JPH11296643A - IC card and manufacturing method thereof - Google Patents

Abstract

(57) [Summary] [Problem] An IC having a uniform thickness and smooth front and back surfaces, and excellent in post-processing suitable for printing design patterns, photographs, etc.
Provided is a method for manufacturing a card. SOLUTION: At least one side of the non-polar resin film is
The oversheet treated by ultraviolet irradiation or corona discharge is brought into contact with the thin plate embedded with the IC module,
An electric field having a frequency of 300 MHz is applied, and only the treated film of the oversheet is heated and fused to form an IC.
Manufacture cards.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card in which the thickness of the card is uniform and the front and back surfaces are smoothly finished, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, regarding a method of manufacturing an IC card,
JP-A-6-286375, JP-A-6-286376, JP-A-6-286377, JP-A-6-286378, etc.
A resin substrate having a shape that can mount an IC module is manufactured by injection molding or punching, and then the IC module is mounted on the resin substrate, and then an oversheet is attached with an adhesive tape or hot pressing by hot pressing. A method for doing so is disclosed.

Further, JP-A-6-122297 and JP-A-9-109584 disclose that an I-type substrate is provided on a substrate provided with a spacer.
A method is disclosed in which, after the C module is mounted, a liquid curable resin is potted, and then covered with an oversheet, and the potting resin is adhered to the oversheet while being cured by ultraviolet irradiation or heat treatment.

[0004]

According to the above-described method of forming a shape suitable for an IC module by injection molding or punching and mounting the IC module, a gap is formed when an oversheet is attached to an IC module having a complicated shape. This tends to cause unevenness on the front and back surfaces, and a smooth IC card cannot be obtained.

[0005] Further, in a method described below in which an IC module on a substrate is mounted and potted with a liquid resin, and the liquid resin is cured and adhered to an oversheet, the thermal expansion of the potting resin and the film of the oversheet is performed. -Since there is a difference in shrinkage, wrinkles are easily formed on the surface of the IC card, and as a result, it is difficult to obtain an IC card having both front and back surfaces smooth.

[0006]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a method for irradiating one surface of a nonpolar resin film having a dielectric power factor of 0.01 or less at a frequency of 1 kHz to 1 MHz with ultraviolet irradiation or corona discharge. The over-sheet treated in the above is brought into contact with a thin plate in which an IC module is embedded, and an electric field having a frequency of 1 to 300 MHz is applied,
This is a method for manufacturing an IC card, wherein only the treated film of the oversheet is heated and fused.

Further, a spacer is placed on the treated oversheet, an IC module is mounted in the gap, and a thermosetting liquid resin is potted. Then, the treated oversheet is covered with another treated oversheet. ~ 300
This is a method for manufacturing an IC card, wherein a megahertz electric field is applied to generate heat and fuse and cure the treated film of the oversheet and the liquid resin. Also, in order to prevent the liquid resin for potting from leaking, one of the treated oversheets and the spacer are previously fused by applying an electric field having a frequency of 1 to 300 MHz, and An IC card may be manufactured in which the IC module is mounted, the adhesive is potted, and the IC card is covered with another oversheet to apply the electric field.

Further, the present invention relates to a polyester film having at least one surface treated by ultraviolet irradiation or corona discharge, wherein the surface not subjected to the treatment is placed on the outside at 1 to 300
An IC card characterized in that a thin plate of an IC module is covered with an oversheet in which only the treatment film is heated and melted by applying an electric field having a frequency of megahertz and the surface on the outer skin side does not generate heat.

The non-polar resin does not generate heat even when a high-frequency electric field of 300 MHz or less is applied. Therefore, no fusion or bonding was performed using high-frequency heating. For example, the applied frequency required for high-frequency heating is represented by the following equation.

[0010] f = Pv / where ^{(0.556 × ε × tanθ × E} 2 × 10 ^{over 12)} 1, f is the applied frequency, Pv is the amount of heat required per unit time per unit volume, epsilon is the dielectric constant , Tanθ is the dielectric power factor, E
Is the voltage between the electrodes.

