JPH11296894A - Optical device and method of manufacturing the same - Google Patents

Abstract

(57) Abstract: Provided is an optical device capable of accurately coupling transmitted light to a light receiving region of a light receiving element, and inexpensively and easily manufactured, and a method of manufacturing the same. SOLUTION: A first material having at least a part having a light transmitting property is provided.
, A light-emitting element 21 mounted on the first base 35, and a light-emitting element 21 mounted on the first base 35 at a predetermined interval from the light-emitting element 21. At least a part of the outgoing light of 21 is branched and irradiated on the irradiation object,
Light branching means 30 for guiding the reflected light from the irradiation object so as to pass through the first base 35, and light receiving elements 41 and 42
And the light transmitted through the first base 35 is received by the light receiving elements 41 and 42.
The optical device 1 includes the second base 40 to which the first base 35 is attached so as to be coupled to the light receiving area of the optical device 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an optical device used for a pickup device such as a CD player and a method for manufacturing the same.

[0002]

2. Description of the Related Art CD (Compact Disc) players and LDs
(Laser Disc) In a player or the like, a pickup device is used to read information on a disc, and for example, a laser coupler as shown in FIG. 8 is used in the pickup device. Laser couplers are laser diodes, prisms, photodetectors, etc. integrated into a single unit.Thin, lightweight, highly reliable, and relatively inexpensive, they are used in many optical devices. I have.

Hereinafter, a laser coupler and a conventional optical device will be described with reference to the drawings. FIG. 8 is a perspective view showing a laser coupler, FIG. 9A is a side view of a conventional optical device,
9B is a top view of the optical device shown in FIG. 9A, FIG. 10 is a perspective view of the optical device shown in FIG. 9, and FIG.
FIG. 3 is a diagram for explaining a light receiving element used in the optical device shown in FIG.

In general, a laser coupler 100 has an optical device 110 mounted on a lead frame 150 as shown in FIG.
, And a transparent glass plate 170 that allows light to pass therethrough is placed on the upper surface.

As shown in FIGS. 9 and 10, a laser diode 121 as a light emitting element is provided in an optical device 110.
A photodiode (or “LOP (Laser-diode OnPhoto-detector)”) 12 that emits a laser beam from the device and receives the laser beam to detect the output intensity of the laser beam.
0 and the prism 130 that refracts the laser light emitted from the laser diode 121,
20 (or "PD-IC (Ph
oto Detector-IC) ”).

As shown in FIG. 9B, a recognition pattern 140a and a recognition pattern 120a used when positioning the photodiode 120 on the integrated circuit board 140 are formed on the upper surfaces of the integrated circuit board 140 and the photodiode 120. Are respectively attached.

[0007] The recognition patterns 140a and 120a are arranged in a direction directly above the optical device 110, that is, a CC (not shown) from the Z direction.
An image is taken by using a D camera or the like, and a shift amount of the photodiode 120 with respect to the integrated circuit board 140 in the X direction and the Y direction and a rolling angle θ are obtained from the taken image. Based on these values, the photodiode 120 is finely adjusted to a proper position and positioned.

The photodiode 120 is driven by the above-described recognition patterns 140a, 120a to form an integrated circuit board 140.
When positioned on the top with high precision, as shown in FIG.
The two PDs (Photo De
The laser beams from the laser diode 121 are formed as elliptical spot lights in the light receiving areas of the tectors 141 and 142, and are projected almost at the centers thereof.

[0009]

However, even if the photodiode 120 can be positioned on the integrated circuit board 140 with high accuracy, it is difficult to improve the position accuracy of the photodiode 120 only in the X and Y directions. It is difficult to obtain a spot light reflected in the light receiving areas of the PDs 141 and 142 shown in FIG.

That is, in the Z direction of the coordinate system set in FIGS. 9A and 10, the thickness of the photodiode 120 itself varies due to a dimensional error, or the contact between the photodiode 120 and the integrated circuit board 140. Due to variations in the thickness of the adhesive such as silver paste applied to the surface, the laser emission point P is changed to the arrow A in FIG.
Will vary by several tens of μm in the Z direction indicated by. As a result, the spot light is changed to an arrow B in FIG. 9A and FIG.
Results in a shift in the Y direction indicated by. Similarly, the above-described displacement in the direction of arrow B may also occur due to variation in the arrangement position of the prism 130 in the Z direction.

