JPH1132471A - Semiconductor device, power generation device, and electronic equipment having the same - Google Patents

Abstract

(57) [Summary] Integrated circuit device (I) capable of self-electromotive force (power generation)
C, LSI). SOLUTION: An integrated circuit including at least one kind of a transistor, a resistor, a capacitor and the like is formed on a silicon substrate 41, and a magnetic body (magnet) 42 formed by ion implantation or the like, a wound coil 43, Flat coil 4
6 and the cantilever-shaped flexible sheets 44 and 45 are bent by the vibration and self-excited. As a result, the magnetic member 42
Contact with and separate from to generate electromotive force.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device (integrated circuit device / IC, large-scale integrated circuit device / LSI) having a self-power generation function, and a power generation device, particularly a surface mount type power generation device (chip component type power generation device). ) And an electronic device including at least one of them.

[0002]

2. Description of the Related Art Conventionally, in portable electronic devices such as a radio, a personal computer (PC / personal computer), a word processor (WP / word processor), and a cellular phone, the consumption of a built-in driving power supply battery is reduced or the battery is replaced. For the purpose of making it unnecessary, for example, Japanese Unexamined Patent Publication No.
No. 5 publication has been proposed. The power generating device in this case includes a rocking lever, speed increasing means by a gear train, a rotor magnet mounted at the forefront of the gear train, and an electromotive (power generating) coil surrounding the rotor magnet.

[0003] Japanese Patent Application Laid-Open No. Hei 7-168553 proposes a configuration of a trackball and a dynamo-type generator that rotates in contact with the trackball. Further, a configuration using a solar cell or the like in combination has been proposed.

[0004]

However, the construction of the power generator using the swing mechanism is not simple. In the case of a configuration using a trackball, it is necessary to contact and move the electronic device on a flat surface or the like.

[0005] IC, LS for controlling various electronic devices
In I, a configuration having a self-power generation function has not been proposed. Further, a surface mount type power generation device (chip component type power generation device) has not been proposed.

The present invention relates to an integrated circuit device (IC, LSI) capable of self-electromotive force (power generation) with a simple configuration, a surface mount type power generation device, and various types of electronic devices equipped with these integrated circuit devices and a surface mount type power generation device. An object is to provide a device, for example, a PC, a PHS (simplified mobile phone), a remote controller, and the like.

[0007]

In order to solve the above problems, a semiconductor device according to the present invention has a configuration in which a semiconductor substrate, for example, a silicon substrate, is provided with a magnet portion (magnetic body portion) and a function of an electromotive coil. . Further, a transistor, a resistor, a capacitor and the like are provided on the semiconductor substrate, and an integrated circuit (IC, LS
I) was added.

Further, the power generating apparatus of the present invention has a configuration in which a base portion, for example, an insulating member such as ceramics or resin is provided with a magnet portion and a function of a coil for electromotive force.

A cantilever or a double-supported beam is provided on a base formed of a magnetic member, or a base formed by mixing magnet powder into plastic or rubber to form a rectangular parallelepiped or a column. An electromotive coil was attached to the vibrating beam (magnet).

With the above-described structure, the semiconductor device and the power generating device of the present invention can generate (generate) electric power by vibration, movement of a person or a car, or the like.
Is possible. As a result, the life of the dry battery built in the electronic device can be extended, or the dry battery can be made unnecessary, thereby saving the earth resources and preserving the environment.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first aspect of the present invention is characterized in that a magnet is rollably or slidably mounted in a hole or a recess provided in a semiconductor substrate, and a coil is arranged near the magnet. The semiconductor device according to the present invention is capable of generating power by vibration, movement of a human body, etc., extending the life of a dry battery used as a power supply, or eliminating the need for a dry battery.

According to a second aspect of the present invention, there is provided the semiconductor device according to the first aspect, wherein an integrated circuit is provided on a semiconductor substrate. To control. Alternatively, it has the effect of extending the life of the battery.

According to a third aspect of the present invention, there is provided a semiconductor device in which a cylindrical coil is disposed in a hole or a concave portion provided in a semiconductor substrate, and a magnet is mounted in the cylindrical coil so as to roll or slide. It is possible to generate electricity by vibration, movement of the human body, etc., extending the life of the dry battery used as a power supply,
Or eliminate the need for batteries.

According to a fourth aspect of the present invention, a semiconductor device is characterized in that an electromotive coil is disposed near a magnetic portion formed on a semiconductor substrate, and the electromotive coil can be brought into and away from the magnetic portion. The magnetic device can be provided on a silicon substrate by a semiconductor forming process.

According to a fifth aspect of the present invention, there is provided the semiconductor device according to the fourth aspect, wherein a coil for electromotive is wound around a flexible sheet. The flexible sheet bends to allow power generation.

According to a sixth aspect of the present invention, there is provided the semiconductor device according to the fourth aspect, characterized in that a flexible printed wiring board is etched to form a coil for electromotive force. The ease of bending is improved.

According to a seventh aspect of the present invention, there is provided the semiconductor device according to the fourth aspect, wherein a metal wire is wound into a coil spring to form an electromotive coil. It is easy to maintain and maintain self-excited vibration.

According to an eighth aspect of the present invention, there is provided the semiconductor device according to the fourth aspect of the present invention, wherein a coil for electromotive force is attached to a flexible sheet. The selection range of the flexible sheet is expanded.

According to a ninth aspect of the present invention, there is provided a semiconductor device in which an electromotive coil is arranged near a beam-shaped magnetic portion formed on a semiconductor substrate. Body and electromotive coil can be arranged.

According to a tenth aspect of the present invention, there is provided a semiconductor device in which an electromotive coil is disposed so as to face a beam-shaped magnetic body formed on a semiconductor substrate. A magnetic part and an electromotive coil can be arranged.

According to an eleventh aspect of the present invention, there is provided a semiconductor device in which a piezoelectric member layer is provided on a cantilever formed on a semiconductor substrate, and a voltage is generated by bending of the piezoelectric member layer. The formation process allows the piezoelectric layer to be provided on the silicon substrate, eliminating the need for a coil.