For example, a specific gravity of 1.5 and a specific heat of 0.5 calories
The amount of heat required per unit time per unit volume of a thermoplastic resin having a deformation temperature of 150 ° C. per unit time Pv is 470 watts, and the applied voltage between the electrodes is 10 kV / cm. When the dielectric constant (ε) = 2 and the dielectric power factor (tan θ) = 0.0005, the required applied frequency is a very high frequency of 8450 MHz from the above equation. For this reason, high-frequency heating has been limited to polar resins such as vinyl chloride resin, vinylidene chloride resin, nylon resin and urethane resin having a dielectric power factor of 0.01 or more. Therefore, the non-polar resin used in the present invention does not generate heat in principle even when a high-frequency electric field is applied.

However, the applicant has disclosed in Japanese Patent Application Laid-Open No. 9-22076.
As disclosed in No. 5, when the surface of a non-polar resin is irradiated with ultraviolet rays, it has been found that only the irradiated surface generates heat to the melting temperature of the resin by application of an electric field.

According to the present invention, as a result of further intensive research on the above technology, in the manufacture of an IC card, an IC module is sandwiched between oversheets of a non-polar resin film having at least one surface treated by ultraviolet irradiation or corona discharge.
It has been found that when an electric field having a frequency of 1 to 300 MHz is applied, an IC card having a uniform thickness and smooth front and back surfaces can be easily manufactured. That is, since the surface of the film subjected to the ultraviolet irradiation or the corona discharge treatment is heated to the melting temperature and is softened or fluidized, the thickness of a thin plate-shaped IC module can be absorbed by the deformation of the molten resin if the IC module has small and small irregularities. On the other hand, since the outer skin surface of the oversheet does not generate heat and remains solid, an IC card having a uniform thickness can be easily manufactured without impairing the original smoothness of the sheet.

If the oversheet is masked in advance with a pattern of a predetermined shape and ultraviolet irradiation or corona discharge treatment is performed, it is possible to arbitrarily set a heat generating portion due to application of an electric field. Therefore, it is possible to easily suppress the heat generation of the overseat close to the electronic components such as the memory and the transmission / reception coil in the IC module.

The wavelength of the ultraviolet light used in the present invention is preferably 380 nm or less. Further, the time for the treatment by ultraviolet irradiation or corona discharge is appropriately set depending on the frequency of the electric field and the application time in the next fusion step. Further, the preferred material of the oversheet in the present invention,
From the viewpoints of film strength, surface hardness, moisture resistance, printing characteristics, and the like, it is a film of a polyester resin, in particular, a polyethylene terephthalate resin called PET or a polybutylene terephthalate resin.

In the case where the IC module has a thick plate shape or a shape with large irregularities, a spacer may be used to secure the thickness of the IC module. If the spacer is made of the same material as the oversheet and its surface is subjected to ultraviolet irradiation or corona discharge treatment in advance, the molten resin from the oversheet and the molten resin from the spacer are compatible with each other and are firmly fused. Therefore, an IC card in which the oversheet or the spacer is not easily peeled off due to deformation such as bending can be easily manufactured. The space created by the spacer may be potted with a heat-curable epoxy resin or an ultraviolet-curable acrylic or epoxy resin. Normally, these potting liquid resins have a polar group in the molecule, and generate heat simultaneously with the application of an electric field during the oversheet fusing step to be cured.

[0017]

According to the manufacturing method of the present invention, since the outer surface of the oversheet forming the skin of the finished IC card does not generate heat but remains solid, it is possible to obtain an IC card which maintains the original surface smoothness of the film. .

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION

An embodiment of the present invention will be described below with reference to FIGS.

