JPH11271966A - Photosensitive resin composition and photosensitive element using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance photosensitivity, resolution, resistance to chemicals, intimate adhesion, mechanical strength, and flexibility by incorporating a binder polymer and a specified compound having polymerizable ethylenically unsaturated groups in the molecule and a photopolymerization initiator. SOLUTION: The photosensitive resin composition to be used comprises (A) the binder polymer, (B) the compound having the polymerizable ethylenically unsaturated grounds in the molecule and (C) the photopolymerization initiator. The compound (B) is made essentially from a compound represented by formula I and a compound represented by formula II in which R<1> is, independently, a 1-10C alkylene group; R<2> is a group represented by formula III; R<3> is an H atom or a methyl group; X<1> is a 2-6C alkylene group; each of (k) and (m) is a positive integer of satisfying k+m=8 to 40; each of R<4> and R<5> is same as R<3> ; X<1> is same as X<2> and X<3> ; and (n) is an integer of 1-14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a photosensitive resin composition and a photosensitive element using the same.

[0002]

2. Description of the Related Art Conventionally, in the field of manufacturing printed circuit boards, a photosensitive resin composition and a photosensitive element obtained using a support and a protective film have been widely used as a resist material for etching, plating and the like. Have been. The printed circuit board is formed by laminating a photosensitive film on a copper substrate, exposing it to a pattern, removing the unexposed portion with a developing solution, etching or plating to form a pattern, and curing the cured portion. It is manufactured by a method of peeling off from the substrate.

[0003] As a developing solution for removing the unexposed portion, an alkali developing type using a sodium hydrogen carbonate solution or the like is mainly used, and the developing solution usually has a capacity to dissolve the photosensitive layer to some extent. It is used, and at the time of use, the photosensitive resin composition is dissolved or dispersed in the developer. Due to the recent increase in the density of printed wiring boards, the contact area between the copper substrate and the patterned photosensitive layer has become smaller, so that excellent adhesive strength, mechanical strength, chemical resistance, Flexibility is required. Of this kind of property,
A method using a photopolymerizable compound having a bisphenol A skeleton to improve chemical resistance is disclosed in Japanese Patent Publication No. 7-2720.
Although described in Japanese Patent Publication No. 5 (KOKAI) No. 5, the cured film tends to be brittle. Further, a photopolymerizable composition having both chemical resistance and flexibility is described in JP-A-8-286372.
There is a problem in that the resolution is slightly inferior and the high density correspondence is not always sufficient.

[0004]

SUMMARY OF THE INVENTION The inventions according to claims 1, 2 and 3 provide a photosensitive material having excellent photosensitivity, resolution, chemical resistance (plating resistance), adhesion, mechanical strength, flexibility and the like. The present invention provides a conductive resin composition. The invention according to claim 4 is
An object of the present invention is to provide a photosensitive element excellent in photosensitivity, resolution, chemical resistance (plating resistance), adhesion, mechanical strength, flexibility, environment, workability, and the like.

[0005]

The present invention comprises (A) a binder polymer, (B) a compound having a polymerizable ethylenically unsaturated group in a molecule, and (C) a photopolymerization initiator. ) Component of the general formula (I)

Embedded image (Wherein, R ¹ represents an alkylene group having 1 to 10 carbon atoms;
The three R ^{1 s} may be the same or different, and R ² has the following general formula

Embedded image (Wherein, R ³ represents a hydrogen atom or a methyl group, X ¹ represents an alkylene group having 2 to 6 carbon atoms, and n is an integer of 1 to 14), and 3 R ² may be the same or different) and a compound represented by the general formula (II)

Embedded image (Wherein R ⁴ and R ⁵ each independently represent a hydrogen atom or a methyl group, X ² and X ³ each independently represent an alkylene group having 2 to 6 carbon atoms, and k and m represent k + m = 8 to A positive integer selected to be 40) as an essential component.

