JPH11284341A - Manufacture of multi-layer printed circuit board - Google Patents
Manufacture of multi-layer printed circuit boardInfo
- Publication number
- JPH11284341A JPH11284341A JP8747598A JP8747598A JPH11284341A JP H11284341 A JPH11284341 A JP H11284341A JP 8747598 A JP8747598 A JP 8747598A JP 8747598 A JP8747598 A JP 8747598A JP H11284341 A JPH11284341 A JP H11284341A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- printed wiring
- wiring board
- multilayer printed
- prepreg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 40
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000011889 copper foil Substances 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims description 66
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 239000002184 metal Substances 0.000 claims description 25
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 230000007547 defect Effects 0.000 abstract description 8
- 239000011347 resin Substances 0.000 abstract description 7
- 229920005989 resin Polymers 0.000 abstract description 7
- 230000037303 wrinkles Effects 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000000470 constituent Substances 0.000 description 22
- 238000000465 moulding Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 5
- 239000004744 fabric Substances 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000003825 pressing Methods 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- -1 voids Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は多層プリント配線板
用基板の製造方法に関する。The present invention relates to a method for manufacturing a substrate for a multilayer printed wiring board.
【０００２】[0002]
【従来の技術】多層プリント配線板用基板の製造方法
は、ガラス布やアラミド繊維布等の基材に、エポキシ樹
脂やポリイミド樹脂などの合成樹脂を含浸、乾燥させて
得られるプリプレグと金属箔張積層板の表面に回路を形
成した内層回路用基板とを積み重ね、更に必要に応じて
プリプレグを介して銅箔と重ね加熱加圧積層一体化する
ことにより製造される。通常は、多層プリント配線板用
基板の構成材料である内層回路用基板、プリプレグ及び
銅箔を複数組準備し、中間板もしくは鏡板と称される金
属板（以下、鏡板と称す）と、交互に多数枚重ね合せ、
これらをプレスの熱盤間に挿入し加熱加圧するのが一般
的である。このとき１枚の多層プリント配線板用基板を
構成する材料として、内層回路用基板を２枚以上使用す
る場合は、内層回路用基板の位置合わせした後に全体を
金属の鳩目等で一旦仮止めすることが一般的である。2. Description of the Related Art A method of manufacturing a substrate for a multilayer printed wiring board is performed by impregnating a base material such as a glass cloth or an aramid fiber cloth with a synthetic resin such as an epoxy resin or a polyimide resin and drying the prepreg and metal foil. It is manufactured by stacking an inner layer circuit substrate having a circuit formed on the surface of the laminate, and further stacking and laminating with a copper foil via a prepreg as necessary. Usually, a plurality of sets of a substrate for an inner layer circuit, a prepreg, and a copper foil, which are constituent materials of a substrate for a multilayer printed wiring board, are prepared, and alternately with a metal plate (hereinafter, referred to as a mirror plate) called an intermediate plate or a mirror plate. Overlay many,
Generally, these are inserted between hot plates of a press and heated and pressed. At this time, when two or more inner-layer circuit boards are used as a material for forming one multi-layer printed wiring board board, the entire board is temporarily temporarily fixed with a metal eyelet or the like after alignment of the inner-layer circuit boards. That is common.