The photodiode 120 is mounted on the integrated circuit substrate 1
By positioning the mounting position of the prism 130 in the Y direction after positioning on the 40, it is possible to obtain a good spot light as shown in FIG. 11, but in the method of moving the prism 130, defocusing is performed. In many cases, this causes the inconvenience of causing an optical disk reading failure.

FIG. 12 is a perspective view showing an optical device corresponding to a magneto-optical signal, and FIGS. 13 (a) and 13 (b) are diagrams for explaining a light receiving element used in the optical device shown in FIG. FIG. 14 shows a differential phase detector (DPD).
n) A perspective view showing a method-compatible optical device, and FIGS. 15A and 15B are diagrams for explaining a light receiving element used in the optical device shown in FIG.

An optical device 2 corresponding to a magneto-optical signal shown in FIG.
A birefringent prism 230 for separating incident light into two light beams based on a difference in polarization is used for the light source 10, and a laser reflected light from a disc (not shown) is applied to the integrated circuit board 240 through the birefringent prism 230. PD24 to detect
1 and a PD 242a for detecting only ordinary light and a PD 242 for detecting only extraordinary light among the reflected light from the PD 241.
b and PD2 for monitoring the output from the front of the laser
43 are provided.

When the photodiode 220 and the birefringent prism 230 are arranged on the integrated circuit board 240 with high precision, a spot light as shown in FIG. 13A is obtained. In the case of this optical device 210, Since ordinary light and extraordinary light are detected by different PDs, for example, if the position of the light emitting point P of the laser diode 221 varies in the Z direction, the spot light moves in the direction of arrow B shown in FIG. State, and there is a disadvantage that spot light detection failure is likely to occur.

FIG. 1 which is frequently used in DVD players and the like
The optical device 310 compatible with the DPD method shown in FIG.
As shown in (a), the PD 341 is divided into two parts on the left and right in the figure. However, as in the above-described case, if the position of the light emitting point P of the laser diode in the Z direction varies, the spot light becomes There is a disadvantage that the light beam is moved in the direction of arrow B shown in FIG.

That is, in the optical devices 210 and 310 shown in FIGS. 12 and 14, in order to keep the spot light position of the laser beam in a good state, not only the X and Y directions with respect to the light emitting point P but also the Z direction. However, it is necessary to perform highly accurate positioning.

For example, when the above-described optical device 110 is manufactured, in the step of attaching the prism 130 to the integrated circuit substrate 140, generally, in order to maintain the reflection angle of each reflecting surface of the prism 130 with high accuracy, Instead of attaching the prism 130 to each of the circuit boards 140, a work configuration in which a rod-shaped prism is mounted on a wafer on which a plurality of integrated circuit boards 140 are formed, and the prism 130 is diced together with the dicing of the integrated circuit board 140. ing.

However, in the above-described manufacturing method, for example, as shown in FIG. 10, it is necessary to form the wire bonding pad portion 144 formed on the integrated circuit board 140 as close to the photodiode 120 as possible. No lead frame and wire bonding pad 144
In many cases, the efficiency of the wire bonding operation significantly deteriorates.

Further, as described above, the integrated circuit board 14
0 and the prism 130 are diced at the same time, so that when the width of the integrated circuit substrate 140 in the X direction is increased, the width of the prism 130 is also increased accordingly, thereby reducing the efficiency of use of the prism 130. It often deteriorates and leads to an increase in the manufacturing cost of the optical device 110.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned circumstances, and has as its object to provide an optical system which can accurately couple transmitted light to a light receiving region of a light receiving element, and which can be manufactured at low cost and easily. An object of the present invention is to provide an apparatus and a method of manufacturing the same.

[0021]

In order to achieve the above object, an optical device according to the present invention comprises a first base having at least a portion having light transmittance, and a first base mounted on the first base. And at least one light-emitting element is mounted on the first base at a predetermined distance from the light-emitting element, and at least a part of light emitted from the light-emitting element is branched to irradiate the irradiation target. A light branching unit that guides the reflected light from the irradiation object so as to pass through the first base; and a light receiving element, and the transmitted light of the first base is used for the light receiving element. A second base on which the first base is mounted so as to be coupled into the light receiving area;
With a base.

