JPH11319734A - Cleaning device, cleaning method and substrate - Google Patents
Cleaning device, cleaning method and substrateInfo
- Publication number
- JPH11319734A JPH11319734A JP6891999A JP6891999A JPH11319734A JP H11319734 A JPH11319734 A JP H11319734A JP 6891999 A JP6891999 A JP 6891999A JP 6891999 A JP6891999 A JP 6891999A JP H11319734 A JPH11319734 A JP H11319734A
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- cleaning liquid
- substrate
- tank
- supply port
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 241
- 239000000758 substrate Substances 0.000 title claims abstract description 57
- 238000000034 method Methods 0.000 title claims description 6
- 239000007788 liquid Substances 0.000 claims abstract description 81
- 238000005202 decontamination Methods 0.000 abstract description 10
- 230000003588 decontaminative effect Effects 0.000 abstract description 10
- 238000011109 contamination Methods 0.000 abstract description 2
- 238000009792 diffusion process Methods 0.000 description 10
- 239000010419 fine particle Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
Landscapes
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
(57)【要約】
【課題】基板の洗浄を均一にかつ効率的に行うことがで
き、基板の再汚染を効果的に防止でき、汚染除去作業の
回数を減らすことができ、たとえ汚染除去作業を行う場
合でも容易に汚染除去作業を行うことができる優れた洗
浄装置を提供する。
【解決手段】洗浄槽11の底部にある洗浄液供給口16
から洗浄液2を洗浄槽11に供給して、互いに並列して
配置された複数の基板4を洗浄するための洗浄装置10
において、洗浄液供給口16と底部と壁部とが滑らかに
つながっているように構成した。
[PROBLEMS] To uniformly and efficiently clean a substrate, effectively prevent re-contamination of a substrate, and reduce the number of times of decontamination work. An excellent cleaning device capable of easily performing a decontamination operation even when performing cleaning. A cleaning liquid supply port (16) at a bottom of a cleaning tank (11).
For supplying a cleaning liquid 2 to a cleaning tank 11 for cleaning a plurality of substrates 4 arranged in parallel with each other.
In the above, the cleaning liquid supply port 16, the bottom, and the wall are smoothly connected to each other.
Description
【0001】[0001]
【発明の属する技術分野】本発明は、洗浄槽に収納した
水晶基板やガラス等の基板に、薬液や純水などの洗浄液
を用いて基板を洗浄する洗浄装置に関する。また、その
ような洗浄装置を用いた洗浄方法及びそのような洗浄装
置によって洗浄された基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning apparatus for cleaning a substrate such as a quartz substrate or glass housed in a cleaning tank by using a cleaning solution such as a chemical solution or pure water. Further, the present invention relates to a cleaning method using such a cleaning device and a substrate cleaned by such a cleaning device.
【0002】[0002]
【従来の技術】従来の洗浄装置は、例えば特開平4−2
3433号公報の第1図、特開平5−267262号公
報の図1B、特開平8−17782号公報の図2に開示
されている。以下、図7〜図13を用いて、従来の洗浄
装置について説明する。2. Description of the Related Art A conventional cleaning apparatus is disclosed in, for example,
FIG. 1 of JP-A No. 3433, FIG. 1B of JP-A-5-267262, and FIG. 2 of JP-A-8-17782 are disclosed. Hereinafter, a conventional cleaning apparatus will be described with reference to FIGS.
【0003】図7に示す洗浄装置70は、洗浄槽71
と、洗浄槽71の壁部73の上部外周に設けられている
オーバーフロー部76とを備え、薬液又は純水で調整さ
れた洗浄液2を洗浄槽71内に満たすとともに、キャリ
アに収められた基板(図示せず)をこの洗浄液2に浸漬
するようになっている。そして洗浄槽71の底部72に
は洗浄液供給口74が設けられており、この洗浄液供給
口74から供給された洗浄液2は、洗浄槽71内を図8
に示す矢印のように流れ、オーバーフロー部76から洗
浄液1がオーバーフローされるような構造となってい
る。[0003] A cleaning apparatus 70 shown in FIG.
And an overflow portion 76 provided on the outer periphery of the upper portion of the wall portion 73 of the cleaning tank 71. The cleaning liquid 2 adjusted with a chemical solution or pure water is filled in the cleaning tank 71, and the substrate ( (Not shown) is immersed in the cleaning liquid 2. A cleaning liquid supply port 74 is provided at the bottom 72 of the cleaning tank 71, and the cleaning liquid 2 supplied from the cleaning liquid supply port 74 flows through the cleaning tank 71 in FIG.