According to a twelfth aspect, there is provided a power generation apparatus characterized in that a magnet is rollably or slidably mounted in a hole or a recess provided in a base and a coil is arranged near the magnet. , Vibration, movement of the human body, etc.
Extend the life of batteries used as a power source or eliminate the need for batteries.

According to a thirteenth aspect of the present invention, there is provided a power generator according to the twelfth aspect, wherein terminal electrodes for connecting to an external circuit are provided at both ends of the base to be a surface mount type. Enables surface mounting on a substrate or the like.

A fourteenth invention is characterized in that a flat coil for electromotive force is attached to a base housing a magnet.
According to the power generation device of the invention, power can be generated by vibration, movement of a human body, and the like.

A fifteenth invention is a power generator according to the thirteenth invention, characterized in that an electromotive coil is wound around a base housing a magnet, and the coil winding is automated. It will be easier.

According to a sixteenth aspect of the present invention, there is provided a power generating apparatus characterized in that a cylindrical coil is arranged in a hole or a concave portion provided in a base, and a magnet is rollably or slidably mounted in the cylindrical coil. It is possible to generate electricity by vibration, human body movement, etc.

According to a seventeenth aspect of the present invention, a surface mount type is characterized in that an electromotive coil is arranged near a magnet having terminal electrodes at both ends, and the electromotive coil can be connected to and separated from the magnet. It is a power generation device, which can generate power by vibration, movement of the human body, and the like.

According to an eighteenth aspect of the present invention, there is provided the power generating apparatus according to the seventeenth aspect, wherein an electromotive coil is wound around a cantilever-shaped flexible sheet. The flexible sheet bends due to the movement of the sheet and the like, thereby enabling power generation.

According to a nineteenth aspect, the power generating apparatus according to the seventeenth aspect is characterized in that the cantilever-shaped flexible printed wiring board is etched to form a coil for generating electricity. , And the ease of bending is improved.

According to a twentieth aspect, a seventeenth aspect is characterized in that an electromotive coil is attached to a cantilever-shaped flexible sheet.
The invention is a surface mount type power generating apparatus according to the invention, and an arbitrary coil form such as a heat fusion coil can be selected.

According to a twenty-first aspect of the present invention, there is provided a power generating apparatus characterized in that an electromotive coil is arranged near a cantilevered magnet formed on a base. It can be integrally molded at the same time.

A twenty-second invention is characterized in that the electromotive coil is formed on a substrate by any one of a sputtering method, a vapor deposition method, a printing method, and an etching method. And the coil can be made thinner.

According to a twenty-third aspect of the present invention, there is provided the power generating apparatus according to the twenty-first aspect, wherein an electromotive coil is wound around a base, and it is easy to automate the coil formation.

A twenty-fourth aspect of the present invention is directed to a power generating apparatus characterized in that an electromotive coil is arranged to face a beam-shaped magnet portion formed on a base. Can be integrally molded.

According to a twenty-fifth aspect, the power generator according to the twenty-fourth aspect is characterized in that a flat coil for electromotive force is provided on an insulating substrate, and the coil can be made thinner.

According to a twenty-sixth aspect of the present invention, there is provided the power generation apparatus according to the twenty-fourth aspect, wherein an electromotive coil is wound around a base, and the coil formation can be easily automated.

According to a twenty-seventh aspect, a cantilever portion is formed on a base provided with terminal electrodes at both ends for connection to an external circuit,
A piezoelectric member layer is disposed on the cantilever, and a voltage is generated by bending of the piezoelectric member layer to provide a surface-mounted power generation device. No coil is required.

Hereinafter, a semiconductor device according to an embodiment of the present invention will be described with reference to FIGS.
This will be described with reference to FIG.

(Embodiment 1) FIG. 1 is a sectional view of a principal part showing a concept of a semiconductor device according to Embodiment 1 of the present invention.
FIG. 3 is a cross-sectional view of the configuration of a MOS transistor showing a part of an integrated circuit provided on the silicon substrate (semiconductor substrate) of FIG.
3A and 3B are cross-sectional views of a mounting example in which the semiconductor device of the present invention is mounted on a package, FIG. 9 is a plan view of an example of a coil forming FIG. 1, and FIG. 13 is a spherical shape forming FIG. FIG. 14 is a perspective view illustrating an example of a magnet, FIG. 14 is a perspective view illustrating a magnet having another shape, and FIGS. 10 to 12 are perspective views illustrating configurations of other coils.

In FIG. 1, reference numeral 1 denotes a semiconductor substrate, reference numeral 2 denotes a spherical magnet, and reference numeral 3 denotes an electromotive flat coil attached to both front and back surfaces of the semiconductor substrate.

The semiconductor substrate 1 is composed of a silicon substrate, a silicon nitride substrate, a diamond substrate or the like. A semiconductor device 100 is provided in which a magnet 2 is slidably or slidably mounted in a through hole 5 or a concave portion provided in the semiconductor substrate 1 and an electromotive coil 3 is arranged near the magnet 2. In FIG. 1, the electromotive coils 3 are arranged vertically so as to sandwich the magnet 2.

Further, a transistor or the like is provided at another portion of the semiconductor substrate 1, and an integrated circuit (IC / LSI) is also provided.

The spherical magnet 2 is mounted on a flat coil 3 so as to roll. That is, it rolls on the flat coil 3 in an arbitrary direction to generate a current in the flat coil 3 to generate power.

The rolling of the spherical magnet 2 is performed by vibrating (oscillating), tilting, or carrying an electronic device in which the semiconductor device 100 is mounted in any direction of up, down, left, and right. Of course, depending on the vehicle, it is possible to start, stop,
The spherical magnet rolls and generates electricity due to the unevenness of the road during the traveling process.

It is needless to say that the through hole 5 for accommodating the spherical magnet 2 does not necessarily have to penetrate the semiconductor substrate 1 and may be a concave portion of any shape.

