JPH11293020A - Foamed composition for sealing and method of use thereof - Google Patents
Foamed composition for sealing and method of use thereofInfo
- Publication number
- JPH11293020A JPH11293020A JP9362398A JP9362398A JPH11293020A JP H11293020 A JPH11293020 A JP H11293020A JP 9362398 A JP9362398 A JP 9362398A JP 9362398 A JP9362398 A JP 9362398A JP H11293020 A JPH11293020 A JP H11293020A
- Authority
- JP
- Japan
- Prior art keywords
- foam
- parts
- weight
- sealing composition
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 87
- 238000007789 sealing Methods 0.000 title claims description 75
- 238000000034 method Methods 0.000 title claims description 36
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 43
- 239000003822 epoxy resin Substances 0.000 claims abstract description 42
- 229920000620 organic polymer Polymers 0.000 claims abstract description 38
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 36
- 238000005187 foaming Methods 0.000 claims abstract description 29
- 239000003054 catalyst Substances 0.000 claims abstract description 27
- 239000004088 foaming agent Substances 0.000 claims abstract description 24
- 238000009833 condensation Methods 0.000 claims abstract description 19
- 230000005494 condensation Effects 0.000 claims abstract description 19
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 claims abstract description 19
- 238000010438 heat treatment Methods 0.000 claims description 22
- 239000003566 sealing material Substances 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 11
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 10
- 230000006698 induction Effects 0.000 claims description 6
- 125000000466 oxiranyl group Chemical group 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 abstract description 10
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 238000002156 mixing Methods 0.000 abstract description 2
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 abstract description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 abstract 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical group [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 25
- 239000007788 liquid Substances 0.000 description 24
- -1 methacryloxypropylmethyl Chemical group 0.000 description 23
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 17
- 239000000463 material Substances 0.000 description 16
- 238000005979 thermal decomposition reaction Methods 0.000 description 16
- 229920000642 polymer Polymers 0.000 description 14
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 12
- 238000005259 measurement Methods 0.000 description 12
- 239000000243 solution Substances 0.000 description 12
- 125000000524 functional group Chemical group 0.000 description 11
- 239000006260 foam Substances 0.000 description 10
- 239000000178 monomer Substances 0.000 description 9
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 8
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 8
- 229920001971 elastomer Polymers 0.000 description 8
- 238000012856 packing Methods 0.000 description 8
- 239000005060 rubber Substances 0.000 description 8
- 239000011324 bead Substances 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 7
- 125000003700 epoxy group Chemical group 0.000 description 7
- 239000005357 flat glass Substances 0.000 description 7
- 150000004756 silanes Chemical class 0.000 description 7
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 6
- 229910002012 Aerosil® Inorganic materials 0.000 description 6
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 6
- 150000002148 esters Chemical class 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 239000011342 resin composition Substances 0.000 description 6
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 5
- 125000003396 thiol group Chemical group [H]S* 0.000 description 5
- 229920002554 vinyl polymer Polymers 0.000 description 5
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 4
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 4
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 4
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
- 239000012943 hotmelt Substances 0.000 description 4
- 229920000570 polyether Polymers 0.000 description 4
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 3
- 125000001951 carbamoylamino group Chemical group C(N)(=O)N* 0.000 description 3
- WCRDXYSYPCEIAK-UHFFFAOYSA-N dibutylstannane Chemical compound CCCC[SnH2]CCCC WCRDXYSYPCEIAK-UHFFFAOYSA-N 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 229920000159 gelatin Polymers 0.000 description 3
- 150000002430 hydrocarbons Chemical group 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 150000002902 organometallic compounds Chemical class 0.000 description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 3
- 229920002857 polybutadiene Polymers 0.000 description 3
- 230000000379 polymerizing effect Effects 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 125000001302 tertiary amino group Chemical group 0.000 description 3
- OWRCNXZUPFZXOS-UHFFFAOYSA-N 1,3-diphenylguanidine Chemical compound C=1C=CC=CC=1NC(=N)NC1=CC=CC=C1 OWRCNXZUPFZXOS-UHFFFAOYSA-N 0.000 description 2
- RXYPXQSKLGGKOL-UHFFFAOYSA-N 1,4-dimethylpiperazine Chemical compound CN1CCN(C)CC1 RXYPXQSKLGGKOL-UHFFFAOYSA-N 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 2
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 2
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 2
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052602 gypsum Inorganic materials 0.000 description 2
- 239000010440 gypsum Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 150000002429 hydrazines Chemical class 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 229910052588 hydroxylapatite Inorganic materials 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- QOHMWDJIBGVPIF-UHFFFAOYSA-N n',n'-diethylpropane-1,3-diamine Chemical compound CCN(CC)CCCN QOHMWDJIBGVPIF-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- XYJRXVWERLGGKC-UHFFFAOYSA-D pentacalcium;hydroxide;triphosphate Chemical compound [OH-].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O XYJRXVWERLGGKC-UHFFFAOYSA-D 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920001195 polyisoprene Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 125000005372 silanol group Chemical group 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 150000003377 silicon compounds Chemical class 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 150000003505 terpenes Chemical class 0.000 description 2
- 235000007586 terpenes Nutrition 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- 150000003606 tin compounds Chemical class 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- OBETXYAYXDNJHR-SSDOTTSWSA-M (2r)-2-ethylhexanoate Chemical compound CCCC[C@@H](CC)C([O-])=O OBETXYAYXDNJHR-SSDOTTSWSA-M 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- ULUZGMIUTMRARO-UHFFFAOYSA-N (carbamoylamino)urea Chemical compound NC(=O)NNC(N)=O ULUZGMIUTMRARO-UHFFFAOYSA-N 0.000 description 1
- YOBOXHGSEJBUPB-MTOQALJVSA-N (z)-4-hydroxypent-3-en-2-one;zirconium Chemical compound [Zr].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O YOBOXHGSEJBUPB-MTOQALJVSA-N 0.000 description 1
- TYKCBTYOMAUNLH-MTOQALJVSA-J (z)-4-oxopent-2-en-2-olate;titanium(4+) Chemical compound [Ti+4].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O TYKCBTYOMAUNLH-MTOQALJVSA-J 0.000 description 1
- ZBBLRPRYYSJUCZ-GRHBHMESSA-L (z)-but-2-enedioate;dibutyltin(2+) Chemical compound [O-]C(=O)\C=C/C([O-])=O.CCCC[Sn+2]CCCC ZBBLRPRYYSJUCZ-GRHBHMESSA-L 0.000 description 1
- QGLWBTPVKHMVHM-KTKRTIGZSA-N (z)-octadec-9-en-1-amine Chemical compound CCCCCCCC\C=C/CCCCCCCCN QGLWBTPVKHMVHM-KTKRTIGZSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- KPAPHODVWOVUJL-UHFFFAOYSA-N 1-benzofuran;1h-indene Chemical compound C1=CC=C2CC=CC2=C1.C1=CC=C2OC=CC2=C1 KPAPHODVWOVUJL-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 description 1
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- OVEUFHOBGCSKSH-UHFFFAOYSA-N 2-methyl-n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound CC1=CC=CC=C1N(CC1OC1)CC1OC1 OVEUFHOBGCSKSH-UHFFFAOYSA-N 0.000 description 1
- PZYFAYMXLISRGL-UHFFFAOYSA-N 2-methylhexanenitrile Chemical compound CCCCC(C)C#N PZYFAYMXLISRGL-UHFFFAOYSA-N 0.000 description 1
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- HXLAEGYMDGUSBD-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propan-1-amine Chemical compound CCO[Si](C)(OCC)CCCN HXLAEGYMDGUSBD-UHFFFAOYSA-N 0.000 description 1
- MBNRBJNIYVXSQV-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propane-1-thiol Chemical compound CCO[Si](C)(OCC)CCCS MBNRBJNIYVXSQV-UHFFFAOYSA-N 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- RDIGYBZNNOGMHU-UHFFFAOYSA-N 3-amino-2,4,5-tris(oxiran-2-ylmethyl)phenol Chemical compound OC1=CC(CC2OC2)=C(CC2OC2)C(N)=C1CC1CO1 RDIGYBZNNOGMHU-UHFFFAOYSA-N 0.000 description 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- LVACOMKKELLCHJ-UHFFFAOYSA-N 3-trimethoxysilylpropylurea Chemical compound CO[Si](OC)(OC)CCCNC(N)=O LVACOMKKELLCHJ-UHFFFAOYSA-N 0.000 description 1
- NBOCQTNZUPTTEI-UHFFFAOYSA-N 4-[4-(hydrazinesulfonyl)phenoxy]benzenesulfonohydrazide Chemical compound C1=CC(S(=O)(=O)NN)=CC=C1OC1=CC=C(S(=O)(=O)NN)C=C1 NBOCQTNZUPTTEI-UHFFFAOYSA-N 0.000 description 1
- GHBRMZFUMLMOKO-UHFFFAOYSA-N 5-[diethoxy(methyl)silyl]pentane-1,3-diamine Chemical compound CCO[Si](C)(OCC)CCC(N)CCN GHBRMZFUMLMOKO-UHFFFAOYSA-N 0.000 description 1
- OSSMYOQKNHMTIP-UHFFFAOYSA-N 5-[dimethoxy(methyl)silyl]pentane-1,3-diamine Chemical compound CO[Si](C)(OC)CCC(N)CCN OSSMYOQKNHMTIP-UHFFFAOYSA-N 0.000 description 1
- GKOPXGXLFSTRKU-UHFFFAOYSA-N 5-benzyl-2-methyl-1h-imidazole Chemical compound N1C(C)=NC(CC=2C=CC=CC=2)=C1 GKOPXGXLFSTRKU-UHFFFAOYSA-N 0.000 description 1
- JBBURRWEMSTGIX-UHFFFAOYSA-N 5-ethyl-5-methyl-1,3-bis(oxiran-2-ylmethyl)imidazolidine-2,4-dione Chemical compound O=C1N(CC2OC2)C(=O)C(CC)(C)N1CC1CO1 JBBURRWEMSTGIX-UHFFFAOYSA-N 0.000 description 1
- ZOTKGMAKADCEDH-UHFFFAOYSA-N 5-triethoxysilylpentane-1,3-diamine Chemical compound CCO[Si](OCC)(OCC)CCC(N)CCN ZOTKGMAKADCEDH-UHFFFAOYSA-N 0.000 description 1
- KHLRJDNGHBXOSV-UHFFFAOYSA-N 5-trimethoxysilylpentane-1,3-diamine Chemical compound CO[Si](OC)(OC)CCC(N)CCN KHLRJDNGHBXOSV-UHFFFAOYSA-N 0.000 description 1
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 1
- XAYDWGMOPRHLEP-UHFFFAOYSA-N 6-ethenyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1CCCC2OC21C=C XAYDWGMOPRHLEP-UHFFFAOYSA-N 0.000 description 1
- KNDQHSIWLOJIGP-UHFFFAOYSA-N 826-62-0 Chemical compound C1C2C3C(=O)OC(=O)C3C1C=C2 KNDQHSIWLOJIGP-UHFFFAOYSA-N 0.000 description 1
- 239000004156 Azodicarbonamide Substances 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-M Bicarbonate Chemical compound OC([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-M 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- 239000004604 Blowing Agent Substances 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- DFPAKSUCGFBDDF-UHFFFAOYSA-N Nicotinamide Chemical group NC(=O)C1=CC=CN=C1 DFPAKSUCGFBDDF-UHFFFAOYSA-N 0.000 description 1
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 101710173681 Sulfate adenylyltransferase subunit 2 2 Proteins 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- GKXVJHDEWHKBFH-UHFFFAOYSA-N [2-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC=C1CN GKXVJHDEWHKBFH-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- JJLKTTCRRLHVGL-UHFFFAOYSA-L [acetyloxy(dibutyl)stannyl] acetate Chemical compound CC([O-])=O.CC([O-])=O.CCCC[Sn+2]CCCC JJLKTTCRRLHVGL-UHFFFAOYSA-L 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- 125000004423 acyloxy group Chemical group 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000003302 alkenyloxy group Chemical group 0.000 description 1
- 125000005370 alkoxysilyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- 125000002344 aminooxy group Chemical group [H]N([H])O[*] 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- XOZUGNYVDXMRKW-AATRIKPKSA-N azodicarbonamide Chemical compound NC(=O)\N=N\C(N)=O XOZUGNYVDXMRKW-AATRIKPKSA-N 0.000 description 1
- 235000019399 azodicarbonamide Nutrition 0.000 description 1
- JRPRCOLKIYRSNH-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC2OC2)C=1C(=O)OCC1CO1 JRPRCOLKIYRSNH-UHFFFAOYSA-N 0.000 description 1
- KIKYOFDZBWIHTF-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohex-3-ene-1,2-dicarboxylate Chemical compound C1CC=CC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 KIKYOFDZBWIHTF-UHFFFAOYSA-N 0.000 description 1
- XFUOBHWPTSIEOV-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohexane-1,2-dicarboxylate Chemical compound C1CCCC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 XFUOBHWPTSIEOV-UHFFFAOYSA-N 0.000 description 1
- KBWLNCUTNDKMPN-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) hexanedioate Chemical compound C1OC1COC(=O)CCCCC(=O)OCC1CO1 KBWLNCUTNDKMPN-UHFFFAOYSA-N 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 150000001721 carbon Chemical class 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 150000004292 cyclic ethers Chemical class 0.000 description 1
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- DYHSMQWCZLNWGO-UHFFFAOYSA-N di(propan-2-yloxy)alumane Chemical compound CC(C)O[AlH]OC(C)C DYHSMQWCZLNWGO-UHFFFAOYSA-N 0.000 description 1
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 1
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- ASGKDLGXPOIMTM-UHFFFAOYSA-N diethoxy-methyl-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](C)(OCC)OCC)CCC2OC21 ASGKDLGXPOIMTM-UHFFFAOYSA-N 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 125000002228 disulfide group Chemical group 0.000 description 1
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- HTSRFYSEWIPFNI-UHFFFAOYSA-N ethyl-dimethoxy-methylsilane Chemical compound CC[Si](C)(OC)OC HTSRFYSEWIPFNI-UHFFFAOYSA-N 0.000 description 1
- 239000011151 fibre-reinforced plastic Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 125000001188 haloalkyl group Chemical group 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 229940091173 hydantoin Drugs 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 150000002483 hydrogen compounds Chemical class 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 150000002611 lead compounds Chemical class 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000006078 metal deactivator Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 238000013008 moisture curing Methods 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- VAUOPRZOGIRSMI-UHFFFAOYSA-N n-(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CNC1=CC=CC=C1 VAUOPRZOGIRSMI-UHFFFAOYSA-N 0.000 description 1
- 150000002832 nitroso derivatives Chemical class 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- WLAHGGSLQFSJKG-UHFFFAOYSA-N phenyl 2,3-diaminobenzenesulfonate Chemical compound NC1=CC=CC(S(=O)(=O)OC=2C=CC=CC=2)=C1N WLAHGGSLQFSJKG-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 150000004980 phosphorus peroxides Chemical class 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- HKJYVRJHDIPMQB-UHFFFAOYSA-N propan-1-olate;titanium(4+) Chemical compound CCCO[Ti](OCCC)(OCCC)OCCC HKJYVRJHDIPMQB-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 125000005373 siloxane group Chemical group [SiH2](O*)* 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 238000006276 transfer reaction Methods 0.000 description 1
- 125000005270 trialkylamine group Chemical group 0.000 description 1
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、シーリング材やガ
スケットなどのシーリング用途に適した発泡型シーリン
グ用組成物とその使用方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a foamable sealing composition suitable for sealing applications such as sealing materials and gaskets, and a method of using the same.