And the cleaning liquid 1 overflows from the overflow section 76.
【0004】また、図9に示す洗浄装置90は、洗浄槽
91の底部の洗浄液供給口94から、洗浄槽91内に微
粒子等を流入することを防止するために設けたフィルタ
97を介して洗浄液2を供給している。そして、さら
に、図10に示すようなほぼ多数の供給口99が形成さ
れた拡散板98を介して基板4に向けて洗浄液2を供給
させることにより、基板4を効率良く洗浄しようとして
いる。A cleaning apparatus 90 shown in FIG. 9 is provided with a cleaning liquid 97 through a filter 97 provided to prevent fine particles and the like from flowing into the cleaning tank 91 from a cleaning liquid supply port 94 at the bottom of the cleaning tank 91. 2 are supplied. Further, the cleaning liquid 2 is supplied to the substrate 4 through the diffusion plate 98 having the substantially large number of supply ports 99 as shown in FIG. 10, so that the substrate 4 is efficiently cleaned.
【0005】さらに、拡散板98にとしては、図11に
示すような、中央部の洗浄液供給口99aを、その基板
の洗浄液供給口99b、99cより大きく成形したもの
もある。そのため、洗浄液供給口99aから供給される
洗浄液を洗浄液供給口99b、99cから供給される洗
浄液よりも多量に供給させて、基板に対して充分な流量
を確保できるようにしている。Further, as the diffusion plate 98, there is a diffusion plate 98 in which a cleaning liquid supply port 99a at a central portion is formed larger than the cleaning liquid supply ports 99b and 99c of the substrate as shown in FIG. Therefore, the cleaning liquid supplied from the cleaning liquid supply port 99a is supplied in a larger amount than the cleaning liquid supplied from the cleaning liquid supply ports 99b and 99c, so that a sufficient flow rate to the substrate can be secured.
【0006】[0006]
【発明が解決しようとする課題】しかしながら、上記し
た従来の洗浄装置では以下のような問題点を有してい
た。However, the above-described conventional cleaning apparatus has the following problems.
【0007】まず、洗浄装置70については、図8の矢
印に示されるように、洗浄槽71に浸漬された基板の中
央部分にしか洗浄液2が十分に供給されず、基板の洗浄
を均一に行うことができないという問題点があった。First, in the cleaning device 70, as shown by the arrow in FIG. 8, the cleaning liquid 2 is sufficiently supplied only to the central portion of the substrate immersed in the cleaning tank 71, and the substrate is uniformly cleaned. There was a problem that it was not possible.
【0008】また、洗浄装置90については、フィルタ
97及び拡散板98の存在により、図12の矢印に示さ
れるように洗浄液2の流速が大きくならないうえ不均一
になりやすい。その結果、効率的な洗浄を行うことがで
きず基板4の洗浄が不均一なものとなりやすいという問
題点があった。また、オーバーフロー部96から排出さ
れなかった微粒子が滞留領域111に残留し、基板4を
取り出す際に基板4を再汚染してしまうという問題点も
あった。また、洗浄槽が二分割されてしまい、洗浄され
て基板から除去された微粒子が洗浄槽下部に移動してし
まうため、洗浄装置全体の汚染除去作業を頻繁に行なわ
なくてはならず、その際は拡散板98が固定されている
ためその作業が容易ではないという問題点があった。In the cleaning device 90, the flow rate of the cleaning liquid 2 does not increase and tends to become non-uniform due to the presence of the filter 97 and the diffusion plate 98, as shown by arrows in FIG. As a result, there has been a problem that efficient cleaning cannot be performed, and the cleaning of the substrate 4 tends to be uneven. Further, there is also a problem that the fine particles not discharged from the overflow section 96 remain in the stagnation region 111 and recontaminate the substrate 4 when the substrate 4 is taken out. In addition, since the cleaning tank is divided into two parts, and the fine particles removed from the substrate after being cleaned move to the lower part of the cleaning tank, the entire cleaning apparatus must be frequently decontaminated. There is a problem that the work is not easy because the diffusion plate 98 is fixed.