【０００３】[0003]
【発明が解決しようとする課題】鳩目等で内層回路用基
板等の構成材料を一旦仮止めすると、図２（ａ）に示す
ように、構成材料の厚みよりも鳩目の厚み（高さ）が大
きくなる。一般的には鳩目材料の厚みが０．０５〜０．
３ｍｍであるため、上下面の折り返しを含めてその２倍
近い厚み（高さ）の差が発生する。これを鏡板と重ね合
わせるき、図２（ｂ）、（ｃ）に示すように鏡板の大き
さが鳩目部にかぶさる大きさのものを使用すると、加熱
加圧する際に、圧力が鳩目部分に集中してかかるため、
圧力のムラが発生し多層化接着の成形性に問題が生じ、
基板端部樹脂不足やボイド、銅箔しわ等の成形欠陥が生
じる。この対策として、鳩目で固定するときの圧力を上
げ鳩目高さを構成材料と同じ高さとしても、構成材料は
多層化接着時の樹脂の溶融や樹脂流れ等により、厚みが
薄くなり、やはり、鳩目部分に圧カが集中することにな
り圧力ムラによる欠陥を発生させることが非常に多い。
逆に鏡板のサイズを小さくし、図３（ａ）、（ｂ）に示
すように鳩目部が鏡板にかぶさらずに外に出るようにす
ると、鳩目部を含む構成材料の端部が折れ曲がり、図３
（ｃ）に示すような位置ズレを生じる。この位置ズレは
プリント配線板が高密度になればなるほど、少しのズレ
でも問題となる。最近では位置ズレを５０μｍ以下とす
る高密度の仕様が出てきており、小さい鏡板を使用し
て、鳩目部を鏡板の外に出す方式では、５０μｍはおろ
か１００μｍ以内に抑えるのも困雌である。本発明は上
記の事情に鑑み、多層化接着時の基板端部の樹脂不足や
ボイド、銅箔しわ等の成形欠陥の発生を防止し、かつ位
置ズレの少ない多層プリント配線板用基板の製造方法を
提供することを目的とした。Once the constituent materials of the inner layer circuit board and the like are temporarily fixed with eyelets or the like, as shown in FIG. 2A, the eyelet thickness (height) is greater than the thickness of the constituent materials. growing. Generally, the thickness of the eyelet material is 0.05-0.
Since it is 3 mm, a difference in thickness (height) almost twice that of the upper and lower surfaces including the turn-back occurs. When this is superimposed on the end plate, and the size of the end plate is large enough to cover the eyelet as shown in FIGS. 2 (b) and (c), the pressure concentrates on the eyelet when heating and pressing. Because it takes
Unevenness in pressure occurs, causing problems in the moldability of multilayer bonding,
Molding defects such as insufficient resin at the edge of the substrate, voids, and copper foil wrinkles occur. As a countermeasure, even if the pressure at the time of fixing with eyelets is raised and the eyelet height is the same as the constituent material, the constituent material becomes thinner due to melting or resin flow of the resin at the time of multilayer bonding, The pressure is concentrated on the eyelet portion, which often causes a defect due to pressure unevenness.
Conversely, if the size of the end plate is reduced so that the eyelet portion goes out without covering the end plate as shown in FIGS. 3A and 3B, the end of the constituent material including the eyelet portion is bent, FIG.
The positional deviation as shown in FIG. As for the positional deviation, as the density of the printed wiring board becomes higher, even a small deviation becomes a problem. In recent years, high-density specifications with a displacement of 50 μm or less have come out, and it is difficult to control the eyelet part to 100 μm or less by using a small end plate and putting the eyelet out of the end plate. . SUMMARY OF THE INVENTION In view of the above circumstances, the present invention provides a method of manufacturing a substrate for a multilayer printed wiring board, which prevents the occurrence of molding defects such as resin shortage, voids, copper foil wrinkles and the like at the end of the substrate during multi-layer bonding, and has a small displacement. Aimed to provide.
【０００４】[0004]
【課題を解決するための手段】本発明は、表面に回路を
有する少なくとも２つの基板と、その基板間に少なくと
も１枚のプリプレグを配置し、これらを仮止めした後、
これらをプリプレグを介して銅箔を設け若しくはプリプ
レグを介して銅箔を設けないで多層化プリント配線板用
基板の材料を、複数の金属板と交互に多数枚積み重ね、
加熱加圧して多層化接着する多層プリント配線板用基板
の製造方法において、多層化接着する多層プリント配線
板用基板の材料と金属板を交互に積み重ねる際に、金属
板として、仮止め部を覆う大きさの金属板と、仮止め部
を覆わない大きさの金属板を、一枚ごとに変えて重ねる
ことを特徴とする多層プリント配線板用基板の製造方法
である。SUMMARY OF THE INVENTION According to the present invention, at least two substrates having a circuit on a surface, at least one prepreg are arranged between the substrates, and these are temporarily fixed.