In the present invention, the binder polymer (A) preferably has an acid value of 100 to 500 and a weight average molecular weight of 2
The present invention relates to the photosensitive resin composition having a molecular weight of from 0.000 to 300,000. Further, in the present invention, the use ratios of the component (A), the component (B) and the component (C) are as follows.
Component (A) is 40 to 8 with respect to 100 parts by weight of the total amount of components.
0 parts by weight, 20 to 60 parts by weight of the component (B) and 0.1 to 20 parts by weight of the component (C), and the compound represented by the general formula (I) in the component (B) and the general formula The present invention relates to the above-mentioned photosensitive resin composition containing the compound represented by (II) in an amount of 3 to 50 parts by weight or more. The present invention also relates to a photosensitive element obtained by applying the photosensitive resin composition on a support and drying the composition.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION The photosensitive resin composition of the present invention comprises
(A) a binder polymer, (B) a compound having a polymerizable ethylenically unsaturated group in a molecule, and (C) a photopolymerization initiator, wherein the component (B) is represented by the general formula (I) or the general formula It contains the compound represented by (II) as an essential component.

Examples of the binder polymer (A) in the present invention include acrylic acid, methacrylic acid, and vinyl copolymers obtained by copolymerizing vinyl monomers copolymerizable therewith. The polymers are used alone or in combination of two or more. The vinyl monomer is not particularly limited, for example, methyl acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, tetrahydrofurfuryl acrylate,
Dimethylaminoethyl acrylate, diethylaminoethyl acrylate, glycidyl methacrylate, 2,2,2-trifluoroethyl acrylate, 2,2,3,3-tetrafluoropropyl acrylate, methacrylic acid esters corresponding to the above, Acrylamide, diacetone acrylamide, styrene, vinyltoluene and the like can be mentioned.

(A) The binder polymer must be soluble or swellable in an aqueous alkaline solution (for example, an aqueous solution of 1 to 3% by weight of sodium carbonate or potassium carbonate) from the viewpoints of developability and environmental preservation. Preferably, it has a carboxyl group in order to have such properties. When the binder polymer (A) is soluble or swellable in an aqueous alkaline solution (for example, an aqueous solution of 1 to 3% by weight of sodium carbonate or potassium carbonate), its acid value is 100 to 500. Is preferred. If the acid value is less than 100, the developing time tends to be slow, and if it exceeds 500, the developer resistance of the photocured resist tends to decrease. Further, the weight average molecular weight (measured by gel permeation chromatography and converted to standard polystyrene) of the binder polymer (A) is preferably from 20,000 to 300,000. If the weight average molecular weight is less than 30,000, the developer resistance tends to decrease, and if it exceeds 300,000, the development time tends to be long.

In the compound (B) of the present invention, the photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in the molecule, the compound represented by the above general formula (I) contained as an essential component, In the formula (I), examples of the alkylene group having 1 to 10 carbon atoms represented by R ¹ include a methylene group, an ethylene group, a propylene group, an isopropylene group, a butylene group, an isobutylene group, a pentylene group, a neopentylene group, and a hexylene group. , A heptylene group, an octylene group, a 2-ethyl-hexylene group, a nonylene group, a decylene group and the like. Examples of the alkylene group having 2 to 6 carbon atoms represented by X ¹ include an ethylene group, a propylene group, an isopropylene group, a butylene group, an isobutylene group, a pentylene group, a neopentylene group, and a hexylene group. An ethylene group is preferred from the viewpoints of properties and plating resistance. Further, n in the above general formula as R ² is 1 to
It is an integer of 14 and preferably 2 to 14. n
Exceeds 14, the chemical resistance decreases.

As a commercially available product of the compound represented by the above general formula (I), for example, UA-21 (R in the above general formula (I))
¹ is -C ₆ H ₁₂ -, n in R ² is 4, X ¹ is -CH ₂ C
H ₂ —, R ³ is —CH _3, a product of Shin-Nakamura Chemical Co., Ltd.). The compounds represented by formula (I) are used alone or in combination of two or more.

Further, in the compound represented by the general formula (II) contained as an essential component in the component (B) in the present invention, the number of carbon atoms represented by X ² and X ³ in the general formula (II) the 2-6 alkylene group, include the same ones as exemplified for the above X ^1, resolution, ethylene group is preferable from the viewpoint of plating resistance. In the above general formula (II),
k + m is 8 to 40, but when k + m is 7 or less,
(A) The compatibility with the binder polymer decreases, and the photosensitive element is easily peeled off when the photosensitive element is laminated on the substrate. Or k +
When m is 41 or more, the hydrophilicity increases, the resist image tends to peel off during development, and the plating resistance (particularly, solder plating) decreases.