【0002】[0002]
【従来の技術】従来、発泡性樹脂組成物として、SB
S、SIS等のブロックポリマーを樹脂成分とするホッ
トメルト系(特公平7−17896号公報等)のほか、
ポリウレタン系やエポキシ系が知られているが、それぞ
れ、以下のような長所短所を有していた。2. Description of the Related Art Conventionally, as a foamable resin composition, SB
In addition to hot-melt systems using a block polymer such as S or SIS as a resin component (JP-B-7-17896, etc.),
Polyurethanes and epoxies are known, but each has the following advantages and disadvantages.
【0003】SBS、SIS等のブロックポリマーを樹
脂成分とする発泡性樹脂組成物は、ホットメルト性を有
するため使用上の利点を有するが、SBSやSIS等の
ブロックポリマーの軟化点が例えば60℃位と低いの
で、耐熱性が低く、シーリング用途には使用しにくいと
いう問題があった。シーリング用途では常温下のみでな
く高温下での密着性も要求されるが、ホットメルト系発
泡性樹脂組成物はこの点でも大いに問題があった。A foamable resin composition containing a block polymer such as SBS or SIS as a resin component has a hot-melt property and therefore has an advantage in use. However, the softening point of the block polymer such as SBS or SIS is, for example, 60 ° C. Therefore, there is a problem that heat resistance is low and it is difficult to use for sealing applications. For sealing applications, adhesiveness not only at room temperature but also at high temperature is required. However, the hot-melt foamable resin composition has a great problem also in this point.
【0004】エポキシ系発泡性樹脂組成物は、耐熱性の
問題が起きにくく、しかも密着性も十分に高い。しか
し、柔軟性に乏しく割れやすいため、クラックや欠落等
が発生し易いという問題があった。これに対し、ポリウ
レタン系発泡性樹脂組成物は、適度の弾性を有するた
め、耐久性、耐磨耗性等に優れており、クラックや欠落
等の問題を生じない。しかし、高温下の密着性のみでな
く常温下での密着性も低く、界面破壊が生じ易いとい
う、シーリング用途における重大な欠点を有していた。[0004] The epoxy foamable resin composition hardly causes a problem of heat resistance and has sufficiently high adhesion. However, there is a problem that cracks and missing parts are apt to occur because of poor flexibility and easy cracking. On the other hand, since the polyurethane-based foamable resin composition has appropriate elasticity, it is excellent in durability, abrasion resistance and the like, and does not cause problems such as cracks and chipping. However, not only the adhesion at a high temperature but also the adhesion at a normal temperature is low, and there is a serious drawback in sealing applications that the interface is easily broken.
【0005】発泡性樹脂組成物は、これまで、ハロゲン
化炭素(フロン)で発泡させるのが通常であった。気体
による発泡は十分な発泡倍率が得やすいからである。し
かし、フロンを使用する気体発泡法は、発泡後の寸法に
ばらつきが生じやすく、防水性が低いと言う問題がある
ほか、フロンがオゾン層を破壊するため、地球環境保護
の観点から、近い将来、使用できなくなる。Until now, foamable resin compositions have been usually foamed with halogenated carbon (CFC). This is because foaming with a gas can easily obtain a sufficient foaming ratio. However, the gas foaming method using chlorofluorocarbon has a problem that the dimensions after foaming are apt to vary and the waterproofness is low, and fluorocarbons destroy the ozone layer. , Can not be used.
【0006】別の発泡方法として、イソシアネート等の
反応性発泡剤を用いて発泡させる方法があるが、この発
泡方法では往々にして気泡が連続気泡となりやすく、防
水性に劣り、しかも、十分な発泡倍率が得られない。As another foaming method, there is a method of foaming using a reactive foaming agent such as isocyanate. In this foaming method, air bubbles often tend to be open cells, are poor in waterproofness, and have sufficient foaming. The magnification cannot be obtained.
【0007】[0007]
【発明が解決しようとする課題】そこで、本発明が解決
しようとする課題は、塗工に適度な粘度が得られて、し
かも、耐熱性があり、フロンを使用しなくても十分な発
泡倍率が得られて、しかも、その発泡倍率が安定してお
り、かつ、常温下でも高温下でも十分な密着性を有し、
防水性が高い発泡型シーリング用組成物およびその使用
方法を提供することである。The problem to be solved by the present invention is to provide an appropriate viscosity for coating, heat resistance, and sufficient foaming ratio without using Freon. Is obtained, and its foaming ratio is stable, and has sufficient adhesion even at normal temperature or high temperature,
An object of the present invention is to provide a foam-type sealing composition having high waterproofness and a method for using the same.
【0008】[0008]
【課題を解決するための手段】本発明者は、上記課題を
解決するために、鋭意検討した結果、耐熱性と適度の弾
性を得るために、樹脂成分としてはゴム質系有機重合体
を選ぶことにした。ゴム質系有機重合体は、常温下で適
度の粘度を有し、塗工性に優れているからでもある。そ
して、このゴム質系有機重合体に反応性ケイ素基を導入
し、これをシラノール縮合触媒で硬化させることによっ
て、架橋構造が形成されるようにした。このようにすれ
ば、常温下のみならず高温下でも十分な密着性が得ら
れ、防水性が高まるからである。次に、発泡剤として有
機系熱分解型発泡剤を選択した。有機系熱分解型発泡剤
による発泡方法は、十分な発泡倍率を得させるととも
に、発泡後の寸法安定性も良いからである。以上のよう
にして、本発明が完成した。Means for Solving the Problems The present inventors have conducted intensive studies to solve the above-mentioned problems, and as a result, in order to obtain heat resistance and appropriate elasticity, select a rubber organic polymer as a resin component. It was to be. This is because the rubbery organic polymer has an appropriate viscosity at room temperature and is excellent in coatability. Then, a reactive silicon group was introduced into this rubbery organic polymer, and this was cured with a silanol condensation catalyst to form a crosslinked structure. This is because sufficient adhesion can be obtained not only at room temperature but also at high temperature, and the waterproofness can be enhanced. Next, an organic thermal decomposition type foaming agent was selected as a foaming agent. This is because the foaming method using an organic thermal decomposition type foaming agent can obtain a sufficient foaming ratio and also has good dimensional stability after foaming. The present invention has been completed as described above.
【0009】したがって、本発明にかかる発泡型シーリ
ング用組成物は、少なくとも1つの反応性ケイ素基を含
有するゴム質系有機重合体と、前記ゴム質系有機重合体
を硬化させるシラノール縮合触媒と、有機系熱分解型発
泡剤とを含む。この組成物は、1分子中にオキシラン環
を2つ以上有するエポキシ樹脂とこのエポキシ樹脂を硬
化させる硬化触媒、シランカップリング剤、粘着付与樹
脂、誘導加熱によって発熱する導電体から選ばれた少な
くとも1種をさらに含むことが出来る。この組成物は最
終製品であるシーリング材であっても良い。Therefore, the foamable sealing composition according to the present invention comprises a rubbery organic polymer containing at least one reactive silicon group, a silanol condensation catalyst for curing the rubbery organic polymer, Organic thermal decomposition type foaming agent. The composition has at least one selected from an epoxy resin having two or more oxirane rings in one molecule, a curing catalyst for curing the epoxy resin, a silane coupling agent, a tackifying resin, and a conductor that generates heat by induction heating. Seeds can be further included. This composition may be a sealant which is a final product.
【0010】本発明にかかる発泡型シーリング用組成物
の使用方法は、上記発泡型シーリング用組成物を加熱し
て発泡させる方法であり、前記加熱を高周波加熱によっ
て行うことが出来る。The method of using the foam-type sealing composition according to the present invention is a method of heating and foaming the foam-type sealing composition, and the heating can be performed by high-frequency heating.
【0011】[0011]
【発明の実施の形態】以下では、まず、本発明の発泡型
シーリング用組成物を構成する必須成分と好ましい付加
成分について説明し、その後に、発泡型シーリング用組
成物の構成と使用方法について説明する。 〔反応性ケイ素基含有ゴム質系有機重合体〕反応性ケイ
素基含有ゴム質系有機重合体の主体である重合体鎖は、
たとえば、次のゴム質系有機重合体に由来する。すなわ
ち、アジピン酸等の2塩基酸とグリコールとの縮合反応
やラクトン類の開環反応で得られるポリエステル系重合
体;エチレン−プロピレン系共重合体;ポリイソブチレ
ン;イソブチレンとイソプレン等との共重合体;ポリク
ロロプレン;ポリイソプレン;イソプレンとブタジエ
ン、スチレン、アクリロニトリル等との共重合体;ポリ
ブタジエン;ブタジエンとスチレン、アクリロニトリル
等との共重合体;ポリイソプレン、ポリブタジエン、イ
ソプレンまたはブタジエンとスチレン、アクリロニトリ
ル等との共重合体を水素添加して得られるポリオレフィ
ン系重合体;エチルアクリレート、ブチルアクリレート
等のモノマーをラジカル重合して得られるポリアクリル
酸エステル;エチルアクリレートやブチルアクリレート
等のアクリル酸エステルと、酢酸ビニル、アクリロニト
リル、メチルメタクリレート、スチレン等の単量体とを
共重合させて得られるアクリル酸エステル系重合体;上
記で例示した各種ゴム質系有機重合体にビニルモノマー
をグラフト重合させて得られるグラフト重合体;プロピ
レンオキサイド、エチレンオキサイド、テトラヒドロフ
ラン等の環状エーテルの重合により得られるポリエーテ
ル系重合体(主鎖が−R−O−(式中、Rは炭素数2〜
4の2個のアルキレン基を示す。)で表される重合体)
中で、炭素数1〜13のアルコールと(メタ)アクリル
酸とのエステル、酢酸ビニル、アクリロニトリル、スチ
レン等のビニルモノマーを重合させて得られるビニルポ
リマー変性ポリエーテル系重合体;ポリサルファイド系
重合体等である。これらのうちでも、ゴム質系有機重合
体としては、プロピレンオキサイド系ポリエーテル中で
エチルアクリレートやブチルアクリレート等のビニルモ
ノマーを重合させて得られるビニルポリマー変性ポリエ
ーテル系重合体;ポリアクリル酸エステル;アクリル酸
エステルと、酢酸ビニル、アクリロニトリル、メチルメ
タクリレート、スチレン等の共重合体が好ましい。BEST MODE FOR CARRYING OUT THE INVENTION In the following, first, essential components and preferable additional components constituting the foam-type sealing composition of the present invention will be described, and then, the structure and usage of the foam-type sealing composition will be described. I do. (Reactive silicon group-containing rubber organic polymer) The polymer chain that is the main component of the reactive silicon group-containing rubber organic polymer,
For example, it is derived from the following rubbery organic polymer. That is, a polyester-based polymer obtained by a condensation reaction of a dibasic acid such as adipic acid with glycol or a ring-opening reaction of a lactone; an ethylene-propylene-based copolymer; a polyisobutylene; a copolymer of isobutylene and isoprene; Polychloroprene; polyisoprene; a copolymer of isoprene with butadiene, styrene, acrylonitrile, etc .; polybutadiene; a copolymer of butadiene with styrene, acrylonitrile, etc .; a copolymer of polyisoprene, polybutadiene, isoprene or butadiene with styrene, acrylonitrile, etc. Polyolefin polymer obtained by hydrogenating a copolymer; Polyacrylic ester obtained by radical polymerization of monomers such as ethyl acrylate and butyl acrylate; Acrylic such as ethyl acrylate and butyl acrylate An acrylate polymer obtained by copolymerizing an ester and a monomer such as vinyl acetate, acrylonitrile, methyl methacrylate, or styrene; a vinyl monomer is graft-polymerized to the various rubbery organic polymers exemplified above. A polyether-based polymer obtained by polymerization of a cyclic ether such as propylene oxide, ethylene oxide, or tetrahydrofuran (wherein the main chain is -RO- (where R is 2 to 2 carbon atoms)
4 represents two alkylene groups. A) a polymer represented by
Among them, a vinyl polymer-modified polyether polymer obtained by polymerizing an ester of an alcohol having 1 to 13 carbon atoms and (meth) acrylic acid, vinyl acetate, acrylonitrile, styrene, etc .; a polysulfide polymer, etc. It is. Among these, as the rubber-based organic polymer, a vinyl polymer-modified polyether-based polymer obtained by polymerizing a vinyl monomer such as ethyl acrylate or butyl acrylate in a propylene oxide-based polyether; a polyacrylate ester; Acrylic esters and copolymers of vinyl acetate, acrylonitrile, methyl methacrylate, styrene and the like are preferred.
