JPH1128656A - Polishing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polishing apparatus capable of selecting a polishing pad according to an object to be polished and easily processing frictional heat by securely holding a polishing pad and easily attaching and detaching the polishing pad. I will provide a. SOLUTION: A holding portion 3 holding a polishing pad 1 is fixed to a tip portion of a rotating shaft 2 connected to a motor 4.
The holding means 11 between the polishing pad 1 and the holding portion 3 is provided detachably.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus for holding a polishing pad at the tip of a rotating shaft rotated by a driving device, bringing the polishing pad into contact with an object to be polished, and polishing the object. is there.

[0002]

As a polishing apparatus for holding a polishing pad at the tip of a rotating shaft rotated by a driving device and bringing the polishing pad into contact with an object to be polished, for example, the present applicant has Invented PCT / JP97 / 006
33, a polishing method and a polishing apparatus for a hard disk, and a polishing apparatus generally used for finishing a vehicle surface. The following are required requirements for the polishing pad of these polishing apparatuses. (1) The polishing pad must be removable so that it can be easily replaced when worn. (2) The polishing pad mounted on the rotating shaft is securely held and does not shift or come off during polishing. (3) The frictional heat generated by polishing can be treated.

[0003] The polishing apparatus of the present invention has been invented as satisfying the above-mentioned necessary conditions sufficiently. The polishing apparatus holds the polishing pad securely and easily attaches and detaches the polishing pad. It is an object of the present invention to provide a polishing apparatus capable of selecting a polishing pad according to the conditions, and capable of easily processing frictional heat.

[0004]

According to the present invention, a rotating shaft, a holding portion provided at a tip portion of the rotating shaft, and an object to be polished held by the holding portion are brought into contact with the object to be polished. A polishing pad, wherein the polishing pad is held by a holding portion by detachable holding means, and a porous member is interposed between the holding means and a polishing surface member of the polishing pad. .

The polishing pad comprises a rotating shaft, a holding portion provided at a tip portion of the rotating shaft, and a polishing pad held by the holding portion and in contact with and polishes an object to be polished. The polishing pad is a porous member held by a holding portion by a detachable holding means, and the polishing pad is fixed to the holding means.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the present invention, in order to hold a polishing pad at a tip portion of a rotating shaft rotated by a driving device, a holding portion is provided at the tip portion, and a polishing pad is inserted into the holding portion. For this purpose, detachable holding means such as a hook-and-loop fastener (also called Magic Tape (registered trademark)) or an adhesive material is provided so that the polishing pad can be easily replaced when worn. Further, in order to more securely hold the holding portion, a projection is formed on the holding portion, and a fitting hole in which the projection is fitted is formed substantially at the center of the polishing pad, so that the position shift due to friction. Etc. are prevented.

Further, in order to treat frictional heat generated by polishing friction, a porous member is interposed between the holding means and the polishing surface member, or the porous member itself is used as a polishing pad. In addition, since the polishing pad is easily attached and detached as described above, even with the same polishing apparatus, a polishing pad suitable for an object to be polished can be selected, and appropriate polishing according to the material can be performed. It becomes possible.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. Example 1 FIG. 1 is a side view showing a polishing apparatus according to the present invention, and FIG. 2 is a side sectional view of a polishing pad of Example 1. As shown in FIG. 1, the polishing apparatus according to the first embodiment includes a motor 4 as a driving device.
A holding portion 3 for holding the polishing pad 1 is fixed to a tip end portion of a rotating shaft 2 connected to the rotating shaft 2, and a holding means 11 between the polishing pad 1 and the holding portion 3 is detachably provided.

As the holding means 11, for example, as shown in FIG. 2, a surface fastener 11a is fixed to the upper surface of the polishing pad 1, and a surface fastener (not shown) for receiving the surface fastener 11a is provided on the bottom surface of the holding portion 3. By sticking,
The attachment / detachment of the polishing pad 1 is facilitated. On the other hand, since the holding by the surface fastener is strong against the horizontal force during polishing, the polishing pad 1 is reliably held without displacement.