The compound represented by the general formula (II) includes, for example, 2,2-bis [4- (methacryloxypentaethoxy) phenyl] propane and 2,2-bis [4-
(Acryloxypentaethoxy) phenyl] propane,
2,2-bis [4- (methacryloxypentadecaethoxy) phenyl] propane, 2,2-bis [4- (acryloxypentadecaethoxy) phenyl] propane,
2-bis [4- (methacryloxydiethoxy) phenyl] propane, 2,2-bis [4- (acryloxydiethoxy) phenyl] propane, and the like, and commercially available products such as BPE-500 and BPE-1300 (All are trade names of Shin-Nakamura Chemical Co., Ltd.). The compounds represented by the general formula (II) are used alone or in combination of two or more.

In the present invention, the component (B) includes:
Compounds other than the compounds represented by the above general formula (I) and the general formula (II), which are essential components in the component (B), can be used. Compounds obtained by reacting an α, β-unsaturated carboxylic acid with a polyhydric alcohol (polyethylene glycol diacrylate (having 2 to 14 ethylene groups), trimethylolpropane diacrylate, trimethylolpropane triacrylate, tetramethylol Methane triacrylate, tetramethylol methane tetraacrylate, polypropylene glycol diacrylate (having 2 to 14 propylene groups), dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, etc.), glycidyl group-containing compounds, α, β
-A compound obtained by adding an unsaturated carboxylic acid (trimethylolpropane triglycidyl ether triacrylate, bisphenol A diglycidyl ether acrylate, etc.), urethane acrylate (acrylic or methacrylic monomer having an OH group at the β-position and isophorone diisocyanate, 2,6-toluene diisocyanate,
2,4-toluene diisocyanate or addition reaction product of 1,6-mexamethylene diisocyanate), nonylphenyldioxylene acrylate, γ-chloro-β-
Hydroxypropyl-β′-acryloyloxyethyl-o-phthalate, β-hydroxyethyl-β′-acryloyloxyethyl-o-phthalate, methacrylates corresponding thereto, alkyl esters of acrylic acid (methyl acrylate, ethyl acrylate) ester,
Butyl acrylate, 2-ethylhexyl acrylate, etc.), and the corresponding alkyl esters of methallylic acid.

As the photopolymerization initiator (C) in the present invention, for example, aromatic ketones (benzophenone, 4,4 ')
-Bis (dimethylamino) benzophenone, 4,4'-
Bis (diethylamino) benzophenone, 4-methoxy-4'-dimethylaminobenzophenone, 2-ethylanthraquinone, phenanthrenequinone, etc., benzoin (benzoin ether such as benzoin methyl ether, benzoin ethyl ether, benzoin phenyl ether, etc., methyl benzoin, ethyl benzoin Benzyl derivatives (benzyldimethyl ketal, etc.), 2,4,5
-Triarylimidazole dimer (2-o-chlorophenyl) -4,5-diphenylimidazole dimer, 2
-(O-chlorophenyl) -4,5-di (m-methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer,
-(O-methoxyphenyl) -4,5-diphenylimidazole dimer, 2- (p-methoxyphenyl) -4,
5-diphenylimidazole dimer, 2,4-di (p-
Methoxyphenyl) -5-phenylimidazole dimer, 2- (2,4-dimethoxyphenyl) -4,5-diphenylimidazole dimer, 2- (p-methylmercaptophenyl) -4,5-diphenylimidazole dimer Acridine derivative (9-phenylacridine,
1,7-bis (9,9'-acridinyl) heptane and the like
And the like. These are used alone or in combination of two or more.

The amount of the component (A) in the present invention is as follows:
Preferably, the amount is 40 to 80 parts by weight based on 100 parts by weight of the total of the components (A) and (B). When the compounding amount is less than 40 parts by weight, the photocured product is apt to become brittle,
When used as a photosensitive element, the coating properties tend to be poor, and if it exceeds 80 parts by weight, the sensitivity tends to be insufficient.

The amount of the component (B) in the present invention is as follows:
The amount is preferably 20 to 60 parts by weight based on 100 parts by weight of the total of the components (A) and (B). If the amount is less than 20 parts by weight, the sensitivity tends to be insufficient, and if it exceeds 60 parts by weight, the photocured product tends to be brittle.

