JPH11273026A - Composite thin-film magnetic head and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress the expansion of a recording magnetic field by aligning the width of a lower magnetic pole to the width of an upper magnetic pole core by a simple method having high through-put. SOLUTION: After forming a lower magnetic pole 6 to be used also as an upper shield layer on a magnetoresistance effect(MRE) element constituting an MRE head 2, a magnetic layer 5 having width wider than that of an upper magnetic pole core 3 is formed on the surface of the pole 6 by plating. Then a gap layer 4 is formed and the core 3 is formed at a position corresponding to the layer 5, on the surface of the layer 4. Then the corner part of the layer 5 is dry-etched so that an angle θ formed by the main surface of the pole 6 and the side face of the layer 5 becomes 45 deg.<=θ<=90 deg..

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite thin-film magnetic head and a method of manufacturing the same, and more particularly, to an inductive component forming a composite thin-film magnetic head used in a magnetic recording device such as a hard disk drive (HDD) or a magnetic tape device. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite thin film magnetic head characterized by a lower magnetic pole core structure of a die head and a method of manufacturing the same, and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, miniaturization of hard disk drives and the like has been realized.
Research and development of hard disk devices capable of high-density magnetic recording have been rapidly progressing with the increase in demand due to the increase in capacity, but with such high-density hard disk devices, the recording head, In order to meet such demands, MR heads which can be applied to a small disk without depending on the speed of a recording medium and which provide a high output can be used.
(Magnetic resistance) heads are attracting attention.

In order to realize a high recording density, it is necessary to increase a linear recording density and a track density. To this end, a recording head can record up to a high frequency, and can record data at an adjacent track. Therefore, a head that causes less recording bleeding that causes crosstalk and the like is required.

In recent years, a composite type thin film magnetic head in which an MR head and an inductive type thin film magnetic head are combined has been developed as a head that meets such a demand for higher performance. By optimizing the reproducing gap of the head, the recording characteristics can be improved,
They are trying to improve the reproduction resolution.

Here, a conventional composite thin-film magnetic head will be described with reference to FIG. Note that FIG. 5A is a cross-sectional view on the side facing the recording medium, and FIG. 5B is a cross-sectional view taken along a dashed line in FIG. First, a lower shield layer 32 made of a NiFe alloy or the like is provided on a substrate 31, and a laminated structure of NiFe, Ti, and CoZrMo is provided via a gap spacer layer 33 made of Al ₂ O ₃ or the like. After providing a magnetoresistive element layer 34 made of the same or the like and patterning it into a predetermined shape, a conductive film made of Au or the like is deposited on both ends of the magnetoresistive element layer 34 to form an element electrode 35.

[0006] Then, again, Al ₂ O ₃ or the like of the upper shield layer and the lower core layer 37 made of NiFe alloy or the like through the gap spacer layer 36 is provided in the recording gap layer made of Al ₂ O ₃ or the like thereon 38 Is provided, a coil 39 having a predetermined pattern is formed via an interlayer insulating film (not shown) such as a resist, and then an upper core layer 41 having a predetermined pattern is provided via an interlayer insulating film 40 made of a resist or the like. As a result, a composite thin film magnetic head obtained by combining the reproducing MR head using the magnetoresistive element layer 34 and the inductive thin film magnetic head for recording is obtained.

However, in such a composite type thin film magnetic head, since the upper shield layer and the lower core layer 37, that is, the lower pole also serves as the upper shield layer of the MR head, it is formed wider than the recording track width. Therefore, during recording, the recording magnetic field 42 indicated by a broken line in FIG. 5A spreads widely in the track width direction, so that it was difficult to narrow the track pitch to improve the recording density.

In order to reduce the spread of the recording magnetic field 42, various types of heads having the same upper and lower magnetic pole widths have been proposed (if necessary, see JP-A-2-208812, JP-A-5-143939, and JP-A-7-220245, JP-A-8-129715, JP-A-8-129
720, or Japanese Patent Application Laid-Open No. 9-167316). Such an improved composite thin film magnetic head will be described below.

