JPH11310322A - Bulk feeder - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To supply chip components to a component supply unit at high speed in a bulk feeder that sends chip components supplied from a bulk case to a component supply unit to a component supply device through a conveyance path by air. And do it reliably. A component transport path for transporting a chip component.
7, the upper wall surface 17a
, That is, the bottom wall surface 17b and the left and right side wall surfaces 17
c, 17c are formed on the fine uneven surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a novel bulk feeder. More specifically, the present invention relates to a bulk feeder for supplying chip components to a chip component mounter, and a technique for reliably and quickly supplying chip components to a component supply unit.

[0002]

2. Description of the Related Art Chip components (electronic components) on printed circuit boards
There is known a chip component mounter for mounting a chip. This will be briefly described with reference to FIGS.

[0003] The chip component mounter a is provided with a component supply device b for supplying chip components in a bulk, that is, unpacked state, to a printed circuit board at a substantially central portion thereof. A large number of bulk feeders d, d,... Are arranged in the moving direction of the moving base c on the moving base c of the component supply device b (see FIGS. 10 and 11).

In the bulk case e, chip components f, f,
... are stored in large numbers. The bulk case e has a thin box shape, and an opening g is formed in a front end surface thereof, and the opening g is opened and closed by an opening / closing plate h (see FIG. 3).

FIGS. 1 and 3 show a conventional bulk feeder and bulk case, which are also used in an embodiment according to the present invention described later. What is shown is a conventional example.

[0006] The bulk case e is engaged with the guide portion i of the bulk feeder d and attached to the bulk feeder d, and the opening / closing plate h is slid to open the opening g. Thus, the bulk case e is set in the bulk feeder d (see FIG. 1).

When the bulk case e is set in the bulk feeder d, a large number of chip components f, f,... Stored in the bulk case e enter the component storage j at the rear of the bulk feeder d. come.

In the bulk feeder d, a rather wide space k called a chamber is formed through a bottleneck following the front side of the component storage section j, and a component alignment chamber 1 is directed forward from the front end of the chamber k. Further, a component transport path m extends forward from the front end of the component alignment chamber l, and a component supply section n is formed at the front end of the component transport path m, and the component storage section j, the chamber k, The bottom surfaces of the component alignment chamber 1 and the second half of the component transport path m are continuous and inclined forward and downward (see FIG. 12).

The component transport path m is formed so that most of it extends in the front-rear direction, but the front half of the almost horizontal portion gradually forms a curve, and its end (component supply unit n) Is oriented in a direction orthogonal to the front-rear direction.

[0010] An air outlet o for conveying components is opened at a part of the component conveying path m slightly forwardly separated from the component alignment chamber l in a direction facing the front end of the component conveying path m. An air outlet p for stirring is formed rearwardly, that is, in a direction facing the chamber k, at a front end of the component alignment chamber 1 slightly behind the air outlet o for transport.
Further, another air blowing port q for stirring is opened on the lower surface of the front end of the component storage section j so as to face slightly rearward (see FIG. 12).

The former air blowing port p for stirring is:
After the air is blown out to agitate the chip parts, the air blowout is stopped and the chip parts f, f,.
, And hereinafter referred to as a stirring alignment air outlet p, and the latter stirring air outlet q.
Blows air to agitate the chip components, then stops blowing air and places chip components f, f,.
.. Is hereinafter referred to as an air inlet q for stirring.

An air supply port r is provided in the bulk feeder d, and an air supply path s extending from the air supply port r toward the inside is formed. One is connected to the stirring air outlet p, and the other is an air outlet o for conveying components.
It is connected to the.

Further, the air supply passage s is further branched before the stirring air outlet p, and its tip extends to the vicinity of the component storage j and is connected to the stirring air outlet q. I have.

A positive-pressure air supply device (not shown) is connected to the air supply port r of the bulk feeder d. When positive-pressure air is supplied from the air supply port r, the air passes through the air supply path s, and the air flows through the air supply path s. Air is spouted from the air outlets o, p, and q. The positive-pressure air supplied to the air supply port r is intermittently supplied, and therefore, the air ejected from each of the air outlets o, p, and q is also intermittent.

