JPH11284307A - Method and apparatus for mounting power semiconductor element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and an apparatus for mounting a power semiconductor element, which makes it easy to mount a power semiconductor element on a substrate and stably mounts the power semiconductor element on the substrate. The purpose is to provide. SOLUTION: A conductor having a concave portion and a rod portion soldered to a lead of a power semiconductor element, a substrate having a through hole into which the rod portion of the conductor is fitted, and a heat sink for fixing the power semiconductor element And

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a method and an apparatus for mounting a power semiconductor device.

[0002]

2. Description of the Related Art FIG. 6 is a perspective view showing a conventional power semiconductor device mounting apparatus 100. As shown in FIG.

A conventional power semiconductor device mounting apparatus 100
The through holes 20 formed in the substrate 20 are formed by bending the leads 41, 42, 43 of the power semiconductor element 40 in advance.
h, the leads 41, 42, 43 are inserted. In this state, the power semiconductor element 40 is screwed to the heat sink 10, and the leads 4 projecting from the lower surface of the substrate 20.
The power semiconductor element 40 is mounted by soldering the hands 1, 42 and 43 with hand solder and cutting off the lead legs.

[0004]

However, in the conventional power semiconductor device mounting apparatus 100, the leads 41 to 41 are not provided.
When bending 43, stress is applied to the root of power semiconductor element 40, and there is a problem that disconnection inside power semiconductor element 40 is likely to occur.

In the above-mentioned conventional example, other electronic components (not shown) are also mounted on the substrate 20, and the bent leads 41 to 43 of the power semiconductor element 40 are inserted into the through holes 20h of the substrate 20. In the soldering step, the leads 41 to 43 are subjected to stress in the transporting process until the power semiconductor element 40 is fixed to the heat sink 10 due to the reflow soldering together with the other electronic components. Cause. In particular, stress may be concentrated on a specific lead due to a dimensional error, which may cause damage. Therefore, it is necessary to pay close attention to handling of the substrate until the power semiconductor element 40 is fixed to the heat sink 10, and there is a problem that work is difficult in this respect.

Further, in the above-described conventional example, since the power semiconductor element 40 is soldered after being mounted on the substrate 20, the bending positions of the leads 41 to 43 are required to be accurate. There is a problem that the mounting work of the 40 is complicated.

SUMMARY OF THE INVENTION The present invention provides a method and an apparatus for mounting a power semiconductor element, which makes it easy to mount the power semiconductor element on a substrate and stabilizes the mounting of the power semiconductor element on the substrate. It is intended to do so.

It is another object of the present invention to provide a method and an apparatus for mounting a power semiconductor element in which stress is not applied to the root of a lead when the power semiconductor element is mounted on a substrate. .

[0009]

According to the present invention, there is provided a conductor having a concave portion and a rod portion to be soldered to a lead of a power semiconductor device, a substrate having a through hole into which the rod portion of the conductor is inserted. And a heat sink for fixing the power semiconductor element.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a view showing a power semiconductor device mounting apparatus 101 according to a first embodiment of the present invention, and FIG. 1 (1) is an exploded perspective view thereof. Yes,
FIG. 1B is a right side view of the power semiconductor device mounting device in a state where the power semiconductor device is mounted.

The power semiconductor device mounting device 101 includes a heat sink 10, a substrate 20, a screw B, a plate 30,
It is constituted by conductors 31, 32, and 33.

The heat sink 10 is used for the power semiconductor device 1.
The power semiconductor element 140 has leads 141, 142, and 143, the substrate 20 has through holes 20h, and the plate 30 has conductors 31, 32, and 33. Is fixed. Conductor 31
Has a concave portion 31c soldered to the lead 141 and a rod portion 31b, and the conductor 32 includes a concave portion 32c soldered to the lead 142 and a rod portion 32b.
The conductor 33 has a concave portion 33c to be soldered to the lead 143, and a rod portion 33b.

Next, the operation of mounting the power semiconductor element 140 on the substrate in the above embodiment will be described.

First, a conductor 31 fixed to a plate 30
The rod portions 31b, 32b, 33b of the respective 32, 33
Is inserted into the through hole 20 h of the substrate 20 and soldered, and the leads 141, 142, 143 of the power semiconductor element 140 are inserted.
To the recesses 31c, 32 of the conductors 31, 32, 33, respectively.
The power semiconductor element 140 is screwed and fixed to the heat sink 10 with the screw B in a state of being placed on c and 33c. Then, the leads 141 of the power semiconductor element 140,
142, 143 to the recesses 31c of the conductors 31, 32, 33,
Solder to 32c and 33c. In addition, the rod-shaped part 31
Soldering after inserting b, 32b, and 33b into the through-hole 20h of the board 20 is usually performed when soldering other electronic components (not shown) mounted on the board 20 by reflow, as in the related art. Since they are performed together, no special soldering process is required.

In the above embodiment, the power semiconductor device 140
When attaching the leads 141 to 143 to the heat sink 10, the leads 141 to 143 are connected to the recesses 31c to 33c of the conductors 31 to 33.
, The lead of the power semiconductor element 140 is not subjected to stress as in the related art.

