JPH11330152A - Granular anisotropic conductive adhesive - Google Patents
Granular anisotropic conductive adhesiveInfo
- Publication number
- JPH11330152A JPH11330152A JP10137241A JP13724198A JPH11330152A JP H11330152 A JPH11330152 A JP H11330152A JP 10137241 A JP10137241 A JP 10137241A JP 13724198 A JP13724198 A JP 13724198A JP H11330152 A JPH11330152 A JP H11330152A
- Authority
- JP
- Japan
- Prior art keywords
- anisotropic conductive
- conductive adhesive
- granular
- chip
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
(57)【要約】
【課題】 異方性導電接着剤からなる接着材を用いてＩ
Ｃチップを基板に実装するにあたり、その接着材の保存
管理を容易にし、簡便な操作で短時間にＩＣチップを基
板に実装できるようにする。
【解決手段】 絶縁性接着剤中に導電性粒子が分散して
なる異方性導電接着剤を、室温において固体でかつ粒状
の粒状異方性導電接着剤１０とする。
PROBLEM TO BE SOLVED: To provide an I using an adhesive made of an anisotropic conductive adhesive.
In mounting a C chip on a substrate, the storage management of the adhesive is facilitated, and the IC chip can be mounted on the substrate in a short time by a simple operation. SOLUTION: An anisotropic conductive adhesive obtained by dispersing conductive particles in an insulating adhesive is a granular anisotropic conductive adhesive which is solid at room temperature and granular.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、室温において固体
であり、粒状に成形されている粒状異方性導電接着剤に
関する。TECHNICAL FIELD The present invention relates to a granular anisotropic conductive adhesive which is solid at room temperature and is formed into a granular form.
【０００２】[0002]
【従来の技術】近年、情報端末機器を中心として、高機
能化、軽量化、薄型化、小型化の市場ニーズが高まって
いるのに伴い、ベアチップを直接的にプリント配線板そ
の他の基板に実装する方法が種々検討されている。2. Description of the Related Art In recent years, as market needs for high functionality, light weight, thinness, and miniaturization of information terminal equipment have increased, bare chips have been directly mounted on printed wiring boards and other substrates. Various methods have been studied.
【０００３】その一つとして、熱硬化型接着剤中に導電
性粒子を分散した異方性導電接着剤をフィルム状に成形
した異方性導電膜（ＡＣＦ）や、異方性導電接着剤を液
状に調製した異方性導電ペースト（ＡＣＰ）を用いる方
法がある。このうち異方性導電膜の製品形態は、通常、
図４に示した異方性導電接着材１のように、ベースフィ
ルム２上に異方性導電膜３を積層し、それをリールに巻
いたものとなっている。One of them is an anisotropic conductive film (ACF) formed by forming an anisotropic conductive adhesive in which conductive particles are dispersed in a thermosetting adhesive into a film, or an anisotropic conductive adhesive. There is a method using an anisotropic conductive paste (ACP) prepared in a liquid state. Of these, the product form of the anisotropic conductive film is usually
Like an anisotropic conductive adhesive 1 shown in FIG. 4, an anisotropic conductive film 3 is laminated on a base film 2 and wound on a reel.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、従来の
異方性導電膜３からなる接着材１は、それを用いてＩＣ
チップを基板に実装する際に、まず異方性導電膜３を基
板に加熱加圧して仮転着し、次にベースフィルム２を剥
離し、その後本圧着しなくてはならず、工程数が多いと
いう問題がある。また、異方性導電膜３を基板に仮転着
する工程では、その加熱加圧条件にもよるが、例えば、
温度６０〜１００、圧力２〜５ｋｇｆ／ｃｍ2とした場
合に、タクトタイムとして５〜７秒程度が必要である。
これを短縮するには、設備台数の増設等が必要となる
が、設備を増設することは容易でない。However, the conventional adhesive 1 made of the anisotropic conductive film 3 can be used for the IC 1
When the chip is mounted on the substrate, the anisotropic conductive film 3 must first be heated and pressed to the substrate and temporarily transferred, then the base film 2 must be peeled off, and then the final pressure bonding must be performed. There is a problem that there are many. In addition, in the step of temporarily transferring the anisotropic conductive film 3 to the substrate, although it depends on the heating and pressing conditions, for example,
When the temperature is 60 to 100 and the pressure is 2 to 5 kgf / cm 2 , a tact time of about 5 to 7 seconds is required.
In order to shorten this, it is necessary to increase the number of facilities, but it is not easy to increase the number of facilities.