The light branching means of the optical device according to the present invention is a spectroscope, and the spectroscope branches the light emitted from the light emitting element and guides the reflected light from the irradiation object. A surface is formed. When the spectroscope is a birefringent spectroscope, after the reflected light from the irradiation target enters the birefringent spectroscope, two light fluxes of ordinary light and extraordinary light are generated inside the birefringent spectroscope. And at least two light receiving elements for separately receiving the light are provided.

The optical device according to the present invention is an optical device for detecting the amount of light reflected on an optical disk and reading information recorded on the disk, and at least a part of the first base having optical transparency. And at least one light emitting element mounted on the first base; and on the first base,
The light-emitting element is mounted at a predetermined interval, and at least a part of the light emitted from the light-emitting element is branched and irradiated on the optical disc, and the reflected light from the optical disc is transmitted through the first base. A light branching means for guiding the light to the first base, and a light receiving element, wherein the first base is attached so that transmitted light of the first base is coupled into a light receiving region of the light receiving element. 2 bases. Further, the light splitting means of the optical device of the present invention is a spectroscope, and the spectroscope has a light splitting surface for splitting outgoing light of the light emitting element and guiding reflected light from the optical disc. I have.

According to the method of manufacturing an optical device of the present invention, at least one light-emitting element and at least a part of light emitted from the light-emitting element are branched and irradiated on an object to be irradiated, and reflected light from the object is reflected. A light branching means for guiding the light to pass through the first base;
Measuring the arrangement state of the light emitting element and the light branching means mounted on the first base,
Calculating a transmission position of the transmitted light on the first base; coupling the transmission position of the transmitted light into a light receiving area of a light receiving element provided on the second base based on the calculation result; Mounting the first base on the second base.

Preferably, in the method of manufacturing an optical device according to the present invention, the light emitting element and the light branching unit are respectively mounted on the first bases formed on a plurality of wafers, and then the first And a step of cutting each block as an optical block. More preferably, the light branching means is placed over a plurality of optical blocks, and is cut at the same time as cutting each optical block.

According to the optical device of the present invention, at least a part of the light emitted from the light emitting element mounted on the first base is converted into the light branching means also mounted on the first base. The emitted light is radiated to the irradiation target. For example, a reflection surface is formed on the irradiation object, and light emitted from the light emitting element is reflected by the reflection surface. Next, the reflected light is first split by the light splitting means.
The light is guided so as to pass through a light-transmitting region provided on the base. The transmitted light guided by the light branching unit is coupled into the light receiving area of the light receiving element provided on the second base. When the above-mentioned light splitting means is, for example, a birefringent spectroscope, the reflected light reflected by, for example, the reflection surface of the irradiation object is guided inside the birefringent spectroscope, and inside the birefringent spectroscope, ordinary light and extraordinary light Into two light beams. Its separated 2
The two lights finally pass through the light-transmissive region provided on the first base and are combined into the light receiving regions of at least two light receiving elements provided on the second base. Meanwhile, the light is reflected or partially split inside the birefringent spectroscope. Partially split light passes through, for example, the first base and is coupled to another light receiving element provided on the second base.

According to the optical device of the present invention, at least a part of the light emitted from the light emitting element mounted on the first base is a light branching light also mounted on the first base. The emitted light is radiated to the optical disk. The optical disc has, for example, a reflective surface, and light emitted from the light emitting element is reflected by the reflective surface. Next, the reflected light is split by the light splitting means.
The light is guided so as to pass through a light-transmitting region provided on the first base. The transmitted light guided by the light branching unit is coupled into the light receiving area of the light receiving element provided on the second base. As a result, the amount of transmitted light is detected, and the information recorded on the optical disc is read.

According to the method of manufacturing an optical device of the present invention, after the step of mounting the light emitting element and the light branching means on the first base, the light emitting element arranged on the first base The arrangement state of the light and the light branching means is measured, and the transmission position of the transmitted light on the first base is calculated. After the calculation process, the first position is determined based on the calculation result such that the transmission position of the transmitted light is coupled to the light receiving region of the light receiving element provided on the second base.
Is mounted on the second base. When a plurality of first bases are formed on a wafer, the light-emitting element and the light branching unit are mounted on each of the first bases, and then each of the first bases serves as an optical block. It is divided into blocks. At this time, if the light branching unit is placed over a plurality of optical blocks, the light branching unit is also cut at the same time.