The cross section of the component conveying path m is chip component f.
Therefore, the positive pressure air supplied into the component conveying path m pushes the chip component f from behind to move the chip component f forward, and the tip component f is shifted toward the front end. Is supplied to the component supply unit n.

The chip components f, f,... Arranged in the component alignment chamber 1 sequentially enter the component transport path m, and the chip component f is located at the component supply section n and will be described later. When the chip component f is taken out by the suction nozzle, the next reserved chip component f is immediately moved into the component supply unit n, thereby increasing the speed of component supply from the component supply unit n of the chip component f. Making it possible. In other words,
It is necessary for a high-speed component supply that a plurality of chip components f, f,... Are located in the component transport path m.

A shutter t is provided at the upper part of the component supply unit n so as to be openable and closable. The opening and closing of the shutter t is performed by a pressing unit (not shown) of the chip component mounter a.
By pressing the feed lever u of the bulk feeder d. The supply of the positive pressure air is performed when the shutter t is closed, and when the shutter t is opened, the supply of the positive pressure air is stopped.

The chip component f supplied to the component supply section n can be taken out by opening the shutter t. The chip component f is taken out by the suction nozzle v of the chip component mounter a and mounted on the printed circuit board. ing.

[0019]

However, in such a bulk feeder d, with the miniaturization of the chip component f, a plurality of chip components f,
f, ... are stuck on the inner surface of the parts conveying path m,
Even if a plurality of chip components f, f,... Are congested as a lump on the component conveying path m and air is blown out from the component conveying air outlet o, the leading chip component f is supplied to the component supply unit. The problem of not moving to n occurs.

Since the inner surface of the component transport path m is formed as a smooth surface, when the chip component f is located in the component transport path m, one surface of the chip component f is placed on the inner surface of the component transport path m (bottom or bottom). This is because the chip parts f, f, f, f, f, f, f, f, f, f,. .. Are hindered from moving quickly, and as a result, the supply of the chip component f cannot be speeded up.

Further, in order to take out the chip component f located in the component supply section n, it is necessary that the chip component f does not receive a pressing force from the next chip component f to be withdrawn.
When the movement of the chip components f, f,... In the component conveying path m becomes slow, it becomes difficult to release the residual pressure between the chip components f, f,. The component f is pressed, and the component f cannot be taken out until the residual pressure is released. This also hinders the speeding up of component supply.

.. Have become more remarkable as the chip components f, f,... Have become smaller, and the conventional minimum chip component f has a size of 0 mm. 0.8 × 0.8 × 1.6 (mm), but in recent years, a chip component f having a size of 0.5 × 0.5 × 1.0 (mm) has appeared, and a component using the bulk feeder d has been developed. The above-mentioned problems are occurring in the supply, and 0.3 ×
A chip component f having a size of 0.3 × 0.6 (mm) has been developed, and component supply by a bulk feeder d is being studied.

Therefore, in the conventional bulk feeder d, the chip components f, f,.
・ It is expected that traffic congestion will become a problem in the future.

[0024]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the bulk feeder of the present invention has a component transporting path for transporting chip components.
At least one wall surface except the upper wall surface is formed as a fine uneven surface.

Therefore, according to the bulk feeder of the present invention,
Even when chip components are being miniaturized, the chip components do not come into surface contact with the inner surface in the component transport path, and therefore can be smoothly transported to the component supply unit without sticking to the inner surface. Accordingly, it is possible to increase the speed of component supply, and to cope with downsizing of chip components.

[0026]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a bulk feeder according to the present invention.

The bulk feeder 1 according to the present invention has a frame 2 to which required members are attached. Note that the bulk feeder 1 according to the present invention is the same as the known one except for the structure of the component transport path, and therefore the portions other than the component transport path will be briefly described.

A clamp lever 3 is provided at the rear end of the frame 2.
The clamp claw 4 operated by the clamp lever 3 is attached to the lower end of the clamp lever 3 (see FIG. 1).

Positioning pins provided at two front and rear positions on the lower surface of the frame 2 are fitted and connected to positioning holes at the upper end of the moving base 6 of the component supply device 5, and are connected to the front edge of the rear end of the moving base 6. The clamp claw 4 is locked, and the bulk feeder 1 is attached to the moving base 6 (see FIG. 2).