These are provided with a copper foil via a prepreg or a material of a substrate for a multilayer printed wiring board without providing a copper foil via a prepreg, and a plurality of metal plates are alternately stacked with a plurality of metal plates,
In the method of manufacturing a substrate for a multilayer printed wiring board to be multilayered and bonded by heating and pressing, when the material of the substrate for the multilayer printed wiring board to be multilayered and the metal plate are alternately stacked, the temporary fixing portion is covered as a metal plate. A method for manufacturing a substrate for a multilayer printed wiring board, characterized in that a metal plate having a size and a metal plate having a size not covering the temporary fixing portion are alternately stacked one by one.
【０００５】[0005]
【発明の実施の形態】以下本発明を説明する。図１
（ａ），（ｂ）及び図４、図５に本発明の多層プリント
配線板用基板の製造方法を説明するための多層プリント
配線板用基板の構成材料９と金属板（鏡板４、８）の構
成と配置の断面図と平面図を示した。本発明の多層プリ
ント配線板用基板の構成材料９は、金属箔張積層板の銅
箔を回路加工し表面に回路を形成した内層回路用基板あ
るいは絶縁樹脂の表面にめっきにより回路を形成した内
層回路用基板を用いる。この内層回路用基板には、スル
ーホールを形成してスルーホールの内壁をめっきして導
通を施したものでも良い。また、多層プリント配線板を
内層回路用基板として用いても良い。これら表面に回路
を有する基板である内層回路用基板を少なくとも２枚用
い、内層回路用基板と内層回路用基板の間に少なくとも
１枚のプリプレグを配置する。そして内層回路用基板の
位置合わせを行い内層回路用基板の位置がずれないよう
に鳩目、ステープル、金属線、プラスチック線、プラス
チック治具などにより仮固定を行う。仮固定は、簡単に
行うことができる鳩目が好ましい。仮固定は、通常、内
層回路用基板の四隅に行い、内層回路用基板のサイズ等
の大きさに応じて辺にも必要に応じて仮固定を行う。ま
た、内層回路用基板の最外層に銅箔を設ける場合は、内
層回路用基板の外層にプリプレグを配して銅箔を積層す
るが、この場合、プリプレグを仮固定する（図４）、プ
リプレグと銅箔を仮固定する、プリプレグと銅箔のいず
れも仮固定しないのいずれの方法でも良い。但し、表面
に回路を有する少なくとも２つの基板である内層回路用
基板とその間に設ける少なくとも１枚のプリプレグは、
内層回路用基板の位置合わせのため、仮固定されている
必要がある。仮固定に用いた鳩目部の厚み（高さ）は、
折り返しの分だけ厚く（高く）なる。 鳩目材料の厚み
は０．０５ｍｍ〜０．３ｍｍが一般的であるので、仮止
め後の鳩目部の厚み（高さ）は約その２倍、つまり０．
１ｍｍ〜０．６ｍｍ厚くなることになる。実際には、圧
力をかけて鳩目を行うので、内層回路用基板とプリプレ
グの構成材料が圧縮されることにより厚みが減少する
が、概ね、０．０５ｍｍから０．５ｍｍの厚み増とな
る。これら多層プリント配線板用基板の構成材料を複数
準備し、鏡板と、交互に多数枚重ね合わせる。このと
き、鏡板として大きさの異なるもの２種類を用意する。
鏡板は一般的にはステンレスやアルミニウム等の金属板
が多く、厚みは、０．７ｍｍから３ｍｍのものが一般的
である。大きさは、大きい方は構成材料とほぼ同じか、
大きくし、仮止め部を覆う大きさの金属板（鏡板）にす
る。小さい方は、多層プリント配線板用基板の材料の仮
止め部を覆わない大きさで仮止め部には掛からないよう
に小さくする。重ね合わせる順序は、図１（ａ）に示す
ように下から、仮止め部を覆う大きさの鏡板、多層プリ
ント配線板用基板の構成材料、仮止め部を覆わない大き
さの鏡板、多層プリント配線板用基板の構成材料、仮止
め部を覆う大きさの鏡板、というように、仮止め部を覆
う大きさ鏡板と仮止め部を覆わない大きさの鏡板を交互
に使用する。さらに多数重ねる場合は、前述の重ね合わ
せ順序のものを１セットとして複数セット重ね合わせ
る。複数セット重ね合わせた上下には、必要に応じて、
クッションやキャリアプレートもしくはカバープレート
などを配置する。その後全体をプレスにて加熱加圧し
て、構成材料を多層プリント配線板用基板に成形する。
成形条件は、通常のプリント配線板用基板の製造条件と
同じである。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below. FIG.