【0009】一方、拡散板98を図11に示すようなも
のにしたとしても、図13の矢印に示されるように、洗
浄液2の供給量が小さい部分及び洗浄液2の供給を直接
受けることの無い部分には洗浄液2が効果的に回らず、
洗浄液2の流れが不均一となり、また洗浄槽が二分割さ
れているため、依然として、基板4の洗浄が不均一なも
のとなりやすく、基板取出しの際に基板4を再汚染して
しまいやすく、洗浄装置全体の汚染除去作業を頻繁に行
なわなくてはならず、その際にの作業は容易ではないと
いう問題点があった。On the other hand, even if the diffusion plate 98 is formed as shown in FIG. 11, as shown by the arrow in FIG. 13, the portion where the supply amount of the cleaning liquid 2 is small and the supply of the cleaning liquid 2 is not directly received. The cleaning solution 2 does not rotate effectively in the part,
Since the flow of the cleaning liquid 2 becomes non-uniform and the cleaning tank is divided into two parts, the cleaning of the substrate 4 is still likely to be non-uniform, and the substrate 4 is likely to be re-contaminated when the substrate is taken out. There is a problem that the decontamination work of the entire apparatus must be frequently performed, and the work at that time is not easy.
【0010】そこで、本発明はこのような課題を解決す
るもので、その目的とするところは、基板の洗浄を均一
にかつ効率的に行うことができ、基板の再汚染を効果的
に防止でき、汚染除去作業の回数を減らすことができ、
たとえ汚染除去作業を行う場合でも容易に汚染除去作業
を行うことができる優れた洗浄装置を提供することにあ
り、そのような優れた洗浄装置を用いた洗浄方法を提供
することにあり、そのような優れた洗浄装置を用いて洗
浄された清浄な基板を提供することにある。Therefore, the present invention solves such a problem, and an object of the present invention is to enable uniform and efficient cleaning of a substrate and to effectively prevent recontamination of the substrate. , Reduces the number of decontamination operations,
It is an object of the present invention to provide an excellent cleaning device capable of easily performing a decontamination operation even when performing a decontamination operation, and to provide a cleaning method using such an excellent cleaning device. Another object of the present invention is to provide a clean substrate that has been cleaned by using an excellent cleaning apparatus.
【0011】[0011]
【課題を解決するための手段】請求項1の洗浄装置は、
洗浄槽の底部にある洗浄液供給口から洗浄液を洗浄槽に
供給して、互いに並列して配置された複数の基板を洗浄
するための洗浄装置において、洗浄液供給口と底部とが
滑らかにつながっていることを特徴とする、請求項2の
洗浄装置は、洗浄槽の底部にある洗浄液供給口から洗浄
液を洗浄槽に供給して、互いに並列して配置された複数
の基板を洗浄するための洗浄装置において、底部と壁部
とが滑らかにつながっていることを特徴とする。According to the first aspect of the present invention, there is provided a cleaning apparatus comprising:
In a cleaning apparatus for supplying a cleaning liquid to a cleaning tank from a cleaning liquid supply port at a bottom of the cleaning tank and cleaning a plurality of substrates arranged in parallel with each other, the cleaning liquid supply port and the bottom are smoothly connected. 3. The cleaning apparatus according to claim 2, wherein the cleaning liquid is supplied to the cleaning tank from a cleaning liquid supply port at a bottom of the cleaning tank, and the plurality of substrates arranged in parallel with each other are cleaned. Wherein the bottom portion and the wall portion are smoothly connected.
【0012】請求項3の洗浄装置は、洗浄槽の底部にあ
る洗浄液供給口から洗浄液を洗浄槽に供給して、互いに
並列して配置された複数の基板を洗浄するための洗浄装
置において、洗浄液供給口と底部と壁部とが滑らかにつ
ながっていることを特徴とする。According to a third aspect of the present invention, there is provided a cleaning apparatus for supplying a cleaning liquid to a cleaning tank from a cleaning liquid supply port provided at a bottom of the cleaning tank to wash a plurality of substrates arranged in parallel with each other. The supply port, the bottom, and the wall are smoothly connected.
【0013】請求項4の洗浄装置は、請求項1乃至3の
いずれかに記載の洗浄装置において、洗浄液供給口と底
部と壁部とが滑らかにつながって一体の内面をなしてい
ることを特徴とする。According to a fourth aspect of the present invention, in the cleaning apparatus according to any one of the first to third aspects, the cleaning liquid supply port is smoothly connected to the bottom and the wall to form an integral inner surface. And
【0014】請求項5の洗浄装置は、請求項1乃至3の
いずれかに記載の洗浄装置において、洗浄液供給口と底
部と壁部とが滑らかにつながって、下から上に向かって
洗浄槽の断面積が徐々に大きくなるように、全体として
テーパー形状を有する内面をなしていることを特徴とす
る。According to a fifth aspect of the present invention, there is provided the cleaning apparatus according to any one of the first to third aspects, wherein the cleaning liquid supply port, the bottom and the wall are smoothly connected to each other, and the cleaning tank is formed from bottom to top. It is characterized by forming an inner surface having a tapered shape as a whole so that the cross-sectional area gradually increases.