【０００５】一方、異方性導電ペーストを用いてＩＣチ
ップを基板に実装するときには、異方性導電膜３からな
る接着材１を用いる場合のような仮転着工程は必要な
く、異方性導電ペーストを基板の所定の部位に塗布し、
そこにＩＣチップを加熱加圧すればよい。この異方性導
電ペーストの塗布工程は通常２〜５秒程度で完了するの
で、異方性導電膜３を用いた接着材１よりも実装工程に
要する時間を短縮することができる。また、異方性導電
ペーストの基板への塗布は、市販のディスペンサーを用
いることができるので、設備的にも有利である。[0005] On the other hand, when an IC chip is mounted on a substrate using an anisotropic conductive paste, a temporary transfer step is not required as in the case of using an adhesive material 1 made of an anisotropic conductive film 3. Apply the conductive paste to a predetermined part of the substrate,
The IC chip may be heated and pressed there. Since the application step of the anisotropic conductive paste is usually completed in about 2 to 5 seconds, the time required for the mounting step can be shorter than that of the adhesive 1 using the anisotropic conductive film 3. In addition, a commercially available dispenser can be used for applying the anisotropic conductive paste to the substrate, which is advantageous in terms of equipment.
【０００６】しかしながら、異方性導電ペーストは液状
であるために長期の保存期間中に導電性粒子が沈降する
という問題があり、粘度管理も容易でない。また、溶剤
の揮散による作業環境の悪化も問題となる。さらに、塗
布量を一定にコントロールすることが難しいという問題
もある。[0006] However, since the anisotropic conductive paste is in a liquid state, there is a problem that conductive particles settle during a long storage period, and it is not easy to control the viscosity. In addition, deterioration of the working environment due to evaporation of the solvent also poses a problem. Furthermore, there is a problem that it is difficult to control the amount of application constantly.
【０００７】本発明は、以上のような従来の異方性導電
膜あるいは異方性導電ペーストがかかえる問題に対し、
異方性導電接着剤からなる接着材を用いてＩＣチップを
基板に実装するにあたり、その接着材の保存管理を容易
にし、簡便な操作で短時間にＩＣチップを基板に実装で
きるようにすることを目的とする。[0007] The present invention solves the above-mentioned problems associated with the conventional anisotropic conductive film or anisotropic conductive paste.
When mounting an IC chip on a substrate using an adhesive made of an anisotropic conductive adhesive, the storage management of the adhesive is facilitated, and the IC chip can be mounted on the substrate in a short time by a simple operation. With the goal.
【０００８】[0008]
【課題を解決するための手段】上述の目的を達成するた
め、本発明は、絶縁性接着剤中に導電性粒子が分散して
なる異方性導電接着剤であって、室温において固体であ
り、粒状をなしていることを特徴とする粒状異方性導電
接着剤を提供する。In order to achieve the above-mentioned object, the present invention is directed to an anisotropic conductive adhesive comprising conductive particles dispersed in an insulating adhesive, which is solid at room temperature. The present invention provides a granular anisotropic conductive adhesive characterized by being granular.
【０００９】また、上述の粒状異方性導電接着剤が支持
シート上に複数離隔的に配設されている異方性導電接着
シートを提供する。Further, the present invention provides an anisotropic conductive adhesive sheet in which a plurality of the above-mentioned granular anisotropic conductive adhesives are disposed on a support sheet at a distance.
【００１０】さらに、上述の粒状異方性導電接着剤を用
いたＩＣチップの実装方法として、上述の粒状異方性導
電接着剤をＩＣチップの接続面に仮接着し、その粒状異
方性導電接着剤を仮接着したＩＣチップを基板に圧着す
ることによりＩＣチップを基板に実装するＩＣチップの
実装方法を提供する。Further, as a method of mounting an IC chip using the above-mentioned granular anisotropic conductive adhesive, the above-mentioned granular anisotropic conductive adhesive is temporarily bonded to a connection surface of the IC chip, and the granular anisotropic conductive adhesive is provided. Provided is an IC chip mounting method for mounting an IC chip on a substrate by pressing an IC chip to which an adhesive has been temporarily adhered onto a substrate.
【００１１】本発明の粒状異方性導電接着剤は室温で粒
状に成形されているため、その一粒をＩＣチップの接続
面に仮接着し、それを基板に圧着することによりＩＣチ
ップを基板に実装することができる。この場合、従来の
異方性導電膜からなる接着材を用いてＩＣチップを実装
する場合のような、ＩＣチップを異方性導電膜に仮接着
した後のベースフィルムの剥離工程が不要となり、ま
た、異方性導電膜のカット工程が不要なので、従来の異
方性導電膜からなる接着材に比して少ない工程で容易に
実装することが可能となる。Since the granular anisotropic conductive adhesive of the present invention is formed into a granular form at room temperature, one of the particles is temporarily bonded to the connection surface of the IC chip, and then the IC chip is pressed onto the substrate, thereby bonding the IC chip to the substrate. Can be implemented. In this case, there is no need to remove the base film after temporarily attaching the IC chip to the anisotropic conductive film, as in the case where the IC chip is mounted using an adhesive made of a conventional anisotropic conductive film, Further, since the step of cutting the anisotropic conductive film is not required, the mounting can be easily performed with fewer steps as compared with a conventional adhesive made of an anisotropic conductive film.