In addition to the above configuration, a semiconductor device in which a cylindrical coil is disposed in a hole or a concave portion provided in a semiconductor substrate, and a magnet is rollably or slidably mounted in the cylindrical coil. . The axial direction of the arranged cylindrical coil may be any direction such as a vertical direction and a horizontal direction (not shown).

Further, the electromotive coil is not limited to the flat coil, but may be wound around the semiconductor substrate 1 containing the spherical magnet 2 (not shown).

Next, an embodiment of a flat (planar) coil constituting the power generator 100 of the present invention will be described with reference to FIG.

The flat (flat) coil 92 shown in FIG.
A, 92B is a metal plate having a thickness of about 0.1 mm to 0.5 mm, such as a copper plate, which is etched, laser-processed,
Alternatively, it is formed in a coil shape by means such as press working.

The coil is bonded and laminated on both sides of a thermoplastic resin sheet or a prepreg resin sheet 91,
Furthermore, by performing concave pressure processing with a flat plate while heating,
The coil is buried and integrated so that the surface of the coil and the surface of the resin sheet are substantially flush with each other. The planar coil may be an etching coil, a printing coil, a fusion coil, or the like, in addition to the above.

The etching coil is formed by, for example, forming a spiral planar coil by photo-etching a copper-clad flexible wiring board on both sides or one side, and laminating one or more layers via an insulating layer. The conductor is not limited to copper, and may be any material such as AL or a superconducting material.

The spiral planar coils are electrically connected in series by means of copper plating or the like via through holes so that current flows in the spiral planar coils in the same direction. Naturally, both surfaces of the planar coil are covered with an insulating layer, for example, an epoxy resin, a fluorine resin or the like. The coating promotes the rolling or sliding of the magnet and prevents wear of the coil.

The printing coil is formed, for example, by screen-printing a conductor paste on both sides of a ceramic substrate and baking it to form a spiral planar coil, and electrically connecting each spiral electrically via a through hole provided in advance. After being connected to the planar coil in such a manner that current flows in the same direction, it is covered with an insulating layer (see FIG. 11).

The fusion coil is formed by winding a fusible insulated wire,
It is stuck. The fusible insulated wire is a double-structured covered wire in which a fusible film such as a thermoplastic resin or a thermosetting resin is baked on a covered wire such as polyurethane or polyester.

The conductors can be bonded to each other by means such as solvent, electric heating, or hot air heating, and the fusion coil can be integrally formed into a flat surface, a curved surface such as a spherical surface or a cylindrical surface, and the desired shape can be obtained. Rigidity is obtained.

The conductor used for the fusible insulated conductor includes a round conductor having a circular cross section, a rectangular ribbon conductor, a multiplicity of parallel conductors obtained by processing a plurality of circular conductors in parallel, and the like.

The use of a ribbon conductor, a multiplicity of parallel conductors, or the like makes it possible to make the space between the conductors smaller and denser than a round conductor, and to achieve a reduction in size, thickness, and resistance.

By reducing the size of the plate-like ferromagnetic material or the interval between them, the coil (inductor) can be made smaller and thinner.

FIG. 10 shows an example of a planar fusion coil unit. The cross section is 0.06 × 0.
Winding was performed using a 65 mm 導 2 ribbon conductor, and the conductors were bonded and molded by hot air heating. The external dimensions were about 15 mm in diameter and about 0.5 mm to 1 mm in thickness.

As a matter of course, the outer periphery of the planar fusion coil 9 may have an arbitrary shape such as a square, a polygon, or a sector in addition to a circle. Further, the planar fusion coil does not necessarily have to be a single coil body.

The plate-like plates 8 arranged on both sides of the fusion coil are made of an oxide soft magnetic material (ferrite) such as Mn-Zn or Ni-Zn, an amorphous alloy such as Co or Fe, or an amorphous alloy. A soft magnetic material having an ultrafine structure obtained by crystallizing an alloy, a metal soft magnetic material such as silicon steel, permalloy dust, or the like may be arbitrarily used.

Needless to say, a plastic member may be used. Polyester resin, nylon, fluorine, epoxy, polystyrene,
Any member such as polypropylene may be used.

The thickness of the plate 8 is 10 μm to 500 μm.
μm is preferred. The constituent members of the frame 6 are also optional,
The thickness of the flat fusion coil was made equal to or more than a ferromagnetic material or plastic.

The planar fusion coil unit is mounted and fixed on one or both sides of the semiconductor substrate 1 in a predetermined manner, and connects a wiring pattern provided on the semiconductor substrate 1 to an end of the coil (see FIG. 1). Not shown.)

FIG. 12 shows a collective planar coil according to another embodiment. In FIG. 12, a collective rectangular planar coil 35 is formed by arranging rectangular planar coils 30 on a printed wiring board 32 in a line at equal intervals. The collective rectangular planar coil 35 is formed by winding a conductive wire around a core (bobbin) 31 in a predetermined manner, bonding the conductive wires to each other by energizing and heating, and forming a fan shape.

Naturally, a current in the same direction flows between the collective rectangular planar coils 35 electrically in series and through the collective rectangular planar coils via the wiring pattern provided on the printed wiring board 32. Connected.

Further, the upper surface of the collective rectangular planar coil is covered with an insulating layer, for example, an epoxy resin, a fluorine resin or the like. The assembly of the collective rectangular planar coil 35 and the printed wiring board 32 was integrated via a hole (not shown) provided in the core 31. Of course, you may make it adhere | attach using an adhesive material.

The number of the rectangular planar coils 30 to be arranged may be set arbitrarily according to the desired electromotive force. Of course, the rectangular planar coils 30 may be arranged in a multi-row and multi-column (matrix) such as a cross shape.

Further, when external connection terminals are formed at both ends of the printed wiring board 32, means such as a conductive adhesive (silver paste / silver paint) or plating may be used. Of course, a printed wiring board obtained by subjecting a copper-clad PET resin, a copper-clad polyimide resin, or a copper-clad epoxy resin to desired etching processing, a silicon substrate, a glass substrate, or the like may be used.