【0015】請求項6の洗浄装置は、請求項1乃至3の
いずれかに記載の洗浄装置において、洗浄液供給口と底
部と壁部とが滑らかにつながって全体として凹形状の内
面をなしていることを特徴とする。According to a sixth aspect of the present invention, in the cleaning apparatus according to any one of the first to third aspects, the cleaning liquid supply port is smoothly connected to the bottom and the wall to form a concave inner surface as a whole. It is characterized by the following.
【0016】このため、これらの洗浄装置は、洗浄液
が、従来の洗浄装置の場合と比べて、基板間を層流状態
で多量に均一に流動し、そのため基板に付着した微粒子
を効率良く均一に除去することができる。また、洗浄液
は基板の上部にまで速やかに流れるから、洗浄後の洗浄
液を効率よく洗浄槽外へ排出することができ、洗浄液が
滞留しにくい構造を有しているので、基板への微粒子再
付着の防止効果も有する。また、洗浄槽が拡散板で分割
されていないので、汚染除去作業の回数を減らすことが
できるうえ、たとえ汚染除去作業を行う場合でも容易に
汚染除去作業を行うことができるという効果がある。ま
た、本発明の洗浄装置によれば、拡散板を用いないの
で、槽構造自体が非常に単純であり、洗浄処理に適した
洗浄液の流量分布を容易に得ることができる。Therefore, in these cleaning apparatuses, the cleaning liquid flows in a large amount and uniformly between the substrates in a laminar flow state as compared with the conventional cleaning apparatus, so that the fine particles adhering to the substrates can be efficiently and uniformly dispersed. Can be removed. In addition, since the cleaning liquid quickly flows to the upper portion of the substrate, the cleaning liquid after cleaning can be efficiently discharged to the outside of the cleaning tank, and has a structure in which the cleaning liquid does not easily stay. Also has the effect of preventing. Further, since the cleaning tank is not divided by the diffusion plate, the number of times of the decontamination operation can be reduced, and even when the decontamination operation is performed, the decontamination operation can be easily performed. Further, according to the cleaning apparatus of the present invention, since the diffusion plate is not used, the tank structure itself is very simple, and the flow rate distribution of the cleaning liquid suitable for the cleaning process can be easily obtained.
【0017】ここで、滑らかにつながっているとは、洗
浄液の流れに沿った方向で見て滑らかにつながっている
という意味であり、このような内面に沿って洗浄液がス
ムーズに流れることが可能となる。従って、滞留も起こ
りにくい。内面は、直線と曲線が複合されていても構わ
ず、洗浄槽の形態に合わせて自由に設定できる。たとえ
ば、底部の形状として直線によってその形状を施しても
良いし、洗浄液供給口の形状として曲線によってその形
状を施しても良い。洗浄液供給口と底部と壁部とが、滑
らかにつながって、ア)一体の内面をなしていること、
イ)下から上に向かって洗浄槽の断面積が徐々に大きく
なるように、全体としてテーパー形状を有する内面をな
していること、ウ)全体として凹形状の内面をなしてい
ること等が好ましい。Here, "smoothly connected" means that the liquid is smoothly connected in the direction along the flow of the cleaning liquid, and it is possible that the cleaning liquid can flow smoothly along such an inner surface. Become. Therefore, stagnation is unlikely to occur. The inner surface may be a combination of a straight line and a curved line, and can be set freely according to the form of the washing tank. For example, the shape of the bottom portion may be given by a straight line, or the shape of the cleaning liquid supply port may be given by a curved line. The cleaning liquid supply port, the bottom and the wall are smoothly connected to each other and a) form an integral inner surface;
A) It is preferable that the cleaning tank has a tapered inner surface as a whole so that the cross-sectional area of the cleaning tank gradually increases from bottom to top, and c) a concave inner surface as a whole. .
【0018】洗浄槽には、リンス槽、薬液槽、基板をキ
ャリアに収容した状態で洗浄液に浸漬するキャリアタイ
プの装置、キャリアに収容せず基板をそのまま洗浄液に
浸漬するいわゆるノンキャリアタイプの装置など種々の
種類があるが、いずれの種類の洗浄槽についても効果が
ある。The cleaning tank includes a rinsing tank, a chemical tank, a carrier-type apparatus in which a substrate is immersed in a cleaning liquid while being accommodated in a carrier, and a so-called non-carrier-type apparatus in which a substrate is immersed in a cleaning liquid without being accommodated in a carrier. Although there are various types, any type of cleaning tank is effective.