Referring to FIG. 6A, for example, the recording gap having the same width as that of the upper core layer 41 is formed by performing etching using the upper core layer 41 and the like as a mask, just as in FIG. A method for forming the layer 38 and the projection 43 made of a NiFe alloy film, that is, a magnetic film (see Japanese Patent Application Laid-Open No.
No. 15).

Alternatively, after the upper core layer 41 is formed wide in advance, ion etching is performed using a resist mask (not shown) having a predetermined recording width.
A method of forming an upper core layer 41, a recording gap layer 38, and a convex portion 43 made of a magnetic film having a width substantially equal to the recording width (see Japanese Patent Application Laid-Open No. 5-143939) has also been proposed.

Alternatively, the upper shield layer and lower core layer 37
After forming a convex portion 43 having a predetermined width on the entire surface, a method of forming an upper core layer 41 having a width corresponding to the width of the convex portion 43 via a recording gap layer 38 provided on the entire surface (see Japanese Unexamined Patent Application Publication No.
No. 208812) has also been proposed.

Referring to FIG. 6B, after forming an upper core layer 41 having a predetermined width, a focused ion beam (FIB) 44 is used to form the upper core layer 4.
1. A method has also been proposed in which only the recording gap layer 38 and the vicinity of the upper core layer 41 of the upper shield layer and lower core layer 37 are selectively etched to form the convex portions 43 made of a magnetic film.

The width of the recording magnetic field 42 in the track width direction can be minimized by making the widths of the upper core layer 41 serving as the upper and lower magnetic poles and the protrusions 43 made of the magnetic film uniform by the various methods described above. Thereby, the recording density can be improved.

[0014]

However, in the various proposals described above, the width of the upper and lower magnetic poles of the resulting inductive thin film magnetic head is almost the same, so that the characteristics as a recording head are improved. Although the recording density can be increased, there is a problem in the manufacturing method, and therefore, it has been difficult to manufacture the composite thin-film magnetic head with good productivity and low cost.

For example, when the upper shield layer and lower core layer 37 is etched using the upper core layer 41 as a mask as disclosed in Japanese Patent Application Laid-Open No. 8-129715, the upper core layer 41 is also etched. It is necessary to form the upper core layer 41 thick, but for that purpose, the resist pattern when the upper core layer 41 is formed by plating must be made thicker, and as a result, the processing accuracy of the resist pattern decreases. Therefore, the core width of the upper and lower magnetic poles, ie,
It is difficult to reduce the recording width.

In the case of JP-A-5-143939, it is necessary to etch almost the entire upper shield layer and lower core layer 37 as in the case of the above-mentioned JP-A-8-129715. Since the etching takes time and the amount of etching increases, the etched material is re-adhered and short-circuits the upper and lower magnetic poles, so that another etching process for removing the re-adhered material is necessary. In addition, there is a problem that the process becomes complicated.

In the case of Japanese Patent Application Laid-Open No. 2-208812, since the upper core layer 41 and the projection 43 are not self-aligned, the spread of the recording magnetic field 42 is slightly larger, and the upper core layer 41 is formed. In this case, there is a problem that alignment with the convex portion 43 is required.

Further, when the focused ion beam 44 is used, since the processing time per head takes about 10 seconds, for example, the substrate 31 of 5 inches (about 12.7 cm) is used.
In this case, about 10,000 heads are formed on one substrate, so that the processing time per substrate is 100,000 seconds (≒
27.78 hours), that is, about one day, and the throughput is too low. To improve throughput, shorten the processing time, or
It is necessary to introduce a large amount of FIB devices, but neither is practical.

Accordingly, it is an object of the present invention to suppress the spread of the recording magnetic field by aligning the width of the lower magnetic pole with the width of the upper magnetic pole core by a simple and high-throughput method.