FIG. 11 shows a laminated inductor according to another embodiment. The laminated inductor can constitute, for example, a laminated chip coil.

The laminated inductor 20 has a conductor formed in a spiral shape (coil shape) in a laminated body, and connects upper and lower conductor layers through through holes 12 provided in a magnetic layer. First, a magnetic green sheet 11 is prepared. The green sheet 11 is a sheet of the material before firing. Then, the through hole 1 is formed in the green sheet 11.
Drill 2

Next, the conductor layers 11a to 11e are connected by through holes so as to form a part of the coil pattern and printed. Then, the magnetic layers on which the conductive layers are printed are overlapped and pressed, and the upper and lower conductive layers are connected through the through holes 12 to form a coil in the magnetic laminate. Since the green sheets can be laminated together, the number of manufacturing steps is reduced.

The spherical magnet 2 may have an N pole and an S pole like the earth, or a cylindrical magnet having an N pole and an S pole may be embedded in a spherical magnetic member. Any member may be used as the magnetic member. For example, a resin magnet in which magnetic powder is blended and molded into a synthetic resin binder, or Mn-Al
Materials such as ferrites of Mn-Zn type, amorphous alloys of Co type, Fe type, etc., soft magnetic materials having ultrafine structure crystallized amorphous alloys, metallic soft magnetic materials of silicon steel, permalloy dust, etc. It may be. In the embodiment of FIG. 1, the outer diameter of the spherical magnet is set to about several mm to 5 mm.

The outer shape of the magnet is not limited to a spherical shape.
As shown in FIG. 4, any shape that can be rolled or slidable, such as a disk-shaped magnet 7A, a bar-shaped magnet 7B having a conical bottom joined thereto, a cylindrical bar-shaped magnet 7C, and a rectangular bar-shaped magnet 7D, may be used.

In the case of the disk-shaped magnet 7A, a magnet was obtained by equally dividing a circle and forming N and S poles alternately. In addition, a resin member such as a fluororesin was coated on the bottom surface, the top surface, and the like to facilitate sliding. The magnetic poles of the disc-shaped magnet 7A may be provided with N poles and S poles in the thickness direction. Further, it may be a rectangular plate-shaped magnet or the like.

FIG. 13 shows another means for forming a spherical magnet. In this case, the collective integrated magnet forms a fan-shaped body obtained by equally dividing a sphere, and after forming an N-pole and an S-pole in the fan-shaped body, the magnets are integrated by means such as bonding with an adhesive.

In the above embodiment, the planar coil,
It goes without saying that the magnet, the semiconductor substrate and the like may be set to any size.

As described above, the semiconductor device according to the first embodiment of the present invention enables self-power generation by being vibrated (oscillated) or tilted, or incorporated in an electronic device and carried by a person. As a result, the life of the dry battery built in the electronic device is extended, or the dry battery is not required.

(Embodiment 2) FIG. 4 is a cross-sectional view of a principal part showing the concept of a semiconductor device according to Embodiment 2 of the present invention. In this case, the semiconductor device 200 also forms an integrated circuit including at least one of a transistor, a resistor, a capacitor, and the like, as in the first embodiment, and also includes a magnetic body (magnet) 42 and a coil. It is equipped with power generation.

The structure different from that of the first embodiment is that the magnetic material is fixed and the electromotive coil is movable. That is,
The wound coil 43 for electromotive force and the flat coil 46 for electromotive force, which are disposed on both sides of the magnetic body portion 42 so as to be opposed to each other, are configured to be able to contact and separate.

More specifically, the flexible sheet 44 is fixed to the silicon substrate 41 in a cantilever manner via an adhesive. A metal wire coated with a resin was wound around the flexible sheet 44 to form a winding coil 43 for electromotive force.

The flexible sheet 44 is made of, for example, PET resin,
It is made of a polyimide resin, an epoxy resin, a silicon substrate, a ceramic substrate, a metal plate, or the like.

The vibration of the semiconductor device causes the flexible sheet 44 to bend and self-excit. As a result, the winding coil 4
3 comes into contact with and separates from the magnetic body portion 42 and crosses the magnetic field to generate electricity (electromotive force)
I do. The electromotive flat coil 46 is an example of another electromotive flat coil. In this case, a flexible wiring board in which a metal foil such as copper is bonded to a flexible resin sheet is etched into a coil shape.

FIG. 4 shows an example in which the electromotive coils are arranged on both sides of the magnetic body portion 42. However, it is possible to use only one side separately. The electromotive coils arranged on both sides may have the same configuration.

Further, the coil for electromotive force may be provided in a recess provided in the silicon substrate 41 so as not to protrude from the silicon substrate surface.

Further, a configuration may be adopted in which the heat-fused flat coil described in the first embodiment is bonded to a flexible sheet.

As a method of forming the magnetic member 42, any means may be used. For example, a method in which a magnetic material element is ion-implanted into the silicon substrate 41, or a method in which a liquid magnetic member is applied, such as sputtering, vapor deposition, other CVD (chemical vapor deposition), PVD (physical vapor deposition), etc. , At least one means.

FIG. 5 is a cross-sectional view of a main part of another semiconductor device 300 according to the second embodiment. The semiconductor device 300 shown in FIG. 5 has a winding coil 53 like a tension coil spring adhered to a magnetic layer 52 formed by ion-implanting a magnetic member into a silicon substrate 51.

Both terminal portions 53L, 53R of wound coil 53
Are adhered and fixed to a circuit pattern (not shown) provided on a silicon substrate by a conductive adhesive.

According to this configuration, the wound coil 53 vibrates (oscillates) up and down and left and right by vibrating the semiconductor device to generate electric power across the magnetic field.

It goes without saying that also in the semiconductor device according to the second embodiment, an integrated circuit may be provided on the silicon substrate. The arrangement of the magnetic poles (N pole, S pole) is not limited to the case shown in FIG.

As described above, the semiconductor device according to the second embodiment of the present invention enables self-power generation by vibration (oscillation) or the like.