【００１２】また、本発明の粒状異方性導電接着剤は室
温で固形であるため、従来の液状の異方性導電ペースト
に比して保存安定性が向上したものとなる。さらに、当
該ＩＣチップの実装に適切な異方性導電接着剤の使用量
を、粒状異方性導電接着剤の粒の大きさを適宜選択する
ことにより容易にコントロールすることができる。Further, since the granular anisotropic conductive adhesive of the present invention is solid at room temperature, the storage stability is improved as compared with the conventional liquid anisotropic conductive paste. Further, the amount of the anisotropic conductive adhesive suitable for mounting the IC chip can be easily controlled by appropriately selecting the grain size of the granular anisotropic conductive adhesive.
【００１３】[0013]
【発明の実施の形態】以下、本発明の粒状異方性導電接
着剤を、図面を参照しつつ詳細に説明する。なお、各図
中、同一符号は同一又は同等の構成要素を表している。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the granular anisotropic conductive adhesive of the present invention will be described in detail with reference to the drawings. In each of the drawings, the same reference numerals represent the same or equivalent components.
【００１４】本発明の粒状異方性導電接着剤は、絶縁性
接着剤中に導電性粒子が分散してなり、かつ室温におい
て固体であり、粒状に成形されているものである。The granular anisotropic conductive adhesive of the present invention is formed by dispersing conductive particles in an insulating adhesive, is solid at room temperature, and is formed into particles.
【００１５】ここで、絶縁性接着剤としては、種々の熱
硬化性接着剤又は熱可塑性接着剤を使用することができ
る。例えば、熱硬化性接着剤としては、エポキシ系樹
脂、ウレタン系樹脂、アクリレート系樹脂等をあげるこ
とができる。これらは単独で使用してもよく、複数種を
混合して使用してもよい。また、このような樹脂成分か
ら絶縁性接着剤を調製するに際しては、得られる絶縁性
接着剤が室温で固体となるように適宜調整する。例え
ば、必要に応じて樹脂成分を任意の硬化処理によりＢス
テージ化する。Here, as the insulating adhesive, various thermosetting adhesives or thermoplastic adhesives can be used. For example, examples of the thermosetting adhesive include an epoxy resin, a urethane resin, and an acrylate resin. These may be used alone or in combination of two or more. Further, when preparing an insulating adhesive from such a resin component, an appropriate adjustment is made so that the obtained insulating adhesive is solid at room temperature. For example, the resin component is B-staged by an optional curing treatment as necessary.
【００１６】熱可塑性接着剤としては、アクリル系樹
脂、ウレタン系樹脂、ゴム系樹脂等をあげることができ
る。これらは、単独で使用してもよく、複数種を混合し
て使用してもよい。このような樹脂成分から絶縁性接着
剤を構成する場合も、得られる絶縁性接着剤が室温で固
形となるように適宜調整する。例えば、複数樹脂を使用
する場合、樹脂の軟化点又は融点以上に加熱し、混合後
冷却する。Examples of the thermoplastic adhesive include acrylic resins, urethane resins, rubber resins and the like. These may be used alone or in combination of two or more. In the case where the insulating adhesive is formed from such a resin component, it is appropriately adjusted so that the obtained insulating adhesive is solid at room temperature. For example, when a plurality of resins are used, they are heated above the softening point or melting point of the resins, mixed, and cooled.
【００１７】絶縁性接着剤としては、上述の熱硬化性接
着剤を構成する樹脂成分と熱可塑性接着剤を構成する樹
脂成分とを混合して使用してもよい。As the insulating adhesive, a resin component constituting the above-mentioned thermosetting adhesive and a resin component constituting the thermoplastic adhesive may be mixed and used.
【００１８】一方、導電性粒子としては、例えば、Ｎ
ｉ、Ａｇ、Ｃｕ又はこれらの合金等からなる金属粉、球
状樹脂粒子の表面に金属メッキを施したもの等、電気的
良導体からなる粒子を種々使用することができる。この
ような電気的良導体からなる粒子上に絶縁被膜を形成し
た粒子も使用することができる。また、導電性粒子の粒
径は、０．１〜２０μｍとすることが好ましい。On the other hand, as the conductive particles, for example, N
Various kinds of particles made of a good electrical conductor, such as metal powders made of i, Ag, Cu or alloys thereof, and spherical resin particles having a surface plated with metal can be used. Particles obtained by forming an insulating coating on such particles of a good electrical conductor can also be used. Further, the particle size of the conductive particles is preferably 0.1 to 20 μm.
【００１９】異方性導電接着剤は、以上の絶縁性接着剤
と導電性粒子とを常法にしたがって混合することにより
調製できるが、本発明においては、こうして得られる異
方性導電接着剤が室温において固体となり、かつ粒状と
なるように成形する。ここで、異方性導電接着剤を室温
において固体とするためには、前述のように、導電性粒
子と混合する熱硬化性接着剤又は熱可塑性接着剤を予め
処理してもよく、また、熱硬化性接着剤又は熱可塑性接
着剤と導電性粒子とを混合した後、加熱、ＵＶ照射等の
処理を行ってもよい。The anisotropic conductive adhesive can be prepared by mixing the above-mentioned insulating adhesive and conductive particles according to a conventional method. In the present invention, the anisotropic conductive adhesive thus obtained is used. It is molded to be solid at room temperature and to be granular. Here, in order to make the anisotropic conductive adhesive solid at room temperature, as described above, a thermosetting adhesive or a thermoplastic adhesive mixed with the conductive particles may be previously treated, After mixing the thermosetting adhesive or the thermoplastic adhesive with the conductive particles, a treatment such as heating or UV irradiation may be performed.