At the upper part of the frame 2 at a position slightly forward from the center, a guide 7 which is deviated downward as it goes forward.
The bulk case 8 is attached by being guided by the guide 7 (see FIG. 1).

The bulk case 8 has a flat box shape.
An opening 9 is formed at the front end, and the opening 9 is opened and closed by an opening / closing plate 10 (see FIG. 3).

A knob 11 is provided at the base end of the opening / closing plate 10, and the knob 11 is located in a facing hole 12 formed on the upper surface of the bulk case 8. In such a bulk case 8, the chip components 13, 13,.
Is stored and supplied. When the bulk case 8 is attached to the bulk feeder 1, the opening / closing plate 10 is opened, and the opening 9 is opened.

As described above, when the bulk case 8 is attached to the bulk feeder 1, the chip components 13, 13,
.. Enter into the component storage section 14 at the rear of the bulk feeder 1 (see FIG. 4).

In the frame 2 of the bulk feeder 1, a chamber 15, a component aligning chamber 16, and a component transport path 17 are provided following the front side of the component storage unit 14.
4. Chamber 15, parts alignment chamber 16, and parts transport path 1
The bottom surface of the latter half of 7 is continuous and inclined forward and downward.

The chip component 13 is, for example, a 1608C type ceramic capacitor having a shape of 0.1 mm.
8 × 0.8 × 1.6 (mm) rectangular parallelepiped, both ends in the longitudinal direction are electrode portions 13a, 13a (see FIG. 5), and the component transport path 1 for transporting such chip components 13
7 has a square shape of 0.96 × 0.96 (mm) (see FIG. 6). Here, as an example, 1
608C type ceramic capacitor
As described in the “Prior Art” section, in recent years, as chip components have become smaller, the cross-sectional shape of the component transport path 17 has also become smaller in correspondence with the supplied chip components.

The side surfaces of the component storage unit 14, the chamber 15, and the component alignment chamber 16 are covered by a side cover 18 attached to the frame 2, and the front half of the component transport path 17 is located near the horizontal front end. Is covered by the tip cover 19, and the upper surface of the front half thereof is covered by the transparent cover 20, and is formed in a tunnel shape except for the front end portion (see FIG. 4).

The front half of the substantially horizontal part of the front part of the component transport path 17 has a gentle curve as seen from the vertical direction as shown in FIG. They are oriented in a direction perpendicular to the direction. The upper end of the end of the component transport path 17 is opened to form a component supply unit 21.
The upper surface of 1 is a component extraction opening 21a (see FIG. 8).

The transparent cover 20 is for visually observing the state of the part conveying path 17 on the front side of the part supply unit 21.

A shutter 22 is openably and closably provided on the upper surface of the component supply section 21, that is, the component take-out opening 21a, and the shutter 22 is opened by a pressing section (not shown) of the chip component mounting machine. ) Is performed by pressing the feed lever 23 of the bulk feeder 1. The chip component 13 supplied to the component supply unit 21 can be taken out by opening the shutter 22 (see FIG. 9).

The bottom wall 17b and the left and right side walls 17b of the walls forming the component transfer path 17 excluding the upper wall 17a.
c and 17c are formed on a fine uneven surface.

That is, for example, when the component transport path 17 is formed in the frame 2 made of SK steel, the component transport path 17 is blasted with aluminum powder to form a fine uneven surface. For example, nickel plating is applied to protect the fine uneven surface, improve the wear resistance, and reduce the friction coefficient. The method for forming the fine uneven surface is not limited to this.

An upper wall surface 17a constituting the component transport path 17
That is, on the lower surface of the front cover 19 and on the lower surface of the transparent cover 20, air air flow grooves 19a and 20a which become auxiliary air flow paths 24 are formed along the component conveying path 17, and the auxiliary air flow paths 24 While the shape is rectangular,
The component transport path 17 is formed over substantially the entire length, and one end 24a of the component transport path 17 reaches the component supply unit 21 (see FIG. 8).

Since the width of the auxiliary air passage 24 is smaller than the width of the component transport path 17 and the chip components 13, 13,... The flowing air flow has a high speed, so that the venturi effect is generated, and a negative pressure is generated between the air flow and the chip component 13, so that the chip component 13 is easily floated.

