JPH11301774A - Carrier tape - Google Patents
Carrier tapeInfo
- Publication number
- JPH11301774A JPH11301774A JP10102677A JP10267798A JPH11301774A JP H11301774 A JPH11301774 A JP H11301774A JP 10102677 A JP10102677 A JP 10102677A JP 10267798 A JP10267798 A JP 10267798A JP H11301774 A JPH11301774 A JP H11301774A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- carrier tape
- center
- product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Packaging Frangible Articles (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Packages (AREA)
Abstract
(57)【要約】
【課題】ポケットに収納する製品の高さを一定にして、
自動装置で確実に取り出せるようにする。
【解決手段】ＩＣ等の電子部品を収納するポケット２の
底部中央部のスルーホール部３を底下げして内面をポケ
ット底部に対して凹状に形成する。スルーホール部３の
中央にパンチング方式によりスルーホール４を開け、型
くずれが生じることを防ぐとともにスルーホールのエッ
ジ部に生じたバリがスルーホール部の凹部から突出する
ことを防ぐ。
(57) [Summary] [Problem] Keep the height of the product stored in the pocket constant,
Make sure that automatic equipment can take it out. A through hole (3) at the center of the bottom of a pocket (2) for storing an electronic component such as an IC is lowered to form an inner surface in a concave shape with respect to the bottom of the pocket. A through-hole 4 is opened at the center of the through-hole 3 by a punching method to prevent a mold from being lost and to prevent a burr generated at an edge of the through-hole from protruding from a concave portion of the through-hole.
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、ＩＣ等の電子部
品等を収納して運搬や保管をするときに使用するキャリ
アテープに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier tape used for carrying and storing electronic parts such as ICs.
【０００２】[0002]
【従来の技術】ＩＣ等の電子部品等を収納して運搬や保
管をするためのキャリアテープには各種構造が採用され
ている。例えば、特開平５−４２１２６号公報に示され
たキャリアテープは、電子部品等を収納する収納部であ
るポケットを大小の複数段構造として、異なったサイズ
のＩＣを収納できるようにしている。また、特開平７−
１３２９６２号公報に示されたキャリアテープは、樹脂
又は金属殻なるフイルムやシートの上に、熱可塑性樹脂
を用い射出成形したＩＣ収納部を貼着している。特開平
７−３３５７３４号公報に示されたキャリアテープは、
ＩＣを収納するポケットの長辺側の両側内面に製品保持
用の突起部を設け、ＩＣのリードがポケットの側面に当
たることを防いでいる。2. Description of the Related Art Various structures have been adopted for carrier tapes for carrying and storing electronic components such as ICs. For example, in a carrier tape disclosed in Japanese Patent Application Laid-Open No. 5-42126, pockets, which are storage portions for storing electronic components and the like, have large and small multi-stage structures so that ICs of different sizes can be stored. In addition, Japanese Patent Application Laid-Open
The carrier tape disclosed in JP 132962A has an IC housing portion formed by injection molding using a thermoplastic resin on a film or sheet made of a resin or a metal shell. The carrier tape disclosed in JP-A-7-335934 is
Protrusions for holding the product are provided on the inner surfaces on both sides of the long side of the pocket for storing the IC to prevent the leads of the IC from hitting the side surfaces of the pocket.
【０００３】[0003]
【発明が解決しようとする課題】上記従来のキャリアテ
ープにおいては、ポケット底部のスルーホールの穴開け
は成形後にパンチング方式で行っていた。このため、パ
ンチング時に加えられる圧力により、図６に示すよう
に、ＩＣ等の製品を収納するポケット２のスルーホール
４の周囲の底部に型くずれを引き起こしたり、図７に示
すように、スルーホール４の周りにバリ７が生じて、ポ
ケット２の深さ寸法に誤差が生じる。このようなポケッ
トの型くずれやバリはＩＣ等の製品を収納する工程では
問題ないが、ポケットに収納した製品を自動装置で取り
出すときに、製品の高さが一定せず取り出し不良を発生
させる原因となる。In the above-mentioned conventional carrier tape, a through hole at the bottom of the pocket is formed by punching after molding. For this reason, the pressure applied at the time of punching causes the bottom of the pocket 2 for accommodating products such as ICs to be deformed at the bottom around the through hole 4 as shown in FIG. 6, or the through hole 4 as shown in FIG. Burr 7 occurs around the periphery of the pocket 2, and an error occurs in the depth dimension of the pocket 2. This type of pocket deformation and burrs are not a problem in the process of storing products such as ICs. However, when the products stored in the pockets are taken out by an automatic device, the height of the products is not constant and may cause a defective take-out. Become.