【0019】請求項7の洗浄方法は、請求項1乃至6の
いずれかに記載の洗浄装置を用いて、互いに並列して配
置された複数の基板を洗浄することを特徴とする。この
ため、基板の洗浄を均一にかつ効率的に行うことがで
き、基板の再汚染を効果的に防止でき、汚染除去作業の
回数を減らすことができ、たとえ汚染除去作業を行う場
合でも容易に汚染除去作業を行うことができるという優
れた効果を有する。A cleaning method according to a seventh aspect is characterized in that a plurality of substrates arranged in parallel with each other are cleaned using the cleaning apparatus according to any one of the first to sixth aspects. Therefore, the substrate can be uniformly and efficiently cleaned, the substrate can be effectively prevented from being recontaminated, and the number of times of the decontamination operation can be reduced. It has an excellent effect that a contamination removal operation can be performed.
【0020】請求項8の基板は、請求項1乃至6のいず
れかに記載の洗浄装置を用いて洗浄されたことを特徴と
する。このため、この基板は均一に洗浄された清浄度の
高い優れた基板である。[0020] The substrate of claim 8 is characterized in that it is cleaned by using the cleaning apparatus according to any one of claims 1 to 6. For this reason, this substrate is an excellent substrate that has been uniformly cleaned and has high cleanliness.
【0021】[0021]
【発明の実施の形態】以下、本発明を各実施例及び図面
に基づいて詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to embodiments and drawings.
【0022】(実施例1)図1は、実施例1の洗浄装置
10の断面図である。図1(a)は正面断面図であり、
図1(b)は側面断面図である。洗浄装置10は、洗浄
槽11に洗浄液2が満たされ複数の基板4がキャリア3
ごと洗浄液2に浸漬するように構成されている。洗浄槽
11の底部には洗浄液2を供給するための洗浄液供給口
14を有し、洗浄槽11の壁全面と底部と洗浄液供給口
14は全体として凹形状の曲面で構成され、それらが滑
らかにつながっており一体の内面をなしている。また、
洗浄液供給口と底部と壁部とは、下から上に向かって洗
浄槽の断面積が徐々に大きくなるように、全体としてテ
ーパー形状を有する内面をなしている。FIG. 1 is a sectional view of a cleaning apparatus 10 according to a first embodiment. FIG. 1A is a front sectional view,
FIG. 1B is a side sectional view. The cleaning apparatus 10 includes a cleaning tank 11 filled with a cleaning liquid 2 and a plurality of substrates 4
Each of them is immersed in the cleaning liquid 2. A cleaning liquid supply port 14 for supplying the cleaning liquid 2 is provided at the bottom of the cleaning tank 11, and the entire wall, the bottom, and the cleaning liquid supply port 14 of the cleaning tank 11 are formed as concave curved surfaces as a whole, and they are smoothly formed. They are connected and form an integral inner surface. Also,
The cleaning liquid supply port, the bottom, and the wall form an inner surface having a tapered shape as a whole so that the cross-sectional area of the cleaning tank gradually increases from bottom to top.
【0023】この洗浄装置10を用いて水晶基板やガラ
ス基板を洗浄するには、まず、複数の基板4を互いに平
行にキャリア3に収め、洗浄液2で満たされた洗浄槽1
1にカセット(図示せず)により搬送して浸漬する。図
示はしていないが、このキャリアには大きい切り欠き部
(開口部)が設けられており、洗浄液の流れを阻害しな
いように構成されている。洗浄槽11の底部に設けられ
た洗浄液の洗浄液供給口14から洗浄液2を洗浄槽11
内に供給すると、洗浄槽11内を洗浄液2が層流状態で
均一に流れ、洗浄槽11の上部外周に設けられたオーバ
ーフロー部16にオーバーフローする。これによって基
板4には洗浄液2が十分に行き渡り効果的に洗浄するこ
とができる。To clean a quartz substrate or a glass substrate using the cleaning apparatus 10, first, a plurality of substrates 4 are placed in a carrier 3 in parallel with each other, and a cleaning tank 1 filled with a cleaning liquid 2 is provided.
1 and immersed in a cassette (not shown). Although not shown, the carrier is provided with a large cutout (opening) so as not to obstruct the flow of the cleaning liquid. The cleaning liquid 2 is supplied from the cleaning liquid supply port 14 provided at the bottom of the cleaning tank 11 to the cleaning tank 11.
