JPH11277429A - Wheel forming equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a grinding wheel forming device capable of forming a grinding wheel with high accuracy without causing axial or radial misalignment, and capable of high precision loading and unloading without causing misalignment in loading on and unloading from a grinding machine with a grinding wheel, or the like. SOLUTION: In a grinding wheel forming device using the wire electric discharge machining, which is provided with a grinding wheel 20, a means 20A for driving the grinding wheel 20, a wire supplying means 5A which has a feeding means 3 for sending out a wire 5 and a receiving means 4 to supply the wire 5 to a position facing the grinding wheel 20, and a power source supplying means 2 for applying voltage to the grinding wheel 20 and the wire 5, the wire 5 is provided so that it can be in contact with the suspended grinding wheel. 20.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for truing (forming) and dressing (grinding) a grindstone such as a metal bond grindstone.

[0002]

2. Description of the Related Art In a grinding process, truing (forming) and dressing (sharpening) of a grindstone are performed.
Since it is a major factor affecting the processing efficiency and processing accuracy, many inventions and devices have been devised.

[0003] First, a conventional method of forming a metal bond grindstone will be described.

A method of forming a metal bond grinding wheel is disclosed in
It has been mainly formed by an electric discharge machining method as disclosed in 8-66662. According to this method, it is needless to say that an electrode having concavities and convexities opposite to the shape to be formed must be produced, but the electrode itself is consumed by the discharge during the formation of the metal bond grindstone, and the shape is lost. . Therefore, in order to obtain the desired accuracy, the electrode must be replaced with a new electrode many times, and it is still difficult to form the metal bond grindstone to the desired accuracy. In addition, since it is usual to remove the metal bond grindstone from the grinder and form it, if the formed metal bond grindstone is reattached to the grinder, a run-out will occur due to a mounting error, and the molding precision of the metal bond grindstone is directly affected. It was also difficult to transfer it to a workpiece.

[0005] In order to solve the above-mentioned problems, an apparatus and a method for forming a grindstone which is subjected to electric discharge machining using a wire are disclosed in
38,346, JP-B-2-38347, JP-A-61-4666, JP-A-6-210566, JP-A-8-229814, and the like.

1) In Japanese Patent Publication No. 2-38346, N
In a C machine tool, the wire is caused to travel along an arc orbit along a guide groove formed on the outer periphery of the support as an electrode guide, and a current opposing the wire electrode and the grindstone flows to move the wire electrode with respect to the grindstone surface. The forming process is performed by electric discharge while being performed.

2) In Japanese Patent Publication No. 2-38347, a wire is wound around a support at a fixed pitch to form a discharge electrode, and the support is moved to a grindstone surface to perform a forming process by electric discharge.

3) In Japanese Patent Application Laid-Open No. 61-4666, an electrode guide for supporting a wire on a surface in contact with a grindstone with a wire provided with a winding mechanism at both ends is provided, and the wire is caused to travel thereover. An electric current opposite to the wire electrode and the grindstone is applied, and the forming process is performed by electric discharge while moving the wire electrode with respect to the grindstone surface.

4) In JP-A-6-210566,
A wire provided with a winding mechanism at both ends is run along the guide groove through a wire guide, and a current opposite to the wire electrode and the grindstone is caused to flow by moving the wire electrode with respect to the grindstone surface while discharging. Perform molding processing.

5) In JP-A-8-229814,
In order to form the grindstone into a concave curved surface, the wire is caused to travel along a convex guide, a current opposing the wire electrode and the grindstone is passed, and the wire electrode is moved with respect to the grindstone surface to perform the forming process by electric discharge.

[0011]

However, the above-described grindstone molding apparatus and the molding method still have the following problems.

In any of the above 1) to 5), since a wire is used and the structure is used to wind up the wire, the worn wire is not continuously used. However, in any case, a wire support is present on the contact discharge surface with the grindstone, so that there is a problem that micromachining cannot be performed.