[0020]

FIG. 1 is an explanatory view of the principle configuration of the present invention. Referring to FIG. 1, means for solving the problems in the present invention will be described. FIG.
FIG. 1A is a cross-sectional view of a main part on a surface facing a recording medium, and FIG. 1B is an enlarged view of the vicinity of upper and lower magnetic poles in FIG. See FIG. 1. (1) The present invention manufactures a composite thin-film magnetic head in which a thin-film magnetic head 1 constituting a magnetic circuit is provided on a magneto-resistance effect head 2 with an interlayer insulating film, a gap layer 4, and a conductor coil interposed therebetween. In the method, a lower magnetic pole 6 serving also as an upper shield layer is provided on a magnetoresistive element constituting the magnetoresistive head 2.
Forming a magnetic layer 5 wider than the upper magnetic pole core 3 by plating on the lower magnetic pole 6 also serving as an upper shield layer, forming a gap layer 4, and forming a magnetic layer 5 on the gap layer 4. Forming the upper magnetic pole core 3 at the corresponding position, dry-etching the corners of the magnetic layer 5,
The method is characterized in that the angle θ between the main surface of the lower magnetic pole 6 also serving as the upper shield layer and the side surface of the magnetic layer 5 is set to 45 ° ≦ θ ≦ 90 °.

As described above, according to the present invention, when trimming the lower magnetic pole 6 also serving as the upper shield layer, the corners of the magnetic layer 5 previously formed by plating in a pattern having a predetermined width W ₂ are formed by an ion milling method. Since it is only removed by a dry etching such as a sputter etching method or a reactive ion etching (RIE) method, for example, an ion milling method using ions 8, the etching amount is small, and therefore, the etching time is significantly shorter. Therefore, the throughput is improved. Further, since the etching amount is small, it is not necessary to previously form the upper magnetic pole core 3 thickly.
Therefore, it is possible to make the width W ₁ of the upper magnetic pole core 3 smaller, thereby increasing the recording density.

(2) The present invention also provides a composite type thin film magnetic head in which a thin film magnetic head 1 constituting a magnetic circuit with an interlayer insulating film, a gap layer 4, and a conductor coil interposed on a magnetoresistive effect head 2. Forming a lower magnetic pole 6 also serving as an upper shield layer on the magnetoresistive element constituting the magnetoresistive head 2, forming a magnetic film on the lower magnetic pole 6 also serving as the upper shield layer, A step of forming a magnetic layer 5 wider than the upper magnetic pole core 3 by dry-etching the magnetic film, a step of forming a gap layer 4, and a step of forming the upper magnetic pole core 3 at a position corresponding to the magnetic layer 5 on the gap layer 4. Forming a magnetic layer 5 by dry etching the corners of the magnetic layer 5 to make an angle θ between the main surface of the lower magnetic pole 6 also serving as an upper shield layer and the side surface of the magnetic layer 5 45 ° ≦ θ ≦ 90 °. Features To.

As described above, in the present invention, when trimming the lower magnetic pole 6 also serving as the upper shield layer, the corners of the magnetic layer 5 which have been etched and formed into a pattern having a predetermined width W ₂ are removed by dry etching. Therefore, the amount of etching is small, and the etching time is significantly shortened, so that the throughput is improved. Further, since the etching amount is small, it is not necessary to previously form the upper magnetic pole core 3 thickly.
It is possible to further reduce the width W ₁ of, thereby increasing the recording density. Note that, compared with the case where the magnetic layer 5 is formed by a plating method, a plating-base layer forming step and a removing step are not required.

(3) In the present invention according to (1) or (2), the width of the corner of the magnetic layer 5 before dry etching is smaller than the sum of the width of the upper magnetic pole core 3 and 2 μm. It is characterized by the following.

