JPH11329888A - Stacked chip components - Google Patents

Abstract

(57) [Problem] To provide a multilayer chip component having a built-in variable capacitance capacitor. SOLUTION: A voltage is applied between a pair of first electrodes 1 and 2 which are arranged to face each other with a dielectric material 9 interposed therebetween, and oppose each other with the first electrodes 1 and 2 therebetween. And a pair of second electrodes 3 and 4 for adjusting the capacitance between the first electrodes 1 and 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer chip component used as a capacitor or including a capacitor, for example, as a low-pass filter, a high-pass filter, a band-pass filter, or a band elimination filter.

[0002]

2. Description of the Related Art Hitherto, it has been widely practiced to manufacture a capacitor by a multilayer chip manufacturing technique, or to manufacture a filter including a capacitor and a passive element other than the capacitor. Since the capacitance of the capacitor is fixed, a filter using the capacitor can have only a fixed frequency characteristic.

[0003] Therefore, a problem that a filter whose frequency characteristics do not match is mounted on a device and a desired frequency characteristic cannot be obtained, or a signal component necessary for the incompatible filter is removed. In such a case, a problem may arise that a filter having a different frequency characteristic must be remounted. Further, in a device using such a filter, a problem may occur that a signal waveform is distorted due to impedance mismatch or the like.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in consideration of the above circumstances, and has as its object to provide a multilayer chip component having a built-in capacitor having a variable capacitance.

[0005]

According to the present invention, there is provided a multi-layer chip component for achieving the above object, comprising: a pair of first electrodes disposed to face each other with a dielectric therebetween; and a pair of the first electrodes. And a pair of second electrodes that oppose each other and that adjusts the capacitance between the first electrodes by applying a voltage between them.

[0006]

Embodiments of the present invention will be described below. FIG. 1 is a perspective view showing a first embodiment of the multilayer chip component of the present invention, FIG. 2 is an exploded perspective view showing the internal structure of the first embodiment of the multilayer chip component of the present invention, and FIG.
1 is an AA cross-sectional view (a) and a BB cross-sectional view (b) of FIG. 1, and FIG. 4 is an external view of a first embodiment of a multilayer chip component of the present invention.

This embodiment shows an example in which the multilayer chip component of the present invention is configured as a low-pass filter. As shown in FIG. 1, a pair of electrodes 1, 2,
And a pair of voltage applying electrodes 3 and 4 which oppose each other with the electrodes 1 and 2 therebetween and adjust the capacitance between the electrodes 1 and 2 by applying a voltage between them. Provided.

In this embodiment, a pair of electrodes 1 and 2
2 corresponds to the first electrode according to the present invention,
The pair of voltage applying electrodes 3 and 4 in the present embodiment corresponds to the second electrode according to the present invention. As shown in FIGS. 2 and 3, the multilayer chip 10 is formed as a multilayer chip by laminating a plurality of ceramic layers.

As shown in FIG. 4, the electrode 1 is connected to terminals 5a and 5b formed on both ends 10a and 10b of the multilayer chip 10, respectively. The electrode 2 is connected to terminals 6a and 6b formed on both side surfaces 10c and 10d of the multilayer chip 10, respectively. The voltage applying electrode 3
The voltage application electrode 4 is connected to a terminal 8 formed on a side surface 10 d of the multilayer chip 10, while the terminal 7 is connected to a terminal 7 formed on a side surface 10 c of the multilayer chip 10.

Of the pair of electrodes 1 and 2, the electrode 1 is used as a signal electrode, the electrode 2 is used as a ground electrode, and the two electrodes 1 and 2 form a capacitor. Unless a voltage is particularly applied between the voltage applying electrodes 3 and 4, the multilayer chip 10 functions as a low-pass filter having a fixed frequency characteristic. here,
When a voltage from a power supply (not shown) is applied between the voltage application electrodes 3 and 4 via the terminals 7 and 8,
The capacitance of the capacitor formed between the two changes, and the frequency characteristic of the low-pass filter can be changed to a frequency characteristic different from that when no voltage is applied. By changing the applied voltage between the voltage applying electrodes 3 and 4, the capacitance is reduced by about 0% compared to when no voltage is applied.
From about 80%.