First, electronic components such as a microprocessor, a memory, and a transmission / reception coil are mounted on a PET film.
The IC module (2) is obtained by bonding with a V anaerobic adhesive (3062D, manufactured by Three Bond). FIG. 1 shows an example in which an IC module (2) is sandwiched between two oversheets (1). Corona discharge treatment on one side, thickness 1 mm, melting temperature 2
Dielectric power factor at 55 ° C, 1 MHz: 0.003 to 0.0
06 kg of PET sheet (1) sandwiching the IC module and using a high frequency heating device with two flat electrodes
An IC card was manufactured by applying an electric field of 30 MHz and applying a pressure of 10 cm for 10 seconds while applying a pressure of / cm ² (3).

FIG. 2 shows an example of an IC card having a spacer. First, corona discharge treatment (3, 3 ') is performed on one side of a PET sheet having the same characteristic values as described above.
A PET sheet punched out in a predetermined shape so that an IC module can be mounted is bonded to a predetermined position, and an electric field of 100 MHz is applied for 3 seconds to fuse the oversheet and the spacer (3 ′). Let it. In addition, the PET sheet of the spacer is made of the same material as that of the oversheet, and one side is subjected to corona discharge treatment. Then, after mounting the IC module, a UV anaerobic adhesive (3062, manufactured by Three Bond Co., Ltd.)
D) Potting (5) and irradiating it with UV light having a wavelength of 280 nanometers at 500 mJ / cm ² to cure the UV anaerobic adhesive. At this time, the exposed upper surface of the spacer is also irradiated with ultraviolet rays, but the surface is heated by application of an electric field in the next oversheet fusing step. The two processes of pretreatment of the spacer surface are also used. Separately, a PET sheet having the same characteristic value as described above, in which only the portion in contact with the spacer is subjected to corona discharge treatment, is adjusted to a predetermined position, and a 2 kg / cm ² high-frequency heating device is used as a two-plate electrode. An IC card was manufactured by applying an electric field of 10 megahertz while applying pressure for 20 seconds to fuse (3). In this application, the adhesive component of the adhesive (5), which has not been cured due to the unreached portion of the ultraviolet rays or the shaded portion, is also completely cured by heat generation.

[0022]

According to the present invention, only the inner surface of the oversheet is heated and melted, and the outer skin surface does not generate heat. Therefore, an IC card having a uniform thickness and a smooth finish on both the front and back surfaces can be easily manufactured. In the case where a liquid resin is potted by providing a spacer, the liquid resin also generates heat as well as a film subjected to corona discharge treatment by application of a high-frequency electric field, and can also serve as a function of heat curing.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of an IC card sandwiched between two oversheets.

FIG. 2 is a view showing an example of an I potted with a spacer and a void portion.
Cross section of C card

[Explanation of symbols]

1. Overseat, 2. 2. IC module; Deposited surface, 3 '. 3. Corona discharge treated surface; Spacer, 5, adhesive

Claims (4)

[Claims] 1. An oversheet obtained by treating at least one surface of a nonpolar resin film having a dielectric power factor of 0.01 or less at a frequency of 1 kHz to 1 MHz by ultraviolet irradiation or corona discharge, and applying a thin plate in which an IC module is embedded. A method for manufacturing an IC card, wherein an electric field having a frequency of 1 to 300 MHz is applied in such a manner that only the treated film of the oversheet is heated and fused. 2. A spacer is placed on the treated oversheet, and an IC module is mounted in a space between the treated oversheet and a thermosetting liquid resin is potted. Manufacturing the IC card, further covering the treated another oversheet, applying an electric field of 1 to 300 megahertz, and causing the treated film of the oversheet and the liquid resin to generate heat and to fuse and cure the resin. Method. 3. An oversheet piece in which one of the treated oversheets and the spacer are fused by applying an electric field having a frequency of 1 to 300 MHz in advance.
3. The method for manufacturing an IC card according to claim 2, wherein mounting of the C module and potting of the adhesive are performed. 4. A polyester film having at least one surface treated by ultraviolet irradiation or corona discharge, wherein an electric field having a frequency of 1 to 300 MHz is applied with the surface not subjected to the treatment facing outward, so that only the treated film is applied. Is heated and melted, and the surface on the outer skin side is an oversheet that does not generate heat,
IC characterized by covering a thin plate of an IC module
card.