[0013] Further, in the above 1), since the molding can be performed on the NC machine tool, the removal of the grindstone is not required, and the efficiency and accuracy are greatly improved. However, although it is not necessary to remove the grindstone, the processing must be interrupted each time the grindstone needs to be formed, and the grindstone must be moved to the position where the wire traveling device is installed to perform the forming. Therefore, there is also a problem that the working efficiency is reduced. In cases other than the above 1), when a grindstone formed by electric discharge machining is mounted on an NC machine tool such as a grinder, there is a problem in adjusting the accuracy.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem, and an object of the present invention is to form a grinding wheel with high precision without occurrence of displacement and the like, and An object of the present invention is to provide a whetstone forming apparatus which can be attached and detached with high accuracy without causing a positional shift or the like even when attaching and detaching to and from a grinder or the like.

[0015]

According to a first aspect of the present invention, there is provided a whetstone forming apparatus, comprising: a whetstone; a means for driving the whetstone;
A grindstone forming apparatus by wire discharge, comprising: wire running means having wire sending means and receiving means for moving a wire to a position facing the grindstone; and power supply means for applying a voltage to the grindstone and the wire. , Wherein the wire is provided in contact with the grindstone by being bridged.

According to a second aspect of the present invention, there is provided a whetstone forming apparatus.
The grinding wheel forming apparatus according to claim 1, characterized in that a measuring means for measuring a position error or a wear state of the grinding wheel with a laser beam is provided at a position facing the grinding stone.

According to a third aspect of the present invention, there is provided a whetstone forming apparatus,
According to a second aspect of the present invention, in the whetstone forming apparatus, the measuring means uses cross-point light such that the laser light is focused on a portion of the whetstone to be measured.

According to a fourth aspect of the present invention, there is provided a whetstone forming apparatus,
4. The grinding wheel forming apparatus according to claim 2, wherein the measuring unit has a correcting unit that determines a position error or a degree of wear based on the measurement result and corrects a discharge position of the wire. And

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings and tables.

(Embodiment) An embodiment of the present invention will be described.

FIG. 1 is a view showing the arrangement of a grinding stone forming apparatus according to this embodiment. FIG. 2 is a diagram showing a configuration of a laser measuring machine for measuring the position of the grindstone provided in the grindstone forming apparatus shown in FIG.

As shown in FIG. 1, the grindstone forming apparatus includes a wire electric discharge machine 1, a laser measuring machine 11, a metal bond grindstone (hereinafter, grindstone) 20, and a driving means 20A. The wire electric discharge machine 1 mainly includes a discharge power source 2, a wire running means 5A including a wire feeder 3, a wire feed side guide 3a, a wire receiver 4, a wire receiving side guide 4a, and a moving mechanism (not shown), And an XY table section 6 for mounting a work. A power source for discharging is supplied to the wire 5 and the grindstone 20 from the discharge power source 2. Here, the driving means 20A of the grindstone 20
Is mounted on the wire electric discharge machine 1, has a whetstone mounting table 22, and is configured to be able to rotationally drive the whetstone 20 by a whetstone drive motor 21. In other words, in this embodiment, the grindstone 20 once removed from the NC machine tool (such as a grinder) is
Here, forming with a wire electric discharge machine 1 (truing /
Dressing).

The actual operation is as follows.

First, the grindstone 20 is set on the grindstone mounting table 22 manually or automatically. Next, a rotating operation is given to the grindstone 20 by the grindstone drive motor 21, and at the same time, the wire feeder 3 and the wire receiver 4 are operated to move the wire 5. Thereafter, a discharge voltage is applied from the discharge power source 2 to the wire 5 and the grindstone 20 to generate a discharge, thereby performing processing. Thereby, shaping (truing and dressing) of the grindstone 20 is easily performed. still,
Regarding the shaping of the grindstone 20, the XY table 6 may be used to move the grindstone 20 side, or the wire 5 side (wire running means 5A side) may be moved, or both may be moved to perform a predetermined forming operation. I don't care.

In the configuration of this embodiment, the wire 5 is supplied from the wire feeder 3 and wound up by the wire receiver 4. During this time, only the wire sending-out guide 3a and the wire receiving-side guide 4a are present in the vicinity of the devices 3 and 4, respectively. ing. Therefore, compared to a configuration in which a support or a guide is provided at a portion in contact with the grindstone 20, it is possible to form a complicated shape with high accuracy. Here, the distance between the wire feeding side guide 3a and the wire receiving side guide 4a is the whetstone 2
It may be larger than 0 diameter.