【0012】ゴム質系有機重合体は、分枝した構造であ
ってもよく、直線状の構造であってもよい。ゴム質系有
機重合体の分子量については、特に限定はなく、好まし
くは500〜50,000、さらに好ましくは1,00
0〜20,000である。ゴム質系有機重合体の分子量
が500未満であると、硬化すると伸度が低下し、硬度
が高くなるおそれがある。他方、ゴム質系有機重合体の
分子量が50,000を超えると、硬化すると伸度が高
くなり、抗張力が低下しすぎるおそれがある。また同時
に、粘度が高くなり、取扱いにくくなる。The rubbery organic polymer may have a branched structure or a linear structure. The molecular weight of the rubbery organic polymer is not particularly limited, and is preferably from 500 to 50,000, and more preferably from 1,000 to 50,000.
0 to 20,000. If the molecular weight of the rubber-based organic polymer is less than 500, elongation may be reduced upon curing and the hardness may be increased. On the other hand, when the molecular weight of the rubbery organic polymer exceeds 50,000, elongation increases when cured, and the tensile strength may be too low. At the same time, the viscosity increases, making it difficult to handle.
【0013】本発明で使用するゴム質系有機重合体は、
分子中に、少なくとも1つの反応性ケイ素基を含有して
いる。反応性ケイ素基としては、たとえば、加水分解性
ケイ素基やシラノール基を挙げることができる。ここ
で、加水分解性ケイ素基とは、水分によって分解を受け
る基がケイ素原子に結合している基のことである。シラ
ノール基は、加水分解性ケイ素基を加水分解することに
よって得ることもできる。反応性ケイ素基中のケイ素原
子の数は、1個でもよく、2個以上であってもよい。反
応性ケイ素基中に2価シロキサン基を含む場合は、反応
性ケイ素基中のケイ素原子の数は、20個までであれば
自由に使用することができる。The rubbery organic polymer used in the present invention comprises:
The molecule contains at least one reactive silicon group. Examples of the reactive silicon group include a hydrolyzable silicon group and a silanol group. Here, the hydrolyzable silicon group is a group in which a group that is decomposed by moisture is bonded to a silicon atom. Silanol groups can also be obtained by hydrolyzing hydrolyzable silicon groups. The number of silicon atoms in the reactive silicon group may be one, or two or more. When the reactive silicon group contains a divalent siloxane group, the number of silicon atoms in the reactive silicon group can be freely used as long as the number is up to 20.
【0014】反応性ケイ素基の具体例としては、下記一
般式(1)や(2)で示される反応性ケイ素基を挙げる
ことができる。反応性ケイ素基は、ゴム質系有機重合体
の主体である重合体鎖に対し、ケイ素−炭素結合を介し
て結合している。Specific examples of the reactive silicon group include the reactive silicon groups represented by the following general formulas (1) and (2). The reactive silicon group is bonded via a silicon-carbon bond to a polymer chain that is a main component of the rubbery organic polymer.
【0015】[0015]
【化1】 Embedded image
【0016】(式中、Xは水酸基または加水分解性基;
R1は炭素数1〜20の1価の炭化水素基または炭素数
1〜20の1価の炭化水素基がケイ素原子に結合したシ
ロキシ基;a=1〜3の整数;bは0〜2の整数;1≦
a+b;m=0〜18の整数である。)(Wherein X is a hydroxyl group or a hydrolyzable group;
R 1 is a monovalent hydrocarbon group having 1 to 20 carbon atoms or a siloxy group in which a monovalent hydrocarbon group having 1 to 20 carbon atoms is bonded to a silicon atom; a is an integer of 1 to 3; Integer of 1 ≦
a + b; m = 0 to 18; )
【0017】[0017]
【化2】 Embedded image
【0018】(式中、Xは水酸基または加水分解性基;
R2は炭素数1〜18の1価の炭化水素基;n=1〜3
の整数である。) Xとして用いられる加水分解性基としては、たとえば、
水素原子、ハロゲン原子、アルコキシ基、アシルオキシ
基、ケトキシメート基、アミノ基、アミド基、酸アミド
基、アミノオキシ基、メルカプト基、アルケニルオキシ
基等を挙げることができ、これらの基は、1種または2
種以上共存することもできる。これらの基のうち、加水
分解性が温和で取扱いやすいと言う理由で、アルコキシ
基が好ましい。(Wherein X is a hydroxyl group or a hydrolyzable group;
R 2 is a monovalent hydrocarbon group having 1 to 18 carbon atoms; n = 1 to 3
Is an integer. The hydrolyzable group used as X includes, for example,
Examples include a hydrogen atom, a halogen atom, an alkoxy group, an acyloxy group, a ketoximate group, an amino group, an amide group, an acid amide group, an aminooxy group, a mercapto group, and an alkenyloxy group. 2
More than one species can coexist. Among these groups, an alkoxy group is preferred because it is mild in hydrolysis and easy to handle.
【0019】加水分解性ケイ素基を例に挙げて説明する
と、ゴム質系有機重合体に反応性ケイ素基を導入する方
法としては下記(a)〜(d)の方法がある。 (a)ビニルトリアルコキシシラン、メタクリロキシプ
ロピルメチルジアルコキシシラン、メタクリロキシプロ
ピルトリアルコキシシラン等の共重合可能な不飽和基と
加水分解性ケイ素基とを分子中に有するモノマーを、エ
チレン、プロピレン、イソブチレン、クロロプレン、イ
ソプレン、ブタジエン、アクリル酸エステル等の重合性
モノマーと共重合させる方法;γ−グリシドキシプロピ
ルトリメトキシシラン、γ−グリシドキシプロピルメチ
ルジメトキシシラン等の共重合可能なエポキシ基と加水
分解性ケイ素基を分子内に有するモノマーを、プロピレ
ンオキシドやエチレンオキシド等と共重合させる方法。To explain, taking a hydrolyzable silicon group as an example, there are the following methods (a) to (d) as a method for introducing a reactive silicon group into a rubbery organic polymer. (A) a monomer having a copolymerizable unsaturated group such as vinyl trialkoxysilane, methacryloxypropylmethyl dialkoxysilane, methacryloxypropyl trialkoxysilane and a hydrolyzable silicon group in the molecule, ethylene, propylene, A method of copolymerizing with a polymerizable monomer such as isobutylene, chloroprene, isoprene, butadiene, or an acrylate ester; and a copolymerizable epoxy group such as γ-glycidoxypropyltrimethoxysilane or γ-glycidoxypropylmethyldimethoxysilane. A method in which a monomer having a hydrolyzable silicon group in a molecule is copolymerized with propylene oxide, ethylene oxide, or the like.
【0020】(b)ラジカル重合において連鎖移動反応
を起こし得るメルカプトプロピルトリアルコキシシラ
ン、メルカプトプロピルメチルジアルコキシシラン等の
メルカプト基やジスルフィド基等と加水分解性ケイ素基
とを分子中に有するケイ素化合物を連鎖移動剤として使
用し、ラジカル重合性モノマーを重合させる方法。 (c)アゾビス−2−(6−メチルジエトキシシリル−
2−シアノヘキサン)等の加水分解性ケイ素基を含有す
るアゾ系開始剤や過酸化物系開始剤を使用してラジカル
重合性モノマーを重合させる方法。(B) A silicon compound having a mercapto group or disulfide group such as mercaptopropyl trialkoxysilane or mercaptopropylmethyldialkoxysilane which can cause a chain transfer reaction in radical polymerization and a hydrolyzable silicon group in the molecule. A method in which a radical polymerizable monomer is polymerized by using it as a chain transfer agent. (C) azobis-2- (6-methyldiethoxysilyl-
A method of polymerizing a radical polymerizable monomer using an azo-based initiator or a peroxide-based initiator containing a hydrolyzable silicon group such as 2-cyanohexane).
【0021】(d)重合体の側鎖および/または末端に
水酸基、カルボキシル基、メルカプト基、エポキシ基、
イソシアネート基等の官能基を有する重合体に対し、こ
の官能基と反応し得る別の官能基を分子中に含有すると
ともに加水分解性ケイ素基をも含有するケイ素化合物
を、両者の官能基の反応で結合させる方法。 上記(a)の方法によれば重合体分子側鎖に加水分解性
ケイ素基を導入できる。上記(b)、(c)の方法によ
れば重合体鎖の末端に加水分解性ケイ素基を導入でき
る。 〔シラノール縮合触媒〕シラノール縮合触媒剤はゴム質
系有機重合体中の反応性ケイ素基の縮合反応(硬化反
応)を促進させる。(D) a hydroxyl group, a carboxyl group, a mercapto group, an epoxy group,
For a polymer having a functional group such as an isocyanate group, a silicon compound containing another functional group capable of reacting with this functional group in the molecule and also containing a hydrolyzable silicon group is reacted with both functional groups. How to combine with. According to the method (a), a hydrolyzable silicon group can be introduced into the side chain of the polymer molecule. According to the above methods (b) and (c), a hydrolyzable silicon group can be introduced into the terminal of the polymer chain. [Silanol condensation catalyst] The silanol condensation catalyst promotes the condensation reaction (curing reaction) of the reactive silicon group in the rubbery organic polymer.
【0022】シラノール縮合触媒としては、たとえば、
テトラブチルチタネート、テトラプロピルチタネート等
のチタン酸エステル類;ジブチルスズジラウレート、ジ
ブチルスズマレエート、ジブチルスズアセテート、オク
チル酸スズ、ナフテン酸スズ、ジブチルスズオキサイド
とフタル酸エステルとの反応物、ジブチルスズジアセチ
ルアセトナート等の有機スズ化合物類;アルミニウムト
リスアセチルアセトナート、アルミニウムトリスエチル
アセトアセトナート、ジイソプロポキシアルミニウムト
リスエチルアセトアセトナート等の有機アルミニウム化
合物類;ジルコニウムテトラアセチルアセトナート、チ
タンテトラアセチルアセトナート等のキレート化合物
類;オクチル酸鉛等の有機鉛化合物類;ブチルアミン、
オクチルアミン、ラウリルアミン、ジブチルアミン、モ
ノエタノールアミン、ジエタノールアミン、トリエタノ
ールアミン、ジエチレントリアミン、トリエチレンテト
ラミン、オレイルアミン、シクロヘキシルアミン、ベン
ジルアミン、ジエチルアミノプロピルアミン、キシリレ
ンジアミン、トリエチレンジアミン、グアニジン、ジフ
ェニルグアニジン、2,4,6−トリス(ジメチルアミ
ノメチル)フェノール、モルホリン、N−メチルモルホ
リン、2−エチル−4−メチルイミダゾール、1,8−
ジアザビシクロ〔5.4.0〕ウンデセン−7(DB
U)等のアミン化合物類;前記アミン化合物類のカルボ
ン酸塩;過剰のポリアミンと多塩基酸とから得られる低
分子量ポリアミド樹脂;過剰のポリアミンとエポキシ化
合物との反応生成物等を挙げることができ、これらは1
種または2種以上使用される。As the silanol condensation catalyst, for example,
Titanate such as tetrabutyl titanate and tetrapropyl titanate; dibutyltin dilaurate, dibutyltin maleate, dibutyltin acetate, tin octylate, tin naphthenate, a reaction product of dibutyltin oxide and phthalate, and organic such as dibutyltin diacetylacetonate Tin compounds; organoaluminum compounds such as aluminum trisacetylacetonate, aluminum trisethylacetoacetonate, diisopropoxyaluminum trisethylacetoacetonate; chelate compounds such as zirconium tetraacetylacetonate, titanium tetraacetylacetonate; Organic lead compounds such as lead octylate; butylamine,
Octylamine, laurylamine, dibutylamine, monoethanolamine, diethanolamine, triethanolamine, diethylenetriamine, triethylenetetramine, oleylamine, cyclohexylamine, benzylamine, diethylaminopropylamine, xylylenediamine, triethylenediamine, guanidine, diphenylguanidine, 2 , 4,6-tris (dimethylaminomethyl) phenol, morpholine, N-methylmorpholine, 2-ethyl-4-methylimidazole, 1,8-
Diazabicyclo [5.4.0] undecene-7 (DB
Amine compounds such as U); carboxylate salts of the amine compounds; low-molecular-weight polyamide resins obtained from excess polyamine and polybasic acid; reaction products of excess polyamine and epoxy compound; , These are 1
Seeds or two or more are used.