As described above, in order to dry-etch the corners of the magnetic layer 5 and quickly make the width of the portion of the magnetic film 5 facing the upper magnetic pole core 3 equal to the width W ₁ of the upper magnetic pole core 3. In consideration of the margin, it is desirable that the width W ₂ of the corner portion of the magnetic layer 5 before the dry etching is W ₁ ≦ W ₂ ≦ W ₁ +2 μm with respect to the width W ₁ of the upper magnetic pole core 3.

(4) In the present invention, in any one of the above (1) to (3), the thickness of the magnetic layer 5 is not less than the gap length and not more than twice the gap length. It is characterized by.

As described above, the height of the protrusion for suppressing the spread of the recording magnetic field, that is, the thickness t ₂ of the magnetic layer 5 is equal to the gap length, that is, the thickness t ₁ of the gap layer 4. A sufficient effect can be obtained if the thickness is on the order, and the thickness t ₂ of the magnetic layer 5 is desirably set to t ₁ ≦ t ₂ ≦ 2t _{1 in} consideration of a margin.

(5) The present invention also provides a composite type thin film magnetic head in which a thin film magnetic head 1 constituting a magnetic circuit with an interlayer insulating film, a gap layer 4, and a conductor coil interposed on a magnetoresistive effect head 2. Wherein the thin-film magnetic head 1 is formed by any one of the above methods (1) to (4).

As described above, the thin-film magnetic head 1 is replaced with the above (1)
By forming by any of the methods (4) to (4), it is possible to obtain an inexpensive and high-density composite thin-film magnetic head.

[0030]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A composite thin film magnetic head according to a first embodiment of the present invention will now be described with reference to FIGS. FIG. 2 is an explanatory view of a manufacturing process of the composite thin-film magnetic head, which is a cross-sectional view of a main part on the side facing the recording medium, and which shows a magnetoresistance that is not substantially related to the essence of the present invention. The effect head portion is not shown for simplicity of description, and FIG. 2 shows the trimming angle and the spread width of the recording magnetic field in the composite thin film magnetic head according to the first embodiment of the present invention. FIG.

Referring to FIG. 2A, first, as in the manufacturing process of the conventional composite type thin film magnetic head shown in FIG. 5, a substrate made of Al ₂ O ₃ .TiC is
A lower shield layer made of a NiFe alloy is provided, and Al ₂ O
NiFe with a gap spacer layer made of _3, T
After a magnetoresistive element layer having a laminated structure of i and CoZrMo is provided and patterned into a predetermined shape, a conductive film made of Au is deposited on both ends of the magnetoresistive element layer to form an element electrode, and then again. A lower pole / upper shield layer 11 made of a NiFe alloy and having a thickness of 2.0 to 4.0 μm, for example, 3.0 μm, is formed via a gap spacer layer made of Al ₂ O ₃ .

Next, on the lower pole and upper shield layer 11, a Ti layer having a thickness of 50 to 100 °, for example, 50 °, and a NiFe having a thickness of 1000 ° or less, for example, 500 °, are provided.
After forming a plating base layer 12 made of an alloy, a resist film is applied and patterned to have a thickness of 1.0 to 3.0 μm, for example, 2.0 μm, and a width of
For example, a resist mask 1 having an opening of 2.0 μm
3 is formed, and a raised magnetic film 14 made of a NiFe alloy having a thickness of 1 μm or less, for example, 0.5 μm is formed by electroplating.

In this case, the width of the opening provided in the resist mask 13 and, therefore, the width W ₂ of the raised magnetic film 14 is larger than the width W ₁ of the upper pole core in order to enable quick trimming. And W ₁ ≦ W ₂ ≦ W ₁ +2 μm
It is desirable to set
The thickness t ₂ is such that the same extent as the gap length, by a margin, then the thickness t ₁ of the recording gap layer 15 is deposited, t ₁ ≦ t ₂ ≦ 2 × t ₁ It is desirable to set so that

Then, after removing the resist mask 13, the plating base layer 1 is formed by ion milling using Ar ions.
By removing the exposed portion of No. 2, a pattern of the raised magnetic film 14 serving as the lower magnetic pole core is formed.