(Embodiment 3) FIG. 6 is a sectional view showing a principal part of the concept of a semiconductor device according to Embodiment 3 of the present invention. The semiconductor device 400 in this case is characterized in that an electromotive coil is arranged in the vicinity of a cantilevered magnetic body 62 formed on a silicon substrate (semiconductor substrate) 61.

The magnetic portion 62 is configured to be elastically deformed and capable of being repeatedly bent. Further, the magnet function is configured in the same manner as in the second embodiment. For example, a magnetic member is used as one of means such as ion implantation, coating, and sputtering from both surfaces of the beam-shaped portion.

The processing of the cantilever is performed by etching the silicon substrate in a predetermined manner using an integrated circuit forming process.

The electromotive coil 63 was formed by any means such as screen printing, sputtering, and vapor deposition. Further, the magnetic body portion 62 was formed almost immediately at the center of the electromotive coil 63.

The coil for electromotive force may be formed by bonding a heat-sealed flat coil prepared in a separate process in advance. Of course,
The electromotive coil may be formed by etching a metal thin film provided on the silicon substrate surface.

[0098] As shown in FIG.
May be provided on both surfaces of the silicon substrate 61. Further, as in the second embodiment, an integrated circuit may be formed in another part of the silicon substrate.

With the above configuration, in the semiconductor device 400, the cantilever-shaped magnetic body portion 62 is displaced by the vibration, and the magnetic field moves to generate power. The magnetic poles may have N poles and S poles in the thickness direction of the silicon substrate as shown in FIG. 6, or may have N poles and S poles in the left-right direction.

(Embodiment 4) FIG. 7 is a sectional view showing a principal part of the concept of a semiconductor device according to Embodiment 4 of the present invention. The semiconductor device 500 in this case is characterized in that an electromotive coil 73 is arranged so as to oppose a doubly supported magnetic body portion 62 formed on a silicon substrate (semiconductor substrate) 71. The magnetic body portion 72 is configured to be elastically deformed and capable of repeatedly bending. In the case of the semiconductor device 500 shown in FIG. 7, the electromotive coils 73 are arranged on both sides of the magnetic body portion 72 to face each other.

The means for forming the magnetic part 72 is the same as that of the second embodiment.
It may be carried out in the same manner as in the case of 3. The electromotive coil 73 is formed by means of printing, sputtering, vapor deposition, or the like on an insulating substrate such as a silicon substrate, a glass substrate, or a resin substrate, or a flat coil prepared in a separate process is bonded in advance, or a printed wiring board is formed. Embodiment 1 such as etching a metal foil
3 to 3.

Arrangement of the magnetic poles, formation of an integrated circuit in another part of the silicon substrate, and the like may be arbitrarily performed.

The integration of the silicon substrate 71 and the insulating substrate 74 may be performed by any means such as bonding with epoxy resin, powdered glass or the like. Note that, instead of the insulating substrate 74, the electromotive coil may be formed on another semiconductor substrate such as a silicon substrate.

According to the above configuration, the semiconductor device 500 generates electric power by displacing the doubly-held magnetic body 72 by the vibration and moving the magnetic field.

(Embodiment 5) FIG. 8 is a sectional view showing a principal part of the concept of a semiconductor device 600 according to Embodiment 5 of the present invention. The semiconductor device 600 is a silicon substrate (semiconductor substrate)
The lower electrode 8 is provided on the upper surface of the cantilever weight portion 85 formed at 81.
3, the piezoelectric member layer 82 and the upper electrode 84 are stacked and arranged in this order, and the piezoelectric member layer 82 is bent so as to generate electricity. That is, as the weight 85 vibrates (oscillates) due to the vibration, the piezoelectric member layer 82 disposed thereon is bent.

Also in this case, as in the first to fourth embodiments, an integrated circuit may be provided in another portion of the silicon substrate.

The lower electrode 83, the upper electrode 84, and the piezoelectric member layer (piezo) 82 are provided by any one of sputtering, vapor deposition, coating (including printing), CVD, and the like. The arrangement thickness was set to several micrometer to several hundred micrometer.

As the piezoelectric member, for example, BaTiO ↓
3, any member such as PbTiO3, ZnO, AlN, PZT, etc.

The lower electrode 83 and the upper electrode 84 are of course electrically connected to a circuit pattern provided on the silicon substrate 81 (not shown).

(Embodiment 6) FIG. 15 is a cross-sectional view of a main part showing the concept of a power generator according to Embodiment 6 of the present invention.
FIG. 6 is a cross-sectional view of a principal part showing the concept of another power generation device according to Embodiment 6 of the present invention.

In FIG. 15, reference numeral 101 denotes a base, 10
Reference numeral 2 denotes a spherical magnet, 103 denotes a flat coil for electromotive force attached to the front and back surfaces of the base, and 104 denotes a terminal electrode for external connection. The base 101 is a silicon substrate,
It is made of a member such as ceramics, epoxy resin, ABS resin, and PS resin. The base 1 has a rectangular parallelepiped or columnar shape, and is formed by integrally forming a rectangular or elliptical through hole or recess at the center. Further, terminal electrodes 4 for connecting to an external circuit are provided at both ends of the base 1. When the terminal electrode 4 is formed, a means such as a conductive adhesive (silver paste / silver paint) or plating (solder plating, nickel plating, etc.) may be used.

The power generation device 700 according to Embodiment 6
The magnet 10 is placed in the through hole 106 or the concave portion provided in the base 101.
2 was rollably or slidably accommodated, and an electromotive coil 103 was arranged near the magnet 102. In the case of FIG.
A configuration in which flat coils 103 for electromotive force are provided above and below so as to sandwich the magnet 102 is shown.

The spherical magnet 102 rolls in an arbitrary direction on the flat coil 3 to generate an electric current in the flat coil 103 to generate electric power.

The through hole 10 for accommodating the spherical magnet 102
It is needless to say that 5 does not necessarily have to penetrate the base 101 and may be a concave portion of any shape.

