 2 is an enlarged view of a portion where the conductive patterns 31 and 32 are formed near the upper end of the printed wiring board 1 of FIG. The conduction pattern 31 has terminals 31a, 3
1b, and the terminals 31a and 31b
A connecting portion 31c is formed at a position closer to the scheduled line 10 than to the connecting lines 31a and 31b. The connection part 31c is
Extend in a direction substantially perpendicular to the terminals 31a,
It has a U-shape consisting of two orthogonal portions that are electrically connected to 31b and a parallel portion that extends in parallel with the predetermined line 10. Similarly,
The conductive pattern 32 includes terminals 32a and 32b,
c, and the connecting portion 32c has a U-shape including a parallel portion and two orthogonal portions.

The conductive patterns 31 and 32 are formed so as to face each other with the predetermined line 10 interposed therebetween, and have a mirror image relationship with each other with the predetermined line 10 interposed therebetween. Furthermore, the conduction pattern 3
The parallel portion closest to the planned line 10 in the first connection portion 31c is in contact with the boundary 10b between the shift allowable region 10a of the V-groove and the circuit pattern formation region 1a. The closest parallel part is
V groove allowable area 10a and circuit pattern forming area 1a
Is in contact with the boundary line 10c. That is, when a part of the V-groove is engraved on the side of the circuit pattern forming region 1a beyond the boundary line 10b, the conductive pattern 31 is formed at a position where the connection part 31c is disconnected, and a part of the V-groove is formed as a boundary. The conductive pattern 32 is formed at a position where the connection portion 32c is disconnected when the connection portion 32c is cut in the circuit pattern forming region 1a beyond the line 10c. The conductive patterns 31, 32 near the lower end of the printed wiring board 1 and the conductive patterns 41, 42 near the right end and the left end have the same configuration.

On such a printed wiring board 1, a V-shaped groove having a V-shaped cross section is engraved on the predetermined lines 10 and 20, that is, the bottom line of the groove coincides with the predetermined lines 10 and 20. FIG. 3 is an enlarged view showing the vicinity of the conductive patterns 31 and 32 when the V-groove is engraved within the allowable deviation range of the V-groove. The bottom line 101 of the V groove 100 is located on the predetermined line 10. A notch 102 is formed at an end of the printed wiring board 1. Since the V-groove 100 is engraved within the deviation allowable range 10a of the V-groove, the conduction patterns 31 and 32 do not break even after the V-groove is engraved. Therefore, when a pattern inspection is performed on the printed wiring board 1 by an electric inspection machine, it is confirmed that both of the conduction patterns 31 and 32 are electrically conducted.

FIG. 4 is a side view of the printed wiring board 1 of FIG. On the back surface of the surface where the V-groove 100 is engraved, V
A groove 100 'is engraved. The printed wiring board 1 has V
The groove is divided at a position corresponding to a line B connecting the vertices of the cross-sectional shapes of the grooves 100 and 100 '. When the printed wiring board 1 is divided, the side surface (the surface corresponding to the line B in FIG. 3) of the divided printed wiring board and the inner surface 100a of the V groove 100 are adjacent to each other. , V-groove 100 are not side surfaces adjacent to the inner surface 100a. Therefore, the side surface 3u together with the upper surface 31u of the conductive pattern 31
Since 1 s is also masked by the solder resist, a solder ball is formed on the side surface 31 in the solder dip when mounting an electronic component.
Does not adhere to s. Similarly, since the side surface 32s of the conductive pattern 32 is not the side surface adjacent to the inner surface 100a of the V-shaped groove 100, the solder ball does not adhere to the side surface 32s in the solder dip.

FIG. 5 is an enlarged view showing the vicinity of the conductive patterns 31 and 32 when the V-groove is engraved beyond the boundary line 10b. The bottom line 101 of the V groove 100 is not located on the predetermined line 10, and the conduction pattern 31 is
Is disconnected due to Therefore, the conduction patterns 31, 32
When the continuity check is performed by the electric tester, it is confirmed that the continuity pattern 31 is electrically non-conductive.

