JPH11328721A - Electrical component holding unit - Google Patents

Abstract

(57) [Problem] To fix a substrate to a predetermined portion via an adhesive applied to several places on the side surface of the substrate holding electric components and the like,
Provided is an electric component holding unit that can securely fix a substrate, an electric component, and the like to a predetermined portion by securely curing the adhesive in a short time and over the entirety. A flexible member (4a) affixed on a substrate (8) has cutouts (44) formed in opposing portions thereof, and the surface of the substrate (the side opposite to the contact surface (8a)) is formed through these cutouts. Surface) is exposed. Then, after the position of the substrate is adjusted, the photocurable adhesive 12 is applied to the side peripheral surface of the substrate (the side peripheral surface of the substrate partially exposed through the cutout portion of the flexible substrate). The adhesive is spot-irradiated to cure the adhesive, and the substrate is positioned and fixed at a predetermined portion of the fixed optical block. At this time, at the same time, the light receiving element held on the substrate is positioned with respect to the optical axis.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric component holding unit for holding an electric component such as a light receiving element for converting light into an electric signal at a predetermined position.

[0002]

2. Description of the Related Art Conventionally, in an electric component holding unit disclosed in, for example, Japanese Patent Application Laid-Open No. Hei 5-189975, a substrate for holding electric components such as a light receiving element is made of a material that transmits laser light or ultraviolet light. And is fixed to a predetermined site via an ultraviolet-curable adhesive.

[0003] Specifically, when the substrate is fixed to a predetermined portion, an ultraviolet curing adhesive is applied to the entire mounting surface of the substrate, and the mounting surface coated with such an adhesive is attached to the predetermined portion. Then, ultraviolet rays are irradiated over the entire adhesive. At this time, the adhesive irradiated with the ultraviolet light cures, thereby fixing the substrate and the electric components such as the light receiving element soldered to the substrate to a predetermined portion.

[0004]

By the way, in the conventional electric component holding unit, since the adhesive is applied to the entire mounting surface of the substrate, it is necessary to cure the adhesive over the entire adhesive. It is necessary to irradiate a wide range with ultraviolet rays. For this reason, there is a problem that not only the time required for curing the adhesive is required, but also the position of the electric component such as the light receiving element with respect to the optical axis is shifted due to thermal contraction of the adhesive.

Therefore, there has been proposed a method for solving the above-mentioned problem by applying an adhesive to several places on the side surface of the substrate. In recent years, from the viewpoint of workability and quality stability, a flexible printed circuit board (hereinafter, simply referred to as "flexible") on which a predetermined pattern is printed is adhered to the substrate, and electric components such as a light receiving element are attached to the flexure. The method of soldering is adopted.

However, when the flexible member is bonded to the substrate as described above, even when a substrate having optical transparency is used,
This flexibility makes it difficult for ultraviolet rays to pass through, so that the ultraviolet rays hardly reach the adhesive flowing around the mounting surface side of the substrate, and there is a problem that the adhesive does not harden. Then, if the adhesive that has wrapped around the mounting surface side of the substrate is not cured, the substrate cannot be securely and firmly fixed to a predetermined portion.

The present invention has been made to solve such a problem, and an object of the present invention is to fix a substrate to a predetermined portion via an adhesive applied to several places on the side surface of the substrate holding electric components and the like. An object of the present invention is to provide an electric component holding unit capable of firmly fixing a substrate, an electric component, and the like to a predetermined portion by securely curing the adhesive in a short time and over the entirety. .

[0008]

In order to achieve the above object, the present invention provides an electric component, a printed circuit board for electrically connecting the electric component, the electric component and the printed circuit board. Can be held, consisting of a substrate formed of a material having light transmissivity, by irradiating light to a photocurable adhesive applied to the substrate,
In the electric component holding unit capable of fixing the substrate to a predetermined portion, the printed circuit board includes a light irradiating unit configured to irradiate the photocurable adhesive applied to the substrate with light. Are formed.