Further, the electromotive coil 103 disposed near the magnet 102 is not only a flat coil but also a base 10.
The same is true for a wound coil wound around one (not shown).

Further, in addition to the above-described structure, as shown in FIG.
03A, and a power generator 800 in which the magnet 102 is slidably or slidably mounted in the cylindrical wound coil 103A.
It may be. The axial direction of the arranged cylindrical wound coil 103A does not matter in a vertical direction, a horizontal direction, or the like.

Also in this case, the flat coil, the arrangement of the spherical magnets and the magnetic poles, the magnet components, etc. are the same as in the first embodiment.
It may be implemented arbitrarily. Further, the sizes of the planar coil, the magnet, the base and the like may be arbitrarily set.

As described above, the power generating apparatus according to Embodiment 6 of the present invention can generate power by being vibrated (oscillated) or tilted, or incorporated in an electronic device and carried by a person. As a result, the life of the dry battery built in the electronic device is extended, or the dry battery is not required.

(Embodiment 7) FIG. 17 is a cross-sectional view of a main part showing the concept of a power generator according to Embodiment 7 of the present invention. The power generation device 900 in this case is also similar to the sixth embodiment.
A surface-mounted power generator was provided in which terminal electrodes 134 were provided at both ends of a rectangular parallelepiped or column.

The structure different from the sixth embodiment is that the magnet part is fixed and the electromotive coil part is movable. That is, the electromotive flat coils 133 disposed on both sides of the columnar magnet 132 so as to be opposed to each other are configured to be able to contact and separate.

More specifically, the flat coils for electromotive force 133 formed on a flexible sheet are fixed to both surfaces of the base 131 in a cantilever manner with an adhesive 135 interposed therebetween.

The flexible sheet is made of, for example, PET resin, polyimide resin, epoxy resin, silicon substrate, ceramic substrate, metal plate and the like.

The flexible sheet bends by vibrating the base 131 and vibrates self-excitedly. As a result, the flat coil 1
33 crosses the magnetic field by contacting and separating from the magnet 132 to generate electricity (electromotive force)
I do.

The flat coil for electromotive force may have any form. For example, there are a configuration in which a flexible printed wiring board is etched into a coil shape, a configuration in which a heat-fused flat coil is bonded to a flexible sheet, and a wound coil wound around a flexible sheet.

Although FIG. 17 shows an example in which the electromotive coils are arranged on both sides of the magnet 132, another side may be used on one side.

Further, a step-shaped step may be provided on the base 131 so that the flat coil 133 for electromotive does not protrude from the surface of the base 131, and may be attached to the step (not shown).

Further, the outer shape of the base 131 may be arbitrarily set, and may be, for example, a rectangular parallelepiped, a column, or the like. Magnetic pole (N
The arrangement of the poles and S poles is not limited to the case shown in FIG. A single N-pole and a single S-pole may be provided at both ends.

The magnetic member constituting the base may be any member. For example, resin magnets, rubber magnets, Mn-Al based, Mn-Zn based ferrites,
Co-based, Fe-based amorphous alloys, soft magnetic materials with ultrafine structure crystallized amorphous alloys, silicon steel,
Metallic soft magnetic materials such as permalloy sendust.

As described above, the surface-mounted power generation device according to Embodiment 7 of the present invention enables self-power generation by vibration (swing) or the like.

(Eighth Embodiment) FIG. 18 is a cross-sectional view of a principal part of the concept of a surface mount type power generation device according to an eighth embodiment of the present invention. The surface-mounted power generation device 1000 in this case is characterized in that an electromotive coil 143 is arranged near a cantilevered magnet portion 142 formed on a base 141 made of a magnetic member. The base 141 has terminal electrodes 144 at both ends to enable surface mounting.

The magnet portion 142 is configured to be elastically deformed and repeatedly bent, and to be capable of self-excited vibration. Further, the magnetic poles may be embodied in any pattern other than FIG.

The cantilever was formed integrally with the base 141 at the same time. The magnetic member constituting the base 141 may be arbitrary, such as the same member as in the seventh embodiment.

The electromotive coil 143 may be formed by any means such as screen printing, sputtering, and vapor deposition. Also,
The magnetic body portion 142 is provided substantially at the center of the electromotive coil 143.
Was formed.

As the electromotive coil, a heat-sealed flat coil prepared in a separate step may be bonded to the surface of the base. Of course, the coil for electromotive force may be formed by etching a metal thin film provided on the surface of the base by means such as plating.

Further, a wound coil may be wound around the base 141 in a coil shape. In the case of a wound coil, machining can be easily automated.

With the above configuration, in the semiconductor device 1000, the cantilever-shaped magnetic portion 162 is displaced by the vibration, and the magnetic field moves to generate power. The magnetic poles may have N poles and S poles in the thickness direction of the silicon substrate as shown in FIG. 18, or may have N poles and S poles in the left-right direction.

(Embodiment 9) FIG. 19 is a sectional view showing a main part of a concept of a power generating apparatus according to Embodiment 9 of the present invention. The power generation device 1100 in this case is characterized in that an electromotive coil 153 is wound near a doubly supported beam formed on a base 151.

The base 151 has terminal electrodes 154 at both ends to enable surface mounting. Further, the magnet section 152 is configured to be elastically deformed and repeatedly bent, and to be capable of self-excited vibration. Note that a configuration may be employed in which a flat coil for electromotive force is arranged to face the doubly supported magnet portion 152 formed on the base 151 (not shown). In this case, the flat coil 153 for electromotive force may be formed on a substrate such as a silicon substrate, a glass substrate, or a resin substrate by means of printing, sputtering, vapor deposition, or the like, or a flat coil prepared in a separate process may be bonded or printed. It may be arbitrarily performed, for example, by etching the metal foil of the wiring board.

The shape of the base 151, the constituent members (magnetic material), the arrangement of the magnetic poles, the method of processing the magnet portion, and the like may be the same as those in Embodiments 7 and 8, or may be arbitrarily performed.