【0023】上記シラノール縮合触媒のうち、有機金属
化合物類、有機金属化合物類とアミン化合物類の組み合
わせが好ましく、硬化性が高い。有機金属化合物類とし
ては、有機スズ化合物類が好ましく、4価の有機スズ化
合物類がさらに好ましい。シラノール縮合触媒として4
価の有機スズ化合物類を用い、シランカップリング剤と
して1級または2級のアミノ基と加水分解性ケイ素基と
を含有する化合物を用いた場合、弾性率や強度が高ま
る。 〔有機系熱分解型発泡剤〕有機系熱分解型発泡剤は、加
熱されると、シーリング用組成物を、再現性よく、十分
な発泡倍率で発泡させる。Among the above silanol condensation catalysts, organometallic compounds and a combination of an organometallic compound and an amine compound are preferable and have high curability. As the organometallic compounds, organotin compounds are preferred, and tetravalent organotin compounds are more preferred. 4 as silanol condensation catalyst
When a valence organic tin compound is used and a compound containing a primary or secondary amino group and a hydrolyzable silicon group is used as a silane coupling agent, the elastic modulus and strength are increased. [Organic thermal decomposition type foaming agent] The organic thermal decomposition type foaming agent, when heated, foams the sealing composition with good reproducibility and sufficient expansion ratio.
【0024】有機系熱分解型発泡剤としては、たとえ
ば、アゾジカルボンアミド、等のアゾ化合物;N,N’
−ジニトロペンタメチレンテトラミン等のニトロソ化合
物;4,4’−オキシビス(ベンゼンスルホニルヒドラ
ジド)、ヒドラゾカルボンアミド等のヒドラジン誘導
体;アジド化合物;トリアゾール化合物等を挙げること
ができ、これらは1種または2種以上使用される。Examples of the organic thermal decomposition type foaming agent include azo compounds such as azodicarbonamide; N, N '
Nitroso compounds such as -dinitropentamethylenetetramine; hydrazine derivatives such as 4,4'-oxybis (benzenesulfonylhydrazide) and hydrazocarbonamide; azide compounds; and triazole compounds. Used above.
【0025】本発明では、上記有機系熱分解型発泡剤と
ともに無機系熱分解型発泡剤を用いてもよい。無機系熱
分解型発泡剤としては、たとえば、重炭酸塩、炭酸塩、
亜硝酸塩、水素化合物等を挙げることができ、これらは
1種または2種以上使用される。 〔エポキシ樹脂とその硬化触媒〕本発明で用いられるエ
ポキシ樹脂は、架橋することによって網目構造を形成す
ることができ、発泡型シーリング用組成物の密着性およ
び耐熱性の向上に大きく寄与する。In the present invention, an inorganic thermal decomposition type foaming agent may be used together with the organic thermal decomposition type foaming agent. Examples of the inorganic pyrolytic foaming agent include bicarbonate, carbonate,
Nitrite, hydrogen compounds and the like can be mentioned, and one or more of these are used. [Epoxy Resin and Curing Catalyst Thereof] The epoxy resin used in the present invention can form a network structure by being cross-linked, and greatly contributes to the improvement in adhesion and heat resistance of the foam-type sealing composition.
【0026】本発明で用いられるエポキシ樹脂として
は、特に限定はなく、たとえば、エピクロロヒドリン−
ビスフェノールA型エポキシ樹脂;エピクロロヒドリン
−ビスフェノールF型エポキシ樹脂;エピクロロヒドリ
ン−ビスフェノールS型エポキシ樹脂;テトラブロモビ
スフェノールAのグリシジルエーテル等の難燃型エポキ
シ樹脂;ノボラック型エポキシ樹脂;水添型ビスフェノ
ールA型エポキシ樹脂;ビスフェノールA型プロピレン
オキシド付加物のグリシジルエーテル型エポキシ樹脂、
ビスフェノールA型エチレンオキシド付加物のグリシジ
ルエーテル型エポキシ樹脂;ジグリシジル−p−オキシ
安息香酸、フタル酸ジグリシジルエステル、テトラヒド
ロフタル酸ジグリシジルエステル、ヘキサヒドロフタル
酸ジグリシジルエステル、アジピン酸ジグリシジルエス
テル等のグリシシルエステル型エポキシ樹脂;トリグリ
シジル−m−アミノフェノール、N,N,N’,N’−
テトラグリシジルジアミノジフェニルメタン、N,N−
グリシジルアニリン、N,N−ジグリシジル−o−トル
イジン等のグリシシルアミン型エポキシ樹脂;1,3−
ジグリシジル−5−メチル−5−エチルヒダントイン等
のヒダントイン型エポキシ樹脂;トリグリシジルイソシ
アヌレート;ポリアルキレングリコールジグリシジルエ
ーテル;グリセリン、ソルビトール等の多価アルコール
のグリシジルエーテル;アリサイクリックジエポキシア
セタール、アリサイクリックジエポキシアジペート、ア
リサイクリックジエポキシカルボキシレート、ビニルシ
クロヘキセンオキシド等の環式脂肪族エポキシ樹脂;ポ
リブタジエン、石油樹脂等の不飽和重合体のエポキシ化
物等を挙げることができ、これらは1種または2種以上
使用される。これらのうち、エポキシ基を2個以上有す
るエポキシ樹脂は、架橋構造を形成しやすいため、好ま
しい。エポキシ樹脂がエピクロロヒドリン−ビスフェノ
ールA型エポキシ樹脂であると、ゴム質系有機重合体と
の相溶性が高いため、さらに好ましい。The epoxy resin used in the present invention is not particularly limited, and for example, epichlorohydrin-
Bisphenol A epoxy resin; epichlorohydrin-bisphenol F epoxy resin; epichlorohydrin-bisphenol S epoxy resin; flame-retardant epoxy resin such as glycidyl ether of tetrabromobisphenol A; novolak epoxy resin; hydrogenated Bisphenol A type epoxy resin; glycidyl ether type epoxy resin of bisphenol A type propylene oxide adduct,
Glycidyl ether type epoxy resin of bisphenol A type ethylene oxide adduct; glycidyl-p-oxybenzoic acid, diglycidyl phthalate, diglycidyl tetrahydrophthalate, diglycidyl hexahydrophthalate, diglycidyl adipate, etc. Sil ester type epoxy resin; triglycidyl-m-aminophenol, N, N, N ', N'-
Tetraglycidyldiaminodiphenylmethane, N, N-
Glycidylamine type epoxy resins such as glycidylaniline and N, N-diglycidyl-o-toluidine; 1,3-
Hydantoin type epoxy resins such as diglycidyl-5-methyl-5-ethylhydantoin; triglycidyl isocyanurate; polyalkylene glycol diglycidyl ether; glycidyl ether of polyhydric alcohols such as glycerin and sorbitol; alicyclic diepoxy acetal, alisai Cycloaliphatic epoxy resins such as click diepoxy adipate, alicyclic diepoxy carboxylate, and vinylcyclohexene oxide; epoxidized unsaturated polymers such as polybutadiene and petroleum resins; Two or more are used. Among them, an epoxy resin having two or more epoxy groups is preferable because it easily forms a crosslinked structure. It is more preferable that the epoxy resin is an epichlorohydrin-bisphenol A type epoxy resin because the compatibility with the rubbery organic polymer is high.
【0027】エポキシ樹脂を硬化させるための触媒とし
ては、たとえば、トリエチレンテトラミン、テトラエチ
レンペンタミン、ジエチルアミノプロピルアミン、N−
アミノエチルピペラジン、メンセンジアミン、イソホロ
ンジアミン、モルホリン、ピペリジン、m−キシリレン
ジアミン、m−フェニレンジアミン、ジアミノジフェニ
ルメタン、ジアミノジフェニルスルホン酸等の1級、2
級のアミン類;トリアルキルアミン、N−メチルモルホ
リン、N,N’−ジメチルピペラジン、ピリジン、ピコ
リン、グアニジン、ジフェニルグアニジン、1,8−ジ
アザビシクロ〔5.4.0〕ウンデセン−7(DB
U)、ベンジルジメチルアミン、2−(ジメチルアミノ
メチル)フェノール、2,4,6−トリス(ジメチルア
ミノメチル)フェノール等の3級アミン類およびその有
機酸塩;2−メチルイミダゾール、2−エチル−4−メ
チルイミダゾール、2−ウンデシルイミダゾール、1−
ベンジル−2−メチルイミダゾール等のイミダゾール
類;ポリアミド樹脂;ジシアンジアミド類;3フッ化ホ
ウ素−アミン錯体;無水フタル酸、ヘキサヒドロ無水フ
タル酸、テトラヒドロ無水フタル酸、エンドメチレンテ
トラヒドロ無水フタル酸、ドデシル無水コハク酸、無水
トリメリット酸、無水ピロメリット酸、無水クロレン酸
等の無水カルボン酸類;アルコール類;フェノール類;
カルボン酸類;3フッ化ホウ素、6フッ化リン、3塩化
アルミニウム、4塩化スズ等のルイス酸類およびその塩
等を挙げることができ、これらは1種または2種以上使
用される。これらのうち、3級アミン類およびその有機
酸塩、イミダゾール類は、硬化性が高いため、好まし
い。 〔シランカップリング剤〕シランカップリング剤は、加
水分解性ケイ素基と他の官能基とを1分子中に含有する
官能基含有シラン類であり、前記ゴム質系有機重合体を
含有する海(マトリクス)中に、エポキシ樹脂を含有す
る島(ドメイン)を均一に分散させ、安定化させる作用
を発揮する。As a catalyst for curing the epoxy resin, for example, triethylenetetramine, tetraethylenepentamine, diethylaminopropylamine, N-
Primary and secondary such as aminoethylpiperazine, mensendiamine, isophoronediamine, morpholine, piperidine, m-xylylenediamine, m-phenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfonic acid, etc.
Grade amines; trialkylamine, N-methylmorpholine, N, N'-dimethylpiperazine, pyridine, picoline, guanidine, diphenylguanidine, 1,8-diazabicyclo [5.4.0] undecene-7 (DB
U), tertiary amines such as benzyldimethylamine, 2- (dimethylaminomethyl) phenol, 2,4,6-tris (dimethylaminomethyl) phenol and organic acid salts thereof; 2-methylimidazole, 2-ethyl- 4-methylimidazole, 2-undecylimidazole, 1-
Imidazoles such as benzyl-2-methylimidazole; polyamide resins; dicyandiamides; boron trifluoride-amine complex; phthalic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, endomethylenetetrahydrophthalic anhydride, dodecylsuccinic anhydride Carboxylic anhydrides, such as, trimellitic anhydride, pyromellitic anhydride, chlorenic anhydride; alcohols; phenols;
Carboxylic acids: Lewis acids such as boron trifluoride, phosphorus hexafluoride, aluminum trichloride, and tin chloride, and salts thereof, and the like, and one or more of these can be used. Of these, tertiary amines, their organic acid salts, and imidazoles are preferable because of their high curability. [Silane Coupling Agent] The silane coupling agent is a functional group-containing silane containing a hydrolyzable silicon group and another functional group in one molecule. In the matrix), islands (domains) containing the epoxy resin are uniformly dispersed and exert an effect of stabilizing.