[0029]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the optical device according to the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an embodiment of an optical device according to the present invention, and FIG.
2A is a diagram for explaining a birefringent prism of the optical device shown in FIG. 1, and FIG. 2B is a diagram for explaining an optical block and an integrated circuit substrate of the optical device shown in FIG. is there.

An optical device corresponding to a magneto-optical signal shown in FIG. 1 (hereinafter, simply referred to as “optical device” in this embodiment) 10
A laser 20 for irradiating an optical disc such as a CD (not shown), and a photodiode 20 for detecting the output intensity of the laser light, and a part of the light emitted from the laser diode 21 for branching the optical disc (not shown). And a birefringent prism 30 as a light branching means for guiding the reflected light reflected by the reflecting surface formed on the optical disk so as to pass through a transparent substrate 35 described later, and a photodiode 20. Is mounted on the upper surface thereof, and a transparent substrate 35 capable of transmitting the reflected light guided by the prism 30 and an integrated circuit substrate 4 on which a circuit for operating the photodiode 20 is formed on a silicon substrate
0.

The photodiode 20 includes a laser diode 21 as a light emitting element and a PIN diode (a low-concentration layer in a silicon pn junction) serving as a monitoring light detecting element for receiving light emitted from behind the laser diode 21. ) 23 are disposed. The laser diode 21 moves the light receiving surface 30a of the prism 30
The laser beam is emitted in a direction parallel to the upper surface of the transparent substrate 35.

As shown in FIG. 2A, the prism 30 has a cross section in which two pairs of opposing surfaces other than the light receiving surface 30a are parallel when viewed from the X direction of the coordinate system set in FIG. Then, the reflected light from the optical disk (not shown) branched at the light receiving surface 30a is split into ordinary light and extraordinary light by its birefringence characteristics.

The light-receiving surface 30a and the contact surface 30b between the prism 30 and the transparent substrate 35, which are not covered by a PD 42 as a light-receiving element described later provided on the integrated circuit substrate 40, are incident on the light-receiving surface 30a. A light-branching film (hereinafter, referred to as a “BS film”) that branches the reflected light from the optical disk is deposited, and a part of the reflected light from the optical disk passes through the BS film and enters the PD 41, and the remaining Is reflected inside the prism 30.

On a flat surface 30c facing the contact surface 30b shown in FIG. 2A, reflected light transmitted through the light receiving surface 30a and incident on the inside of the prism 30 is transmitted via a transparent substrate 35 to a PD 42 described later. A high-reflection film (hereinafter, referred to as an “HR film”) is deposited so that the light can be received in the light-receiving region of FIG. Further, a non-reflective film (hereinafter, referred to as an “AR film”) is deposited on a flat surface 30 d formed on the back side of the prism 30 so that an output from the front of the laser diode 21 can be detected.

The transparent substrate 35 is preferably formed of, for example, sapphire glass having high thermal conductivity and excellent heat dissipation. As shown in FIG.
As can be seen from (b), the photodiode 20 and the prism 30 are arranged at predetermined intervals so that the light emitted from the laser diode 21 is orthogonal to the light receiving surface 30a at an angle of 45 °.

The transparent substrate 35 receives the reflected light from the optical disk (not shown),
Part of the incident light is transmitted through the BS film on the contact surface 30b and appears on the rear surface 35a of the transparent substrate 35. The transparent substrate 35 is smaller than the integrated circuit substrate 40 as can be seen from FIG.
0 are formed on both sides. Such a continuous surface is formed because the prism 30 is simultaneously diced when the transparent substrate 35 is diced.

The integrated circuit board 40 is, as described above,
PD4 for detecting reflected light from an optical disk (not shown)
1, PD42a and PD42b, and a PD43 for directly monitoring the output of the laser from the front end face. Also, the reflected light from the optical disk is incident on the prism 30 and then
The light is split into two light beams, ordinary light and extraordinary light, and the separation gradually increases, and is separately detected at the positions of the PDs 42a and 42b.
In addition, PD41, PD42a, PD4 of this optical device 10
The most preferable state of the spot light in the detection area 2b is the state shown in FIG. As shown in FIG. 1, a plurality of wire bonding pad portions 44 are formed on the upper surface of the integrated circuit board 40 in the longitudinal direction so as to be wire-bonded to the leads of a package (not shown).