As a method of changing the voltage applied to the laminated chip 10, for example,
Is mounted on a circuit, and then a voltage power supply and a variable resistor are connected between the terminals 7 and 8 to change the resistance value. As a material of the dielectric 9,
High dielectric constant materials such as relaxor-based and barium titanate;
Raw materials containing at least a dielectric material, such as a mixture of magnetic materials such as NiZn-ferrite and NiZnCu-ferrite, or a material obtained by adding a sintering aid to these materials can be used. By laminating the ceramic green sheets produced from the above-described raw materials, the laminated chip 10 having the structure shown in FIGS. 4 to 3 can be manufactured.

Next, a second embodiment of the present invention will be described. FIG. 5 is an internal structural view showing a second embodiment of the multilayer chip component of the present invention, FIG. 6 is a sectional view taken along line AA of FIG. 5, and FIG. It is an appearance perspective view of an embodiment. This embodiment shows an example in which the multilayer chip component of the present invention is used as a bandpass filter.

As shown in FIG. 5, this laminated chip 20
A pair of electrodes 21 and 22 which are opposed to each other with the dielectric 9 interposed therebetween, and which are opposed to each other with the electrodes 21 and 22 interposed therebetween.
A pair of voltage application electrodes 23 and 24 for adjusting the capacitance between the electrodes 1 and 22 are provided. The pair of electrodes 21 and 22 in the present embodiment correspond to the first electrode according to the present invention, and the pair of voltage applying electrodes 23 and 24 in the present embodiment correspond to the second electrode according to the present invention. Of the electrodes.

As shown in FIG. 6, this laminated chip 20
Is formed as a laminated chip by laminating a plurality of ceramic layers. As shown in FIG.
1 is an end portion 20 of the multilayer chip 20 via a coil 25.
The electrode 22 is connected to a terminal 27 formed on the other end 20 b of the multilayer chip 20. The voltage application electrode 23 is connected to a terminal 28 formed at the end 20 c of the multilayer chip 20, and the voltage application electrode 24 is connected to the end 2 of the multilayer chip 20.
It is connected to a terminal 29 formed at 0d.

As in the first embodiment, a pair of electrodes 21 and
22 forms a capacitor. Further, in the present embodiment, a coil 25 is formed between the electrode 21 and the terminal 26, and the coil 25 and the capacitor constitute a bandpass filter having a specific frequency characteristic. By changing the voltage applied between the voltage applying electrodes 23 and 24 via the terminal 28 and the terminal 29, the capacitance of the capacitor formed between the electrodes 21 and 22 is changed and the band pass is changed. The frequency characteristics of the filter can be changed.

[0016]

As described above, the laminated chip component of the present invention has a pair of first electrodes disposed to face each other with a dielectric therebetween, and the pair of first electrodes interposed therebetween. And a pair of second electrodes facing each other.
By changing the voltage applied between the electrodes, it is possible to adjust the capacitance between the first electrodes. For example, a built-in variable capacitance capacitor that can be used as a filter with variable frequency characteristics A multilayer chip component can be realized.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a first embodiment of a multilayer chip component of the present invention.

FIG. 2 is an exploded perspective view showing the internal structure of the first embodiment of the multilayer chip component of the present invention.

3A is a cross-sectional view of FIG. 1A, and FIG. 3B is a cross-sectional view of BB.

FIG. 4 is an external view of a first embodiment of the multilayer chip component of the present invention.

FIG. 5 is an internal structural diagram showing a second embodiment of the multilayer chip component of the present invention.

6 is a sectional view taken along line AA of FIG.

FIG. 7 is an external perspective view of a second embodiment of the multilayer chip component of the present invention.

[Explanation of symbols]

1, 2, 3, 4 electrode 5a, 5b, 6a, 6b, 7, 8 terminal 9 dielectric 10 laminated chip 10a, 10b end 10c, 10d side surface 20 laminated chip 21, 22, 23, 24 electrode 25 coil 26, 27, 28, 29 terminals

Claims (1)

[Claims] A pair of first electrodes disposed to face each other with a dielectric interposed therebetween, and a pair of first electrodes facing each other with the pair of first electrodes interposed therebetween. The first
And a pair of second electrodes for adjusting the capacitance between the electrodes.