Further, the present invention provides an electric component, a printed circuit board for electrically connecting the electric component, and a light transmissive material capable of holding the electric component and the printed circuit board. In an electrical component holding unit that can fix the substrate to a predetermined portion by irradiating light to a photo-curable adhesive applied to the substrate, the substrate includes: It is possible to apply the photocurable adhesive to a position avoiding the printed board, and to irradiate the photocurable adhesive with light without being blocked by the printed board. Light irradiating part is formed.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electric component holding unit according to an embodiment of the present invention will be described below with reference to the accompanying drawings. As shown in FIGS. 1 to 3, the electric component holding unit according to the present embodiment controls an electric component such as a light receiving element that converts incident light into a predetermined electric signal, and controls an electric signal output from the electric component. A flexible printed board (hereinafter, simply referred to as “flexible”) 4 to be transmitted to the board 2 and a board 8 that can be fixed to the fixed optical block 6 while holding the electric components and the flexible 4 are provided.

In the present embodiment, as an example, two light receiving elements 10 are assumed as electric components, and these light receiving elements 10 are respectively held on corresponding substrates 8. .

Each of the substrates 8 is formed of a material having a light transmitting property (eg, resin, glass, etc.). One surface of the substrate 8 is fixed when the substrate 8 is fixed to the fixed optical block 6. 6 is formed on the contact surface 8a.

In this embodiment, as a method of fixing the substrate 8 to the fixed optical block 6, a photo-curing adhesive 12 is used, and the contact surface 8a of the substrate 8 is applied to the fixed optical block 6. In this state, the adhesive 12 is applied to several places on the side peripheral surface of the substrate 8, and the adhesive 12 is cured by light, so that the substrate 8 can be fixed to the fixed optical block 6. ing. The specific fixing method will be described later.

The flexible member 4 has one end 4a attached to a surface of the substrate 8 opposite to the contact surface 8a.
The other end (not shown) is connected to the control plate 2 screwed to the fixed optical block 6. Flexible 4 has
Transmission wires (not shown) are printed in a predetermined pattern, and after inserting the terminals 10a of the light receiving element 10 into a plurality of holes 14 penetrating from the substrate 8 to one end 4a of the flexible 4, these terminals 10a By soldering, the light receiving element 10 can be held on the substrate 8 and, at the same time, the light receiving element 10 can be electrically connected to the transmission wiring of the flexible 4.

In the optical device incorporating the electric component holding unit according to the present embodiment, the semiconductor laser 16 is press-fitted and fixed to a holding plate 18, and the holding plate 18 is screwed to the fixed optical block 6. It has been stopped. The collimating lens 20 is connected to the frame 2
2, the crystal plate 24, the quarter-wave plate 26, and the condenser lens 28 are all held by a frame 30. These frames 22, 30 are fixed to the fixed optical block 6 via a leaf spring 32. Have been. And the frame 22,
By adjusting the position of 30, the collimator lens 20 and the condenser lens 28 can be aligned along the optical axis direction. Further, the polarization beam splitter 34 and the half-wave plate 36 are respectively adhesively fixed to the optical fixing block 6, and
Is fixedly adhered with one side thereof abutted on the fixed optical block 6 by a spring 40.

In such a configuration, the semiconductor laser 1
The laser light emitted from 6 is collimated by a collimating lens 20.
After being converted into a parallel light beam by the above, the light is guided to the polarizing beam splitter 34 via the half-wave plate 36, and is divided into reflected light and transmitted light. The reflected light is applied to a detection element 42 for detecting the output of the semiconductor laser 16, and the transmitted light is focused on a recording medium (not shown) via, for example, an objective lens (not shown). At this time, the return light reflected from the recording medium is again transmitted from the objective lens to the polarization beam splitter 3.
4, the light is reflected from the polarization beam splitter 34, and is guided from the crystal plate 24 and the quarter-wave plate 26 to the half mirror 38 via the condenser lens 28. Then, after being split into two light beams by the half mirror 38, the light beams are respectively applied to the light receiving elements 10 positioned by the following fixing method.