【0028】官能基含有シラン類に含まれる他の官能基
としては、たとえば、1級、2級、3級のアミノ 基、メ
ルカプト基、エポキシ基、ウレイド基、イソシアネート
基、ビニル基、メタクリル基、ハロゲノアルキル基等を
挙げることができる。これらのうち、他の官能基として
は、ゴム質系有機重合体およびエポキシ樹脂の両方に反
応可能な、1級、2級、3級のアミノ 基、メルカプト
基、エポキシ基、ウレイド基等が好ましく、1級、2
級、3級のアミノ 基がさらに好ましく、1級、2級アミ
ノ 基が最も好ましい。Other functional groups contained in the functional group-containing silanes include, for example, primary, secondary, and tertiary amino groups, mercapto groups, epoxy groups, ureido groups, isocyanate groups, vinyl groups, methacryl groups, Examples include a halogenoalkyl group. Among these, as the other functional groups, primary, secondary, and tertiary amino groups, mercapto groups, epoxy groups, ureido groups, and the like that can react with both the rubbery organic polymer and the epoxy resin are preferable. 1st grade, 2nd grade
Primary and tertiary amino groups are more preferred, and primary and secondary amino groups are most preferred.
【0029】官能基含有シラン類に含まれる加水分解性
ケイ素基としては、たとえば、Xが加水分解性基である
反応性ケイ素基(A)等を挙げることができ、これらの
うち、アルコキシシリル基が好ましい。官能基含有シラ
ン類としては、たとえば、N−β−(アミノエチル)−
γ−アミノプロピルトリメトキシシラン、γ−アミノプ
ロピルトリメトキシシラン、γ−アミノプロピルトリエ
トキシシラン、γ−アミノプロピルメチルジメトキシシ
ラン、γ−アミノプロピルメチルジエトキシシラン、γ
−(2−アミノエチル)アミノプロピルトリメトキシシ
ラン、γ−(2−アミノエチル)アミノプロピルトリエ
トキシシラン、γ−(2−アミノエチル)アミノプロピ
ルメチルジメトキシシラン、γ−(2−アミノエチル)
アミノプロピルメチルジエトキシシラン、γ−(2−ア
ミノペンチル)アミノプロピルトリメトキシシラン、γ
−(2−アミノペンチル)アミノプロピルトリエトキシ
シラン、γ−(2−アミノペンチル)アミノプロピルメ
チルジメトキシシラン、γ−(2−アミノペンチル)ア
ミノプロピルメチルジエトキシシラン、N−β−(N−
ビニルベンジルアミノエチル)−γ−アミノプロピルト
リメトキシシラン、γ−アニリノプロピルトリメトキシ
シラン等のアミノ基含有シラン類;γ−メルカプトプロ
ピルトリメトキシシラン、γ−メルカプトプロピルトリ
エトキシシラン、γ−メルカプトプロピルメチルジメト
キシシラン、γ−メルカプトプロピルメチルジエトキシ
シラン等のメルカプト基含有シラン類;γ−グリシドキ
シプロピルトリメトキシシラン、γ−グリシドキシプロ
ピルトリエトキシシラン、γ−グリシドキシプロピルメ
チルジメトキシシラン、γ−グリシドキシプロピルメチ
ルジエトキシシラン、β−(3,4−エポキシシクロヘ
キシル)エチルトリメトキシシラン、β−(3,4−エ
ポキシシクロヘキシル)エチルトリエトキシシラン、β
−(3,4−エポキシシクロヘキシル)エチルメチルジ
メトキシシラン、β−(3,4−エポキシシクロヘキシ
ル)エチルメチルジエトキシシラン等のエポキシ基含有
シラン類;γ−ウレイドプロピルトリメトキシシラン、
γ−ウレイドプロピルトリエトキシシラン、γ−ウレイ
ドプロピルメチルジメトキシシラン、γ−ウレイドプロ
ピルメチルジエトキシシラン等のウレイド基含有シラン
類等を挙げることができ、これらは1種または2種以上
使用される。 〔粘着付与樹脂〕本発明で用いられる粘着付与樹脂は、
密着性や防水性を高める作用を発揮する。Examples of the hydrolyzable silicon group contained in the functional group-containing silanes include a reactive silicon group (A) in which X is a hydrolyzable group, and among these, an alkoxysilyl group Is preferred. Examples of the functional group-containing silanes include N-β- (aminoethyl)-
γ-aminopropyltrimethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropylmethyldimethoxysilane, γ-aminopropylmethyldiethoxysilane, γ
-(2-aminoethyl) aminopropyltrimethoxysilane, γ- (2-aminoethyl) aminopropyltriethoxysilane, γ- (2-aminoethyl) aminopropylmethyldimethoxysilane, γ- (2-aminoethyl)
Aminopropylmethyldiethoxysilane, γ- (2-aminopentyl) aminopropyltrimethoxysilane, γ
-(2-aminopentyl) aminopropyltriethoxysilane, γ- (2-aminopentyl) aminopropylmethyldimethoxysilane, γ- (2-aminopentyl) aminopropylmethyldiethoxysilane, N-β- (N-
Amino group-containing silanes such as vinylbenzylaminoethyl) -γ-aminopropyltrimethoxysilane and γ-anilinopropyltrimethoxysilane; γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, γ-mercaptopropyl Mercapto group-containing silanes such as methyldimethoxysilane and γ-mercaptopropylmethyldiethoxysilane; γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltriethoxysilane, β
Epoxy group-containing silanes such as-(3,4-epoxycyclohexyl) ethylmethyldimethoxysilane, β- (3,4-epoxycyclohexyl) ethylmethyldiethoxysilane; γ-ureidopropyltrimethoxysilane;
Ureido group-containing silanes such as [gamma] -ureidopropyltriethoxysilane, [gamma] -ureidopropylmethyldimethoxysilane, [gamma] -ureidopropylmethyldiethoxysilane and the like can be mentioned, and one or more of these can be used. (Tackifying resin) Tackifying resin used in the present invention,
Demonstrates the effect of improving adhesion and waterproofness.
【0030】粘着付与樹脂としては、たとえば、ロジ
ン、ロジンエステル、芳香族石油樹脂、テルペンフェノ
ール樹脂、クマロン−インデン樹脂等を挙げることがで
き、これらは1種または2種以上使用される。粘着付与
樹脂の軟化点については、軟化点が低いと湿気硬化が進
むまでの常温での接着力が低下し、高くなると、溶融温
度を高くする必要が生じ、熱安定性が問題となるため、
軟化点は、好ましくは70〜130℃、さらに好ましく
は70〜100℃である。 〔発泡型シーリング用組成物およびその使用方法〕本発
明にかかる発泡型シーリング用組成物は、上で説明した
必須成分や好ましい付加成分を含む組成物であり、その
ままで最終製品たるシーリング材となるほか、シーリン
グ材の原料たる中間製品であることもある。Examples of the tackifying resin include rosin, rosin ester, aromatic petroleum resin, terpene phenol resin, and coumarone-indene resin, and one or more of these are used. For the softening point of the tackifier resin, the lower the softening point, the lower the adhesive strength at normal temperature until moisture curing proceeds, and the higher the softening point, the higher the melting temperature needs to be raised, because thermal stability becomes a problem.
The softening point is preferably from 70 to 130C, more preferably from 70 to 100C. [Foam-type sealing composition and method of using the same] The foam-type sealing composition according to the present invention is a composition containing the essential components and the preferable additional components described above, and becomes a sealing material as a final product as it is. In addition, it may be an intermediate product that is a raw material for sealing materials.
【0031】発泡型シーリング用組成物中のシラノール
縮合触媒の割合については、特に限定はないが、好まし
くは、ゴム質系有機重合体100重量部に対し1〜10
重量部であり、さらに好ましくは1〜4重量部である。
シラノール縮合触媒の割合が1重量部未満であると、硬
化が不十分で耐熱性が低下するおそれがある。他方、シ
ラノール縮合触媒の割合が10重量部を超えると、硬化
しやすすぎて、取扱いにくくなるおそれがある。The proportion of the silanol condensation catalyst in the foam-type sealing composition is not particularly limited, but is preferably 1 to 10 parts by weight based on 100 parts by weight of the rubbery organic polymer.
Parts by weight, more preferably 1 to 4 parts by weight.
If the ratio of the silanol condensation catalyst is less than 1 part by weight, curing may be insufficient and heat resistance may decrease. On the other hand, if the ratio of the silanol condensation catalyst exceeds 10 parts by weight, the composition may be too hard to cure and may be difficult to handle.
【0032】発泡型シーリング用組成物中の有機系熱分
解型発泡剤の割合については、特に限定はないが、好ま
しくは、ゴム質系有機重合体100重量部に対し5〜3
0重量部であり、さらに好ましくは10〜25重量部で
ある。有機系熱分解型発泡剤の割合が5重量部未満であ
ると、十分に発泡させることができず、安定した発泡倍
率が得られないおそれがある。他方、有機系熱分解型発
泡剤の割合が30重量部を超えると、発泡倍率が高くな
りすぎ、収縮および膨張しやすくなり、密着性や防水性
が低下するおそれがある。The ratio of the organic thermal decomposition type foaming agent in the foam type sealing composition is not particularly limited, but is preferably 5 to 3 parts by weight per 100 parts by weight of the rubbery organic polymer.
0 parts by weight, more preferably 10 to 25 parts by weight. If the proportion of the organic thermal decomposition type foaming agent is less than 5 parts by weight, the foam cannot be sufficiently foamed, and a stable foaming ratio may not be obtained. On the other hand, when the proportion of the organic thermal decomposition type foaming agent exceeds 30 parts by weight, the expansion ratio becomes too high, and the resin tends to contract and expand, and the adhesion and the waterproofness may be reduced.
【0033】本発明の発泡型シーリング用組成物は、エ
ポキシ樹脂とその硬化触媒をさらに含むことがある。発
泡型シーリング用組成物中のエポキシ樹脂の割合につい
ては、特に限定はないが、好ましくは、ゴム質系有機重
合体100重量部に対し20〜80重量部であり、さら
に好ましくは40〜60重量部である。エポキシ樹脂の
割合が20重量部未満であると、密着性や防水性が低下
するおそれがある。他方、エポキシ樹脂の割合が80重
量部を超えると、シーリング剤としての柔軟性が低下す
るおそれがある。エポキシ樹脂硬化剤の割合について
は、特に限定はないが、好ましくは、エポキシ樹脂の2
〜8重量%であり、さらに好ましくは4〜6重量%であ
る。エポキシ樹脂硬化剤の割合が2重量%未満である
と、エポキシ樹脂の硬化反応が遅くなるおそれがある。
他方、エポキシ樹脂硬化剤の割合が8重量部を超える
と、未反応のエポキシ樹脂硬化剤が硬化後に残存するよ
うになり、可塑化しやすく、耐熱性が低下するおそれが
ある。The foam-type sealing composition of the present invention may further contain an epoxy resin and a curing catalyst thereof. The proportion of the epoxy resin in the foam-type sealing composition is not particularly limited, but is preferably 20 to 80 parts by weight, more preferably 40 to 60 parts by weight, per 100 parts by weight of the rubbery organic polymer. Department. If the proportion of the epoxy resin is less than 20 parts by weight, there is a possibility that the adhesion and the waterproofness are reduced. On the other hand, if the proportion of the epoxy resin exceeds 80 parts by weight, the flexibility as a sealing agent may be reduced. The ratio of the epoxy resin curing agent is not particularly limited, but is preferably 2% of the epoxy resin.
-8% by weight, more preferably 4-6% by weight. If the proportion of the epoxy resin curing agent is less than 2% by weight, the curing reaction of the epoxy resin may be slow.
On the other hand, when the proportion of the epoxy resin curing agent exceeds 8 parts by weight, the unreacted epoxy resin curing agent remains after curing, and is likely to be plasticized, which may lower heat resistance.
【0034】本発明の発泡型シーリング用組成物は、シ
ランカップリング剤をさらに含むことがある。発泡型シ
ーリング用組成物中のシランカップリング剤の割合につ
いては、特に限定はないが、好ましくは、ゴム質系有機
重合体100重量部に対し1〜10重量部であり、さら
に好ましくは1〜7重量部、最も好ましくは1〜5重量
部である。シランカップリングの割合が1重量部未満で
あると、ゴム質系有機重合体とエポキシ樹脂とが均一に
分散せず、密着性および耐熱性が低下するおそれがあ
る。他方、シランカップリングの割合が10重量部を超
えると、硬化反応が速くなり、取扱いにくくなるおそれ
がある。The foam-type sealing composition of the present invention may further contain a silane coupling agent. The proportion of the silane coupling agent in the foam-type sealing composition is not particularly limited, but is preferably 1 to 10 parts by weight, more preferably 1 to 10 parts by weight, based on 100 parts by weight of the rubbery organic polymer. 7 parts by weight, most preferably 1 to 5 parts by weight. If the ratio of the silane coupling is less than 1 part by weight, the rubbery organic polymer and the epoxy resin are not uniformly dispersed, and the adhesion and heat resistance may be reduced. On the other hand, when the proportion of the silane coupling exceeds 10 parts by weight, the curing reaction may be accelerated and the handling may be difficult.