When the cleaning liquid 2 is supplied to the inside of the cleaning tank 11, the cleaning liquid 2 flows uniformly in a laminar flow state in the cleaning tank 11, and overflows into an overflow section 16 provided on the upper outer periphery of the cleaning tank 11. As a result, the substrate 4 can be sufficiently cleaned with the cleaning liquid 2 and effectively cleaned.
【0024】図1(b)の側面断面図における内面形状
も図1(a)の正面断面図における内面形状とほぼ同様
の内面形状を有しているが、必ずしも同じである必要は
ない。例えば、基板を大量に洗浄する場合には、側面方
向に長く構成されていてもよいし、洗浄液供給口が側面
方向に長い形状を有していてもよいし、洗浄液供給口が
複数設けられてもよい。The inner shape in the side sectional view of FIG. 1B has substantially the same inner shape as the inner shape in the front sectional view of FIG. 1A, but it is not always necessary to be the same. For example, when cleaning a large amount of a substrate, the substrate may be configured to be long in the side direction, the cleaning liquid supply port may have a shape that is long in the side direction, or a plurality of cleaning liquid supply ports may be provided. Is also good.
【0025】図2は、実施例1における洗浄液2の流れ
を示す図である。このように、本実施例1においては、
洗浄槽11の洗浄液供給部と底部と壁13とが滑らかに
つながっており一体になっているため、洗浄液2の滞留
が起こりにくく、洗浄槽11全体に洗浄液2を均一に供
給することができる。また、基板4が存在する中央部分
は、基板3が存在しない周辺部分の流量よりも大きくな
っている。従って、実施例1によれば、基板4が存在す
る中央部分においては充分な流速の洗浄液2の供給が確
保され、基板4の効率的な洗浄を行うことができる。ま
た、基板4が存在しない両隅部においても充分な流量を
得ているため、滞留しにくく、基板4への微粒子の再付
着防止が実現できる。そして、この結果洗浄時間が短縮
され、洗浄液2を節約できるという効果もある。FIG. 2 is a diagram showing the flow of the cleaning liquid 2 in the first embodiment. Thus, in the first embodiment,
Since the cleaning liquid supply part of the cleaning tank 11, the bottom and the wall 13 are smoothly connected and integrated, the retention of the cleaning liquid 2 hardly occurs, and the cleaning liquid 2 can be uniformly supplied to the entire cleaning tank 11. The flow rate in the central portion where the substrate 4 exists is larger than the flow rate in the peripheral portion where the substrate 3 does not exist. Therefore, according to the first embodiment, the supply of the cleaning liquid 2 at a sufficient flow rate is secured in the central portion where the substrate 4 exists, and the substrate 4 can be efficiently cleaned. In addition, since a sufficient flow rate is obtained at both corners where the substrate 4 does not exist, the flow is hardly retained, and the re-adhesion of the fine particles to the substrate 4 can be prevented. As a result, the cleaning time is shortened and the cleaning liquid 2 can be saved.
【0026】図3は、実施例1の洗浄装置における洗浄
効果を示す説明図である。微粒子の排出効率を測定した
洗浄試験の結果を示すものである。21は、実施例1
(図1に示す容積30リットル)の洗浄槽11内に微粒
子を混入し、微粒子の初期の個数をパーティクルカンウ
ンターで測定し、所定時間純水をオーバーフローさせた
後純水の流動を止め、パーティクルカウンターにて再び
微粒子の個数を測定した結果得られた測定結果である。
20は、従来の洗浄装置における同様の測定結果であ
る。FIG. 3 is an explanatory view showing the cleaning effect of the cleaning apparatus of the first embodiment. 4 shows the results of a cleaning test in which the discharge efficiency of fine particles was measured. 21 is Example 1
Fine particles are mixed into a washing tank 11 (volume of 30 liters shown in FIG. 1), the initial number of the fine particles is measured by a particle counter, the pure water overflows for a predetermined time, and then the flow of the pure water is stopped. It is a measurement result obtained by measuring the number of fine particles again by the counter.
Reference numeral 20 denotes a similar measurement result in the conventional cleaning device.
【0027】20分後で比較すると、実施例1の洗浄装
置の場合は、1立方CF(センチフィート)当たり約5
個の微粒子が検出されたのに対して、従来の洗浄装置
(図7に示す)の場合は、1立方CF(センチフィー
ト)当たり約100個の微粒子が検出された。Comparing after 20 minutes, in the case of the cleaning apparatus of the first embodiment, about 5 per cubic CF (centimeter) was used.
In contrast to the case where particles were detected, in the case of the conventional cleaning device (shown in FIG. 7), about 100 particles were detected per cubic CF (centimeter).