The PD 41, PD 42a, and PD 42b can detect the spot diameter of the laser beam emitted from the laser diode 21, the change in the position of the spot diameter, and the like, whereby the tracking error signal TE, the focus error signal FE, Also, the information signal RF recorded on the optical disk (not shown) can be read. The extraction of these signals is performed by a known method.

A method for calculating each of the above-described signals will be described with reference to, for example, FIG. Signals obtained from the two sets of light receiving elements 141 and 142 shown in FIG.
Using b, c, d and the signals i, j, k, l, the tracking error signal TE is calculated by the following equation (1), the focus error signal FE is calculated by the following equation (2), and not shown by the following equation (3). Information signals RF recorded on the optical disc are calculated.

TE = {(a + b) − (c + d)} + {(k + 1) − (i + j)} (1)

FE = {(a + d) − (b + c)} − {(i + 1) − (j + k)} (2)

RF = a + b + c + d + i + j + k + l (3)

That is, the detection of the focus error signal FE due to the vertical movement of the optical disk is performed by detecting the size of the spot light, and the detection of the tracking error signal TE is performed by the well-known push-pull method. The detection of the information signal RF recorded on the optical disc is detected by the sum of the spots S1 and S2.

Next, the optical path of the laser light emitted from the laser diode 21 will be described with reference to FIGS. Part of the laser light L emitted from the light emitting point P of the laser diode 21 mounted on the transparent substrate 35 is:
BS of prism 30 similarly mounted on transparent substrate 35
The light is branched by the light receiving surface 30a on which the film is deposited. A part of the branched outgoing light passes through the light receiving surface 30a and is guided inside the prism 30, and after the light receiving surface 30a is refracted by a predetermined angle in the guiding direction, passes through the inside of the prism 30. Spread while spreading.

Part of the laser light L guided into the prism 30 is finally led out of the prism 30 via the AR film. Part of the derived laser light L enters the laser output monitoring PD 43, is fed back to an external laser driver circuit, and is used for controlling the laser output.

The remaining part of the branched outgoing light is reflected upward in the drawing by the light receiving surface 30a, condensed at one point via an objective lens (not shown), and radiated to a reflecting surface of an optical disk (not shown). . At this time, if a pit exists on the reflection surface, a phase difference occurs between the laser light reflected through the pit and the laser light when irradiating the optical disk, and the amount of reflected light decreases. Will be. By detecting this difference in light amount using the PD 41, PD 42a, and PD 42b, information recorded on the optical disk can be read. Tracking control and focus control are performed by calculating the detection signals.

The light reflected from the reflecting surface of the optical disk returns to the light receiving surface 30a again and enters the prism 30.
This incident light is separated into two light beams, ordinary light and extraordinary light, by the prism 30, and the light amounts thereof are detected by the PDs 42a and 42b, respectively. A magneto-optical signal is obtained based on the detection result. For example, preferably, if the prism 30 is manufactured so that the intensity of the ordinary light and the intensity of the extraordinary light are just equal in a state where there is no rotation of the polarization, the magneto-optical signal is expressed by the equation (detection result of the PD 42a) − (PD 42b (Detection result). Through the optical paths described above, the laser light from the laser diode 21 is coupled to the light receiving regions of each PD.

Next, a method for manufacturing the optical device 1 will be described with reference to FIGS. FIG. 3 is a flowchart showing a method of manufacturing the optical device shown in FIG. 1, and FIG. 4 is a diagram for explaining how a photodiode and a prism used in the optical device shown in FIG. 1 are mounted on a transparent substrate. FIG. 5 is a diagram for explaining a state in which a transparent substrate on which a photodiode and a prism are mounted is mounted on an integrated circuit substrate.