The component alignment chamber 16 of the component transport path 17
A part of the air outlet 2 for parts transportation
5 is formed, and a stirring alignment air outlet 26 is formed at the front end of the component alignment chamber 16 slightly behind the component transport air outlet 25, and on the lower surface of the front end of the component storage unit 14. An air inlet 27 for stirring and drawing in is opened (see FIG. 4).

An air supply port 28 is formed at the upper end of the frame 2, and an air supply path 29 extending from the air supply port 28 toward the inside of the frame 2 is formed.
9 is branched at its tip into two, one of which is connected to the above-mentioned stirring air outlet 26, the other is connected to the parts conveying air outlet 25, and the stirring and alignment air outlet 26. The fork is further branched in the foreground, and its front end extends to the vicinity of the component storage section 14 and is connected to the stirring-in air blowing outlet 27.

The air supply port 28 of the bulk feeder 1
A positive pressure air supply device (not shown) is connected to the air supply port 2.
When the positive-pressure air is supplied from 8, the air is blown out from each of the air outlets 25, 26, and 27 through the air supply path 29. Incidentally, the positive pressure air supplied to the air supply port 28 is intermittently supplied.
The air ejected from 5, 26, 27 is also intermittent.

The supply of the positive pressure air is performed when the shutter 22 is closed, and when the shutter 22 is opened,
The supply of the positive pressure air is stopped.

When the positive-pressure air is intermittently supplied from a positive-pressure air supply device (not shown) connected to the air supply port 28, the supply of the positive-pressure air is performed in the same manner as in the above-described conventional example. , Chip components 13, 13,... Are supplied to the component supply unit 21 through the component transport path 17 (see FIG. 4).

FIG. 4 is a cross-sectional view showing a main part of the bulk feeder 1. The portion between the two dashed lines is a portion omitted in the middle, and the right portion of the portion omitted in the middle is the bulk. 1 shows a vertical cross-sectional view of the feeder 1, and the left side shows a cross-sectional view of the bulk feeder 1.

The chip component 13 passing through the component transport path 17 has a small contact area with the bottom wall face 17b because the bottom wall face 17b of the component transport path 17 is formed with a fine uneven surface. The chip component 13
Are not stuck to the bottom wall surface 17b of the component transport path 17, so that the chip components 13, 13,... Do not clump in the component transport path 17, and therefore, the components are supplied by air supply. The chip components 13, 1
.. Can move smoothly, and the chip components 13 can sequentially reach the component supply unit 21 without any delay.

The left and right side walls 17c, 17 of the component transport path 17
Since c is also formed on the fine uneven surface, even if it is pressed against the outer side surface by the centrifugal force even in the curved portion of the first half portion, it does not come into surface contact with the side wall surface 17c, and the contact resistance is small, and it is smooth. The chip component 13 can pass through.

The speed of the air flow flowing through the auxiliary air flow passage 24 depends on the chip component 1 transported in the component transport path 17.
3, a suction force is generated in the chip component 13 by Bernoulli's theorem, and the chip component 1
3 slightly floats from the bottom surface of the component transport path 17, the friction between the chip component 13 and the bottom surface of the component transport path 17 is further reduced, and the chip components 13, 13,. 17 can be moved smoothly.
Further, since the friction between the bottom surface of the component conveying path 17 and the chip component 13 is reduced, the chip component 13 can be conveyed at a correspondingly high speed, and the wear of the chip component 13 is reduced. The generation of flour and chips is reduced.

Further, the positive pressure air jetted from the component conveying air outlet 25 to the component conveying path 17 is supplied to the auxiliary air flow path 2.
Since the positive pressure air that has passed through 4 is discharged to the outside from the component supply unit 21, even if there is a space between the chip components 13, the air in the space flows outside through the auxiliary air flow passage 24. The space between the chip components 13 is less likely to be generated, so-called air cushion does not occur, and the leading chip component 13 is pressed against the end wall surface 17d of the component transport path 17 to be accurately positioned at a predetermined position. Can be.

Since no positive pressure remains in the component transport path 17, the first chip component 1 located in the component supply section 21
3 does not jump out of the component supply unit 21 at the same time when the shutter 22 is opened, and does not run on the periphery thereof.