【０００４】この発明はかかる短所を改善し、ポケット
底部のスルーホールの穴開けをしたときのポケット底部
の型くずれを防止するとともにバリが発生してもポケッ
トの深さ寸法に影響を与えず、ポケットに収納した製品
を自動装置で確実に取り出すことができるキャリアテー
プを提供することを目的とするものである。[0004] The present invention improves the disadvantages, prevents the pocket bottom from being deformed when a through hole is formed in the bottom of the pocket, and does not affect the depth dimension of the pocket even if burrs occur. It is an object of the present invention to provide a carrier tape capable of surely taking out a product stored in an automatic device.
【０００５】[0005]
【課題を解決するための手段】この発明に係るキャリア
テープは、キャリアテープの製品を収納するポケットの
中央部のスルーホール部を底下げして、スルーホール部
の内面をポケットの底面に対して凹状に形成したことを
特徴とする。In a carrier tape according to the present invention, a through hole at the center of a pocket for accommodating a product of the carrier tape is lowered, and the inner surface of the through hole is positioned with respect to the bottom of the pocket. It is characterized by being formed in a concave shape.
【０００６】この発明に係る第２のキャリアテープは、
キャリアテープの製品を収納するポケットの底部の両側
面に底上げ部を設け、ポケットの中央にスルーホールを
形成したことを特徴とする。[0006] The second carrier tape according to the present invention comprises:
A bottom-up portion is provided on both sides of the bottom of the pocket for storing the carrier tape product, and a through hole is formed in the center of the pocket.
【０００７】この発明に係る第３のキャリアテープは、
キャリアテープの製品を収納するポケットの底部の中央
部に四角形の帯び状の底上げ部を設け、ポケットの中央
にスルーホールを形成したことを特徴とする。[0007] The third carrier tape according to the present invention comprises:
A rectangular band-shaped raised portion is provided at the center of the bottom of the pocket for storing the carrier tape product, and a through hole is formed at the center of the pocket.
【０００８】[0008]
【発明の実施の形態】この発明のエンボスキャリアテー
プは、ＩＣ等の電子部品を収納するポケットの底部中央
のスルーホール部を底下げして内面をポケット底部に対
して凹状に形成する。このスルーホール部の中央にパン
チング方式によりスルーホールを開ける。このスルーホ
ールを開けるときに、局部的に底下げしてあるスルーホ
ール部を押さえてスルーホールを開けるから、型くずれ
が生じることを防ぐことができる。また、内面が凹状に
形成されたスルーホール部にスルーホールを開けるか
ら、スルーホールのエッジ部にバリが生じてもスルーホ
ール部の凹部から突出することを防ぐ。BEST MODE FOR CARRYING OUT THE INVENTION The embossed carrier tape of the present invention has a through hole at the center of the bottom of a pocket for accommodating an electronic component such as an IC, and the inner surface is formed to be concave with respect to the bottom of the pocket. A through hole is formed at the center of the through hole by a punching method. When the through-hole is opened, the through-hole is opened by pressing the through-hole part which is locally lowered, so that it is possible to prevent the mold from being lost. Further, since the through-hole is formed in the through-hole portion whose inner surface is formed in a concave shape, even if burrs are generated at the edge portion of the through-hole, the through-hole is prevented from protruding from the concave portion of the through-hole portion.
【０００９】[0009]
【実施例】図１はこの発明の一実施例のキャリアテープ
の構成を示す断面図である。図に示すように、可逆性樹
脂素材で真空または射出成型方法で製造されるエンボス
キャリアテープ１のＩＣ等の電子部品を収納するポケッ
ト２の底部中央のスルーホール部３は底下げして、内面
がポケット底部に対してが凹状に形成されている。この
スルーホール部３の中央にパンチング方式により、図１
（ｂ）に示すようにスルーホール４を開ける。このよう
にスルーホール部３にスルーホール４を開けるときに、
局部的に底下げしてあるスルーホール部３を押さえてス
ルーホール４を開けるから、型くずれが生じることを防
ぐことができる。また、内面が凹状に形成されたスルー
ホール部３にスルーホール４を開けるから、スルーホー
ル４のエッジ部にバリが生じてもスルーホール部３の凹
部から突出することがなく、ポケット２内に収納する製
品の底部に当たることを防ぐことができ、ポケット２内
に収納した製品を一定高さで保管することができる。FIG. 1 is a sectional view showing the structure of a carrier tape according to one embodiment of the present invention. As shown in the figure, a through hole 3 at the center of the bottom of a pocket 2 for accommodating an electronic component such as an IC of an embossed carrier tape 1 manufactured by a vacuum or injection molding method using a reversible resin material is lowered to the inner surface. Is formed concavely with respect to the pocket bottom. The center of the through hole 3 is punched by a punching method as shown in FIG.