【００２０】また、本発明において異方性導電接着剤が
粒状であるとは、固体の一粒一粒が独立した状態にあれ
ばよく、個々の粒の形状に特に限定はない。例えば、球
状、板状、キュービック状等とすることができる。これ
らのうち、球状の異方性導電接着剤を得る方法として
は、例えば、絶縁性接着剤と導電性粒子とを混合したも
のをその融点以上の温度に加熱し、それを非相溶系の溶
媒に滴下する。また、板状やキュービック状のものは、
例えば、棒状に成形した異方性導電接着剤を所定の厚み
にカットすることにより得ることができる。この他、金
型を使用して任意の形状に成形してもよく、網に異方性
導電接着剤を押し出してもよい。In the present invention, the expression that the anisotropic conductive adhesive is in the form of particles means that each solid particle is in an independent state, and the shape of each individual particle is not particularly limited. For example, the shape may be spherical, plate-like, cubic, or the like. Among these, as a method of obtaining a spherical anisotropic conductive adhesive, for example, a mixture of an insulating adhesive and conductive particles is heated to a temperature equal to or higher than its melting point, and the mixture is heated to an incompatible solvent. To be dropped. In addition, plate-shaped or cubic-shaped
For example, it can be obtained by cutting a rod-shaped anisotropic conductive adhesive into a predetermined thickness. In addition, a metal mold may be used to form an arbitrary shape, or an anisotropic conductive adhesive may be extruded into a net.
【００２１】なお、同一形状の粒状異方性導電接着剤を
大量に生産する点からは、粒子形状を球形とすることが
好ましく、また、粒状異方性導電接着剤をＩＣチップに
仮接着する際の接着安定性の点からは、板状あるいはキ
ュービック状等とすることが好ましい。From the viewpoint of mass-producing the same shape of the granular anisotropic conductive adhesive, it is preferable that the particle shape is spherical, and the granular anisotropic conductive adhesive is temporarily bonded to the IC chip. From the viewpoint of the bonding stability at this time, it is preferable to use a plate shape or a cubic shape.
【００２２】粒状異方性導電接着剤の大きさは、接続す
るベアチップの実質的な大きさ及び作業性の点から、粒
状異方性導電接着剤の一粒の体積ｄを０．１〜３０ｍｍ
3とすることが好ましい。The size of the granular anisotropic conductive adhesive is set such that the volume d of one particle of the granular anisotropic conductive adhesive is 0.1 to 30 mm in view of the substantial size of the bare chip to be connected and workability.
It is preferably 3 .
【００２３】また、図３（ａ）に示すように、粒状異方
性導電接着剤１０を用いて基板２０のパターン２１とＩ
Ｃチップ３０の電極３１とを接続し、同図（ｂ）のよう
な実装構造を得る場合の当該基板２０のパターン２１の
高さをｈ1、ＩＣチップ３０の電極３１の高さをｈ2、Ｉ
Ｃチップ３０の接着面積をＡとしたときに次式Ｄ＝（ｈ
1＋ｈ2）×Ａにより算出される体積Ｄと、粒状異方性導
電接着剤の一粒の体積ｄとが0.5Ｄ≦ｄ≦2Ｄを満たすよ
うにすることが好ましい。ｄ＞2ＤであるとＩＣチップ
３０を接続する際に異方性導電接着剤のはみ出し量が多
くなり、ボンディングベッドが汚れるので好ましくな
く、ｄ＜0.5ＤであるとＩＣチップ３０と基板２０との
間に異方性導電接着剤が満たされず、接続信頼性が低く
なるので好ましくない。As shown in FIG. 3A, the pattern 21 of the substrate 20 is
When connecting the electrodes 31 of the C chip 30 to obtain a mounting structure as shown in FIG. 3B, the height of the pattern 21 of the substrate 20 is h 1 , and the height of the electrodes 31 of the IC chip 30 is h 2. , I
When the bonding area of the C chip 30 is A, the following equation D = (h
It is preferable that the volume D calculated by 1 + h 2 ) × A and the volume d of one granular anisotropic conductive adhesive satisfy 0.5D ≦ d ≦ 2D. When d> 2D, the amount of the anisotropic conductive adhesive protruding when the IC chip 30 is connected increases, and the bonding bed becomes dirty, which is not preferable. When d <0.5D, the IC chip 30 and the substrate 20 are not connected to each other. It is not preferable because the anisotropic conductive adhesive is not filled between them, and the connection reliability is lowered.