Next, as shown in FIG.
After the recording gap layer 15 is formed by depositing Al ₂ O ₃ having a thickness of, for example, 0.4 μm, a conductor film is provided via an interlayer insulating film (not shown) such as a resist as in the conventional process. By patterning, a coil (not shown) is formed by winding the connecting portion of the raised magnetic film 14 serving as the upper magnetic pole core 16 and the lower magnetic pole core a plurality of times, and then an interlayer insulating film (not shown) such as a resist is formed. After covering the coil, patterning is performed so that the connection between the upper magnetic pole core 16 and the raised magnetic film 14 is exposed. In this case, the thickness t ₁ of the recording gap layer 15 becomes the gap of the magnetic gap, that is, the gap length.

Next, a thickness of 50 to be a plating base layer is obtained.
Å100 °, for example, 50 ° Ti layer (not shown), and 1000 ° or less, for example, 500 ° NiFe
Are sequentially formed by a sputtering method, and a resist pattern (not shown) for forming the upper magnetic pole core 16 is formed by exposing and developing a resist, and then, a thickness of 2 mm is formed by electrolytic plating. .5-
4.0μm, for example, in 3.0μm, the width W ₁ 0.5~
An upper pole core 16 made of a 2.0 μm, for example, 1.0 μm, NiFe alloy is formed.

[0037] As the magnetic film 14 and the upper magnetic pole core 16 raised such, it becomes necessary to use a high saturation magnetic flux density B _s material in order to improve the high frequency characteristics, the eddy current in accordance with the frequency becomes high loss due to increases, because that would lead to a decrease in the recording magnetic field intensity due to the skin effect, in order to suppress the generation of eddy currents, it is necessary to use a material having a large specific resistance [rho, high B _s soft Therefore Although a NiFe alloy, which is a magnetic material, is used,
FeNZr, it is permissible to use other high B _s soft magnetic material such as CoNiFe, 50% NiFe.

Next, as shown in FIG. 2D, the resist pattern for the magnetic pole is removed, and the plating base layer in the area other than the exposed upper magnetic pole core 16 is removed.
After the removal by the ion milling method using r ions, subsequently, the exposed recording gap layer 15 is selectively removed by the ion milling method using Ar ions 17 using the upper pole core 16 as a mask.

Next, ion milling was again performed by using Ar ions 18 at 0 ° incidence, thereby forming the raised magnetic film 1.
By preferentially etching away the corners of No. 4
The angle formed between the main surface of the lower magnetic pole and upper shield layer 11 and the side surface of the raised magnetic film 14, that is, the trimming angle θ is 45
The tapered raised magnetic film 14 satisfies ° ≦ θ ≦ 90 °.

In this trimming process,
The side of the conductive film 14 that contacts the recording gap layer 15 is an upper magnetic pole.
Etched in a self-aligned manner using core 16 as a mask
Thus, their widths are substantially the same. Also trimming
The angle θ is determined by the etching time and the height of the raised magnetic film 14.
Width W _TwoAnd thickness t_TwoWill depend on

FIG. 3 shows that the width W ₁ of the upper magnetic pole core 16 is 4.0 μm,
It is a diagram showing the correlation between the trimming angle θ and the amount of spread of the recording magnetic field when the magnetic film having a thickness t ₂ of 0.5 μm is etched to a depth of 2.0 μm. 1/2 spread [Delta] C _w of the recording magnetic field, i.e., it is represented by the spread of the recording magnetic field on one side. As is apparent from the figure, θ = 90 °, that is, the raised magnetic film 14
When the side surface is perpendicular, the spread of the recording magnetic field is the smallest, but even when θ = 45 °, ΔC _w /2<0.2 μm. Therefore, practically, 45 ° ≦ θ ≦ 90 °. Good.