(A), (b) and FIGS. 4 and 5 show a method of manufacturing a substrate for a multilayer printed wiring board according to the present invention. A cross-sectional view and a plan view of the configuration and arrangement are shown. The constituent material 9 of the multilayer printed wiring board substrate of the present invention is an inner layer circuit board in which a circuit is formed by processing a copper foil of a metal foil-clad laminate to form a circuit on the surface or an inner layer in which a circuit is formed by plating on the surface of an insulating resin. A circuit board is used. The inner layer circuit board may be formed by forming a through hole and plating the inner wall of the through hole to provide conduction. Further, a multilayer printed wiring board may be used as the substrate for the inner layer circuit. At least two substrates for an internal circuit, which are substrates having circuits on their surfaces, are used, and at least one prepreg is disposed between the substrates for an internal circuit. Then, the substrate for the inner layer circuit is aligned, and temporarily fixed with eyelets, staples, metal wires, plastic wires, plastic jigs, or the like so that the position of the substrate for the inner layer circuit does not shift. Temporary fixation is preferably an eyelet that can be easily performed. The temporary fixing is usually performed at the four corners of the substrate for the inner layer circuit, and the temporary fixing is also performed on the side according to the size of the substrate for the inner layer circuit as necessary. When a copper foil is provided on the outermost layer of the inner circuit board, a prepreg is arranged on the outer layer of the inner circuit board and the copper foil is laminated. In this case, the prepreg is temporarily fixed (FIG. 4). And the copper foil are temporarily fixed, and neither the prepreg nor the copper foil is temporarily fixed. However, the substrate for the inner layer circuit, which is at least two substrates having circuits on the surface, and at least one prepreg provided between the substrates,
It is necessary to be temporarily fixed for the alignment of the substrate for the inner layer circuit. The thickness (height) of the eyelet part used for temporary fixing is
It becomes thick (high) by the amount of the turn. Since the thickness of the eyelet material is generally 0.05 mm to 0.3 mm, the thickness (height) of the eyelet portion after the temporary fixing is about twice that of the eyelet, that is, 0.1 mm.
It will be 1 mm to 0.6 mm thick. Actually, since eyelets are performed by applying pressure, the thickness is reduced by compressing the constituent materials of the inner layer circuit substrate and the prepreg, but the thickness is generally increased from 0.05 mm to 0.5 mm. A plurality of constituent materials of these multilayer printed wiring board substrates are prepared, and a large number of them are alternately superimposed on a mirror plate. At this time, two types of end plates having different sizes are prepared.