Next, measurement of the position of the grinding wheel 20 and the degree of wear
The molding method will be described.

In FIG. 1, a laser measuring machine 10 is mounted on a wire electric discharge machine 1, and a laser beam 13 is scanned from a laser projector 11 side to a laser receiver 12 side. The laser measuring device 10 judges that the laser light 13 emitted from the laser projector 11 side is normally ON when the laser light 13 is detected by the laser light receiver 12 side, and if the laser light 13 is blocked by something (in this case, the grindstone 20). It shall be determined to be OFF.

FIG. 2 is a view showing a method of measuring the grinding wheel 20 with high accuracy by the laser measuring machine 10. (A) shows the side surface at the time of measurement, (b) shows the upper surface at the time of measurement, and (c) shows the side surface at the time of electric discharge machining of the grindstone based on the measurement result.

In this embodiment, an NC machine tool (such as a grinder)
In order to form (truing and dressing) the grindstone 20 once removed from the outside of the machine, here, the wire electric discharge machine 1, it must be mounted on the grindstone mounting table 22 on the wire electric discharge machine 1 side. The mounting accuracy usually depends on the mechanical mechanism, but is several tens of μm or more, which is insufficient for grinding on the order of several μm, and is not suitable for forming the grindstone 20. This is why external molding is difficult.

Therefore, in the present embodiment, the laser measuring machine 10 mounted on the grinding wheel forming apparatus, that is, the wire electric discharge machine 1 is used.
The position of the surface and the end surface of the grindstone 20 is measured by the above. That is, as shown in the top view of FIG.
In the ON state, the laser beam 13 first measures the outer diameter of the grindstone 20. In this case, the grindstone 20 is moved in the X or Y direction toward the laser measuring machine 10 using the XY table 6 in FIG. 1 to detect a position where the laser beam 13 is blocked, and determine that position as the surface of the grindstone 20. I do. Similarly, as shown in the side view of FIG. 2A, the position of the side surface of the grindstone 20 is measured similarly. With this method, the surface / end surface of the grindstone 20 can be accurately grasped. Furthermore, even when the shape of the grindstone 20 is complicated, for example, a trapezoidal shape, the shape, position, wear amount, and the like of the grindstone 20 can be accurately measured by the same method.

[0031]

[Table 1]

Table 1 above is a table summarizing the results when the grindstone is mounted by a normal mechanical mechanism and the results when measured with a laser in this embodiment.

Since the surface, end face, wear amount, etc. of the grindstone 20 can be accurately measured from the above results, the wire 5 having a fixed relative positional relationship with the laser measuring machine 10 can be used as shown in FIG.
As shown in (1), it is possible to perform electric discharge molding while rotating the grindstone 20 to finish it in a desired shape. In other words, based on the result measured by the laser measuring device 10, the grinding wheel forming apparatus determines the result, and feeds back the result at the time of forming to the grinding wheel 2.
It becomes possible by repeating a series of operations such as finishing the desired shape by correcting the discharge position of the wire 5 with respect to 0.

In the actual measurement, the grindstone 20 is mainly composed of abrasive grains, a binder, and pores so that the surface thereof is suitable for grinding, and has a roughness of several tens μm or more. Therefore, in order to absorb the unevenness error and measure the surface with high accuracy, the cutoff ON / OFF signal of the laser beam 13 is determined to determine
Measurement can be repeated with an accuracy of 10 μm.

In order to further improve the accuracy, the laser beam 13 is condensed at the surface measurement position of the grindstone 20 and the laser beam 1
The cross-point light may be set so that 3 becomes the minimum diameter. In that case, more accurate measurement can be performed.

More specifically, the laser beam 13 has a diameter of several hundred μm or more, but by using cross-point light, the diameter can be reduced to about 10 μm, and measurement can be performed with an accuracy of several μm. Therefore, as shown in FIG. 2 (c), the grindstone 20 can be formed by electric discharge molding with the wire 5 having a fixed relative positional relationship with the laser measuring machine 10 to finish it in a desired shape.