【0035】本発明の発泡型シーリング用組成物は、粘
着付与樹脂をさらに含むことがある。発泡型シーリング
用組成物中の粘着付与樹脂の割合については、特に限定
はないが、好ましくは、ゴム質系有機重合体100重量
部に対し5〜20重量部であり、さらに好ましくは5〜
15重量部である。粘着付与樹脂の割合が5重量部未満
であると、密着性や防水性が低下し、凝集力が低くなる
おそれがある。他方、粘着付与樹脂の割合が20重量部
を超えると、粘度が高くなり、取扱にくくなるおそれが
ある。The foam-type sealing composition of the present invention may further contain a tackifier resin. The proportion of the tackifying resin in the foam-type sealing composition is not particularly limited, but is preferably 5 to 20 parts by weight, more preferably 5 to 20 parts by weight, based on 100 parts by weight of the rubbery organic polymer.
15 parts by weight. If the proportion of the tackifier resin is less than 5 parts by weight, the adhesion and waterproofness may be reduced, and the cohesive strength may be reduced. On the other hand, if the proportion of the tackifier resin exceeds 20 parts by weight, the viscosity may increase, and handling may be difficult.
【0036】本発明の発泡型シーリング用組成物は、誘
導加熱によって発熱する導電体をさらに含むものでも良
く、この場合、短時間でしかも均一に発泡させることが
でき、発泡倍率が安定し、密着性や防水性もさらに高ま
る。誘導加熱は、たとえば、高周波等によって行われ
る。上記導電体としては、たとえば、銀、鉄等の金属;
炭素等を挙げることができ、これらは1種または2種以
上使用される。The foam-type sealing composition of the present invention may further contain a conductor which generates heat by induction heating. In this case, the foam can be foamed uniformly in a short time, the expansion ratio is stable, and the adhesion can be improved. The properties and waterproofness are further improved. Induction heating is performed by, for example, high frequency. Examples of the conductor include metals such as silver and iron;
Carbon and the like can be mentioned, and these are used alone or in combination of two or more.
【0037】導電体の形態については、特に限定はな
く、粉末状、粒状等のいずれの形態であってもよいが、
より均一に発熱する粉末状が好ましい。発泡型シーリン
グ用組成物中の導電体の割合については、特に限定はな
いが、好ましくは、ゴム質系有機重合体100重量部に
対し1〜10重量部であり、さらに好ましくは2〜8重
量部、最も好ましくは4〜6重量部である。導電体の割
合が1重量部未満であると、発泡倍率が安定せず、密着
性や防水性が低下するおそれがある。他方、導電体の割
合が10重量部を超えると、硬化反応が速く、作業粘度
が高くなり、取扱いにくくなるおそれがある。The form of the conductor is not particularly limited, and may be any form such as a powder form and a granular form.
Powders that generate heat more uniformly are preferred. The proportion of the conductor in the foam-type sealing composition is not particularly limited, but is preferably 1 to 10 parts by weight, more preferably 2 to 8 parts by weight, per 100 parts by weight of the rubbery organic polymer. Parts, most preferably 4 to 6 parts by weight. When the proportion of the conductor is less than 1 part by weight, the expansion ratio is not stable, and there is a possibility that the adhesion and the waterproofness are reduced. On the other hand, if the proportion of the conductor exceeds 10 parts by weight, the curing reaction will be fast, the working viscosity will be high, and the handling may be difficult.
【0038】本発明の発泡型シーリング用組成物は、下
記のような成分を含むことができる。ゴム質系有機重合
体、シラノール縮合触媒、充填剤等を安定化させるため
に用いられるカルボン酸等の保存安定性改良剤;脱水
剤;相溶化剤;接着性改良剤;物性調整剤;充填剤;老
化防止剤;紫外線吸収剤;金属不活性化剤;オゾン劣化
防止剤;光安定剤;アミン系ラジカル連鎖禁止剤;リン
系過酸化物分解剤;顔料;滑剤等である。これらは、1
種または2種以上使用される。The foam-type sealing composition of the present invention may contain the following components. Storage stability improvers such as carboxylic acids used to stabilize rubbery organic polymers, silanol condensation catalysts, fillers, etc .; dehydrating agents; compatibilizers; adhesion improvers; Antioxidants; ultraviolet absorbers; metal deactivators; antiozonants; light stabilizers; amine radical chain inhibitors; phosphorus peroxide decomposers; pigments; These are 1
Seeds or two or more are used.
【0039】本発明の発泡型シーリング用組成物は、上
記各成分を配合し、ミキサー、ロール、ニーダー等を用
いて混練等して調製することができる。発泡型シーリン
グ用組成物の反応性および保存安定性を考慮すると、使
用直前に調製するのが好ましい。発泡型シーリング用組
成物は、後述のA液−B液の2液の組み合わせからなる
組成物としてもよい。この場合、使用直前に、予め調製
しておいたA液とB液を混合して、発泡型シーリング用
組成物とする。A液、B液の構成としては、たとえば、
(1)シラノール縮合触媒を必須とするA液とゴム質系
有機重合体および有機系熱分解型発泡剤を必須とするB
液の組み合わせが好ましく、(2)エポキシ樹脂および
シラノール縮合触媒を含むA液とゴム質系有機重合体、
シランカップリング剤、エポキシ樹脂硬化剤および有機
系熱分解型発泡剤含むB液の組み合わせがさらに好まし
い。上記組み合わせでは、反応しやすい2つの成分、す
なわち、エポキシ樹脂とエポキシ樹脂硬化剤、ゴム質系
有機重合体とシラノール縮合触媒を別々に分けることが
出来るので、組成物の保存安定性が高くなる。The foam-type sealing composition of the present invention can be prepared by mixing the above-mentioned components and kneading them using a mixer, roll, kneader or the like. In consideration of the reactivity and storage stability of the foam-type sealing composition, it is preferably prepared immediately before use. The foam-type sealing composition may be a composition composed of a combination of two liquids, liquid A and liquid B described below. In this case, a liquid A and a liquid B prepared in advance are mixed immediately before use to obtain a foamable sealing composition. As a configuration of the liquid A and the liquid B, for example,
(1) Liquid A which essentially requires a silanol condensation catalyst, and B which essentially contains a rubbery organic polymer and an organic thermal decomposition type blowing agent
A combination of liquids is preferable, (2) liquid A containing an epoxy resin and a silanol condensation catalyst and a rubbery organic polymer,
A combination of a liquid B containing a silane coupling agent, an epoxy resin curing agent and an organic thermal decomposition type foaming agent is more preferable. In the above combination, two components that are easily reacted, that is, the epoxy resin and the epoxy resin curing agent, the rubbery organic polymer, and the silanol condensation catalyst can be separately separated, so that the storage stability of the composition is increased.
【0040】本発明にかかる発泡型シーリング用組成物
は、加熱することによって発泡、硬化させることがで
き、密着性、防水性および耐熱性に優れ、安定した十分
な発泡倍率が得られるため、たとえば、プレシーリング
材、ガスケット材等に好ましく用いられる。発泡型シー
リング用組成物をプレシーリング材として用いて得られ
た建築用外壁材の一例を、図1に示す。建築用外壁材1
は、板状の外壁材本体2のラップジョイント部3aに、
プレシーリング材をビード状に塗布した後、発泡、硬化
させることにより得られた、プレシーリング部3bを備
えている。プレシーリング材を外壁材本体2のラップジ
ョイント部3aにビード状に塗布する方法については、
特に限定はないが、たとえば、外壁材本体2を80〜1
00℃に加温しながら、アプリケータを用いてビード幅
2〜10mmとなるようにプレシーリング材を塗布する
方法等を挙げることができる。外壁材本体2は、板状で
あれば特に限定はなく、任意の素材、厚み、大きさのも
のが使用される。The foam-type sealing composition according to the present invention can be foamed and cured by heating, and has excellent adhesion, waterproofness and heat resistance, and a stable and sufficient expansion ratio can be obtained. , Pre-sealing material, gasket material and the like. FIG. 1 shows an example of an architectural outer wall material obtained by using a foam-type sealing composition as a pre-sealing material. Exterior wall material for construction 1
Is attached to the lap joint portion 3a of the plate-shaped outer wall material body 2,
A pre-sealing portion 3b is obtained by applying a pre-sealing material in a bead shape, and then foaming and curing the pre-sealing material. Regarding the method of applying the pre-sealing material to the lap joint portion 3a of the outer wall material main body 2 in a bead shape,
Although not particularly limited, for example, the outer wall material body 2 is
A method of applying a pre-sealing material to a bead width of 2 to 10 mm using an applicator while heating to 00 ° C. can be used. The outer wall material main body 2 is not particularly limited as long as it has a plate shape, and any material, thickness, and size are used.
【0041】ラップジョイント部に塗布されたプレシー
リング材を発泡、硬化させるための加熱方法としては、
たとえば、以下の〜の方法を挙げることができ、こ
れらの方法を組み合わせて行ってもよい。 ドライヤー等を用いて、外壁材本体等にプレシーリ
ング材が塗布されたプレシーリング材塗布物に対し、1
40〜160℃の熱風を吹きつける方法。As a heating method for foaming and curing the pre-sealing material applied to the lap joint,
For example, the following methods can be mentioned, and these methods may be combined. Using a drier or the like, apply 1% to the pre-sealing material applied to the outer wall material
A method of blowing hot air at 40 to 160 ° C.
【0042】 プレシーリング材塗布物を、100〜
120℃の温度雰囲気下に放置する方法。 プレシーリング材塗布物に対し、高周波加熱を施す
方法。 上記〜のうちでも、の方法は、プレシーリング材
を短時間で均一に発泡させることができる。の方法
は、プレシーリング材に含まれるゴム質系有機重合体が
絶縁体であるため、高周波によって誘電加熱されるよう
になり、短時間で内部まで十分に加熱させることができ
る。また、の方法において、プレシーリング材が誘導
加熱によって発熱する導電体を含む場合は、高周波によ
って誘導加熱されるようになり、外壁材本体等のプレシ
ーリング材以外の部分は、通常、加熱されないため、変
形したり破損したりすることはない。The pre-sealing material applied material is
A method in which it is left in an atmosphere at a temperature of 120 ° C. A method in which high-frequency heating is applied to the pre-sealing material application. Among the above methods, the method can uniformly foam the pre-sealing material in a short time. According to the method, since the rubber organic polymer contained in the pre-sealing material is an insulator, dielectric heating is performed by high frequency, and the inside can be sufficiently heated in a short time. In addition, in the method, when the pre-sealing material includes a conductor that generates heat by induction heating, the high-frequency heating is performed by induction heating, and parts other than the pre-sealing material such as the outer wall material main body are generally not heated. It will not be deformed or damaged.
【0043】上記で発泡、硬化させたプレシーリング材
は、たとえば、室温下で約3〜7日間放置した後、50
℃で約3日間放置することによって、その硬化を完全な
ものにすることができる。このようにして得られた建築
用外壁材はプレハブ住宅の外壁等に用いられる。建築用
外壁材の製造は、施工現場ではなく、工場内で行われる
のが好ましく、これによって、施工現場での目地仕上げ
の作業を短縮することができ、住宅建設の日数を短縮す
ることができるからである。The foamed and cured pre-sealing material is, for example, allowed to stand at room temperature for about 3 to 7 days.
The cure can be completed by leaving it at about 3 days. The architectural outer wall material thus obtained is used for an outer wall of a prefabricated house. It is preferable that the manufacture of the building outer wall material is performed not in the construction site but in the factory, thereby shortening the joint finishing work at the construction site and shortening the number of days of house construction. Because.
【0044】本発明にかかる発泡型シーリング用組成物
は、自動車のウインドガラス用モールなどのガスケット
用途やその他の用途に使用することもできる。その他の
用途としては、冷蔵庫の内箱や外箱のシール、缶フタの
パッキング等である。これらの場合も、上記と同様の加
熱方法で発泡、硬化させることが出来る。図2は自動車
のウインドガラス用モールに使用した例を示す。自動車
のウインドガラス5とボディー6とは接着剤層7を介し
て固定されており、接着剤層7はダムラバー8とモール
4とに挟まれている。モール4は、本発明にかかる発泡
型シーリング用組成物を使用して得られているため、ウ
インドガラス5とボディー6に対する密着性が高く、ウ
インドガラス5やボディー6との間に隙間を作らせず、
高い防水性と気密性を得させる。The foam-type sealing composition according to the present invention can also be used for gasket applications such as moldings for automobile window glasses and other applications. Other uses include sealing inner and outer boxes of refrigerators, packing can lids, and the like. Also in these cases, foaming and curing can be performed by the same heating method as described above. FIG. 2 shows an example in which the present invention is used for a window glass molding of an automobile. The window glass 5 and the body 6 of the automobile are fixed via an adhesive layer 7, and the adhesive layer 7 is sandwiched between the dam rubber 8 and the molding 4. Since the molding 4 is obtained by using the foam-type sealing composition according to the present invention, the molding 4 has high adhesion to the window glass 5 and the body 6, and a gap is formed between the window glass 5 and the body 6. Without
Get high waterproofness and airtightness.