The end plate is generally made of a metal plate such as stainless steel or aluminum, and has a thickness of 0.7 mm to 3 mm. As for the size, the larger one is almost the same as the constituent material,
Make the metal plate (end plate) large enough to cover the temporary fixing part. The smaller one has a size that does not cover the temporary fixing portion of the material of the substrate for a multilayer printed wiring board, and is small so as not to be applied to the temporary fixing portion. As shown in FIG. 1 (a), the order of superposition is as follows: from the bottom, a mirror plate having a size covering the temporary fixing portion, a constituent material of the substrate for a multilayer printed wiring board, a mirror plate having a size not covering the temporary fixing portion, and a multilayer print. A head plate having a size covering the temporary fixing portion and a head plate having a size not covering the temporary fixing portion are used alternately, such as a constituent material of the wiring board substrate and a head plate having a size covering the temporary fixing portion. In the case of superimposing a plurality of sets, a plurality of sets are superposed as one set in the above-described superposition order. Above and below the multiple sets,
Place a cushion, carrier plate or cover plate. Thereafter, the whole is heated and pressed by a press to form a constituent material into a substrate for a multilayer printed wiring board.
The molding conditions are the same as those for manufacturing a normal printed wiring board substrate.
【０００６】本発明では、仮止め部が多層プリント配線
板用基板の構成材料の厚みより厚くても、仮止め部を覆
わない大きさの鏡板と仮止め部を覆う大きの鏡板を交互
に重ね合わせているため、仮止め部を覆わない大きさの
鏡板１枚の厚み分、厚み差が吸収され、仮止め部による
圧力ムラが低減される。また、鏡板すべてに仮止め部を
覆わない大きさの鏡板を使用した場合には、全ての構成
材料の仮止め部が鏡板から出ているため、仮止め部の曲
がりによる内層回路用基板同士の位置ズレが発生した
が、本発明では、仮止め部を覆う大きさの鏡板と仮止め
部を覆わない大きさの鏡板を交互に使い、多層プリント
配線板用基板の構成材料２枚おきに仮止め部をふくむ全
体に接しているため、仮止め部の曲がりは発生せず、位
置ズレも発生しない。以下に本発明を実施例により具体
的に説明する。According to the present invention, even if the temporary fixing portion is thicker than the thickness of the constituent material of the substrate for a multilayer printed wiring board, a mirror plate having a size not covering the temporary fixing portion and a mirror plate having a size covering the temporary fixing portion are alternately stacked. Since they are aligned, the thickness difference is absorbed by the thickness of one end plate having a size that does not cover the temporary fixing portion, and pressure unevenness due to the temporary fixing portion is reduced. In addition, when the end plates having a size that does not cover the temporary fixing portions are used for all the end plates, since the temporary fixing portions of all the constituent materials are protruding from the end plates, the substrates for the inner layer circuit due to the bending of the temporary fixing portions are bent. Although displacement occurred, in the present invention, a head plate having a size to cover the temporary fixing portion and a head plate having a size not to cover the temporary fixing portion were alternately used, and a temporary material was formed every two constituent materials of the substrate for a multilayer printed wiring board. Since it is in contact with the whole including the stopper, the temporary stopper does not bend and the position does not shift. Hereinafter, the present invention will be described specifically with reference to Examples.