The compounding amount of the compound represented by the general formula (I), which is an essential component in the component (B) in the present invention, is as follows:
It is preferably from 3 to 50 parts by weight, more preferably from 5 to 40 parts by weight, based on 100 parts by weight of the total amount of the components (A) and (B). When the amount is less than 3 parts by weight, sensitivity, adhesion, plating resistance and the like tend to be inferior. When the amount exceeds 50 parts by weight, the stripping time of the resist tends to be too long.

In the present invention, the compounding amount of the compound represented by the general formula (II), which is an essential component in the component (B), is based on 100 parts by weight of the total of the components (A) and (B). It is preferably from 3 to 50 parts by weight, more preferably from 5 to 40 parts by weight. If the amount is less than 3 parts by weight, the resolution tends to be poor, and if it exceeds 50 parts by weight, the stripping time of the resist tends to be too long.

The amount of the component (C) in the present invention is as follows:
The amount is preferably 0.1 to 20 parts by weight based on 100 parts by weight of the total of the components (A) and (B). If the amount is less than 0.1 part by weight, the sensitivity tends to be insufficient. If the amount exceeds 20 parts by weight, the absorption on the surface of the composition during exposure increases, and the internal photo-curing increases. It tends to be insufficient.

The photosensitive resin composition of the present invention may contain, if necessary, a dye such as malachite green, a coloring agent such as leuco crystal violet, a plasticizer such as p-toluenesulfonic acid, a pigment, a flame retardant, and a thermal polymerization. Inhibitors, adhesion promoters and the like can be added.

In the photosensitive resin composition of the present invention, each of the above components is dissolved in a solvent dissolving them, for example, toluene, acetone, methyl ethyl ketone (MEK), methyl isobutyl ketone, methyl cellosolve, ethyl cellosolve, chloroform, methylene chloride, By dissolving and mixing in methanol, ethanol, or the like, a uniform solution can be obtained.

The photosensitive element of the present invention is prepared by applying the above-described photosensitive resin composition of the present invention on a support and drying the same to form a photosensitive layer having a thickness of about 5 to 100 μm on the support. it can. The coating can be performed by a known method, for example, a roll coater, a comma coater, a gravure coater, an air knife coater, a die coater, a bar coater, or the like. Drying is performed at 80 to 150 ° C. for about 5 to 30 minutes.

As the support, a polymer film having a thickness of 5 to 100 μm, preferably about 10 to 30 μm, for example, a film made of polyethylene terephthalate, polypropylene, polyethylene or the like can be mentioned.
Polyethylene terephthalate films are preferred. Further, these polymer films can be laminated on the photosensitive layer as a protective film for the photosensitive layer.

As a method for producing a photoresist image using the photosensitive element of the present invention, when the above-mentioned protective film is present, after removing the protective film,
A method of laminating by pressing the photosensitive layer on the substrate while heating the photosensitive layer may, for example, be mentioned. The surface to be laminated is usually a metal surface, but is not particularly limited.

The heating temperature of the photosensitive layer is not particularly limited.
The temperature is preferably set to 0 to 130 ° C. The pressure for pressing the photosensitive layer is not particularly limited, and is preferably 1 to 10 kgf / cm ² . If the photosensitive layer is heated as described above, it is not necessary to pre-heat the substrate in advance, but the substrate may be pre-heated to further improve the lamination property.

The photosensitive layer thus completed in lamination is
It is then imagewise exposed to actinic light using a negative or positive film. At this time, if the support existing on the photosensitive layer is transparent, it may be exposed as it is, and if it is opaque, it is necessary to remove it.

From the viewpoint of protecting the photosensitive layer, the support is transparent, and it is preferable to expose the support while leaving the support.

As the activating light, a known activating light source, for example, light generated from a carbon arc, a mercury vapor arc, a xenon arc, a flood lamp for photography, a sun lamp or the like is used.

Next, after the exposure, if a polymer film or the like is present on the photosensitive layer, the polymer film is removed, and then, using an aqueous alkali solution, for example, spraying, rocking immersion, brushing, scraping, etc. The unexposed portion is removed by a known method described above, and development is performed. Examples of the base of the alkaline aqueous solution include alkali hydroxides (such as hydroxides of lithium, sodium or potassium), alkali carbonates (such as carbonates or bicarbonates of lithium, sodium or potassium), and alkali metal phosphates (such as potassium phosphate). , Sodium phosphate, etc.), and alkali metal pyrophosphates (sodium pyrophosphate, potassium pyrophosphate, etc.), and an aqueous solution of sodium carbonate is preferable. The pH of the aqueous alkali solution used for development is preferably in the range of 9 to 11, and the temperature is adjusted according to the developability of the photosensitive layer. Also,
A surfactant, an antifoaming agent, a small amount of an organic solvent for accelerating the development, and the like can be mixed in the alkaline aqueous solution. From the viewpoint of developability and the like, a 0.1 to 5% by weight aqueous sodium carbonate solution is preferred.