A through hole 4 is opened as shown in FIG. Thus, when opening the through hole 4 in the through hole part 3,
Since the through-hole 4 is opened by pressing the through-hole 3 locally lowered, it is possible to prevent the mold from being lost. In addition, since the through hole 4 is formed in the through hole 3 having an inner surface formed in a concave shape, even if burrs are generated at the edge of the through hole 4, the through hole 4 does not protrude from the recess of the through hole 3 and remains in the pocket 2. The product stored in the pocket 2 can be prevented from hitting the bottom of the stored product, and can be stored at a constant height.
【００１０】上記実施例はエンボスキャリアテープ１の
ポケット２のスルーホール部３を局部的に底下げした場
合について説明したが、ＳＰＯ，ＳＯＪタイプＩＣを収
納するキャリアテープ１の場合には、図２の断面図と図
３の平面図の（ａ）に示すように、収納する製品のリー
ド端子の無い側のポケット２の両端に底上げ部５を設
け、両端の底上げ部５の上面で製品のボディ両端を保持
すると良い。このように底上げ部５で製品を保持するか
ら、ポケット２の中央にスルーホール４をパンチングで
形成するときに型くずれやバリに影響されずに、収納し
た製品の高さを一定にすることができる。この場合、底
上げ部５は、図３（ｂ）に示すように、ポケット２の両
端部より離して設けても良い。In the above embodiment, the case where the through hole 3 of the pocket 2 of the embossed carrier tape 1 is locally lowered has been described. In the case of the carrier tape 1 which accommodates SPO and SOJ type ICs, FIG. As shown in the cross-sectional view of FIG. 3 and the plan view of FIG. 3A, bottom-height portions 5 are provided at both ends of the pocket 2 on the side where the lead terminal of the product to be housed does not have a lead terminal. It is good to hold both ends. Since the product is held by the bottom raised portion 5 in this manner, the height of the stored product can be made constant without being affected by mold collapse and burrs when the through hole 4 is formed in the center of the pocket 2 by punching. . In this case, as shown in FIG. 3B, the raised bottom portion 5 may be provided apart from both ends of the pocket 2.
【００１１】また、ＱＦＰ，ＱＦＪタイプＩＣを収納す
る場合は、図４の断面図と図５の平面図（ａ）に示すよ
うに、ポケット２の中央部に一定大きさで四角形の帯び
状の底上げ部６を設け、底上げ部６の上面で製品を保持
すると良い。このように、四角形状の底上げ部６で製品
を保持するから、ポケット２の中央にスルーホール４を
パンチングで形成するときに型くずれやバリに影響され
ずに、収納した製品の高さを一定にすることができる。
この場合、底上げ部６は、図５（ｂ）に示すように、四
角形の４隅だけで形成したり、図５（ｃ）に示すよう
に、四角形の４辺だけで形成しても良い。When a QFP or QFJ type IC is to be stored, as shown in the sectional view of FIG. 4 and the plan view (a) of FIG. It is preferable to provide the bottom raising portion 6 and hold the product on the upper surface of the bottom raising portion 6. As described above, since the product is held by the square-shaped raised portion 6, the height of the stored product can be kept constant without being affected by mold collapse and burrs when the through hole 4 is formed in the center of the pocket 2 by punching. can do.
In this case, the bottom raising portion 6 may be formed only at four corners of a square as shown in FIG. 5B, or may be formed only at four sides of the square as shown in FIG. 5C.
【００１２】[0012]
【発明の効果】この発明は以上説明したように、キャリ
アテープのスルーホール部をポケットの底面より底下げ
して凹部を形成し、このスルーホール部にスルーホール
を開けるようにしたから、スルーホールをパンチングに
より開けるときに型くずれが生じることを防ぐことがで
きるとともにスルーホールのエッジ部にバリが生じても
スルーホール部の凹部から突出することがなく、ポケッ
ト内に収納した製品を一定高さで保管することができ
る。As described above, according to the present invention, the through hole of the carrier tape is lowered from the bottom of the pocket to form a recess, and the through hole is formed in the through hole. Can be prevented from breaking when punching the product, and even if burrs are formed at the edge of the through hole, it does not protrude from the recess of the through hole, and the product stored in the pocket at a certain height Can be stored.