As described above, in the first embodiment of the present invention, since the magnetic film serving as the lower magnetic pole core is formed in advance as the raised magnetic film 14 having the predetermined width W ₂ , the raised magnetic film is formed in the trimming step. The corners of the film 14 may be preferentially etched, and the amount of etching is small, so that the processing time can be drastically reduced and the throughput is improved.

Further, since the etching amount is small, there is no need to consider the thinning of the upper magnetic pole core 16 due to the trimming, and the upper magnetic pole core 16 can be made thinner, so that the magnetic pole resist pattern can be made thinner. The width W ₁ of the upper magnetic pole core 16, that is, the recording width can be reduced, thereby enabling a higher recording density.

Next, a manufacturing process of the second embodiment of the present invention will be described with reference to FIG. Referring to FIG. 4A, first, similarly to the first embodiment, Al ₂ O _3.
A lower shield layer made of a NiFe alloy is provided on a substrate made of TiC, and a magnetoresistive element layer made of a laminated structure of NiFe, Ti, and CoZrMo is provided via a gap spacer layer made of Al ₂ O _3, and a predetermined layer is formed. After patterning into a shape, a conductive film made of Au is deposited on both ends of the magnetoresistive element layer to form an element electrode, and then,
Again, a lower pole / upper shield layer 21 made of a NiFe alloy and having a thickness of 2.0 to 4.0 μm, for example 3.0 μm, is formed via a gap spacer layer made of Al ₂ O ₃ .

Next, a magnetic film 22 made of a NiFe alloy having a thickness of 1 μm or less, for example, 0.5 μm is deposited on the lower magnetic pole and upper shield layer 21 by a sputtering method, and then a resist is applied and patterned. 1.5 to 2.5 μm, for example, 2.0 μm
An m resist mask 23 is formed.

Also in this case, the width of the resist mask 23 and therefore the width W ₂ of the raised magnetic film 25 formed below will be larger than the width W ₁ of the upper pole core in order to enable quick trimming. , W ₁ ≦ W ₂ ≦ W ₁ + 2μ
m, and the height of the magnetic film 2
The thickness t ₂ of _No. 5 is set to be substantially the same as the gap length, and a margin is taken into consideration, and the thickness t ₁ of the next recording gap layer 26 is set to t ₁ ≦ t ₂ ≦ 2 × t. It is desirable to set it to ₁ .

Referring to FIG. 4B, the magnetic film 2 is formed by ion milling with Ar ions 24 using the resist mask 23 as a mask.
2 is etched to form a raised magnetic film 25.

Next, after the resist mask 23 is removed, the thickness is then reduced to 0.3 to 0.6 μm, for example, 0.1 μm by a sputtering method as in the first embodiment. 4 μm A
After depositing l ₂ O ₃ to form the recording gap layer 26,
As in the conventional process, a conductor film is provided via an interlayer insulating film (not shown) such as a resist, and is patterned to connect the upper magnetic pole core 27 and the raised magnetic film 25 serving as the lower magnetic pole core a plurality of times. A coil to be wound (not shown) is formed, and then an interlayer insulating film such as a resist (not shown)
Is formed to cover the coil, and patterning is performed so that the connection between the upper magnetic pole core 27 and the raised magnetic film 25 is exposed.

Next, a thickness of 50 to serve as a plating base layer
Å100 °, for example, 50 ° Ti layer (not shown), and 1000 ° or less, for example, 500 ° NiFe
Are sequentially formed by a sputtering method, and a resist is exposed and developed to form a magnetic pole resist pattern (not shown) for forming the upper magnetic pole core 27. Then, electrolytic plating is performed to obtain a thickness of 2 mm. .5-
4.0μm, for example, in 3.0μm, the width W ₁ 0.5~
The upper magnetic pole core 27 made of a 2.0 μm, for example, 1.0 μm, NiFe alloy is formed.