[0055]

As is apparent from the above description, the bulk feeder of the present invention has at least one of the walls excluding the upper wall among the walls constituting the component conveying path through which the chip components are passed by air. It is formed on a fine uneven surface.

Therefore, in the bulk feeder of the present invention, since the contact area between the chip component and the inner surface of the component transport path is small and the two are not in surface contact, the chip component is stuck on the wall surface of the component transport path. It will not stick,
The chip components do not clump in the component transport path, so that the chip components can move smoothly in the component transport path by the supply of air, and the chip components reach the component supply unit without delay. Can be. And
As a result, the congestion of the chip components in the component transport path, which has conventionally occurred with the miniaturization of the chip components, can be eliminated, and the chip components can be supplied at high speed and reliably.

According to the second aspect of the present invention, since the bottom wall surface of the component transport path is formed with an uneven surface, the chip component does not stick to the bottom surface of the component transport path, and the chip component can be smoothly removed. It can be transported to the supply unit.

According to the third and fourth aspects of the present invention, since the side wall surface of the component conveying path is formed with an uneven surface,
Even if the component transport path is curved, the chip component does not stick to the side wall surface, and the chip component can be smoothly transported to the component supply unit.

According to the inventions described in claims 5 to 8, the auxiliary air flow passage is formed along the component transport path on the upper wall surface constituting the component transport path. The high-speed airflow that flows through the components allows the chip components to float in the component transport path, further reducing the friction between the chip components and the bottom surface of the component transport path, allowing the chip components to move smoothly in the component transport path. Can be moved.

It should be noted that the shapes and structures of the respective parts shown in the above-described embodiments are merely examples of the embodiment of the present invention, and the technical scope of the present invention is thereby reduced. It should not be interpreted restrictively.

[Brief description of the drawings]

FIG. 1 shows an embodiment of a bulk feeder of the present invention together with FIG. 2 to FIG. 9, and this figure is a schematic perspective view.

FIG. 2 is a schematic side view showing a state where the apparatus is attached to a component supply device.

FIG. 3 is a perspective view showing a bulk case.

FIG. 4 is an enlarged longitudinal sectional view showing a main part.

FIG. 5 is an enlarged perspective view of a chip component.

FIG. 6 is an enlarged cross-sectional view of a main part when the inside of the component transport path is viewed from the transport direction.

FIG. 7 is a plan view of a distal end portion of the bulk feeder.

FIG. 8 is an enlarged cross-sectional view showing a component supply unit.

FIG. 9 is an enlarged sectional view taken along line IX-IX in FIG. 7;

FIG. 10 schematically shows the component supply device together with FIG. 11, and FIG. 10 is a perspective view.

FIG. 11 is a side view.

FIG. 12 is an enlarged longitudinal sectional view showing an example of a conventional bulk feeder.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Bulk feeder, 13 ... Chip component, 17 ... Component conveyance path, 17a ... Top wall surface, 17b ... Bottom wall surface, 17c ... Side wall surface, 21 ... Component supply part, 24 ... Auxiliary air flow passage

Claims (8)

[Claims] 1. A bulk feeder for transporting chip components on a component transport path by air flow and supplying the component to a component supply unit for a component mounting machine mounted on a printed circuit board. A bulk feeder characterized in that at least one wall surface excluding an upper wall surface is formed on a fine uneven surface. 2. The bulk feeder according to claim 1, wherein the uneven surface is formed on a bottom wall surface of the component conveying path. 3. The bulk feeder according to claim 1, wherein the uneven surface is formed on a side wall surface of the component conveying path. 4. The bulk feeder according to claim 2, wherein the uneven surface is formed on a side wall surface of the component conveying path. 5. The bulk feeder according to claim 1, wherein an auxiliary air flow path is formed along an upper surface of the component conveying path along the component conveying path. 6. The bulk feeder according to claim 2, wherein an auxiliary air flow path is formed along an upper surface of the component transport path along the component transport path. 7. The bulk feeder according to claim 3, wherein an auxiliary air flow path is formed along an upper surface of the component conveying path along the component conveying path. 8. The bulk feeder according to claim 4, wherein an auxiliary air flow passage is formed along an upper surface of the component conveying path along the component conveying path.