First, as shown in FIGS. 3 and 4, a photodiode 20 and a prism 30 are attached to a plurality of transparent substrates 35 formed in a wafer, respectively, and an adhesive such as silver paste or UV resin is applied. Use and fix. The prism 30 attached at this time has a long rod shape extending in the direction of the light receiving surface 30a, and is disposed over the plurality of transparent substrates 35 (ST1). The reason why such a prism 30 is used is to maintain the angle of the light receiving surface 30a with respect to the photodiode 20 at a uniform and high accuracy, so that the light receiving surface 30a is provided for each transparent substrate 35. The inconvenience of variation is eliminated.

Photodiode 20 and prism 30
Is attached, the photodiode 20 and the prism 3 are arranged along the dividing line formed on the transparent substrate wafer.
Each transparent substrate 35 on which 0 is placed is regarded as one optical block, and dicing is performed for each optical block. At this time, the above-mentioned elongated rod-shaped prism 30 is also diced simultaneously with the dicing of the transparent substrate 35 (ST2).

After the dicing of the transparent substrate 35 and the prism 30 is completed, the positional relationship between the photodiode 20 and the prism 30 and the coordinates (X, Y, Z), prism height, mount tilt angle θ
And a plurality of parameters such as the thickness of the transparent substrate 35 are measured. By the optical path calculation based on the measurement result, the position of each spot light exposed on the lower surface of the transparent substrate 35 when the laser light is emitted from the light emitting point P is calculated (ST).
3).

After each spot light position is calculated, the position of each spot light is determined by PD41, PD42a, P2 shown in FIG.
A transparent substrate 35 on which the photodiode 20 and the prism 30 are mounted is mounted on a plurality of integrated circuit substrates 40 formed in a semiconductor wafer shape so as to be accommodated in respective light receiving regions (not shown) of D42b, and adhesive such as UV resin is attached. Fix with an agent (ST4). Finally, when the semiconductor wafer is diced for each integrated circuit substrate 40 (ST5), the optical device 10 is manufactured.

In this embodiment, for example, sapphire glass is used as the transparent substrate 35, but a glass substrate or a diamond substrate may be used instead. In addition,
Any material may be used for the transparent substrate 35 as long as the material allows the light incident on the prism to be transmitted to each light receiving element without being reduced or diffused. The laser diode 21 has the advantage that the amount of emitted light can be directly modulated and emits a large amount of light per unit volume. A material with high conduction efficiency and good heat dissipation is more convenient.

In the present embodiment, the BS film is provided on a part of the contact surface 30b between the prism 30 and the transparent substrate 35, but the BS film is not limited to that region. For example, the contact surface between the transparent substrate 35 and the integrated circuit substrate 40 may be provided in a region near the light receiving element 41 on the back surface side of the transparent substrate 35.

In the present embodiment, the optical device 10 compatible with a magneto-optical signal has been described. However, as shown in FIG. 6, a light receiving element 41 for directly receiving reflected light from an optical disk (not shown) is divided, thereby Detection of phase difference of reflected light (D
The present invention can be applied to a DPD method compliant optical device for performing PD) in the same manner. Further, the number of optical blocks mounted on one integrated circuit board 40 is not limited to one. That is,
As shown in FIG. 7, a plurality of optical blocks may be mounted on one integrated circuit board 40. Further, the configuration may be such that the transparent substrate 35 of the plurality of optical blocks is shared by one sheet and is mounted on one integrated circuit board 40. In such a case, as shown in FIG. 7, different types of photodiodes 20 and prisms 30 may be used.

As described above, according to the optical device 10 of the present embodiment, since the optical block in which the photodiode 20 and the prism 30 are mounted on the transparent substrate 35 is provided, the light emitting point and the like in the state of the optical block are provided. Can be easily measured, and the position of each spot light of the transmitted light transmitted through the transparent substrate 35 can be calculated from the measurement result. Therefore, the calculated spot light positions are stored in the PD 41, PD 42a, P
The transparent substrate 3 is coupled to the light receiving area of D42b.
5 can be attached to the integrated circuit board 40,
High-precision positioning becomes possible.

Further, according to the optical device 10 of the present embodiment, the prism 30 is cut at the same time as the transparent substrate 35 is diced, so that the angle of the light receiving surface 30a with respect to the photodiode 20 can be maintained uniformly and with high precision. In addition to the effect, the prism 30 can be used efficiently and the manufacturing cost can be reduced. Further, since the positions of the wire bonding pad portions 44 can be arranged, for example, in the vicinity of the central portion of the integrated circuit board 40 as shown in FIG. 1, the wire bonding operation is facilitated, and the work efficiency of the assembling operation is improved.