Next, as shown in FIG. 4D, the resist pattern for the magnetic pole is removed, and the plating base layer in the area other than the exposed upper magnetic pole core 27 is removed.
After the removal by the ion milling method using r ions, the exposed recording gap layer 26 is selectively removed by the ion milling method using Ar ions 28 using the upper pole core 27 as a mask.

Next, ion milling is performed again by using Ar ions 29 at 0 ° incidence, thereby forming the raised magnetic film 2.
By preferentially etching away the corners of 5
The tapered raised magnetic film 25 has a trimming angle θ of 45 ° ≦ θ ≦ 90 °.

As described above, in the second embodiment of the present invention, the magnetic film serving as the lower magnetic pole core is formed in advance as the raised magnetic film 25 having the predetermined width W ₂ , similarly to the first embodiment. Therefore, in the trimming step, the corners of the raised magnetic film 25 may be preferentially etched, and the etching amount is small, so that the processing time can be drastically shortened and the throughput is improved.

Further, since the etching amount is small, there is no need to consider the thinning of the upper magnetic pole core 27 due to trimming, and the upper magnetic pole core 27 can be made thinner, and therefore, the magnetic pole resist pattern can be made thinner. The width W ₁ of the upper magnetic pole core 27, that is, the recording width can be reduced, thereby enabling a higher recording density.

In the second embodiment,
Since the plating method is not used in the step of forming the raised magnetic film 25, the step of forming the plating base layer and the step of removing the plating base layer are not required. Whether the plating method is used in the step of forming the raised magnetic film as in the first embodiment or the dry etching is performed after the entire surface is formed as in the second embodiment is raised. What is necessary is just to select suitably according to the compatibility of the material which comprises a magnetic film, and a film-forming process.

The embodiments of the present invention have been described above. However, the present invention is not limited to the configuration described in the embodiments, and various modifications are possible. _{Although 2} O ₃ is used, Al ₂ O ₃
But not limited to SiO ₂ , TiO ₂ , Ta ₂
An oxide film such as O ₅ or a non-magnetic metal film such as Ti or Ta having a higher resistance than a permalloy may be used.

In the above embodiments, the ion milling method is used for patterning or trimming the raised magnetic film. However, the present invention is not limited to the ion milling method. Alternatively, a reactive ion etching method using a chlorine-based gas, CHF _3, or the like as a reactive gas may be used.

Further, in the description of each of the above embodiments, the ion milling method is used for etching the recording gap layer. However, the present invention is not limited to the ion milling method. Alternatively, a reactive ion etching method using CHF ₃ or the like may be used, or it may be removed by wet etching using phosphoric acid (H ₃ PO ₄ ).

Although not implemented in each of the above-described embodiments, in the trimming step of the raised magnetic film, if the amount of re-adhesion of the etched magnetic material is large, the ion-injection of about 70 ° causes the re-adhesion. A process for removing the adhesion layer may be added.

In the second embodiment,
When the lower pole / upper shield layer 21 and the magnetic film 22 are formed of the same material, the lower pole / upper shield layer 21
Is formed thick, and without forming the magnetic film 22,
A resist mask 23 is provided and the lower magnetic pole / upper shield layer 21 is etched to a predetermined depth to raise the magnetic film 25.
May be formed.

In the description of each of the above embodiments, the upper magnetic pole core is formed by the electrolytic plating method. However, a dry film forming method such as a sputtering method or a vapor deposition method is used. It may be patterned.

[0061]

According to the present invention, when trimming the lower magnetic pole, the raised magnetic film is provided in advance, so that the FI
Since the trimming can be performed only by the conventional process technology / equipment without using the B apparatus, etc., it is possible to reduce the spread of the recording magnetic field by a simple process with a good throughput, and thereby the It greatly contributes to higher recording density and lower price, and furthermore to the spread of high-performance HDD devices.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of a basic configuration of the present invention.

FIG. 2 is an explanatory diagram of a manufacturing process according to the first embodiment of the present invention.