【００２４】本発明の粒状異方性導電接着剤は、トレー
その他の収容容器に入れ、そこから一粒ずつ取り出して
使用してもよいが、例えば、図２に示すように、支持シ
ート１１上に、複数の粒状異方性導電接着剤１０を離隔
的に配設した異方性導電接着シート１２を作製し、この
シート１２から順次粒状異方性導電接着剤１０を取り出
してもよい。The granular anisotropic conductive adhesive of the present invention may be put in a tray or other storage container and taken out one by one from there, and used, for example, as shown in FIG. Then, an anisotropic conductive adhesive sheet 12 in which a plurality of granular anisotropic conductive adhesives 10 are separately provided may be prepared, and the granular anisotropic conductive adhesive 10 may be sequentially taken out from the sheet 12.
【００２５】この場合、支持シート１１の形成材料には
特に限定はなく、例えば、ポリエステル、アクリル、Ａ
ＢＳ、ポリエチレン、ポリプロピレン等の樹脂から形成
することができる。また、この支持シート１１と粒状異
方性導電接着剤１０との固定は、例えば、アクリル系、
シリコン系等の粘着剤により行うことができ、また、格
別粘着剤を使用することなく、支持シート１１上に粒状
異方性導電接着剤１０を載置し、軽く加圧するだけでも
よい。In this case, the material for forming the support sheet 11 is not particularly limited. For example, polyester, acrylic, A
It can be formed from a resin such as BS, polyethylene, and polypropylene. The fixing of the support sheet 11 and the granular anisotropic conductive adhesive 10 may be performed, for example, using an acrylic resin.
It can be carried out with a silicone-based adhesive or the like. Alternatively, the granular anisotropic conductive adhesive 10 may be placed on the support sheet 11 and lightly pressed without using any special adhesive.
【００２６】支持シート１１上に配設する粒状異方性導
電接着剤１０は、単一の形状あるいは大きさとしてもよ
いが、複数種の形状や大きさのものを配設してもよい。
これにより、当該ＩＣチップと基板との接続に最適の形
状あるいは大きさの粒状異方性導電接着剤１０を一つの
異方性導電接着シート１２の中から容易に選択できるよ
うになる。The granular anisotropic conductive adhesive 10 provided on the support sheet 11 may have a single shape or size, or may have a plurality of shapes and sizes.
As a result, the granular anisotropic conductive adhesive 10 having the optimum shape or size for connecting the IC chip to the substrate can be easily selected from one anisotropic conductive adhesive sheet 12.
【００２７】また、異方性導電接着シート１２は、巻き
回して保管してもよい。これにより、取り扱い性が向上
する。The anisotropic conductive adhesive sheet 12 may be wound and stored. Thereby, handleability is improved.
【００２８】本発明の粒状異方性導電接着剤を用いたＩ
Ｃチップの実装方法としては、例えば、図１に示したよ
うに、ＩＣチップ３０として、突起電極付きベアチップ
ＩＣ３２を使用し、粒状異方性導電接着剤１０の供給源
として上述の図２の異方性導電接着シート１２を用いる
場合、まず、ヒーターツール４０に突起電極付きベアチ
ップＩＣ３２をバキュームチャックし、そのベアチップ
ＩＣ３２を加熱し、支持シート１１上に固定されている
粒状異方性導電接着剤１０上に降ろし（同図ａ）、突起
電極付きベアチップＩＣ３２の接続面に粒状異方性導電
接着剤１０を転着する（同図（ｂ））。次いで、これを
基板２０上に降ろし（同図（ｃ））、ベアチップＩＣ３
２と基板２０とを加熱圧着する（同図（ｄ））。その
後、ヒーターツール４０を引き上げる（同図（ｅ））。
こうしてベアチップＩＣ３２を基板２０へ実装すること
ができる。I using the granular anisotropic conductive adhesive of the present invention
As a method for mounting the C chip, for example, as shown in FIG. 1, a bare chip IC 32 with a protruding electrode is used as the IC chip 30, and the supply source of the granular anisotropic conductive adhesive 10 is the same as that shown in FIG. When using the isotropic conductive adhesive sheet 12, first, the bare chip IC 32 with the protruding electrode is vacuum-chucked to the heater tool 40, the bare chip IC 32 is heated, and the granular anisotropic conductive adhesive 10 fixed on the support sheet 11 is used. Then, the granular anisotropic conductive adhesive 10 is transferred onto the connection surface of the bare chip IC 32 with the protruding electrode (FIG. 2B). Next, this is lowered onto the substrate 20 (FIG. 2C), and the bare chip IC 3
2 and the substrate 20 are thermocompression-bonded (FIG. 2D). Thereafter, the heater tool 40 is pulled up (FIG. 9E).
Thus, the bare chip IC 32 can be mounted on the substrate 20.
【００２９】この場合、ベアチップＩＣ３２と基板２０
との加熱圧着条件は、従来の異方性導電ペーストあるい
は異方性導電膜を使用する場合と同様とすることができ
る。In this case, the bare chip IC 32 and the substrate 20
Can be the same as in the case of using a conventional anisotropic conductive paste or anisotropic conductive film.
【００３０】また、この実装を行うヒーターツール４０
は、従前のフリップチップボンダーで使用されているも
のを使用することができる。Further, a heater tool 40 for performing this mounting is provided.
Can be used in the conventional flip chip bonder.