【0028】(実施例2)図4は、実施例2の洗浄装置
30の正面断面図である。洗浄装置30は、洗浄液供給
口と底部とが滑らかにつながっていないところが洗浄装
置10と異なっている。実施例1と同様の洗浄試験を行
ったところ、実施例2の洗浄装置も、従来の図7の洗浄
装置と比較して優れた洗浄効果を有することが確認でき
た。(Embodiment 2) FIG. 4 is a front sectional view of a cleaning apparatus 30 of Embodiment 2. The cleaning device 30 differs from the cleaning device 10 in that the cleaning liquid supply port and the bottom are not smoothly connected. When the same cleaning test as in Example 1 was performed, it was confirmed that the cleaning device of Example 2 also had an excellent cleaning effect as compared with the conventional cleaning device of FIG.
【0029】(実施例3)図5は、実施例3の洗浄装置
40の正面断面図である。洗浄装置40は、底部と壁部
とが滑らかにつながってないところが洗浄装置10と異
なっている。実施例1と同様の洗浄試験を行ったとこ
ろ、実施例3の洗浄装置も、従来の図7の洗浄装置と比
較して優れた洗浄効果を有することが確認できた。(Embodiment 3) FIG. 5 is a front sectional view of a cleaning apparatus 40 of Embodiment 3. The cleaning device 40 differs from the cleaning device 10 in that the bottom and the wall are not smoothly connected. When a cleaning test similar to that of Example 1 was performed, it was confirmed that the cleaning device of Example 3 also had an excellent cleaning effect as compared with the conventional cleaning device of FIG.
【0030】(実施例4)図6は、実施例4の洗浄装置
50の正面断面図である。洗浄装置50は、下から上に
向かって内面が直線的にふくらんでいるところが洗浄装
置10と異なっている。実施例1と同様の洗浄試験を行
ったところ、実施例4の洗浄装置も、従来の図7の洗浄
装置と比較して優れた洗浄効果を有することが確認でき
た。(Embodiment 4) FIG. 6 is a front sectional view of a cleaning apparatus 50 of Embodiment 4. The cleaning device 50 differs from the cleaning device 10 in that the inner surface is inflated linearly from bottom to top. When the same cleaning test as in Example 1 was performed, it was confirmed that the cleaning device of Example 4 also had an excellent cleaning effect as compared with the conventional cleaning device of FIG.
【図1】実施例1における洗浄装置の断面図である。FIG. 1 is a sectional view of a cleaning apparatus according to a first embodiment.
【図2】実施例1における洗浄液の流れを示す説明図で
ある。FIG. 2 is an explanatory diagram showing a flow of a cleaning solution in Example 1.
【図3】実施例1における洗浄装置の洗浄効果を示す説
明図である。FIG. 3 is an explanatory diagram illustrating a cleaning effect of the cleaning device according to the first embodiment.
【図4】実施例2における洗浄装置の断面図である。FIG. 4 is a sectional view of a cleaning device according to a second embodiment.
【図5】実施例3における洗浄装置の断面図である。FIG. 5 is a sectional view of a cleaning apparatus according to a third embodiment.
【図6】実施例4における洗浄装置の断面図である。FIG. 6 is a sectional view of a cleaning apparatus according to a fourth embodiment.
【図7】従来の洗浄装置の断面図である。FIG. 7 is a sectional view of a conventional cleaning device.
【図8】図7の洗浄装置における洗浄液の流れを示す説
明図である。FIG. 8 is an explanatory diagram showing a flow of a cleaning liquid in the cleaning device of FIG. 7;
【図9】従来の洗浄装置の断面図である。FIG. 9 is a sectional view of a conventional cleaning device.