Further, according to the optical device 10 of the present embodiment, since it is not necessary to form a circuit on the transparent substrate 35, the transparent substrate 35 can be set as small as possible, and the compact optical device 10 can be realized.

According to the optical device of the present embodiment, 1
When a plurality of optical blocks are mounted on one integrated circuit board 40, the film setting provided on each plane of the prism 30 can be set independently for each optical block. can do.

Further, according to the optical device of the present embodiment,
Since the transparent substrate 35 is formed of a sapphire substrate, the optical device 10 having high heat conduction efficiency and high heat dissipation can be realized.

[0061]

According to the optical device of the present invention, there is an advantage that the light transmitted through the first base can be accurately coupled to the light receiving region of the light receiving element. Further, according to the method for manufacturing an optical device of the present invention, an optical device having the above-described advantages can be manufactured at low cost and easily.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of an optical device according to the present invention.

2A is a diagram for explaining a birefringent prism of the optical device shown in FIG. 1, and FIG. 2B is a diagram for explaining an optical block and an integrated circuit substrate of the optical device shown in FIG. FIG.

FIG. 3 is a flowchart showing a method of manufacturing the optical device shown in FIG.

FIG. 4 is a diagram for explaining how a photodiode and a prism used in the optical device shown in FIG. 1 are mounted on a transparent substrate.

FIG. 5 is a diagram for explaining a state in which a transparent substrate on which a photodiode and a prism are mounted is mounted on an integrated circuit substrate.

FIG. 6 is a perspective view showing an optical device compatible with the DPD method.

FIG. 7 is a perspective view illustrating a state in which two optical blocks are mounted on one integrated circuit board.

FIG. 8 is a perspective view showing a laser coupler.

9A is a side view of a conventional optical device, and FIG.
FIG. 10B is a top view of the optical device shown in FIG.

FIG. 10 is a perspective view of the optical device shown in FIG. 9;

11 is a diagram for explaining a light receiving element used in the optical device shown in FIG.

FIG. 12 is a perspective view showing a magneto-optical signal compatible optical device.

FIG. 13 is a diagram for explaining a light receiving element used in the optical device shown in FIG.

FIG. 14 is a perspective view showing an optical device compatible with the DPD method.

FIG. 15 is a diagram for explaining a light receiving element used in the optical device shown in FIG.

[Explanation of symbols]

10, 110 optical device, 20, 120 photodiode, 21, 121 laser diode, 23 PIN
Diode, 30, 130 ... Prism, 30a, 130
a ... light receiving surface, 35, 135 ... transparent substrate, 40, 140 ...
Integrated circuit board (PD-IC), 41, 42a, 42b ...
Light receiving element (PD), 43: Laser output monitoring light receiving element (PD), 44: Wire bonding pad, 100
… Laser coupler

Claims (24)