As shown in FIG. 2, a polishing surface member 12 of the polishing pad 1 which comes into contact with an object to be polished (not shown) is formed of a polishing cloth. The surface fastener 11 a and the polishing surface member 12 are fixed via a porous member 13. The porous member 13 is interposed for the purpose of radiating frictional heat generated during polishing and improving the adhesion to the object to be polished.

In order to more securely hold the polishing pad 1 during polishing, a fitting hole 14 is formed at the center of the polishing pad 1 so as to be located at the center of the bottom surface of the holding portion 3 as shown in FIG. The polishing pad 1 is provided such that the projection 31 is fitted in the fitting hole 14 so that the center position of the polishing pad 1 does not shift.

The material of the polishing surface member is not limited to the above-mentioned polishing cloth, and its selection is arbitrary depending on the object to be polished, such as a fiber laminated material or a material to which particles are fixed like sandpaper.

Second Embodiment FIG. 3 is a side sectional view of a polishing pad according to a second embodiment. FIG.
As shown in the figure, in the polishing pad 1a of the second embodiment,
The polishing surface member itself in contact with the object to be polished is the porous member 13a.
And is directly fixed to the holding means 11b. Examples of the object to be polished by the porous member 13a include those having many irregularities and those easily damaged. Further, as a polishing pad for polishing a material having many irregularities or a material which is easily damaged as in the present embodiment, for example, a soft material having a brush shape or a bore shape can be applied.

The holding means in each of the above embodiments is not limited to the hook-and-loop fastener, but may be, for example, an adhesive material that can be attached and detached many times or a magnet sheet.
In addition, as a means for more securely holding, a small projection is provided on the bottom surface of the holding portion, and the tip of the projection is formed to be sharp, so that it pierces the upper surface of the polishing pad,
A polishing pad that does not shift in the horizontal direction may be used. Further, in the above embodiment, the diameters of the holding portion and the polishing pad are shown to be substantially the same, but the present invention is not limited to this, and since the polishing pad is detachable, the size can be arbitrarily selected. .

[0015]

According to the present invention, the configuration is as described above.
Since the polishing pad is securely held and easily attached and detached, the replacement is easy, and the polishing pad can be arbitrarily selected according to the object to be polished. Further, the use of the porous member has an excellent effect that frictional heat can be easily treated.

[Brief description of the drawings]

FIG. 1 is a side view showing a polishing apparatus according to the present invention.

FIG. 2 is a side sectional view of the polishing pad according to the first embodiment.

FIG. 3 is a side sectional view of a polishing pad according to a second embodiment.

[Explanation of symbols]

 Reference Signs List 1 polishing pad 11 holding means 11a surface fastener 12 polishing surface member 13 porous member 13a porous member 14 fitting hole 2 rotating shaft 3 holding portion 31 ‥‥ Projection 4 ‥‥‥ Motor

Claims (7)

[Claims] 1. A rotating shaft, a holding portion provided at a tip portion of the rotating shaft, and a polishing pad held by the holding portion and in contact with and polishes an object to be polished, wherein the polishing pad is A polishing apparatus, wherein the polishing apparatus is held by a holding portion by detachable holding means, and a porous member is interposed between the holding means and a polishing surface member of the polishing pad. 2. A rotating shaft, a holding portion provided at a tip end portion of the rotating shaft, and a polishing pad held by the holding portion and in contact with and polishes an object to be polished. A polishing apparatus characterized in that the polishing pad is a porous member held by a holding portion by detachable holding means, and the polishing pad is fixed to the holding means. 3. The polishing apparatus according to claim 1, wherein the holding means for the polishing pad is a surface fastener. 4. The polishing apparatus according to claim 1, wherein the holding means of the polishing pad is a detachable adhesive. 5. The polishing apparatus according to claim 1, wherein the polishing pad is a polishing cloth or a fiber laminated material. 6. The polishing apparatus according to claim 1, wherein particles are fixed to a polishing surface member of the polishing pad. 7. A projection formed on an extension of a rotation axis on a surface of a holding portion, and a fitting hole for fitting the projection is formed substantially at a center of the polishing pad. Polishing equipment.