FIG. 3 is a correlation diagram between a trimming angle and a spread width of a recording magnetic field in the composite thin-film magnetic head according to the first embodiment of the present invention.

FIG. 4 is an explanatory diagram of a manufacturing process according to a second embodiment of the present invention.

FIG. 5 is an explanatory diagram of a conventional composite type thin film magnetic head.

FIG. 6 is an explanatory diagram of a manufacturing process of a conventional improved composite thin film magnetic head.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Thin-film magnetic head 2 Magnetoresistive head 3 Upper magnetic pole core 4 Gap layer 5 Magnetic layer 6 Lower magnetic pole which also serves as an upper shield layer 7 Lower shield layer 8 Ions 11 Lower magnetic pole and upper shield layer 12 Plating base layer 13 Resist mask 14 Raised magnetism Film 15 recording gap layer 16 upper magnetic pole core 17 ion 18 ion 21 lower magnetic pole and upper shield layer 22 magnetic film 23 resist mask 24 ion 25 raised magnetic film 26 recording gap layer 27 upper magnetic pole core 28 ion 29 ion 31 substrate 32 lower shield layer Reference Signs List 33 gap spacer layer 34 magnetoresistive element layer 35 element electrode 36 gap spacer layer 37 upper shield layer and lower core layer 38 recording gap layer 39 coil 40 interlayer insulating film 41 upper core layer 42 recording magnetic field 43 convex part 44 Bundle ion beam

Claims (5)

[Claims] An interlayer insulating film on a magnetoresistive head,
In a method of manufacturing a composite type thin film magnetic head having a thin film magnetic head forming a magnetic circuit with a gap layer and a conductor coil interposed, a lower magnetic pole also serving as an upper shield layer on a magnetoresistive effect element forming the magnetoresistive head Forming a magnetic layer wider than an upper magnetic pole core by plating on a lower magnetic pole also serving as the upper shield layer, forming the gap layer, and corresponding to the magnetic layer on the gap layer. Forming the upper magnetic pole core layer at the position where the magnetic layer is to be formed, dry-etching the corners of the magnetic layer, and setting the angle θ between the main surface of the lower magnetic pole also serving as the upper shield layer and the side surface of the magnetic layer to 45 ° ≦ θ. A method for manufacturing a composite thin-film magnetic head, comprising the step of setting ≦ 90 °. 2. An interlayer insulating film on a magnetoresistive head,
In a method of manufacturing a composite type thin film magnetic head having a thin film magnetic head forming a magnetic circuit with a gap layer and a conductor coil interposed, a lower magnetic pole also serving as an upper shield layer on a magnetoresistive effect element forming the magnetoresistive head Forming a magnetic film on the lower magnetic pole also serving as the upper shield layer, dry etching the magnetic film to form a magnetic layer wider than the upper magnetic pole core, and forming the gap layer. Forming a film, forming an upper pole core layer at a position corresponding to the magnetic layer on the gap layer,
Dry etching the corners of the magnetic layer, wherein the angle θ between the main surface of the lower magnetic pole also serving as the upper shield layer and the side surface of the magnetic layer is set to 45 ° ≦ θ ≦ 90 °. Of manufacturing a composite type thin film magnetic head. 3. The composite thin film magnetic device according to claim 1, wherein a width of the corner portion of the magnetic layer before dry etching is smaller than a sum of a width of the upper pole core and 2 μm. Head manufacturing method. 4. The composite thin film according to claim 1, wherein the thickness of the magnetic layer is not less than the gap length and not more than twice the gap length. A method for manufacturing a magnetic head. 5. An interlayer insulating film on a magnetoresistive head,
In a composite thin film magnetic head provided with a thin film magnetic head constituting a magnetic circuit with a gap layer and a conductor coil interposed therebetween,
5. A composite type thin film magnetic head, wherein the thin film magnetic head is formed by the method according to claim 1.