Next, a fixing method applied to the present embodiment will be described with reference to FIG. In this fixing method, a notch 44 is formed at one end 4a of the flexible 4 affixed on the substrate 8 (hereinafter, referred to as a flexible 4a) at a portion opposed to the one end 4a. Surface of substrate 8 via 44 (surface opposite to contact surface 8a)
Part of it is exposed.

In this embodiment, the flexible 4a
The notch portions 44 are each configured as a light irradiating portion to which the light for curing the adhesive is irradiated with a spot by a light irradiating device 50 described later.

First, as shown in FIGS. 4A and 4C,
In a state where the contact surface 8a of the substrate 8 is applied to the fixed optical block 6, the position adjusting pin 48 is inserted from the substrate 8 into a position adjusting hole 46 provided through the flexible 4a,
The position of the substrate 8 with respect to the fixed optical block 6 is adjusted by moving the position adjusting pins 48.

Subsequently, as shown in FIG. 4B, a photocurable adhesive 12 is applied to the side peripheral surface of the substrate 8 (in the present embodiment,
After the coating is applied to the side surface of the substrate 8 which is partially exposed through the cutout portion (light irradiation portion) 44 of the flexible 4a, the light irradiation device 50
The adhesive 12 is spot-irradiated. At this time, the substrate 8 is positioned and fixed at a predetermined position of the fixed optical block 6 by curing the adhesive 12 irradiated with the adhesive curing light. At the same time, the light receiving element 10 supported on the substrate 8 is also positioned with respect to the optical axis.

As described above, since the notch 44 is formed in the flexible member 4a, there is no object that blocks light at the portion where the adhesive 12 is applied. Light can sufficiently reach the mounting surface 8a side (back side) of the substrate 8. As a result, the adhesive 12 wrapping around the mounting surface 8a side of the substrate 8 can also be cured reliably and in a short time.

Accordingly, the substrate 8 is fixed firmly at a predetermined position of the fixed optical block 6 in a short time and robustly without causing a problem such as displacement of the substrate due to heat shrinkage of the adhesive as in the prior art. be able to. For this reason, the substrate 8
The light receiving element 10 held at the position can also be accurately positioned with respect to the optical axis.

The present invention is not limited to the configuration of the above-described embodiment, but can be variously modified. For example, as shown in FIG. 5, as a fixing method according to the first modified example, it is preferable to provide a through hole 52 in the substrate 8 exposed through the cutout (light irradiation part) 44 of the flexible 4a.

By providing the through holes 52 in this manner, the amount and range of the adhesive 12 wrapped around the contact surface 8a of the substrate 8 can be regulated by the through holes 52. As a result, the spot irradiation range and the light irradiation amount from the light irradiation device 50 can be reduced, so that the adhesive 12 can be cured efficiently and in a short time. Note that other configuration and effects are the same as those of the above-described embodiment, and a description thereof will be omitted.

As shown in FIG. 6, for example, as a fixing method according to a second modification, overhang portions 54 are formed by projecting the opposing ends of the substrate 8 respectively.
It is also preferable to apply the adhesive 12 to the side peripheral surface of the substrate.

In this modification, the projecting portions 54 projecting to the opposite side of the substrate 8 are respectively provided with the light irradiating machine 5 described above.
The light irradiating unit is configured to irradiate the adhesive curing light with a spot by setting the light intensity to 0.

As described above, the adhesive 1 is applied to the side peripheral surface of the overhang portion 54.
2 by applying the adhesive 1 along the direction of the arrow.
2 can be limited to the overhang area of the overhang portion 54. As a result, the spot irradiation range and the light irradiation amount from the light irradiation device 50 can be reduced, so that the adhesive 12 can be cured efficiently and in a short time. Note that other configuration and effects are the same as those of the above-described embodiment, and a description thereof will be omitted.