【0045】図3は冷蔵庫のシールに使用した例を示
す。冷蔵庫の内箱10と外箱11はシール9によって固
定されている。シール9は、本発明にかかる発泡型シー
リング用組成物を使用して得られているため、耐熱性に
優れ、しかも、内箱10、外箱11に対する密着性が高
く、内箱10内に高い気密性を得させる。図4はパッキ
ン付缶フタに使用した例を示す。パッキン付缶フタ12
は、板状の缶フタ本体13の外周部に、本発明にかかる
発泡型シーリング用組成物をビード状に塗布した後、発
泡、硬化させて、パッキン14としている。パッキン1
4は、密着性が高く、缶内部の気密性を大いに保持す
る。FIG. 3 shows an example used for a refrigerator seal. The inner box 10 and the outer box 11 of the refrigerator are fixed by a seal 9. Since the seal 9 is obtained by using the foam-type sealing composition according to the present invention, the seal 9 has excellent heat resistance, and has high adhesion to the inner box 10 and the outer box 11, and is high in the inner box 10. Get airtight. FIG. 4 shows an example of use for a can lid with packing. Can lid with packing 12
The foaming type sealing composition according to the present invention is applied to the outer periphery of a plate-shaped can lid body 13 in a bead shape, and then foamed and cured to form a packing 14. Packing 1
No. 4 has high adhesiveness and greatly maintains the airtightness inside the can.
【0046】[0046]
【実施例】以下に本発明の実施例と比較例を示すが、本
発明は下記実施例に限定されない。以下で、「部」は
「重量部」を示す。 (実施例1−1)シラノール縮合触媒としてのジn−ブ
チルスズ系触媒(商品名:No.918、三共有機合成
社製)4部をA液とした。次に、ゴム質系有機重合体と
しての変性シリコーンオリゴマー(商品名:SAT−2
00、鐘淵化学工業社製)100部、シランカップリン
グ剤としてのN−β−(アミノエチル)−γ−アミノプ
ロピルトリメトキシシラン(商品名:A−1122、日
本ユニカー社製)1部、接着性改良剤としてのハイドロ
キシアパタイト(商品名:HAP BC、325メッシ
ュパス、新田ゼラチン社製)50部、有機系熱分解型発
泡剤としてのヒドラジン誘導体(商品名:ネオセルボン
N#5000、永和化成工業社製)10部、粘着付与樹
脂としてのテルペンフェノール系樹脂(商品名:NIR
EZ V−2040、アリゾナケミカル社製)10部お
よび整泡剤としてのシリコーン系オイル(商品名:TE
GOSTABB8404、ゴールドシュミット社製)1
部を配合して、B液とした。以下の試験方法にしたがっ
て、粘度、発泡倍率、密着強度(室温および100℃)
および防水性を測定した。 〔粘度〕上記A液、B液の粘度をブルックフィールド製
HB型粘度計を用い、温度25℃、回転数50rpmで
測定し、その結果を表1に示す。 〔発泡倍率〕上記で得られたA液とB液を、室温下で混
合して、発泡型シーリング用組成物(1−1)を調製
し、その一定重量(g)を120℃で5分間の条件で発
泡させ、発泡前後の体積増加量(ml)を求め、下式に
より、発泡型シーリング用組成物(1−1)の発泡倍率
を算出し、結果を表1に示した。EXAMPLES Examples of the present invention and comparative examples are shown below, but the present invention is not limited to the following examples. Hereinafter, “parts” indicates “parts by weight”. Example 1-1 Four parts of a di-n-butyltin-based catalyst (trade name: No. 918, manufactured by Sankyoki Gosei Co., Ltd.) as a silanol condensation catalyst was used as Liquid A. Next, a modified silicone oligomer (trade name: SAT-2) as a rubbery organic polymer
00, manufactured by Kanegabuchi Chemical Industry Co., Ltd.), 100 parts of N-β- (aminoethyl) -γ-aminopropyltrimethoxysilane (trade name: A-1122, manufactured by Nippon Unicar) as a silane coupling agent, 50 parts of hydroxyapatite (trade name: HAP BC, 325 mesh pass, manufactured by Nitta Gelatin Co., Ltd.) as an adhesion improver, hydrazine derivative (trade name: Neoserbon N # 5000, Eiwa Chemical Co., Ltd.) as an organic thermal decomposition type foaming agent 10 parts, terpene phenolic resin as a tackifier resin (trade name: NIR)
10 parts of EZ V-2040, manufactured by Arizona Chemical Co., Ltd. and silicone oil as a foam stabilizer (trade name: TE)
GOSTABB8404, manufactured by Goldschmidt) 1
Parts were blended to prepare solution B. According to the following test methods, viscosity, expansion ratio, adhesion strength (room temperature and 100 ° C)
And the waterproofness was measured. [Viscosity] The viscosities of the above liquids A and B were measured using a Brookfield HB viscometer at a temperature of 25 ° C. and a rotation speed of 50 rpm, and the results are shown in Table 1. [Expansion ratio] The liquid A and the liquid B obtained above are mixed at room temperature to prepare a foaming-type sealing composition (1-1), and its constant weight (g) is measured at 120 ° C for 5 minutes. The foaming ratio of the foaming type sealing composition (1-1) was calculated by the following formula, and the results are shown in Table 1.
【0047】発泡倍率=発泡前後の体積増加量/発泡型
シーリング用組成物の重量 〔密着強度〕発泡型シーリング用組成物(1−1)を、
用意した試験板(アルミニウム板(Al板)、軟鋼板
(SPCC板)、繊維強化プチスチック板(FRP
板)、ポリカーボネート板(PC板)、アクリル塗装
板、石膏ボード)に、それぞれ、幅約3mmのビードと
なるように塗布した。この組成物を塗布した各試験板を
120℃の恒温槽中に5分間放置して発泡、硬化させた
後、室温下で24時間放置した。そして、各試験板上の
ビードの密着強度を、室温雰囲気下と100℃雰囲気下
で測定した。この測定は、オートグラフAG−2000
E(島津製作所製)を用い、クロスヘッドスピード50
0mm/minで行った。結果を表2に示した。 〔防水性〕発泡型シーリング用組成物(1−1)を、離
形紙1mmビードで塗布し、発泡させた検体を、石膏ボ
ード上にU字に置き、その上にアクリル板を重ねた。ア
クリル板に圧力をかけ、重ね圧縮50%になるように調
整し、60時間、80℃に保った試験片を取り出した
後、水密性を測定した。水密性は、U字部分に水を一定
量入れて、23℃で24時間放置して、水漏れの程度を
観察した。結果を表2に示す。 (実施例1−2〜1−3)A液とB液の組成を表1に示
す組成に変更する以外は、実施例1−1と同様にして、
発泡型シーリング用組成物(1−2)〜(1−3)を調
製し、実施例1−1と同様の測定、算出を行い、結果を
表1および表2に示した。 (実施例1−4)A液とB液の組成を表1に示す組成に
変更する以外は、実施例1−1と同様にして、発泡型シ
ーリング用組成物(1−4)を調製した。なお、導電体
として用いたカーボンブラックは東海カーボン社製のト
ーカブラック#4500であった。実施例1−1と同様
の測定、算出を行い、結果を表1および表2に示した。
ただし、発泡型シーリング用組成物(1−4)の発泡、
硬化は、高周波加熱装置(山本ビニター社製)を用いて
行った。 (実施例1−5)実施例1−1で調製した発泡型シーリ
ング用組成物(1−1)を、実施例1−4と同じ条件
で、発泡、硬化させ、実施例1−1と同様の測定、算出
を行い、結果を表2に示した。 (比較例1−1)B液に有機系熱分解型発泡剤を配合し
ない以外は、実施例1−1と同様にして、比較組成物
(1−1)を調製し、実施例1−1と同様の測定、算出
を行い、結果を表1および表2に示した。Expansion ratio = volume increase before and after foaming / weight of foam-type sealing composition [Adhesion strength] The foam-type sealing composition (1-1)
Prepared test plates (aluminum plate (Al plate), mild steel plate (SPCC plate), fiber reinforced plastic plate (FRP)
Board), a polycarbonate board (PC board), an acrylic painted board, and a gypsum board) to apply a bead having a width of about 3 mm. Each test plate coated with the composition was left in a thermostat at 120 ° C. for 5 minutes to foam and cure, and then left at room temperature for 24 hours. Then, the adhesion strength of the beads on each test plate was measured in an atmosphere at room temperature and in an atmosphere at 100 ° C. This measurement was performed using an Autograph AG-2000.
E (manufactured by Shimadzu Corporation) with a crosshead speed of 50
The measurement was performed at 0 mm / min. The results are shown in Table 2. [Waterproofness] The foam-type sealing composition (1-1) was applied with a release paper 1 mm bead, and the foamed specimen was placed in a U-shape on a gypsum board, and an acrylic plate was overlaid thereon. A pressure was applied to the acrylic plate to adjust the lap compression to 50%, and a test piece kept at 80 ° C. for 60 hours was taken out, and then water tightness was measured. For water tightness, a certain amount of water was put in the U-shaped portion, left at 23 ° C. for 24 hours, and the degree of water leakage was observed. Table 2 shows the results. (Examples 1-2 to 1-3) In the same manner as in Example 1-1, except that the compositions of the solution A and the solution B were changed to the compositions shown in Table 1,
Foaming sealing compositions (1-2) to (1-3) were prepared, and the same measurements and calculations as in Example 1-1 were performed. The results are shown in Tables 1 and 2. (Example 1-4) A foamable sealing composition (1-4) was prepared in the same manner as in Example 1-1, except that the compositions of the solution A and the solution B were changed to the compositions shown in Table 1. . The carbon black used as the conductor was Toka Black # 4500 manufactured by Tokai Carbon Co., Ltd. The same measurements and calculations were performed as in Example 1-1, and the results are shown in Tables 1 and 2.
However, foaming of the foaming type sealing composition (1-4),
Curing was performed using a high-frequency heating device (manufactured by Yamamoto Vinita). (Example 1-5) The foaming-type sealing composition (1-1) prepared in Example 1-1 was foamed and cured under the same conditions as in Example 1-4, and the same as in Example 1-1. Was measured and calculated, and the results are shown in Table 2. (Comparative Example 1-1) A comparative composition (1-1) was prepared in the same manner as in Example 1-1 except that the organic thermal decomposition type foaming agent was not blended with the solution B. The same measurements and calculations were made as in the above, and the results are shown in Tables 1 and 2.
【0048】この比較組成物(1−1)は、発泡剤を含
まないため、発泡せず、シーリング用途には使用できな
い。This comparative composition (1-1) does not contain a foaming agent and therefore does not foam, and cannot be used for sealing purposes.
【0049】[0049]
【表1】 [Table 1]
【0050】[0050]
【表2】 [Table 2]
【0051】表1、2から分かるように、本発明にかか
る発泡型シーリング用組成物は常温での粘度が適度であ
り、常温下、加熱下での密着強度も充分であり、防水性
も高かった。 (実施例2−1)エポキシ樹脂としてのビスフェノール
Aジグリシジルエーテル(商品名:エピコート828、
油化シェルエポキシ社製、エポキシ当量:184〜19
4、分子量:380、粘度:12,000〜15,00
0cps/25℃)50部、接着性改良剤としてのハイ
ドロキシアパタイト(商品名:HAP BC、325メ
ッシュパス、新田ゼラチン社製)7.5部、シラノール
縮合触媒としてのジn−ブチルスズ系触媒(商品名:N
o.918、三共有機合成社製)2部および充填剤とし
ての疎水性アエロジル(商品名:アエロジルRY−20
0、日本アエロジル社製)2部を配合し、ジn−ブチル
スズ系触媒を安定化させるためのカルボン酸化合物とし
ての2−エチルヘキサン酸(和光純薬工業社製、試薬1
級)1部をさらに添加して、A液とした。次に、ゴム質
系有機重合体としての変性シリコーンオリゴマー(商品
名:SAT−200、鐘淵化学工業社製)100部、シ
ランカップリング剤としてのN−β−(アミノエチル)
−γ−アミノプロピルトリメトキシシラン(商品名:A
−1122、日本ユニカー社製)1部、エポキシ樹脂硬
化剤としての2,4,6−トリス(ジメチルアミノメチ
ル)フェノール(商品名:スミキュアD、化薬アクゾ社
製)5部、充填剤としての疎水性アエロジル(商品名:
アエロジルRY−200、日本アエロジル社製)2部お
よび有機系熱分解型発泡剤(商品名:ネオセルボンN#
5000、永和化成工業社製)30部を配合して、B液
とした。As can be seen from Tables 1 and 2, the foam-type sealing composition according to the present invention has an appropriate viscosity at room temperature, a sufficient adhesive strength at room temperature and under heating, and a high waterproofness. Was. (Example 2-1) Bisphenol A diglycidyl ether as an epoxy resin (trade name: Epikote 828,
Yuka Shell Epoxy, epoxy equivalent: 184-19
4, molecular weight: 380, viscosity: 12,000-15,000
0 cps / 25 ° C.) 50 parts, hydroxyapatite (trade name: HAP BC, 325 mesh pass, manufactured by Nitta Gelatin Co., Ltd.) as an adhesion improver 7.5 parts, di-n-butyltin-based catalyst as a silanol condensation catalyst ( Product name: N
o. 918, manufactured by Sankyoki Gosei Co., Ltd., 2 parts, and hydrophobic Aerosil as a filler (trade name: Aerosil RY-20)
0, manufactured by Nippon Aerosil Co., Ltd., and 2-ethylhexanoic acid (reagent 1 manufactured by Wako Pure Chemical Industries, Ltd.) as a carboxylic acid compound for stabilizing a di-n-butyltin-based catalyst
Grade) 1 part was further added to obtain solution A. Next, 100 parts of a modified silicone oligomer (trade name: SAT-200, manufactured by Kaneka Corporation) as a rubbery organic polymer, and N-β- (aminoethyl) as a silane coupling agent
-Γ-aminopropyltrimethoxysilane (trade name: A
1122, manufactured by Nippon Unicar Co., Ltd.), 1 part, 2,4,6-tris (dimethylaminomethyl) phenol (trade name: Sumicure D, manufactured by Kayaku Akzo) as an epoxy resin curing agent, 5 parts, as a filler Hydrophobic Aerosil (Product name:
2 parts of Aerosil RY-200 (manufactured by Nippon Aerosil Co., Ltd.) and an organic pyrolysis type foaming agent (trade name: Neocervone N #)
5000 parts, manufactured by Eiwa Kasei Kogyo Co., Ltd.) to prepare a B solution.