With the above configuration, the semiconductor device 1100 generates power by vibrating the magnet portion in the form of a double-ended beam and moving the magnetic field with respect to the coil.

(Embodiment 10) FIG. 20 is a sectional view showing a main part of the concept of a power generation device 1200 according to Embodiment 10 of the present invention. The power generating device 1200 is configured such that a lower electrode 163, a piezoelectric member layer 162, and an upper electrode 164 are stacked and arranged in this order on the upper surface of a cantilever weight portion 165 formed on a base body 161, and an electric power is generated by bending of the piezoelectric member layer 162. It is characterized by.
That is, as the weight 165 vibrates (oscillates) due to the vibration, the piezoelectric member layer 162 disposed thereon flexes and generates electric power.

Also in this case, terminal electrodes 166 are provided at both ends of the base 161 to enable surface mounting.

The lower electrode 163, the upper electrode 164, and the piezoelectric member layer (piezo) 162 are provided by any one of a sputtering method, a vapor deposition method, and a coating method (including printing). The arrangement thickness was set to several micrometer to several hundred micrometer.

As a piezoelectric member, for example, BaTiO ↓
3, any member such as PbTiO3, ZnO, AlN, PZT, etc.

The lower electrode 163 and the upper electrode 164 are, of course, electrically connected to a circuit pattern provided on the base 161 (not shown).

The electronic device incorporating at least one of the semiconductor devices of Embodiments 1 to 5 and the power generating devices of Embodiments 6 to 10 is a portable information device such as a PC, WP, or electronic book. It goes without saying that any electronic device such as a mobile communication device may be used in addition to the terminal.

Further, the output generated by the devices of the first to tenth embodiments may be converted to direct current by a rectifier circuit to charge a secondary battery. Further, even when the charging of the secondary battery is completed, if the power generation output is still supplied through the rectifier circuit, the battery may be discharged by an excess overcurrent prevention circuit (not shown).

As described above, the electronic device incorporating the semiconductor device or the power generating device of the present invention can automatically generate power by vibration and inclination, and the power stored in the secondary battery can drive the electronic device. That is, the conventional dry battery constituting the power supply is not required.

[0149]

As described above, according to the present invention, self-power generation can be performed by vibration or inclination. As a result, the life of the dry battery that drives the control circuit of the electronic device can be extended, or the dry battery can be made unnecessary, thereby conserving resources and preserving the global environment.

[Brief description of the drawings]

FIG. 1 is an essential part cross sectional view showing the concept of a semiconductor device in Embodiment 1 of the present invention.

FIG. 2 is a sectional view of a main part of a MOS transistor forming a part of the integrated circuit of FIG. 1;

3A is a cross-sectional view of a main part of a mounting device on which the semiconductor device of the present invention is mounted. FIG. 3B is a cross-sectional view of a main part of a mounting device on which the semiconductor device of the present invention is mounted.

FIG. 4 is an essential part cross sectional view showing the concept of a semiconductor device in Embodiment 2 of the present invention;

FIG. 5 is an essential part cross sectional view showing the concept of another semiconductor device in Embodiment 2 of the present invention.

FIG. 6 is an essential part cross sectional view showing the concept of a semiconductor device in Embodiment 3 of the present invention;

FIG. 7 is an essential part cross sectional view showing the concept of a semiconductor device in Embodiment 4 of the present invention;

FIG. 8 is an essential part cross sectional view showing the concept of a semiconductor device in Embodiment 5 of the present invention.

FIG. 9 is a plan view of an example of a coil included in FIG. 1;

FIG. 10 is a plan view of an example of another coil included in FIG. 1;

FIG. 11 is a plan view of an example of another coil included in FIG. 1;

FIG. 12 is a plan view of an example of another coil included in FIG. 1;

FIG. 13 is a perspective view of an example of a spherical magnet included in FIG. 1;

FIG. 14 is a perspective view showing another shape of the magnet constituting FIG. 1;

FIG. 15 is an essential part cross sectional view showing the concept of a power generator according to Embodiment 6 of the present invention.

FIG. 16 is an essential part cross sectional view showing the concept of another power generator according to Embodiment 6 of the present invention.

FIG. 17 is an essential part cross sectional view showing the concept of a semiconductor device in Embodiment 7 of the present invention;

FIG. 18 is an essential part cross sectional view showing the concept of a semiconductor device in Embodiment 8 of the present invention;

FIG. 19 is an essential part cross sectional view showing the concept of a semiconductor device in a ninth embodiment of the present invention;

FIG. 20 is an essential part cross sectional view showing the concept of a semiconductor device in Embodiment 10 of the present invention;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1, 41, 51, 61, 71, 81 Silicon substrate (semiconductor substrate) 2 Spherical magnet 3 Coil 4 Protective film 5 Through-hole 6 Frame 6a Hole 6b Passage part 7 Integrated magnet 7A Disk magnet 7B, 7C, 7D Rod magnet 7A1, 7D1 Fluororesin 8 Plate 9 Planar fusion coil 11 Dielectric substrate 11a, 11b, 11c, 11d, 11e Conductor (electrode) 12 Through hole 15 Power generation coil unit 20 Multilayer chip coil (multilayer inductor) 30 Rectangular plane -Shaped coil 31 core (bobbin) 32 printed wiring board 33, 47 adhesive material 35 assembled rectangular planar coil 42, 62, 72 magnetic body part 43, 53 wound coil 44 flexible sheet 45 flexible wiring board 46 flat coil 52 Magnetic layer 53L Left terminal 53R Right terminal 54 Electrode 55 Conductivity Adhesive 63, 73 Coil for electromotive 74 Insulating substrate 82 Piezoelectric member layer 83 Lower electrode 84 Upper electrode 85 Weight 91 Resin sheet 92A, 92B Flat coil (flat coil) 100, 200, 300, 400, 500, 600 Semiconductor Apparatus 101, 131, 141, 151, 161 Base 102 Spherical magnet 103, 143 Coil 103A, 153 wound coil 104, 134, 144, 154, 166 Terminal electrode 105 Protective film 106 Through hole 107, 155 Conductive adhesive 132 Magnet 133 Flat coil 135 Adhesive material 136, 165 Weight part 142, 152 Magnet part 162 Piezoelectric member layer 163 Lower electrode 164 Upper electrode 700, 800, 900, 1000, 1100, 120
0 generator