That is, when the circuit pattern is checked by the electric inspection machine after the V-groove is formed, the conduction patterns 31, 3
By checking the conduction and non-conduction of 2 and 41, 42, whether the V-groove is engraved within the allowable range of the V-groove displacement,
Alternatively, it can be checked whether the V-groove is engraved beyond the allowable deviation range.

FIG. 6 is a plan view of a printed wiring board according to a second embodiment of the present invention. The printed wiring board 2 has a first
Like the printed wiring board 1 of the embodiment, the printed wiring board 1 includes three scheduled lines 11 extending in the vertical direction at a predetermined pitch and one scheduled line 21 extending in the horizontal direction. The shift allowable regions 11a and 21a of the V-groove extend along. As in FIG. 1, the shift allowable region 11a of the V groove and the shift allowable region 21a of the V groove are shaded. Circuit pattern formation region 2a, V groove deviation allowable region 11a and V
The configuration of the groove shift allowable area 21a is the same as that of FIG. Further, a conductive pattern 51 is formed near the upper end of the printed wiring board 2 on the left side of each planned line 11, and a conductive pattern 52 is formed near the lower end of the printed wiring board 2 on the right side of each planned line 11. Have been. A conductive pattern 61 is formed above the planned line 21 near the left end of the printed wiring board 2, and a conductive pattern 62 is formed below the planned line 21 near the right end of the printed wiring board 2. ing.

FIG. 7 is an enlarged view of the conduction patterns 51 and 52. The parallel portion closest to the predetermined line 11 in the connection portion 51c of the conduction pattern 51 is a shift allowable region 11a of the V groove.
Is in contact with the boundary line 11b of the circuit pattern formation region 2a and the predetermined line 1 at the connection portion 52c of the conduction pattern 52.
The parallel portion closest to 1 is in contact with the boundary line 11c between the shift allowable region 11a of the V groove and the circuit pattern formation region 2a.
That is, when a part of the V-groove is engraved on the side of the circuit pattern formation region 2a beyond the boundary line 11b, the connection portion 51c
Is formed at a position where the line breaks, and a part of the V groove extends beyond the boundary line 11c to form the circuit pattern formation region 2a.
The conductive pattern 52 is formed at a position where the connecting portion 52c is disconnected when it is engraved on the side. Conduction pattern 6
1 and 62 have the same configuration.

Therefore, as in the first embodiment, the conductive patterns 51, 52 and 61, 6 are cut by an electric tester after the V-groove is formed.
By checking the conduction and non-conduction of 2, it can be confirmed whether or not the V-groove is engraved within the allowable range of the deviation.

FIG. 8 is an enlarged view showing the vicinity of the conductive pattern of the printed wiring board 1 to which the third embodiment of the present invention is applied. The conductive pattern 71 has terminals 71a and 71b and a connection portion 71c, and the conductive pattern 72 has terminals 72a and 7b.
2b and a connection portion 72c. The connection portions 71c and 72c have a V-shape. The conduction patterns 71 and 72 are formed such that the apex of the connection part 71c and the apex of the connection part 72c face each other across the predetermined line 10 and are in a mirror image relationship with each other. Further, the apex of the connection portion 71c of the conduction pattern 71 is in contact with the boundary 10b between the shift allowable region 10a of the V-groove and the circuit pattern formation region 1a.
The vertex of the second connection portion 72c is located at the shift allowable region 10a of the V groove.
And the boundary line 10c of the circuit pattern formation region 1a. That is, when a part of the V-groove is engraved on the side of the circuit pattern formation region 1a beyond the boundary line 10b, the connection portion 7
A conduction pattern 71 is formed at a position where 1c is disconnected, and V
The conduction pattern 72 is formed at a position where the connecting portion 72c is disconnected when a part of the groove is engraved on the side of the circuit pattern formation region 1a beyond the boundary line 10c.