【０００７】[0007]
【実施例】まず図４に示す多層プリント配線板用基板材
料を準備した。表面に回路を有する基板となる内層回路
用基板として、基材厚み０．１ｍｍ、銅箔厚み３５μｍ
のＭＣＬ−Ｅ−６７（ガラス布基材エポキシ樹脂両面銅
張積層板、日立化成工業株式会社製商品名）を、テスト
パターン形状に回路加工したものを準備した。プリプレ
グとしてガラスクロスにエポキシ樹脂を含浸させて、半
硬化状態にしたプリプレグ、ＧＥＡ−６７Ｎ（ガラス布
基材エポキシ樹脂プリプレグ、日立化成工業株式会社製
商品名）の厚み０．０６ｍｍを使用した。銅箔として、
厚み１８μｍのＧＴＳ−１８（電解銅箔、古河サーキッ
トフォイル株式会社製商品名）を準備した。以上の銅箔
を除く構成材料を図４に示すようにプリプレグ２、内層
回路用基板３、プリプレグ２、内層回路用基板３、プリ
プレグ２と重ね、内層回路用基板に予め形成してある位
置合わせ用穴の４箇所に金層製の鳩目１を用いて仮止め
した。各寸法は、図１（ｂ）に示すように、構成材料の
寸法は５１０×５１０ｍｍであり、鳩目部の配置は４５
０×４５０ｍｍ正方配置とした。内層回路用基板のテス
トパターンの配線部分は５０８×４０８ｍｍの範囲に形
成した。EXAMPLE First, a substrate material for a multilayer printed wiring board shown in FIG. 4 was prepared. As a substrate for an inner layer circuit which is a substrate having a circuit on the surface, a base material thickness of 0.1 mm and a copper foil thickness of 35 μm
MCL-E-67 (glass cloth base epoxy resin double-sided copper-clad laminate, trade name of Hitachi Chemical Co., Ltd.) was prepared by processing a circuit into a test pattern shape. As a prepreg, a semi-cured prepreg obtained by impregnating a glass cloth with an epoxy resin and having a thickness of 0.06 mm of GEA-67N (glass cloth base epoxy resin prepreg, trade name of Hitachi Chemical Co., Ltd.) was used. As copper foil,
GTS-18 (electrolytic copper foil, trade name, manufactured by Furukawa Circuit Foil Co., Ltd.) having a thickness of 18 μm was prepared. As shown in FIG. 4, the constituent materials excluding the copper foil are overlapped with the prepreg 2, the internal circuit substrate 3, the prepreg 2, the internal circuit substrate 3, and the prepreg 2, and the alignment is formed in advance on the internal circuit substrate. The four holes were temporarily fixed with eyelets 1 made of a gold layer. As shown in FIG. 1B, the dimensions of the constituent material are 510 × 510 mm, and the arrangement of the eyelets is 45
The square arrangement was 0 × 450 mm. The wiring portion of the test pattern on the inner layer circuit board was formed in a range of 508 × 408 mm.
【０００８】（実施例１）多層プリント配線板用基板の
製造に使用した金層板（鏡板）として、鳩目部を覆わな
い大きさの鏡板として寸法５１０×４１０ｍｍを、鳩目
部を覆う大きさの鏡板として５１０×５１０ｍｍの二種
類の大きさの１．８ｍｍ厚みのステンレス板を用意し、
図１（ａ）に示すように仮止め部である鳩目部を覆わな
い大きさの鏡板５１０×４１０ｍｍの鏡板の外になるよ
うに重ね合わせた。(Embodiment 1) As a metal layer plate (end plate) used for manufacturing a substrate for a multilayer printed wiring board, a size of 510.times.410 mm as a end plate not covering an eyelet portion, and a size of covering an eyelet portion. Prepare a stainless plate with a thickness of 1.8 mm of two sizes of 510 x 510 mm as a mirror plate,
As shown in FIG. 1 (a), they were overlapped so as to be outside a 510 × 410 mm end plate having a size not covering the eyelet portion which is a temporary fixing portion.
【０００９】（比較例１）多層プリント配線板用基板の
製造に使用する金層板（鏡板）として、寸法５１０×５
１０ｍｍの大きさの１．８ｍｍ厚みのステンレス板を用
意し、すべての多層プリント配線板用基板の材料の鳩目
部が、すべて鏡板に覆われるように図２（ｃ）のように
重ね合わせた。Comparative Example 1 A metal layer plate (end plate) used for manufacturing a substrate for a multilayer printed wiring board has a size of 510 × 5.
A stainless steel plate having a size of 10 mm and a thickness of 1.8 mm was prepared, and was overlapped as shown in FIG. 2C so that all the eyelets of the material of the substrate for a multilayer printed wiring board were covered with a mirror plate.
【００１０】（比較例２）多層プリント配線板用基板の
製造に使用する金属板（鏡板）として、寸法５１０×４
１０ｍｍの大きさの１．８ｍｍ厚みのステンレス板を用
意し、すべての多層プリント配線板用基板の材料の鳩目
部が、すべて鏡板から出るように図３（ｂ）のように重
ね合わせた。Comparative Example 2 A metal plate (mirror plate) used for manufacturing a substrate for a multilayer printed wiring board has a size of 510 × 4.