Claims (43)

[Claims] 1. A semiconductor device wherein a magnet is rollably or slidably mounted in a hole or a recess provided in a semiconductor substrate, and an electromotive coil is arranged near the magnet. 2. The magnet according to claim 1, wherein the outer shape of the magnet is any one of a sphere, an ellipse, and a disk.
13. The semiconductor device according to claim 1. 3. The semiconductor device according to claim 2, wherein an integrated circuit is provided on the semiconductor substrate. 4. A semiconductor device wherein a cylindrical coil is disposed in a hole or a concave portion provided in a semiconductor substrate, and a magnet is mounted slidably or slidably in the cylindrical coil. 5. A semiconductor device, wherein an electromotive coil is arranged near a magnetic part formed on a semiconductor substrate, and the electromotive coil can be brought into contact with and separated from the magnetic part. 6. The semiconductor device according to claim 5, wherein an integrated circuit is provided on the semiconductor substrate. 7. The semiconductor device according to claim 5, wherein an electromotive coil is wound around the flexible sheet. 8. The semiconductor device according to claim 5, wherein the flexible printed wiring board is etched to form a flat coil for electromotive force. 9. The semiconductor device according to claim 5, wherein a metal wire is wound in a coil spring shape to form an electromotive coil. 10. The semiconductor device according to claim 5, wherein an electromotive coil is attached to the flexible sheet. 11. A semiconductor device, wherein an electromotive coil is arranged near a beam-shaped magnetic body formed on a semiconductor substrate. 12. The semiconductor device according to claim 11, wherein an integrated circuit is additionally provided on the semiconductor substrate. 13. The semiconductor device according to claim 11, wherein the electromotive coil is formed on the semiconductor substrate by any one of a sputtering method, a vapor deposition method, a printing method, and an etching method. 14. The semiconductor device according to claim 11, wherein electromotive coils are arranged on both front and back surfaces of the semiconductor substrate. 15. A semiconductor device, wherein an electromotive coil is arranged to face a beam-shaped magnetic body formed on a semiconductor substrate. 16. The semiconductor device according to claim 15, wherein an integrated circuit is provided on the semiconductor substrate. 17. The semiconductor device according to claim 15, wherein an electromotive coil is disposed opposite to the front and back surfaces of the magnetic body. 18. The semiconductor device according to claim 15, wherein the electromotive flat coil is provided on an insulating substrate. 19. A semiconductor device wherein a piezoelectric member layer is provided on a cantilever formed on a semiconductor substrate, and a voltage is generated by bending of the piezoelectric member layer. 20. The semiconductor device according to claim 19, wherein an integrated circuit is provided on the semiconductor substrate. 21. The semiconductor device according to claim 19, wherein the piezoelectric member layer is provided by any one of a sputtering method, an evaporation method, and a coating method. 22. An electronic apparatus comprising the semiconductor device according to claim 1. 23. A power generator, wherein a magnet is rollably or slidably mounted in a through hole or a recess provided in a base, and an electromotive coil is arranged near the magnet. 24. The power generating apparatus according to claim 23, wherein terminal electrodes for connecting to an external circuit are provided at both ends of the base to be a surface mount type. 25. The power generator according to claim 24, wherein a flat coil for electromotive force is attached to the base housing the magnet. 26. The power generator according to claim 24, wherein an electromotive coil is wound around a base housing the magnet. 27. A power generating apparatus characterized in that a cylindrical coil is arranged in a hole or a concave portion provided in a base, and a magnet is mounted slidably or slidably in the cylindrical coil. 28. The power generator according to claim 27, wherein terminal electrodes for connecting to an external circuit are provided at both ends of the base to be a surface mount type. 29. A surface-mounted power generator, wherein an electromotive coil is arranged near a magnet having terminal electrodes at both ends, and the electromotive coil can be connected to and separated from the magnet. 30. The surface-mounted power generator according to claim 29, wherein an electromotive coil is wound around a cantilever-shaped flexible sheet. 31. The surface-mounted power generator according to claim 29, wherein the cantilever-shaped flexible printed circuit board is etched to form a flat coil for electromotive force. 32. The surface-mounted power generator according to claim 29, wherein an electromotive coil is attached to a cantilever-shaped flexible sheet. 33. A power generator, wherein an electromotive coil is arranged in the vicinity of a beam-shaped magnet portion formed on a base. 34. The power generating apparatus according to claim 33, wherein terminal electrodes for connecting to an external circuit are provided at both ends of the base to be a surface mount type. 35. An electromotive coil formed on a substrate by any one of a sputtering method, a vapor deposition method, a printing method, and an etching method.
3. The power generator according to 3. 36. The power generator according to claim 33, wherein an electromotive coil is wound around the base. 37. A power generator, wherein an electromotive coil is arranged to face a beam-shaped magnet portion formed on a base. 38. The power generator according to claim 37, wherein terminal electrodes for connecting to an external circuit are provided at both ends of the base to be a surface mount type. 39. The semiconductor device according to claim 37, wherein the flat coil for electromotive force is provided on an insulating substrate. 40. The power generator according to claim 37, wherein an electromotive coil is wound around the base. 41. A cantilever portion is formed on a base provided with terminal electrodes for connecting to an external circuit at both ends, a piezoelectric member layer is provided on the cantilever, and the piezoelectric member layer is bent by bending. A surface-mounted power generation device characterized by generating electromotive force. 42. The surface-mounted power generator according to claim 41, wherein the piezoelectric member layer is disposed by any one of a sputtering method, a vapor deposition method, and a coating method. 43. An electronic apparatus comprising the power generator according to any one of claims 23 to 42.