According to the above embodiment, when the power semiconductor element 140 is mounted on the substrate 20, the power semiconductor element 140 can be fixed to the heat sink 10 without worrying about the position of the through hole 20h. , Power semiconductor device 1
The work of mounting the 40 on the substrate 20 is easy,
The mounting of the power semiconductor element 140 on the substrate 20 is stabilized. Further, according to the above embodiment, the power semiconductor element 14
0 is mounted on the substrate 20, the leads 141, 142,
143 can be connected to a predetermined portion of the substrate 20 without bending the leads 141, 142, 1
There is no stress at the root of 43.

FIG. 2 shows a mounting device 10 for a power semiconductor element.
2 is a diagram showing a relationship between conductors 31 to 33 and a plate 30 in FIG. 1, FIG. 2A is a plan view thereof, and FIG.
Is a front view thereof.

FIG. 3 shows an apparatus 10 for mounting a power semiconductor element.
In 1, a large number of components are mounted on the substrate 20, and
FIG. 3 is a side view showing the heat sink 10 and the board 20 together with a housing 50 on which they are mounted.

FIG. 4 is a plan view showing a power semiconductor device mounting device 102 according to a second embodiment of the present invention.

The mounting device 102 for the power semiconductor element comprises:
Three heat semiconductor elements 140 are attached to three heat sinks 11.
Provided, and three plates 30 are also provided. The number of sets of the power semiconductor element 140 and the plate 30 is determined as necessary, and two or four or more sets may be provided.

FIG. 5 is a view showing a power semiconductor device mounting device 103 according to a third embodiment of the present invention.
(1) is a perspective view thereof, and FIG. 5 (2) is a left side view thereof.

The power semiconductor device mounting device 103 includes a heat sink 12, a substrate 20, a screw B, a plate 30,
It is constituted by conductors 31, 32, and 33. The heat sink 12 is not a flat plate but has an L-shape, and the power semiconductor element 240 is fixed to a rising surface by a screw B (not shown).

The power semiconductor element 240 has its lead 2
41, 242, 243 are bent 90 degrees.

Next, the operation of attaching the power semiconductor element 240 to the substrate 20 in the power semiconductor element 240 will be described.

First, the conductor 31 fixed to the plate 30
The rod portions 31b, 32b, 33b of the respective 32, 33
Is inserted into the through hole 20h of the substrate 20 and soldered, and the leads 241, 242, 243 of the power semiconductor element 240 are inserted.
To the recesses 31c, 32 of the conductors 31, 32, 33, respectively.
The power semiconductor element 240 is screwed and fixed to the heat sink 10 with the screw B in a state where the power semiconductor element 240 is placed on the heat sink c. Then, the leads 241 of the power semiconductor element 240,
242, 243 to the recesses 31c of the conductors 31, 32, 33,
Solder to 32c and 33c.

According to the power semiconductor device mounting device 103, when the power semiconductor device 240 is mounted on the substrate 20, the power semiconductor device 240 can be fixed to the heat sink 12 without regard to the position of the through hole 20h. Therefore, the work of mounting the power semiconductor element 240 on the substrate 20 is easy, and the mounting of the power semiconductor element 240 on the substrate 20 is stable.

Further, the above embodiment can be understood as a connecting member of a power semiconductor element, and the connecting member of the power semiconductor element includes a conductive recess which is soldered to a lead of the power semiconductor element; A connecting member for a power semiconductor element, the connecting member having a conductive rod-shaped portion connected to the recess and soldered to a conductive portion of a substrate.

[0028]

According to the present invention, the operation for mounting a power semiconductor element on a substrate is easy, and
This has the effect of stabilizing the mounting of the power semiconductor element on the substrate.

[Brief description of the drawings]

FIG. 1 is a view showing a power semiconductor device mounting device 101 according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a relationship between conductors 31 to 33 and a plate 30 in the power semiconductor element mounting device 101.

FIG. 3 shows a mounting device 101 for a power semiconductor element.
FIG. 3 is a side view showing a heat sink 10 and the substrate 20 together with a housing 50 on which a large number of components are mounted and the heat sink 10 and the substrate 20 are mounted.

FIG. 4 is a plan view showing a power semiconductor device mounting device 102 according to a second embodiment of the present invention.

FIG. 5 is a view showing a power semiconductor device mounting device 103 according to a third embodiment of the present invention.

FIG. 6 is a perspective view showing a conventional power semiconductor element mounting device 100.

[Explanation of symbols]

 101-103: Device for mounting a power semiconductor element, 140, 240: Power semiconductor, 141-143, 241-243 ... Lead, 10, 11, 12: Heat sink, 20: Substrate, 31-33: Conductor, 31c- 33c: recess.

Claims (3)

[Claims] A heat sink for fixing a power semiconductor element; a conductor having a conductive concave portion soldered to a lead of the power semiconductor element; and a conductive rod portion;
A substrate having a through-hole fitted into the rod-shaped portion of the conductor. 2. A rod-shaped conductor having a concave portion and a rod-shaped portion to be soldered to a lead of a power semiconductor element is fitted into a through hole of a substrate, and the rod-shaped portion of the conductor is soldered to a conductive portion of the substrate. Soldering a conductor; attaching a lead of the power semiconductor element to a concave portion of the conductor, and fixing the power semiconductor element to a heat sink; and fixing the lead of the power semiconductor element to the heat sink. A step of soldering a lead to the recess of the conductor. 3. A conductive concave portion soldered to a lead of a power semiconductor element; and a conductive rod portion connected to the concave portion and soldered to a conductive portion of a substrate. A connection member for a power semiconductor element.