A stainless steel plate having a size of 10 mm and a thickness of 1.8 mm was prepared, and was overlapped as shown in FIG. 3B so that all the eyelets of the material of the substrate for a multilayer printed wiring board came out of the mirror plate.
【００１１】以上の実施例、比較例１、２の各構成をそ
れぞれ１７０℃、３０Ｋｇ／ｃｍ2で９０分間、加熱加
圧して多層プリント配線板用基板を作製し、その成形性
と内層位置ズレを評価した。結果を表１に示す。[0011] Each of the components of the above Examples and Comparative Examples 1 and 2 was heated and pressurized at 170 ° C and 30 Kg / cm 2 for 90 minutes to produce a substrate for a multilayer printed wiring board. Was evaluated. Table 1 shows the results.
【００１２】[0012]
【表１】 項目 実施例 比較例１ 比較例２ 成形欠陥発生結果 ０／３４ ３１／３４ ０／３４ （発生数／試料数） 内層位置ズレ ５５ ５７ １０３ （平均値、μｍ） （成形欠陥発生；ボイド、銅しわ、基板端部樹脂不足）[Table 1] Item Example Comparative example 1 Comparative example 2 Molding defect generation result 0/34 31/34 0/34 (Number of occurrences / Number of samples) Inner layer position shift 55 57 103 (Average value, μm) (Molding defect occurrence; void, copper wrinkle) , Insufficient resin at the end of the board)
【００１３】表１より本発明の実施例では、成形欠陥が
生じることなく、内層位置ズレも少なく抑えることがで
きた。[0013] Table 1 shows that in the embodiment of the present invention, there was no molding defect, and the displacement of the inner layer could be kept small.
【００１４】[0014]
【発明の効果】本発明により、鳩目などによる仮止めし
た多層プリント配線板用基板の材料を多数枚重ねて加熱
加圧して多層化接着する、多層プリント配線板用基板の
製造方法において、内層位置ズレを低く抑えたままで、
成形欠陥を発生させることなく多層プリント配線板用基
板を製造することができる。According to the present invention, there is provided a method for manufacturing a substrate for a multilayer printed wiring board in which a plurality of materials for a multilayer printed wiring board temporarily fixed by eyelets or the like are laminated, and heated and pressed to form a multilayer adhesive. While keeping the gap low,
A multilayer printed wiring board substrate can be manufactured without generating molding defects.
【図１】 本発明の多層プリント配線板用基板の製造方
法を説明するための（ａ）構成材料と金属板（鏡板）の
配置を示す断面図、（ｂ）平面図。FIG. 1A is a cross-sectional view illustrating the arrangement of a constituent material and a metal plate (end plate), and FIG. 1B is a plan view, for explaining a method for manufacturing a substrate for a multilayer printed wiring board according to the present invention.
【図２】 従来例の多層プリント配線板用基板の製造方
法を説明するための（ａ）構成材料の断面図、（ｂ）積
層構成を示す射視図、（ｃ）積層構成を示す断面図。2A is a cross-sectional view of a constituent material, FIG. 2B is a perspective view showing a laminated structure, and FIG. 2C is a cross-sectional view showing a laminated structure, for explaining a method of manufacturing a conventional multilayer printed wiring board substrate. .
【図３】 従来例の多層プリント配線板用基板の製造方
法を説明するための（ａ）積層構成を示す射視図、
（ｂ）積層構成を示す断面図、（ｃ）構成材料の位置ズ
レを示す断面図。FIG. 3 is a perspective view showing (a) a laminated structure for explaining a method of manufacturing a conventional multilayer printed wiring board substrate;
(B) is a cross-sectional view showing a laminated structure, and (c) is a cross-sectional view showing positional deviation of constituent materials.
