JPH1134018A - Particle board and its production - Google Patents
Particle board and its productionInfo
- Publication number
- JPH1134018A JPH1134018A JP20713197A JP20713197A JPH1134018A JP H1134018 A JPH1134018 A JP H1134018A JP 20713197 A JP20713197 A JP 20713197A JP 20713197 A JP20713197 A JP 20713197A JP H1134018 A JPH1134018 A JP H1134018A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- isocyanate
- particle board
- adhesive
- wood
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002245 particle Substances 0.000 title claims description 28
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000000853 adhesive Substances 0.000 claims abstract description 45
- 230000001070 adhesive effect Effects 0.000 claims abstract description 45
- 239000002023 wood Substances 0.000 claims abstract description 38
- 239000012948 isocyanate Substances 0.000 claims abstract description 35
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 32
- 239000012792 core layer Substances 0.000 claims abstract description 9
- 239000002344 surface layer Substances 0.000 claims abstract description 9
- 238000007731 hot pressing Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 abstract description 21
- 238000010521 absorption reaction Methods 0.000 abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 abstract description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
- -1 Aromatic isocyanates Chemical class 0.000 description 3
- 239000004640 Melamine resin Substances 0.000 description 3
- 229920000877 Melamine resin Polymers 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000005056 polyisocyanate Substances 0.000 description 3
- 229920001228 polyisocyanate Polymers 0.000 description 3
- JZLWSRCQCPAUDP-UHFFFAOYSA-N 1,3,5-triazine-2,4,6-triamine;urea Chemical compound NC(N)=O.NC1=NC(N)=NC(N)=N1 JZLWSRCQCPAUDP-UHFFFAOYSA-N 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- JYIZNFVTKLARKT-UHFFFAOYSA-N phenol;1,3,5-triazine-2,4,6-triamine Chemical compound OC1=CC=CC=C1.NC1=NC(N)=NC(N)=N1 JYIZNFVTKLARKT-UHFFFAOYSA-N 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 229920000538 Poly[(phenyl isocyanate)-co-formaldehyde] Polymers 0.000 description 1
- HIFVAOIJYDXIJG-UHFFFAOYSA-N benzylbenzene;isocyanic acid Chemical class N=C=O.N=C=O.C=1C=CC=CC=1CC1=CC=CC=C1 HIFVAOIJYDXIJG-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
Landscapes
- Dry Formation Of Fiberboard And The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ホルムアルデヒド
放散量の少ないパーティクルボード及びその製造方法に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a particle board which emits less formaldehyde and a method for producing the same.
【０００２】[0002]
【従来の技術】パーティクルボード用接着剤は近年叫ば
れている遊離ホルムアルデヒド放散量の低減を考慮し
て、ホルムアルデヒドを有しないイソシアネート系接着
剤が採用され始めている。2. Description of the Related Art An isocyanate-based adhesive having no formaldehyde has begun to be used as an adhesive for particle boards in consideration of a reduction in the amount of free formaldehyde emission, which has recently been called for.
【０００３】[0003]
【発明が解決しようとする課題】ところが、パーティク
ルボード全層の接合にイソシアネート系接着剤を使用す
ると製造コストが高くなる上、吸水、吸湿による寸法変
化を生じるという問題がある。本発明はかかる事情に鑑
みてなされたもので、遊離ホルムアルデヒド放散量が低
く、かつ低コストである上、吸水、吸湿により寸法変化
を生じ難い品質の良いパーティクルボード及びその製造
方法を提供することを目的とする。However, when an isocyanate-based adhesive is used for bonding all the layers of the particle board, there is a problem that the production cost is increased and the dimensional change is caused by water absorption and moisture absorption. The present invention has been made in view of the above circumstances, and provides a high-quality particle board having a low amount of free formaldehyde emission, a low cost, and low dimensional change due to water absorption and moisture absorption, and a method of manufacturing the same. Aim.
【０００４】[0004]
【課題を解決するための手段】前記目的に沿う請求項１
記載のパーティクルボードは、表層用木片の接着剤にイ
ソシアネート系接着剤が、芯層用木片に非イソシアネー
ト系接着剤が使用されている。また、請求項２記載のパ
ーティクルボードの製造方法は、表層用木片にイソシア
ネート系接着剤を、芯層用木片に非イソシアネート系接
着剤を塗布してフォーミングし、熱圧締成形している。According to the present invention, there is provided a semiconductor device comprising:
In the particle board described above, an isocyanate-based adhesive is used as the adhesive for the surface layer wood piece, and a non-isocyanate-based adhesive is used for the core layer wood piece. In the particle board manufacturing method according to the second aspect, an isocyanate-based adhesive is applied to a surface-layer wood piece and a non-isocyanate-based adhesive is applied to a core-layer wood piece, followed by forming and hot pressing.