【００３１】[0031]
【実施例】以下、本発明を実施例に基づいて具体的に説
明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below based on embodiments.
【００３２】実施例１ (1)粒状異方性導電接着剤の作製 以下の表１の異方性導電接着剤成分を混合し、これを７
０℃に加熱したバレルに充填し、ディスペンサーで水中
に滴下することにより、水中に球状の異方性導電接着剤
を形成した。水中から球状の異方性導電接着剤を取り出
し、ドライエアーで乾燥し、直径１．５ｍｍの球状異方
性導電接着剤を得た。また、異方性導電接着剤を水中に
滴下する際のディスペンサーの径を変えることにより、
直径２．６ｍｍの球状異方性導電接着剤を得た。Example 1 (1) Preparation of Granular Anisotropic Conductive Adhesive The anisotropic conductive adhesive components shown in Table 1 below were mixed, and this was mixed with 7
A spherical anisotropic conductive adhesive was formed in water by filling into a barrel heated to 0 ° C. and dripping into water with a dispenser. The spherical anisotropic conductive adhesive was taken out of the water and dried with dry air to obtain a spherical anisotropic conductive adhesive having a diameter of 1.5 mm. Also, by changing the diameter of the dispenser when dropping the anisotropic conductive adhesive in water,
A spherical anisotropic conductive adhesive having a diameter of 2.6 mm was obtained.
【００３３】[0033]
【表１】 異方性導電接着剤成分 ・ビスフェノールＡ型エポキシ樹脂（YD1009、東都化成社） ３０重量部 ・ナフタレン型エポキシ樹脂（4032D、大日本インキ工業社） ５０重量部 ・イミダゾール系硬化剤（3941HP、旭化成社） ２０重量部 ・樹脂ボール導電粒子（ミクロパールAU、積水化学社） １５重量部 [Table 1] Anisotropic conductive adhesive components・ Bisphenol A type epoxy resin (YD1009, Toto Kasei Co., Ltd.) 30 parts by weight ・ Naphthalene type epoxy resin (4032D, Dainippon Ink Industries, Ltd.) 50 parts by weight ・ Imidazole-based curing agent ( 3941HP, Asahi Kasei) 20 parts by weight ・ Resin ball conductive particles (Micropearl AU, Sekisui Chemical) 15 parts by weight
【００３４】(2)ＩＣチップの実装 ＩＣチップとしては、６．３ｍｍ角の大きさで、突起電
極の高さが２０μｍのものと、１０ｍｍ角の大きさで、
突起電極の高さが５０μｍのものを用意し、これらＩＣ
チップを実装する基板としては、導体パターンの高さが
２０μｍのプリント配線板を用意した。(2) Mounting of IC chip The IC chip has a size of 6.3 mm square, and the height of the protruding electrode is 20 μm.
A bump electrode having a height of 50 μm is prepared.
A printed wiring board having a conductor pattern height of 20 μm was prepared as a substrate on which the chip was mounted.
【００３５】フリップチップボンダーのヒーターツール
に、上述の２種のＩＣチップをそれぞれバキュームチャ
ックし、ＩＣチップの接続面を９０℃に加熱し、そこに
直径１．５ｍｍ又は直径２．６ｍｍの球状異方性導電接
着剤を仮接着し、次いでその球状異方性導電接着剤を仮
接着したＩＣチップとプリント配線板とを加熱加圧し
た。Each of the above two types of IC chips is vacuum-chucked to a heater tool of a flip chip bonder, and the connection surface of the IC chips is heated to 90 ° C., and the spherical surface having a diameter of 1.5 mm or 2.6 mm is added thereto. The isotropic conductive adhesive was temporarily bonded, and then the IC chip to which the spherical anisotropic conductive adhesive was temporarily bonded and the printed wiring board were heated and pressed.
【００３６】その結果、６．３ｍｍ角のＩＣチップを直
径１．５ｍｍの球状異方性導電接着剤を用いて実装した
場合には、そのＩＣチップの接続面とプリント配線板と
の間が十分に異方性導電接着剤で満たされ、良好に接続
されていた。As a result, when an 6.3 mm square IC chip is mounted using a 1.5 mm diameter spherical anisotropic conductive adhesive, there is sufficient space between the connection surface of the IC chip and the printed wiring board. Was filled with an anisotropic conductive adhesive and was well connected.
【００３７】１０ｍｍ角のＩＣチップを直径１．５ｍｍ
の球状異方性導電接着剤を用いて接続した場合には、Ｉ
Ｃチップの接続面とプリント配線板との間が異方性導電
接着剤で完全には満たされてはいなかったが、同じく１
０ｍｍ角のＩＣチップを直径２．６ｍｍの球状異方性導
電接着剤を用いて接続した場合には、ＩＣチップの接続
面とプリント配線板との間が十分に異方性導電接着剤で
満たされ、良好に接続されていた。A 10 mm square IC chip having a diameter of 1.5 mm
When the connection is made using the spherical anisotropic conductive adhesive of
The space between the connection surface of the C chip and the printed wiring board was not completely filled with the anisotropic conductive adhesive.