FIG. 9 is an enlarged view showing the vicinity of a conductive pattern of a printed wiring board 1 to which a fourth embodiment of the present invention is applied. Connection portions 81c, 82c of conduction patterns 81, 82
Each have a U-shape. As in the first to third embodiments, the vertex of the connecting portion 81c and the vertex of the connecting portion 82c face each other across the predetermined line 10 and have a mirror image relationship with each other.
The conductive patterns 81 and 82 are formed, and the conductive pattern 81 is formed at a position where the connection portion 81c is disconnected when a part of the V-groove is engraved on the side of the circuit pattern formation region 1a beyond the boundary line 10b, The conduction pattern 82 is formed at a position where the connecting portion 82c is disconnected when a part of the V groove is engraved on the side of the circuit pattern forming region 1a beyond the boundary line 10c.

As described above, according to the first to fourth embodiments, V is checked by electrically checking the conduction pattern.
Since the engraved position of the groove can be confirmed, the reliability is higher than the visual inspection. In addition, since the conduction pattern is not formed over the predetermined line, after dividing the insulating substrate along the V-groove,
Since the side surface of the conductive pattern is not exposed as the side surface adjacent to the inner surface of the groove, the solder ball does not adhere to the side surface of the conductive pattern when applying the solder dip.

In the first to fourth embodiments, the shapes of the connecting portions of the formed conductive patterns are all the same. However, the present invention is not limited to this. It may be formed on a printed wiring board.

[0024]

As described above, according to the present invention, it is easy to confirm the engraved position of the V-groove, and it is possible to obtain a printed wiring board having high electrical reliability after the V-cut processing.

[Brief description of the drawings]

FIG. 1 is a plan view of a printed wiring board according to a first embodiment of the present invention.

FIG. 2 is an enlarged view of the vicinity of a conduction pattern according to the first embodiment.

FIG. 3 is an enlarged view of the vicinity of a conduction pattern when a V-groove is engraved within an allowable range of deviation.

FIG. 4 is a cross-sectional view of the vicinity of a conduction pattern when a V-groove is engraved within an allowable range of deviation.

FIG. 5 is an enlarged view of the vicinity of a conduction pattern when a V-groove is engraved outside an allowable range of deviation.

FIG. 6 is a plan view of a printed wiring board according to a second embodiment of the present invention.

FIG. 7 is an enlarged view near a conduction pattern according to a second embodiment.

FIG. 8 is an enlarged view of the vicinity of a conduction pattern according to a third embodiment.

FIG. 9 is an enlarged view near a conduction pattern according to a fourth embodiment.

[Explanation of symbols]

 1, 2 printed wiring board 10, 20 scheduled line 31, 32, 41, 42 conductive pattern 51, 52, 61, 62 conductive pattern 71, 72 conductive pattern 81, 82 conductive pattern 100 V groove 101 bottom line 102 cutout

Claims (3)

[Claims] 1. A plurality of circuit pattern formation regions, and a V groove misalignment allowable region which is located between the plurality of circuit pattern formation regions and includes a predetermined line on which a V groove for V cut processing is to be engraved. In a printed wiring board having a conductive pattern for connecting a pair of terminals and the pair of terminals and having a connecting portion formed at a position closer to the predetermined line than the pair of terminals, a conduction pattern for confirming a V-groove engraving position is provided. A printed wiring board, wherein at least one connection portion is formed on both sides of the predetermined line, and the connection portion is in contact with a boundary between the circuit pattern formation region and the shift allowable region of the V groove. 2. The conductive pattern is formed at a position where the connecting portion is removed and the pair of terminals are non-conductive when the V-groove is engraved beyond a shift allowable region of the V-groove. The printed wiring board according to claim 1, wherein: 3. A printed wiring having a circuit pattern forming region and a V groove shift allowable region which is located between the circuit pattern forming region and includes a planned line in which a V groove for V cutting is formed. In the plate, a conduction pattern for connecting a pair of terminals and the pair of terminals and having a connecting portion formed at a position closer to the predetermined line than the pair of terminals is used to confirm a V groove engraving position. At least one is formed on each side, and the connecting portion is in contact with a boundary line between the circuit pattern forming region and the shift allowable region of the V groove, and the V groove is engraved in the shift allowable region of the V groove. Printed wiring board.