[Claims] 1. A first base having at least a part having a light transmitting property, at least one light emitting element mounted on the first base, and a first base mounted on the first base. The light-emitting element is placed at a predetermined interval, and at least a part of the light emitted from the light-emitting element is branched and radiated to the irradiation target, and the reflected light from the irradiation target passes through the first base. And a light receiving element, and the first base is attached so that transmitted light of the first base is coupled into a light receiving area of the light receiving element. An optical device having a second base. 2. The light splitting means is a spectroscope, and the spectroscope has a light splitting surface for splitting light emitted from the light emitting element and guiding reflected light from the irradiation object. The optical device according to claim 1, wherein: 3. The spectroscope is a birefringent spectroscope, and a contact surface between the birefringence spectroscope and a first base or a contact surface between the first base and the second base. On any one of the abutting surfaces, a branched film that partially transmits reflected light from the irradiation object guided inside the birefringent spectroscope and partially reflects the rest is provided. The optical device according to claim 2, wherein the second base is provided with at least two light receiving elements for detecting ordinary light and extraordinary light separated by the birefringent spectroscope. 4. The spectroscope has a continuous surface with a pair of opposing surfaces formed on the first base.
The optical device of claim 5. A plurality of light emitting elements on the first base,
A plurality of light branching means provided corresponding to each light emitting element are respectively mounted, and the second base is provided with a plurality of light beams transmitted through the first base and coupled to each other. 2. A light receiving element is provided.
The optical device of claim 6. The optical device according to claim 1, wherein said first base is made of a material having high thermal conductivity. 7. The second base has a plurality of light receiving elements, the second base has a plurality of light emitting elements, and a plurality of light branching elements provided corresponding to the respective light emitting elements. And a plurality of first bases on which the means are respectively mounted, are mounted such that each transmitted light transmitted through each of the first bases is coupled to each of the plurality of light receiving elements. 2. The optical device according to 1. 8. The optical device according to claim 7, wherein light-emitting elements having different emission wavelengths are mounted on the plurality of first bases. 9. The optical device according to claim 7, wherein light-emitting elements having different output intensities are mounted on the plurality of first bases. 10. The optical device according to claim 7, wherein said plurality of first bases are provided with light branching means having different waveguide characteristics. 11. An optical apparatus for reading information recorded on a disc by detecting the amount of reflected light of light applied to the optical disc, wherein at least a part of the first base has light transmissivity; At least one light-emitting element mounted on one base, and on the first base at a predetermined interval from the light-emitting element, and at least a part of light emitted from the light-emitting element. An optical branching unit for irradiating the optical disk with the light branched and guiding reflected light from the optical disk so as to pass through the first base; and a light receiving element; And a second base on which the first base is mounted such that the first base is coupled to a light receiving area of the light receiving element. 12. The light splitting means is a spectroscope, and the spectroscope has a light splitting surface for splitting outgoing light of the light emitting element and guiding reflected light from the optical disk. The optical device according to claim 10. 13. The spectroscope is a birefringent spectroscope, and a contact surface between the birefringence spectroscope and a first base or a contact surface between the first base and the second base. On any one of the abutting surfaces, a branch film that partially transmits reflected light from the optical disk guided inside the birefringent spectroscope and reflects the remaining light is provided. 13. The optical device according to claim 12, wherein the second base is provided with at least two light receiving elements for detecting ordinary light and extraordinary light separated by the birefringent spectroscope. 14. The optical device according to claim 12, wherein the spectroscope has a continuous surface with a pair of opposing surfaces formed on the first base. 15. A plurality of light emitting elements and a plurality of light branching means provided corresponding to each light emitting element are mounted on the first base, respectively. And a plurality of light receiving elements for coupling each transmitted light transmitted through the first base.
The optical device according to 0. 16. The optical device according to claim 10, wherein said first base is made of a material having high thermal conductivity. 17. The second base has a plurality of light receiving elements, and the second base has a plurality of light emitting elements and a plurality of light branching elements provided corresponding to each light emitting element. And a plurality of first bases on which the means are respectively mounted, are mounted such that each transmitted light transmitted through each of the first bases is coupled to each of the plurality of light receiving elements. 11. The optical device according to 10. 18. The optical device according to claim 17, wherein light-emitting elements having different emission wavelengths are mounted on the plurality of first bases. 19. The optical device according to claim 17, wherein light-emitting elements having different output intensities are mounted on the plurality of first bases. 20. An optical branching means having different waveguide characteristics is mounted on each of the plurality of first bases.
The optical device of claim 21. At least one light-emitting element and at least a part of light emitted from the light-emitting element are branched and irradiated on an object to be irradiated, and reflected light from the object is transmitted through the first base. Mounting the light branching means that guides the light on the first base having at least a part thereof having light transmittance; and a light emitting element and light mounted on the first base. A step of measuring the arrangement state of the branching means and calculating the transmission position of the transmitted light on the first base;
Mounting the first base on the second base so as to be coupled to the light receiving region of the light receiving element provided on the base. 22. A step of mounting the plurality of light emitting elements and the light branching means on the plurality of first bases formed on the wafer, and then cutting each of the first bases as an optical block. 22. The method for manufacturing an optical device according to claim 21, comprising: 23. The method of manufacturing an optical device according to claim 22, wherein the light branching means is placed over a plurality of optical blocks, and is cut at the same time as cutting each of the optical blocks. 24. After placing the optical blocks on the second bases formed on a plurality of wafers, respectively,
23. The method according to claim 22, further comprising the step of dividing the base into each base.
A manufacturing method of the optical device according to the above.