When a 0 mm square IC chip is connected using a 2.6 mm diameter spherical anisotropic conductive adhesive, the space between the connection surface of the IC chip and the printed wiring board is sufficiently filled with the anisotropic conductive adhesive. Was and was well connected.
【００３８】[0038]
【発明の効果】本発明の粒状異方性導電接着剤によれ
ば、従来の異方性導電膜からなる接着材を用いてＩＣチ
ップを基板に実装する場合のように、ベースフィルムを
剥離することが不要となり、簡便にＩＣチップと基板と
を接続することが可能となる。According to the granular anisotropic conductive adhesive of the present invention, the base film is peeled off as in the case where an IC chip is mounted on a substrate using a conventional adhesive made of an anisotropic conductive film. This makes it unnecessary to easily connect the IC chip and the substrate.
【００３９】また、本発明の粒状異方性導電接着剤は室
温で固体であるため、従来の異方性導電ペーストのよう
に、その保管中に導電性粒子が沈降することはなく、保
存安定性が向上したものとなる。さらにＩＣチップの実
装時に使用する異方性導電接着剤の量を、粒状異方性導
電接着剤の粒径の大きさを適宜選択することにより容易
にコントロールすることができる。したがって、異方性
導電ペーストの塗布時に必要とされている塗布量の制御
も不要とすることができる。Further, since the granular anisotropic conductive adhesive of the present invention is solid at room temperature, unlike the conventional anisotropic conductive paste, the conductive particles do not settle during storage and are stable in storage. The property is improved. Further, the amount of the anisotropic conductive adhesive used when mounting the IC chip can be easily controlled by appropriately selecting the particle size of the granular anisotropic conductive adhesive. Therefore, it is not necessary to control the amount of application required when applying the anisotropic conductive paste.
【図１】粒状異方性導電接着剤を用いたＩＣチップの実
装方法の工程説明図である。FIG. 1 is a process explanatory view of an IC chip mounting method using a granular anisotropic conductive adhesive.
【図２】異方性導電接着シートの平面図である。FIG. 2 is a plan view of an anisotropic conductive adhesive sheet.
【図３】粒状異方性導電接着剤と、それを用いて実装す
るＩＣチップと基板との断面図（同図（ａ））及びその
実装構造の断面図（同図（ｂ））である。FIG. 3 is a sectional view (FIG. 3A) of a granular anisotropic conductive adhesive, an IC chip and a substrate mounted using the same, and a sectional view of the mounting structure thereof (FIG. 3B). .
【図４】従来の異方性導電膜からなる接着材の断面図で
ある。FIG. 4 is a cross-sectional view of a conventional adhesive made of an anisotropic conductive film.
１ 異方性導電接着材 ２ ベースフィルム ３ 異方性導電膜 １０ 粒状異方性導電接着剤 １１ 支持シート １２ 異方性導電接着シート ２０ 基板 ２１ 基板のパターン ３０ ＩＣチップ ３１ ＩＣチップの電極 ３２ 突起電極付きベアチップＩＣ Reference Signs List 1 anisotropic conductive adhesive 2 base film 3 anisotropic conductive film 10 granular anisotropic conductive adhesive 11 support sheet 12 anisotropic conductive adhesive sheet 20 substrate 21 substrate pattern 30 IC chip 31 IC chip electrode 32 protrusion Bare chip IC with electrodes
Claims (8)
なる異方性導電接着剤であって、室温において固体であ
り、粒状をなしていることを特徴とする粒状異方性導電
接着剤。1. An anisotropic conductive adhesive comprising conductive particles dispersed in an insulating adhesive, which is solid at room temperature and has a granular shape. adhesive.
〜３０ｍｍ3である請求項１記載の粒状異方性導電接着
剤。2. The method according to claim 1, wherein the volume d of the granular anisotropic conductive adhesive is 0.1.
The granular anisotropic conductive adhesive according to claim 1, which has a thickness of from 30 to 30 mm3.
粒状異方性導電接着剤を用いて基板のパターンとＩＣチ
ップの電極とを接続する場合の、基板のパターンの高さ
をｈ1、ＩＣチップの電極の高さをｈ2、ＩＣチップの接
着面積をＡとしたときに次式 Ｄ＝（ｈ1＋ｈ2）×Ａ により算出される体積Ｄとが、 0.5Ｄ≦ｄ≦2Ｄ を満たす請求項１記載の粒状異方性導電接着剤。3. The volume d of the granular anisotropic conductive adhesive and the height of the pattern of the substrate when connecting the pattern of the substrate and the electrode of the IC chip using the granular anisotropic conductive adhesive. h 1 , the height of the electrode of the IC chip is h 2 , and the bonding area of the IC chip is A, and the volume D calculated by the following formula D = (h 1 + h 2 ) × A is 0.5D ≦ d The granular anisotropic conductive adhesive according to claim 1, which satisfies? 2D.
状、板状又はキュービック状である請求項１記載の粒状
異方性導電接着剤。4. The granular anisotropic conductive adhesive according to claim 1, wherein the particle shape of the granular anisotropic conductive adhesive is spherical, plate-like or cubic.