Further, as a method of manufacturing a printed wiring board, there is a method of treating the surface of the substrate by a known method such as etching and plating using the developed photoresist image as a mask. The photoresist image is then:
Usually, it can be peeled off with an aqueous solution having a stronger alkalinity than the aqueous alkali solution used for development. As the strong alkaline aqueous solution, for example, an aqueous solution of 1 to 5% by weight of sodium hydroxide is used.

[0032]

The present invention will be described below with reference to examples. Examples 1 to 4 and Comparative Examples 1 to 3 The materials shown in Tables 1 and 2 were blended to obtain solutions.

[0033]

[Table 1]

[0034]

[Table 2]

The component (B) shown in Table 3 was dissolved in the obtained solution to obtain a solution of the photosensitive resin composition.

[0036]

[Table 3]

The compounds used in Table 3 are shown below. * 1: In the general formula (I), R ¹ is —C ₆ H ₁₂ — and R ³ is —C
A compound in which H ₃ and X ¹ are —CH ₂ CH ₂ — and n is 4 (average value), manufactured by Shin-Nakamura Chemical Co., Ltd. * 2: In the general formula (II), R ⁴ and R ⁵ are each —CH ₃ , X ² and X
³ is -CH ₂ CH ₂ -, compounds of k + m = 10 (average value), Shin-Nakamura Chemical Co., Ltd. * 3: General formula (II), R ⁴ and R ⁵ are -CH _3, X ² and X
³ is —CH ₂ CH ₂ —, k + m = 30 (average value), manufactured by Shin-Nakamura Chemical Co., Ltd. * 4: Polypropylene glycol diacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd.) * 5: γ-chloro -Β-hydroxypropyl-β′-methacryloyloxyethyl-o-phthalate

Next, the obtained solution of the photosensitive resin composition was uniformly coated on a 25 μm-thick polyethylene terephthalate film, and was dried for about 1 hour with a hot air convection dryer at 100 ° C.
After drying for 0 minutes, a photosensitive element was obtained. The dried film thickness of the photosensitive resin composition layer was 50 μm.

On the other hand, the copper surface of a copper-clad laminate (manufactured by Hitachi Chemical Co., Ltd., trade name: MCL-E-61), which is a glass epoxy material having a copper foil (thickness: 35 μm) laminated on both sides, is # 6
Polishing using a polishing machine with a brush equivalent to 00 (manufactured by Sankei Co., Ltd.), washing with water, drying with an air stream, heating the obtained copper-clad laminate to 80 ° C. Was laminated while heating the photosensitive resin composition layer at 120 ° C.

Next, using an exposure machine (manufactured by Oak Co., Ltd.) HMW-201B having a high-pressure mercury lamp, a 21-step stofer tablet as a negative was placed on the test piece and exposed at 60 mJ / cm ² . did. Next, the polyethylene terephthalate film was peeled off, and a 1% by weight aqueous solution of sodium carbonate was sprayed at 30 ° C. for 60 seconds to remove unexposed portions, and then the number of step tablets of the photocured film formed on the copper-clad laminate was measured. Was measured to evaluate the photosensitivity of the photosensitive resin composition. The results are shown in Table 4. The light sensitivity is indicated by the number of steps of the step tablet. The higher the number of steps of the step tablet, the higher the light sensitivity.

The resolution was determined by using a negative having a line / space = 1 and gradually reducing the line width, using a 21-step tablet at an exposure amount of 8 steps, and developing the film under the above conditions. Cover (connection between lines)
The line width of the portion without the mark was measured, and the results are shown in Table 4.
The smaller the numerical value of the resolution, the higher the resolution of a thin line, and the higher the resolution.