【００１３】また、ＳＯＰ，ＳＯＪタイプのＩＣを収納
するポケットのＩＣのリードの無い側にＩＣを保持する
底上げ部を設けることにより、ポケットの中央にスルー
ホールをパンチングで形成したときの型くずれやバリに
影響されずに、収納したＩＣの高さを一定にすることが
できる。Further, by providing a raised portion for holding the IC on the side of the pocket for storing the SOP or SOJ type IC on the side of the IC where the IC is not provided with a lead, it is possible to lose the shape and burrs when a through hole is formed in the center of the pocket by punching. The height of the stored IC can be made constant without being affected by the above.
【００１４】また、ＱＦＰ，ＱＦＪタイプのＩＣを保持
する底上げ部をポケットの中央部に四角形の帯び状に形
成し、その中央にスルーホールをパンチングで形成する
から、スルーホールをパンチングで形成したときの型く
ずれやバリに影響されずに、収納したＩＣの高さを一定
にすることができる。Further, since the bottom raised portion for holding the QFP and QFJ type ICs is formed in a rectangular band shape at the center of the pocket and the through hole is formed at the center by punching, the through hole is formed by punching. The height of the stored IC can be made constant without being affected by the shape collapse and burrs.
【図１】この発明の実施例の構成を示す断面図である。FIG. 1 is a sectional view showing a configuration of an embodiment of the present invention.
【図２】第２の実施例の構成を示す断面図である。FIG. 2 is a cross-sectional view illustrating a configuration of a second embodiment.
【図３】第２の実施例の構成を示す平面図である。FIG. 3 is a plan view showing a configuration of a second embodiment.
【図４】第３の実施例の構成を示す断面図である。FIG. 4 is a sectional view showing a configuration of a third embodiment.
【図５】第３の実施例の構成を示す平面図である。FIG. 5 is a plan view showing a configuration of a third embodiment.
【図６】従来例を示す断面図である。FIG. 6 is a sectional view showing a conventional example.
【図７】他の従来例を示す断面図である。FIG. 7 is a sectional view showing another conventional example.
１ キャリアテープ ２ ポケット ３ スルーホール部 ４ スルーホール ５ 底上げ部 ６ 底上げ部 DESCRIPTION OF SYMBOLS 1 Carrier tape 2 Pocket 3 Through hole part 4 Through hole 5 Bottom raising part 6 Bottom raising part
Claims (3)
トの中央部のスルーホール部を底下げして、スルーホー
ル部の内面をポケットの底面に対して凹状に形成したこ
とを特徴とするキャリアテープ。1. A carrier tape characterized in that a through hole at a central portion of a pocket for accommodating a product of a carrier tape is lowered, and an inner surface of the through hole is formed in a concave shape with respect to a bottom surface of the pocket.
トの底部の両側面に底上げ部を設け、ポケットの中央に
スルーホールを形成したことを特徴とするキャリアテー
プ。2. A carrier tape comprising a pocket for accommodating a carrier tape product, a bottom raised portion provided on both sides of a bottom of the pocket, and a through hole formed in the center of the pocket.
トの底部の中央部に四角形の帯び状の底上げ部を設け、
ポケットの中央にスルーホールを形成したことを特徴と
するキャリアテープ。3. A rectangular band-shaped raised portion is provided at the center of the bottom of the pocket for storing the product of the carrier tape,
A carrier tape having a through hole formed in the center of a pocket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10267798A JP3860659B2 (en) | 1998-04-14 | 1998-04-14 | Carrier tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10267798A JP3860659B2 (en) | 1998-04-14 | 1998-04-14 | Carrier tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11301774A true JPH11301774A (en) | 1999-11-02 |
| JP3860659B2 JP3860659B2 (en) | 2006-12-20 |
Family
ID=14333874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10267798A Expired - Fee Related JP3860659B2 (en) | 1998-04-14 | 1998-04-14 | Carrier tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3860659B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9698040B2 (en) * | 2015-10-29 | 2017-07-04 | Stmicroelectronics (Malta) Ltd | Semiconductor device carrier tape with image sensor detectable dimples |
| JP2018024473A (en) * | 2016-07-27 | 2018-02-15 | 太陽誘電株式会社 | Carrier tape for electronic component storage tape, electronic component storage tape, and method of manufacturing electronic component storage tape |
-
1998
- 1998-04-14 JP JP10267798A patent/JP3860659B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9698040B2 (en) * | 2015-10-29 | 2017-07-04 | Stmicroelectronics (Malta) Ltd | Semiconductor device carrier tape with image sensor detectable dimples |
| JP2018024473A (en) * | 2016-07-27 | 2018-02-15 | 太陽誘電株式会社 | Carrier tape for electronic component storage tape, electronic component storage tape, and method of manufacturing electronic component storage tape |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3860659B2 (en) | 2006-12-20 |
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