【図４】 多層プリント配線板用基板の構成を示す断面
図。FIG. 4 is a cross-sectional view showing a configuration of a multilayer printed wiring board substrate.
【図５】 多層プリント配線板用基板の構成を示す断面
図。FIG. 5 is a cross-sectional view showing a configuration of a multilayer printed wiring board substrate.
１．ハトメ ２．プリプレグ ３．内層回路用基板 ４．鏡板（仮止め部を覆う大きさの金属板） ５．多層プリント配線板用基板の構成材料 ６．仮止め位置 ７．銅箔 ８．鏡板（仮止め部を覆わない大きさの金属板） ９．多層プリント配線板用基板の材料 １０．内層回路用基板（片面に回路を形成したもの） １１．内層回路用基板の回路位置の位置ズレ 1. Eyelets 2. Prepreg 3. 3. Substrate for inner layer circuit 4. End plate (a metal plate large enough to cover the temporary fixing portion) 5. Constituent materials of multilayer printed wiring board substrate Temporary fixing position 7. Copper foil 8. 8. End plate (metal plate of size not covering temporary fixing part) 9. Material of substrate for multilayer printed wiring board 10. Inner layer circuit board (circuit formed on one side) Misalignment of the circuit position of the inner layer circuit board
Claims (1)
板と、その基板間に少なくとも１枚のプリプレグを配置
し、これらを仮止めした後、これらをプリプレグを介し
て銅箔を設け若しくはプリプレグを介して銅箔を設けな
いで多層化プリント配線板用基板の材料を、複数の金属
板と交互に多数枚積み重ね、加熱加圧して多層化接着す
る多層プリント配線板用基板の製造方法において、多層
化接着する多層プリント配線板用基板の材料と金属板を
交互に積み重ねる際に、金属板として、仮止め部を覆う
大きさの金属板と、仮止め部を覆わない大きさの金属板
を、一枚ごとに変えて重ねることを特徴とする多層プリ
ント配線板用基板の製造方法。At least two substrates having a circuit on the surface and at least one prepreg are disposed between the substrates, and after temporarily fixing them, a copper foil is provided via the prepreg or via a prepreg. In the method for manufacturing a multilayer printed wiring board substrate, a multilayer printed wiring board substrate material is stacked with a plurality of metal plates alternately with a plurality of metal plates, and heated and pressed to form a multilayer adhesive without providing a copper foil. When alternately stacking the material of the substrate for the multilayer printed wiring board and the metal plate to be bonded, as the metal plate, a metal plate large enough to cover the temporary fixing portion and a metal plate large enough not to cover the temporary fixing portion are used. A method for manufacturing a substrate for a multilayer printed wiring board, wherein the method is different for each sheet and stacked.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8747598A JPH11284341A (en) | 1998-03-31 | 1998-03-31 | Manufacture of multi-layer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8747598A JPH11284341A (en) | 1998-03-31 | 1998-03-31 | Manufacture of multi-layer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11284341A true JPH11284341A (en) | 1999-10-15 |
Family
ID=13915957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8747598A Pending JPH11284341A (en) | 1998-03-31 | 1998-03-31 | Manufacture of multi-layer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11284341A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008235640A (en) * | 2007-03-22 | 2008-10-02 | Matsushita Electric Ind Co Ltd | Circuit board and circuit board manufacturing method |
| CN104470267A (en) * | 2014-12-10 | 2015-03-25 | 深圳崇达多层线路板有限公司 | Method for improving alignment precision between HDI board layers made of mixed pressure materials |
-
1998
- 1998-03-31 JP JP8747598A patent/JPH11284341A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008235640A (en) * | 2007-03-22 | 2008-10-02 | Matsushita Electric Ind Co Ltd | Circuit board and circuit board manufacturing method |
| CN104470267A (en) * | 2014-12-10 | 2015-03-25 | 深圳崇达多层线路板有限公司 | Method for improving alignment precision between HDI board layers made of mixed pressure materials |
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