The plating resistance was evaluated by laminating as described above, exposing at a predetermined exposure amount, developing with the above developer, and then degreased (PC-455 (manufactured by Meltex) 25% by weight) for 5 minutes. Immersion → Rinse → Soft etch (ammonium persulfate 150g / L) for 2 minutes → Rinse →
Pretreatment was performed in the order of immersion in 10% by weight of sulfuric acid for 1 minute, and the resultant was placed in a copper sulfate plating bath (75 g / liter of copper sulfate, 190 g / liter of sulfuric acid, 50 ppm of chloride ion, 5 ml / liter of Copperglyme PCM (manufactured by Meltex Corporation)). Copper sulfate plating was performed at room temperature at 3 A / dm ² for 40 minutes. After that, it was washed with water, immersed in 10% by weight of borofluoric acid for 1 minute, and subjected to a solder plating bath (45% by weight of tin borofluoride 64 ml / l, 45% by weight of lead borofluoride 22 ml / l, 42% by weight of borofluoric acid) 200ml / liter, Plutin LA Conductivity Salt (Meltex)
20 g / liter, 41 ml / liter of Plutin LA starter (manufactured by Meltex Co., Ltd.), and subjected to solder plating at room temperature and 1.5 A / dm ² for 15 minutes.

In order to examine the plating resistance after washing and drying,
Immediately, a cellophane tape was applied and peeled off in the vertical direction (90 ° peel-off test). The presence or absence of peeling of the resist was observed, and the results are shown in Table 4. In addition, after the resist was peeled off, the presence or absence of undercut of the solder plating was observed from above by an optical microscope, and the results are shown in Table 4. In the case where the solder plating is buried, solder deposited by plating is observed below the transparent resist via the transparent resist.

Further, another test piece was subjected to a cross cut test (JIS-K-5400) after exposure and development with an exposure amount indicating eight steps using a 21-step stepper tablet, and the results are shown in Table 4. Was.

[0045]

[Table 4]

As is clear from Table 4, Examples 1 to 4 within the scope of the present invention have good plating resistance, and excellent resolution and cross-cutting properties.

[0047]

The photosensitive resin compositions according to claims 1, 2 and 3 are excellent in photosensitivity, resolution, chemical resistance (plating resistance), adhesion, mechanical strength, flexibility and the like. It is. The photosensitive element according to claim 4 is excellent in photosensitivity, resolution, chemical resistance (plating resistance), adhesion, mechanical strength, flexibility, environment, workability, and the like.

Continued on the front page (51) Int.Cl. ⁶ Identification code FI G03F 7/004 512 G03F 7/004 512 7/028 7/028 7/033 7/033 // C09D 4/06 C09D 4/06 171/00 171/00 B H05K 3/06 H05K 3/06 H 3/18 3/18 D

Claims (4)

[Claims] 1. A composition comprising (A) a binder polymer, (B) a compound having a polymerizable ethylenically unsaturated group in a molecule and (C) a photopolymerization initiator, wherein the component (B) is represented by the general formula (I): Embedded image (Wherein, R ¹ represents an alkylene group having 1 to 10 carbon atoms;
The three R ^{1 s} may be the same or different, and R ² has the following general formula: (Wherein, R ³ represents a hydrogen atom or a methyl group, X ¹ represents an alkylene group having 2 to 6 carbon atoms, and n is an integer of 1 to 14), and 3 R ² may be the same or different), and a compound represented by the general formula (II): (Wherein R ⁴ and R ⁵ each independently represent a hydrogen atom or a methyl group, X ² and X ³ each independently represent an alkylene group having 2 to 6 carbon atoms, and k and m represent k + m = 8 to A positive integer selected to be 40) as an essential component. 2. The method according to claim 1, wherein (A) the binder polymer has an acid value of 10
0 to 500, and a weight average molecular weight of 20,000 to 3
2. The photosensitive resin composition according to claim 1, wherein the ratio is 0.00000. 3. The use ratio of the component (A), the component (B) and the component (C) is 100 in total of the component (A) and the component (B).
Component (A) is 40 to 80 parts by weight, and (B)
20 to 60 parts by weight of component and 0.1 to 20 of component (C)
Parts by weight of the compound represented by formula (I) and the compound represented by formula (II) in component (B).
The photosensitive resin composition according to claim 1, which is contained in an amount of 50 to 50 parts by weight or more. 4. A photosensitive element obtained by applying the photosensitive resin composition according to claim 1, 2 or 3 on a support and drying.