Further, as shown in FIG. 7, for example, as a fixing method according to a third modification, the position adjusting holes 46 are arranged, for example, diagonally opposite to each other, and the position adjusting holes 4 are formed.
A cutout portion 44 of the flexible 4a is formed inside the inner surface 6 and at a position facing the diagonal line. Then, it is also preferable to provide a through hole 56 in the substrate 8 exposed through the cutout portion 44 and apply the adhesive 12 to the inner peripheral surface of the through hole 56.

When the position of the substrate 8 with respect to the fixed optical block 6 is adjusted, a force is applied to the substrate 8 by the position adjusting pins 48 (see FIG. 4C), and if the substrate 8 is deformed, When the adjustment pin 48 is removed, the position of the light receiving element 10 (see FIG. 1) may be shifted from the optical axis.

However, according to the method of fixing the substrate 8 to the fixed optical block 6 by applying the adhesive 12 to the inside of the position adjusting hole 46 as in the present modification, the position adjusting pin 48 is removed. Also, the light receiving element 10 does not deviate from the optical axis. As a result, the accuracy of the position adjustment operation can be improved. In this case, the mechanism used at the time of position adjustment is not limited to the position adjusting pin 48. For example, even when a mechanism for moving the substrate 8 while holding the outer shape is used, an adhesive is provided on the inner region of the mechanism. The same operation and effect can be realized by configuring to apply 12. Note that the other configuration and effects are the same as those of the above-described embodiment and the first and second modifications, and thus description thereof will be omitted.

[0031]

According to the present invention, when the substrate is fixed to a predetermined portion via an adhesive applied to several places on the side surface of the substrate for holding the electric components and the like, the adhesive is quickly and entirely applied. By reliably curing over the entire area, it is possible to provide an electric component holding unit capable of firmly fixing a substrate, an electric component, and the like to a predetermined portion.

[Brief description of the drawings]

FIG. 1 is a diagram showing a main configuration of an electric component holding unit according to an embodiment of the present invention.

FIG. 2 is a diagram showing an internal configuration of an optical device in which the electric component holding unit according to the embodiment is incorporated.

FIG. 3 is a diagram showing an external configuration of an optical device in which the electric component holding unit according to the embodiment is incorporated.

4A and 4B are views for explaining a fixing method applied to the present embodiment, and FIG. 4A is a plan view showing a state in which a substrate to which a flexible member is attached is fixed to a fixed optical block with an adhesive. , (B) is a sectional view taken along line bb in FIG.
FIG. 3C is a cross-sectional view illustrating a state where the position of the substrate is adjusted by the position adjustment pins.

FIG. 5A is a plan view showing a state in which a substrate is fixed to a fixed optical block by a fixing method according to a first modification of the present invention, and FIG. 5B is bb in FIG. Sectional view along the line.

6A is a plan view showing a state in which a substrate is fixed to a fixed optical block by a fixing method according to a second modification of the present invention, and FIG. 6B is bb in FIG. Sectional view along the line.

FIG. 7 is a plan view showing a state where a substrate is fixed to a fixed optical block by a fixing method according to a third modified example of the present invention.

[Explanation of symbols]

 4a Flexible 8 Substrate 8a Applied surface 12 Adhesive 44 Notch 50 Light irradiation machine

Claims (2)

[Claims] An electric component, a printed circuit board for making an electrical connection to the electric component, and a substrate formed of a light transmissive material capable of holding the electric component and the printed circuit board By irradiating the light-curable adhesive applied to the substrate with light, the electrical component holding unit capable of fixing the substrate to a predetermined portion, wherein the printed board has An electric component holding unit, wherein a light irradiating portion capable of irradiating the applied photocurable adhesive with light is formed. 2. An electric component, a printed circuit board for making an electrical connection to the electric component, and a substrate formed of a light transmissive material capable of holding the electric component and the printed circuit board By irradiating light to a photo-curable adhesive applied to the substrate, an electric component holding unit capable of fixing the substrate to a predetermined portion, wherein the substrate is formed from the printed substrate In the avoidance position,
A light irradiating part is formed, which can apply the photocurable adhesive and can irradiate the photocurable adhesive with light without being blocked by the printed circuit board. An electric component holding unit characterized by the above-mentioned.