【図10】図9の洗浄装置における拡散板の平面図であ
る。FIG. 10 is a plan view of a diffusion plate in the cleaning device of FIG. 9;
【図11】図9の洗浄装置における別の拡散板の平面図
である。FIG. 11 is a plan view of another diffusion plate in the cleaning device of FIG. 9;
【図12】図9の洗浄装置における洗浄液の流れを示す
説明図である。FIG. 12 is an explanatory diagram showing a flow of a cleaning liquid in the cleaning device of FIG. 9;
【図13】図9の洗浄装置における洗浄液の流れを示す
説明図である。FIG. 13 is an explanatory diagram showing a flow of a cleaning liquid in the cleaning device of FIG. 9;
2 洗浄液 3 キャリア 4 基板 5 本発明の洗浄装置の内面 10、40、50、60 本発明の洗浄装置 70、90 従来の洗浄装置 11、41、51、61 本発明の洗浄槽 71、91 従来の洗浄槽 72 従来の洗浄装置の底部 73 従来の洗浄装置の壁部 14、44、54、64 本発明の洗浄装置の洗浄液供
給口 74、94 従来の洗浄装置の洗浄液供給口2 Cleaning Solution 3 Carrier 4 Substrate 5 Inner Surface of Cleaning Device of the Present Invention 10, 40, 50, 60 Cleaning Device of the Present Invention 70, 90 Conventional Cleaning Device 11, 41, 51, 61 Cleaning Tank 71, 91 of the Present Invention Cleaning tank 72 Bottom portion of conventional cleaning device 73 Wall portion of conventional cleaning device 14, 44, 54, 64 Cleaning liquid supply port 74 of cleaning device of the present invention Cleaning liquid supply port of conventional cleaning device
Claims (8)
液を洗浄槽に供給して、互いに並列して配置された複数
の基板を洗浄するための洗浄装置において、洗浄液供給
口と底部とが滑らかにつながっていることを特徴とする
洗浄装置。1. A cleaning apparatus for supplying a cleaning liquid to a cleaning tank from a cleaning liquid supply port provided at a bottom of the cleaning tank and cleaning a plurality of substrates arranged in parallel with each other. A cleaning device characterized by being smoothly connected.
液を洗浄槽に供給して、互いに並列して配置された複数
の基板を洗浄するための洗浄装置において、底部と壁部
とが滑らかにつながっていることを特徴とする洗浄装
置。2. A cleaning apparatus for supplying a cleaning liquid to a cleaning tank from a cleaning liquid supply port at a bottom of the cleaning tank to clean a plurality of substrates arranged in parallel with each other, wherein the bottom and the wall are smooth. A cleaning device characterized by being connected to
液を洗浄槽に供給して、互いに並列して配置された複数
の基板を洗浄するための洗浄装置において、洗浄液供給
口と底部と壁部とが滑らかにつながっていることを特徴
とする洗浄装置。3. A cleaning apparatus for supplying a cleaning liquid to a cleaning tank from a cleaning liquid supply port provided at a bottom of the cleaning tank to clean a plurality of substrates arranged in parallel with each other. A cleaning device characterized in that the parts are smoothly connected.
置において、洗浄液供給口と底部と壁部とが滑らかにつ
ながって一体の内面をなしていることを特徴とする洗浄
装置。4. The cleaning apparatus according to claim 1, wherein the cleaning liquid supply port, the bottom and the wall are smoothly connected to each other to form an integral inner surface.
置において、洗浄液供給口と底部と壁部とが滑らかにつ
ながって、下から上に向かって洗浄槽の断面積が徐々に
大きくなるように、全体としてテーパー形状を有する内
面をなしていることを特徴とする洗浄装置。5. The cleaning apparatus according to claim 1, wherein the cleaning liquid supply port, the bottom and the wall are smoothly connected, and the cross-sectional area of the cleaning tank gradually increases from bottom to top. A cleaning apparatus characterized in that the cleaning apparatus has an inner surface having a tapered shape as a whole.
置において、洗浄液供給口と底部と壁部とが滑らかにつ
ながって全体として凹形状の内面をなしていることを特
徴とする洗浄装置。6. The cleaning apparatus according to claim 1, wherein the cleaning liquid supply port, the bottom and the wall are smoothly connected to each other to form a concave inner surface as a whole. apparatus.
置を用いて、互いに並列して配置された複数の基板を洗
浄することを特徴とする洗浄方法。7. A cleaning method using the cleaning apparatus according to claim 1 for cleaning a plurality of substrates arranged in parallel with each other.
置を用いて洗浄されたことを特徴とする基板。8. A substrate which has been cleaned by using the cleaning apparatus according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6891999A JPH11319734A (en) | 1998-03-13 | 1999-03-15 | Cleaning device, cleaning method and substrate |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10-63767 | 1998-03-13 | ||
| JP6376798 | 1998-03-13 | ||
| JP6891999A JPH11319734A (en) | 1998-03-13 | 1999-03-15 | Cleaning device, cleaning method and substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11319734A true JPH11319734A (en) | 1999-11-24 |
Family
ID=26404895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6891999A Withdrawn JPH11319734A (en) | 1998-03-13 | 1999-03-15 | Cleaning device, cleaning method and substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11319734A (en) |
-
1999
- 1999-03-15 JP JP6891999A patent/JPH11319734A/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20060606 |