Here, the positional relationship between the wire running means 5A and the laser measuring machine 10 is shown in FIG. 2A, where the wire 5 of the wire running means 5A is in contact with the grindstone 20 with the laser measuring machine. 10 may be moved so that the grindstone 20 is measured, or the wire traveling means 5A may be moved to the back of the grindstone 20 when viewed from the paper, and the laser measuring machine 1
The positional relationship in which the whetstone 20 is measured by moving 0 may be used. In (c), the laser measuring machine 10 is separated from the grindstone 20,
The wire running means 5A is moved so as to be in contact with the grindstone 20, and is arranged so that electric discharge machining can be performed.

In this embodiment, the laser measuring device 10
Has been described in connection with the configuration in which it is mounted on the wire electric discharge machine 1, but may be configured separately. In addition, the wire 5 has a configuration in which a winding wire feeder 3 and a receiver 4 are provided at both ends thereof, but the present invention is not limited to this, and the traveling means 5A of the wire 5 is of an endless shape. You may. Furthermore, although the metal bond whetstone was used as the whetstone 20, it is not limited to this, and another type may be used. In addition, whetstone 20
May be stored in some storage means in the grindstone forming apparatus. Thus, it is not necessary to measure each time for an arbitrary grinding wheel 20.

As described above, since the grindstone forming apparatus in this embodiment is a separate dedicated forming apparatus (electric discharge machine) separated from the grinder for processing the work, the grindstone is formed by the NC machine tool (grinding machine). ) Is performed in parallel with the work processing, thereby enabling the grinding wheel to be formed efficiently without interrupting the grinding processing as much as possible. In addition, in order to replace the grindstone used in the grinding machine in the wire electric discharge machine and form it into the desired shape, the mounting position error and wear amount of the grindstone are measured by the laser measuring machine mounted in the wire electric discharge machine. According to the position and the amount of abrasion, a cut is made by a wire electric discharge machine, and truing and dressing to an originally desired shape can be performed, thereby realizing accurate regeneration of the grindstone.

(Application Example 1) Next, an example in which a laser measuring machine is applied to a grinding device will be described.

FIG. 3 is a block diagram showing a case where a laser measuring machine for measuring the position of a grindstone provided in the grindstone forming apparatus in the above embodiment is applied to a grinding apparatus.

As shown in FIG. 3, the grinding device is a grinder 3
0, a laser measuring device 11. Grinding machine 30
Is a grindstone 20, a grindstone drive motor 2 for driving the grindstone 20
1 and a grinding table 33 on which a workpiece 32 is mounted. The configuration and operation of the laser measuring device 11 are the same as those described in the above embodiment. Further, when molding the grindstone 20 used or used in this application example, the grindstone 20 is temporarily removed from the NC machine tool such as a grinding device, and the grindstone 20 is mounted on the grindstone molding device of the above-described embodiment and molded. And

The actual operation is as follows.

As shown in FIG. 3, the formed grindstone 20 is mounted on a grinder 30. The mounted grindstone 20 is driven to rotate by a grindstone drive motor 21 and the grindstone 2 is
0 itself normally operates on the YZ axes, and the workpiece 32 mounted on the grinding table 33 is processed into a desired shape by the grinding table 33 moving in the X axis. Here, if there is a problem with the mounting accuracy of the grindstone 20 or the grinding accuracy of the workpiece 32, similarly to the above-described embodiment, the grindstone 20 is set by the laser measuring machine 10 installed on the grinding table 33 or a dedicated jig.
The workpiece 32 can be ground with high precision by measuring the surface, end face, wear amount, etc. of the workpiece 32 with high accuracy.

In this application example, the result of measuring the grindstone 20 with the laser measuring machine 10 may be stored in some storage means in the grinding device. Thus, it is not necessary to measure each time for an arbitrary grinding wheel 20.

As described above, since the grinding device using a grindstone in this application example is a separate device separate from the device for forming and processing the grindstone (electric discharge machine), the grindstone subjected to the forming process outside the machine is mounted again. Must. At this time, since the laser measuring device is mounted, the workpiece (work) can be ground in the previous shape without any displacement even when mounted on a grinding machine.