支持シート上に複数離隔的に配設されている異方性導電
接着シート。5. An anisotropic conductive adhesive sheet, wherein a plurality of the granular anisotropic conductive adhesive according to claim 1 are disposed on a support sheet at a distance.
電接着剤が配設されている請求項５記載の異方性導電接
着シート。6. The anisotropic conductive adhesive sheet according to claim 5, wherein a plurality of types of granular anisotropic conductive adhesives are provided.
ＩＣチップの接続面に仮接着し、その粒状異方性導電接
着剤を仮接着したＩＣチップを基板に圧着することによ
りＩＣチップを基板に実装するＩＣチップの実装方法。7. An IC by temporarily bonding the granular anisotropic conductive adhesive according to claim 1 to a connection surface of an IC chip, and pressing the IC chip on which the granular anisotropic conductive adhesive is temporarily bonded to a substrate. An IC chip mounting method for mounting a chip on a substrate.
らＩＣチップの接続面に粒状異方性導電接着剤を転着さ
せることにより粒状異方性導電接着剤をＩＣチップに仮
接着する請求項７記載のＩＣチップの実装方法。8. The granular anisotropic conductive adhesive is temporarily bonded to the IC chip by transferring the granular anisotropic conductive adhesive from the anisotropic conductive adhesive sheet according to claim 5 to the connection surface of the IC chip. A method for mounting an IC chip according to claim 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13724198A JP3424735B2 (en) | 1998-05-19 | 1998-05-19 | Granular anisotropic conductive adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13724198A JP3424735B2 (en) | 1998-05-19 | 1998-05-19 | Granular anisotropic conductive adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11330152A true JPH11330152A (en) | 1999-11-30 |
| JP3424735B2 JP3424735B2 (en) | 2003-07-07 |
Family
ID=15194082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13724198A Expired - Fee Related JP3424735B2 (en) | 1998-05-19 | 1998-05-19 | Granular anisotropic conductive adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3424735B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001135672A (en) * | 1999-11-01 | 2001-05-18 | Sony Chem Corp | Anisotropic conductive connector, manufacturing method and paste-like connecting material |
| JP2002280716A (en) * | 2001-03-19 | 2002-09-27 | Pioneer Electronic Corp | Electronic part mounting method and bonded body |
| JP2002358825A (en) * | 2001-05-31 | 2002-12-13 | Hitachi Chem Co Ltd | Anisotropic conductive adhesion film |
| US6769469B2 (en) * | 1999-08-09 | 2004-08-03 | Sony Chemicals Corp. | Process for mounting semiconductor device and mounting apparatus |
| JP2010091857A (en) * | 2008-10-09 | 2010-04-22 | Hitachi High-Technologies Corp | Variable mounting mechanism of assembling apparatus for flat display module, manufacturing apparatus for flat display, and flat display |
| WO2010125966A1 (en) * | 2009-04-28 | 2010-11-04 | 日立化成工業株式会社 | Anisotropic conductive particles |
| KR101142341B1 (en) | 2010-09-27 | 2012-05-18 | 에스케이하이닉스 주식회사 | Method for manufacturing of semiconductor package |
-
1998
- 1998-05-19 JP JP13724198A patent/JP3424735B2/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6769469B2 (en) * | 1999-08-09 | 2004-08-03 | Sony Chemicals Corp. | Process for mounting semiconductor device and mounting apparatus |
| JP2001135672A (en) * | 1999-11-01 | 2001-05-18 | Sony Chem Corp | Anisotropic conductive connector, manufacturing method and paste-like connecting material |
| JP2002280716A (en) * | 2001-03-19 | 2002-09-27 | Pioneer Electronic Corp | Electronic part mounting method and bonded body |
| JP2002358825A (en) * | 2001-05-31 | 2002-12-13 | Hitachi Chem Co Ltd | Anisotropic conductive adhesion film |
| JP2010091857A (en) * | 2008-10-09 | 2010-04-22 | Hitachi High-Technologies Corp | Variable mounting mechanism of assembling apparatus for flat display module, manufacturing apparatus for flat display, and flat display |
| WO2010125966A1 (en) * | 2009-04-28 | 2010-11-04 | 日立化成工業株式会社 | Anisotropic conductive particles |
| JP2010277996A (en) * | 2009-04-28 | 2010-12-09 | Hitachi Chem Co Ltd | Anisotropic conductive particles |
| CN102396038A (en) * | 2009-04-28 | 2012-03-28 | 日立化成工业株式会社 | Anisotropic conductive particles |
| EP2426672A4 (en) * | 2009-04-28 | 2012-12-12 | Hitachi Chemical Co Ltd | ANISOTROPIC CONDUCTIVE PARTICLES |
| KR101457756B1 (en) * | 2009-04-28 | 2014-11-03 | 히타치가세이가부시끼가이샤 | Anisotropic conductive particles |
| KR101142341B1 (en) | 2010-09-27 | 2012-05-18 | 에스케이하이닉스 주식회사 | Method for manufacturing of semiconductor package |
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