【0052】上記A液とB液の粘度を実施例1−1と同
様にして測定、結果を表3に示した。上記で得られたA
液とB液から発泡型シーリング用組成物(2−1)を調
製して、実施例1−1と同様の測定、算出を行い、結果
を表3および4に示した。 (実施例2−2〜2−3)A液とB液の組成を表3に示
す組成に変更する以外は、実施例2−1と同様にして、
A液、B液の調製を行い、その粘度を実施例1−1と同
様にして測定するとともに、これらを用いて発泡型シー
リング用組成物(2−2)〜(2−3)を調製し、実施
例1−1と同様の測定、算出を行い、結果を表3および
表4に示した。 (実施例2−4)A液とB液の組成を表3に示す組成に
変更する以外は、実施例2−1と同様にして、発泡型シ
ーリング用組成物(2−4)を調製した。なお、導電体
として用いたカーボンブラックは実施例1−4と同じも
のであった。実施例1−1と同様の測定、算出を行い、
結果を表3および表4に示した。ただし、発泡型シーリ
ング用組成物(2−4)の発泡、硬化条件は、実施例1
−4と同じであった。 (実施例2−5)実施例2−1で調製した発泡型シーリ
ング用組成物(2−1)を、実施例2−4と同じ条件
で、発泡、硬化させ、実施例1−1と同様の測定、算出
を行い、結果を表4に示した。 (比較例2−1)B液に有機系熱分解型発泡剤を配合し
ない以外は、実施例2−1と同様にして、A液、B液の
調製を行い、その粘度を実施例1−1と同様にして測定
するとともに、このA液、B液を用いて比較組成物(2
−1)を調製し、実施例1−1と同様の測定、算出を行
い、結果を表3および表4に示した。The viscosities of Liquid A and Liquid B were measured in the same manner as in Example 1-1, and the results are shown in Table 3. A obtained above
The foaming-type sealing composition (2-1) was prepared from the liquid and the liquid B, and the same measurement and calculation as in Example 1-1 were performed. The results are shown in Tables 3 and 4. (Examples 2-2 to 2-3) In the same manner as in Example 2-1 except that the compositions of the solution A and the solution B were changed to the compositions shown in Table 3,
Liquid A and liquid B were prepared, and their viscosities were measured in the same manner as in Example 1-1. Using these, foam-type sealing compositions (2-2) to (2-3) were prepared. The same measurements and calculations as in Example 1-1 were performed, and the results are shown in Tables 3 and 4. (Example 2-4) A foam-type sealing composition (2-4) was prepared in the same manner as in Example 2-1 except that the compositions of the solution A and the solution B were changed to the compositions shown in Table 3. . The carbon black used as the conductor was the same as in Example 1-4. The same measurement and calculation as in Example 1-1 were performed.
The results are shown in Tables 3 and 4. However, the foaming and curing conditions of the foam-type sealing composition (2-4) were the same as in Example 1.
Same as -4. (Example 2-5) The foaming-type sealing composition (2-1) prepared in Example 2-1 was foamed and cured under the same conditions as in Example 2-4, and the same as in Example 1-1. Was measured and calculated, and the results are shown in Table 4. (Comparative Example 2-1) Liquid A and liquid B were prepared in the same manner as in Example 2-1 except that the organic thermal decomposition type foaming agent was not blended with liquid B, and the viscosity thereof was measured in Example 1 The measurement was carried out in the same manner as in Example 1.
-1) was prepared, and the same measurement and calculation as in Example 1-1 were performed. The results are shown in Tables 3 and 4.
【0053】この比較組成物(2−1)は、発泡剤を含
まないため、発泡せず、シーリング用途には使用できな
い。 (比較例2−2)比較組成物(2−2)としての市販の
ポリウレタン系発泡型シーリング材(エーテル系ウレタ
ンプレポリマー系シーリング材、発泡倍率3倍)につい
て、実施例1−1と同様の測定、算出を行い、結果を表
3および表4に示した。 (比較例2−3)比較組成物(2−3)としての市販の
ホットメルト系発泡型シーリング材(商品名:ニッタイ
トH−6636、新田ゼラチン社製、発泡倍率3倍)に
ついて、実施例1−1と同様の測定、算出を行い、結果
を表3および表4に示した。なお、溶融粘度測定は、ブ
ルックフィールド型サーモセルシステム粘度計27号を
用いて測定した。Since this comparative composition (2-1) does not contain a foaming agent, it does not foam and cannot be used for sealing purposes. (Comparative Example 2-2) A commercially available polyurethane-based foam-type sealing material (ether-based urethane prepolymer-based sealing material, expansion ratio: 3 times) as a comparative composition (2-2) was the same as in Example 1-1. Measurements and calculations were performed, and the results are shown in Tables 3 and 4. (Comparative Example 2-3) Example of a commercially available hot-melt foam type sealing material (trade name: Nittite H-6636, manufactured by Nitta Gelatin Co., 3 times expansion ratio) as a comparative composition (2-3) The same measurement and calculation as in 1-1 were performed, and the results are shown in Tables 3 and 4. The melt viscosity was measured using a Brookfield type thermocell system viscometer No. 27.
【0054】[0054]
【表3】 [Table 3]
【0055】[0055]
【表4】 [Table 4]
【0056】表3、4から分かるように、本発明にかか
る発泡型シーリング用組成物は常温での粘度が適度であ
り、常温下、加熱下での密着強度も充分であり、防水性
も高かった。これに対し、比較組成物(2−2)も比較
組成物(2−3)も界面破壊が起きており、密着強度に
劣り、防水性も低い。As can be seen from Tables 3 and 4, the foam-type sealing composition according to the present invention has an appropriate viscosity at room temperature, a sufficient adhesive strength at room temperature and under heating, and a high waterproofness. Was. On the other hand, both the comparative composition (2-2) and the comparative composition (2-3) have undergone interfacial destruction, and have poor adhesion strength and low waterproofness.
【0057】[0057]
【発明の効果】本発明にかかる発泡型シーリング用組成
物は、塗工に適度な粘度が得られて、しかも、耐熱性が
あり、フロンを使用しなくても十分な発泡倍率が得られ
て、しかも、その発泡倍率が安定しており、かつ、常温
下でも高温下でも十分な密着性を有し、防水性が高い。The foam-type sealing composition according to the present invention has an appropriate viscosity for coating, has heat resistance, and has a sufficient expansion ratio without using chlorofluorocarbon. In addition, the foaming ratio is stable, and it has sufficient adhesiveness at normal temperature and high temperature, and has high waterproofness.
【0058】本発明にかかる発泡型シーリング用組成物
の使用方法は、発泡型シーリングを容易に得させること
ができる。The method of using the foam-type sealing composition according to the present invention can easily obtain a foam-type sealing.
【図1】本発明の発泡型シーリング用組成物を用いて得
られた建築用外壁材の斜視図である。FIG. 1 is a perspective view of an architectural outer wall material obtained by using the foam-type sealing composition of the present invention.
【図2】本発明の発泡型シーリング用組成物を用いて得
られた自動車のウインドガラス用モール近傍の断面図で
ある。FIG. 2 is a cross-sectional view of the vicinity of a window glass molding of an automobile obtained by using the foam-type sealing composition of the present invention.
【図3】本発明の発泡型シーリング用組成物を用いて得
られた冷蔵庫のシール近傍の断面図である。FIG. 3 is a cross-sectional view near a seal of a refrigerator obtained by using the foam-type sealing composition of the present invention.
【図4】本発明の発泡型シーリング用組成物を用いて得
られたパッキン付缶フタの断面図である。FIG. 4 is a cross-sectional view of a can lid with packing obtained by using the foamable sealing composition of the present invention.
1 建築用外壁材 2 外壁材本体 3a ラップジョイント部 3b プレシーリング部 4 モール 5 ウインドガラス 6 ボディー 7 接着剤層 8 ダムラバー 9 シール 10 内箱 11 外箱 12 パッキン付缶フタ 13 缶フタ本体 14 パッキン DESCRIPTION OF SYMBOLS 1 Building exterior wall material 2 Exterior wall material main body 3a Lap joint part 3b Pre-sealing part 4 Mall 5 Window glass 6 Body 7 Adhesive layer 8 Dam rubber 9 Seal 10 Inner box 11 Outer box 12 Can lid with packing 13 Can lid body 14 Packing
───────────────────────────────────────────────────── フロントページの続き (72)発明者 松本 睦夫 大阪府八尾市二俣2丁目22番地 新田ゼラ チン株式会社大阪工場内 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor, Mutsuo Matsumoto 2-22 Futama, Yao-shi, Osaka Nitta Gerachin Co., Ltd. Osaka Plant
Claims (8)
るゴム質系有機重合体と、前記ゴム質系有機重合体を硬
化させるシラノール縮合触媒と、有機系熱分解型発泡剤
とを含む、発泡型シーリング用組成物。1. A foaming method comprising: a rubbery organic polymer containing at least one reactive silicon group; a silanol condensation catalyst for curing said rubbery organic polymer; and an organic pyrolytic foaming agent. Composition for mold sealing.
エポキシ樹脂と、前記エポキシ樹脂を硬化させるエポキ
シ樹脂硬化触媒とをさらに含む、請求項1に記載の発泡
型シーリング用組成物。2. The foam-type sealing composition according to claim 1, further comprising an epoxy resin having two or more oxirane rings in one molecule, and an epoxy resin curing catalyst for curing the epoxy resin.
項1または2に記載の発泡型シーリング用組成物。3. The foam-type sealing composition according to claim 1, further comprising a silane coupling agent.
3までのいずれかに記載の発泡型シーリング用組成物。4. The foam-type sealing composition according to claim 1, further comprising a tackifier resin.
含む、請求項1から4までのいずれかに記載の発泡型シ
ーリング用組成物。5. The foam-type sealing composition according to claim 1, further comprising a conductor that generates heat by induction heating.
のいずれかに記載の発泡型シーリング用組成物。6. The foamable sealing composition according to claim 1, which is a sealing material.
泡型シーリング用組成物を加熱して発泡させる発泡型シ
ーリング用組成物の使用方法。7. A method of using the foamable sealing composition according to claim 1 wherein the foamable sealing composition is foamed by heating.
項7に記載の発泡型シーリング用組成物の使用方法。8. The method of using the foam-type sealing composition according to claim 7, wherein the heating is performed by high-frequency heating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9362398A JPH11293020A (en) | 1998-04-06 | 1998-04-06 | Foamed composition for sealing and method of use thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9362398A JPH11293020A (en) | 1998-04-06 | 1998-04-06 | Foamed composition for sealing and method of use thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11293020A true JPH11293020A (en) | 1999-10-26 |
Family
ID=14087463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9362398A Pending JPH11293020A (en) | 1998-04-06 | 1998-04-06 | Foamed composition for sealing and method of use thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11293020A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010055593A1 (en) | 2008-11-14 | 2010-05-20 | 新田ゼラチン株式会社 | Sealing material and method of foaming application thereof |
| JP2022544725A (en) * | 2018-12-26 | 2022-10-21 | モメンティブ パフォーマンス マテリアルズ インコーポレイテッド | Curable silicone-based compositions and their uses |
-
1998
- 1998-04-06 JP JP9362398A patent/JPH11293020A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010055593A1 (en) | 2008-11-14 | 2010-05-20 | 新田ゼラチン株式会社 | Sealing material and method of foaming application thereof |
| US9157005B2 (en) | 2008-11-14 | 2015-10-13 | Nitta Gelatin Inc. | Sealing material and method of foaming application thereof |
| JP2022544725A (en) * | 2018-12-26 | 2022-10-21 | モメンティブ パフォーマンス マテリアルズ インコーポレイテッド | Curable silicone-based compositions and their uses |
| US12479994B2 (en) | 2018-12-26 | 2025-11-25 | Momentive Performance Materials Inc. | Curable silicone-based compositions and applications thereof |
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