(Application Example 2) Next, an example in which a grinding wheel forming apparatus is applied will be described.

FIG. 4 is a block diagram of an NC machine tool in which the grindstone forming apparatus in the embodiment and the grinding apparatus in the applied example are integrated, and a laser measuring machine for measuring the position of the grindstone is shared.

As shown in FIG. 4, one laser measuring machine 1
0 moves between the grinding machine consisting of the wire electric discharge machine 1 and the grinding machine consisting of the grinding machine 30 by the moving means 10A.
It is structured to move as needed. Here, the laser measuring machine 10 can freely move the XY axes by the moving means 10A. The replacement of the grindstone 20 in the grinder 30 may be performed by a machine or manually.

Since a plurality of grindstones 20 are provided on the grindstone mounting table 22 as in this application example, an arbitrary grindstone 20 is provided.
In a state in which one grinding wheel 30 is used, the same forming process can be performed on another grindstone 20. by this,
Except for the replacement time of the grindstone 20 in the grinding machine 30, no work loss time occurs, so that work efficiency is improved.
Further, by moving the wire running means 5A as shown in FIG.
The wire may be moved to a position where 0 is mounted, and formed by wire electric discharge machining. It is desirable that these are configured in accordance with the cost performance of the NC machine tool and the entire system.

Since the laser measuring device 10 is commonly used, various types of precision data relating to the grindstone 20 measured at the time of forming processing are stored, so that the stored data at the time of grinding the workpiece 32 is stored. Use can maintain accuracy.

As described above, the embodiments and each application example described above are not limited to the above description unless the gist of the present invention is changed.

[0053]

The grinding wheel forming apparatus according to the present invention has the following effects in each claim.

According to the first aspect of the present invention, even when a complicated forming process is performed on the grindstone, it can be performed with high accuracy.

According to the second and fourth aspects of the present invention, out-of-machine molding of a grindstone can be realized with ease and with significantly improved accuracy. Further, the molding can be performed without depending on the setting accuracy of the grindstone, and the measuring accuracy of the grindstone can be assured with high accuracy without depending on the uneven surface of the grindstone.

According to the third aspect of the present invention, the measurement accuracy of the grindstone can be improved by the cross-point minute light. Further, by adjusting the center of the grindstone, the measurement accuracy of the grindstone can be further improved.

As described above, the grindstone forming (truing / dressing) apparatus of the present invention can form a high-precision grindstone which cannot be realized by the prior art. Grinding becomes possible.

[Brief description of the drawings]

FIG. 1 is a view showing the overall configuration of a grinding wheel forming apparatus according to the present invention.

FIG. 2 is a view showing a grindstone measuring unit of the grindstone forming apparatus according to the present invention.

FIG. 3 is a diagram showing a configuration in which a grindstone measuring unit of the grindstone forming device according to the present invention is applied to a grinding device.

FIG. 4 is a block diagram showing an integrated arrangement of a grinding wheel forming apparatus and a grinding apparatus according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wire electric discharge machine 3 Wire feeder 3a Wire sending side guide 4 Wire receiver 4a Wire receiving side guide 5 Wire 5A Wire running means (mechanism) 10 Laser measuring machine 10A Laser measuring machine moving means (mechanism) 20 Metal bond grindstone 20A Wheel driving means (mechanism)

Claims (4)

[Claims] 1. A whetstone, a means for driving the whetstone, a wire running means having a wire sending means and a receiving means for running the wire at a position facing the whetstone, and a voltage applied to the whetstone and the wire. A grindstone forming apparatus using wire discharge provided with a power supply means for applying a force, wherein the wire is provided in contact with the grindstone by being bridged. 2. A grindstone forming apparatus according to claim 1, further comprising a measuring means for measuring a position error or a degree of wear of said grindstone with a laser beam at a position facing said grindstone. 3. The grinding wheel forming apparatus according to claim 2, wherein the measuring means uses cross-point light such that the laser light is focused on a portion of the grinding wheel to be measured. 4. The measuring device according to claim 2, wherein the measuring device includes a correcting device that determines a position error or a degree of wear based on the measurement result and corrects a discharge position of the wire. The grinding wheel forming apparatus according to the above.