【０００５】請求項１記載のパーティクルボード、及び
請求項２記載のパーティクルボードの製造方法におい
て、イソシアネート系接着剤を構成する化合物として
は、例えば、ジフェニルメタンジイソシアネート、ポリ
メチレンポリフェニルイソシアネート、トリレンジイソ
シアネート、ナフタレンジイソシアネート等の芳香族イ
ソシアネート及びポリイソシアネート類、ヘキサメチレ
ンジイソシアネート、リジンメチルエステルジイソシア
ネート類の脂肪族イソシアネート及びポリイソシアネー
ト類、水添ジフェニルメタンジイソシアネート、イソホ
ロンジイソシアネート、水添トリレンジイソシアネート
等の脂環式イソシアネート及びポリイソシアネート類が
あげられる。特に毒性や価格の面からジフェニルメタン
ジイソシアネートが好ましく、これに単官能アルコール
を付加させた乳化可能型のものを使用するのが好まし
い。また、非イソシアネート系接着剤としては、例え
ば、尿素樹脂、メラミン樹脂、尿素メラミン樹脂、メラ
ミン尿素樹脂、フェノール樹脂、フェノールメラミン樹
脂、メラミンフェノール樹脂等、一般に常用されている
熱硬化性樹脂接着剤があげられる。[0005] In the particle board manufacturing method according to the first aspect and the particle board manufacturing method according to the second aspect, the compound constituting the isocyanate-based adhesive includes, for example, diphenylmethane diisocyanate, polymethylene polyphenyl isocyanate, tolylene diisocyanate, and the like. Aromatic isocyanates and polyisocyanates such as naphthalene diisocyanate, hexamethylene diisocyanate, aliphatic isocyanates and polyisocyanates of lysine methyl ester diisocyanate, hydrogenated diphenylmethane diisocyanate, isophorone diisocyanate, alicyclic isocyanates such as hydrogenated tolylene diisocyanate and And polyisocyanates. Particularly, diphenylmethane diisocyanate is preferable from the viewpoint of toxicity and price, and it is preferable to use an emulsifiable type obtained by adding a monofunctional alcohol thereto. Examples of the non-isocyanate-based adhesive include, for example, urea resin, melamine resin, urea melamine resin, melamine urea resin, phenol resin, phenol melamine resin, melamine phenol resin, and the like, which are commonly used thermosetting resin adhesives. can give.
【０００６】いずれの塗布量は重量比で絶乾木片に対し
４〜１０％とするのが好ましく、熱圧締条件としては温
度１６０〜１８０℃、時間１３〜１６秒／ｍｍ、圧力２
５〜３５ｋｇｆ／ｃｍ2 とするのが好ましい。なお、イ
ソシアネート系接着剤は金属と良く接着する性質を有し
ているので、金属製のプレス盤に接着剤が付着しないよ
うに、プレス盤の表面をフッ素やその他ワックス等で処
理したり、プレス盤として酸化（イソシアネート系接着
剤は酸化部に付着しやすい）し難いアルミニウムやステ
ンレスを用いる等、既に確立された手段を採用するのが
好ましい。[0006] The amount of each coating is preferably 4 to 10% by weight based on the absolutely dry wood pieces, and the conditions of the hot pressing are a temperature of 160 to 180 ° C, a time of 13 to 16 seconds / mm, a pressure of 2
The pressure is preferably 5 to 35 kgf / cm 2 . Since the isocyanate-based adhesive has a property of adhering well to metal, the surface of the press plate is treated with fluorine or other wax or pressed to prevent the adhesive from adhering to the metal press plate. It is preferable to adopt a means that has already been established, such as using aluminum or stainless steel that is difficult to oxidize (isocyanate-based adhesive easily adheres to an oxidized portion) as a disc.
【０００７】[0007]
【発明の実施の形態】続いて、添付した図面を参照しつ
つ本発明を具体化した実施の形態につき説明し、本発明
の理解に供する。ここに、図１は本発明の一実施の形態
に係るパーティクルボードの製造方法の説明図、図２は
同パーティクルボードの製造方法によって製造されたパ
ーティクルボードの断面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention. Here, FIG. 1 is an explanatory diagram of a method of manufacturing a particle board according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the particle board manufactured by the method of manufacturing a particle board.
【０００８】パーティクルボードの原料としては、木材
を破砕して解繊した木片が用いられる。この木片を表層
用と芯層用に区分し、表層用の木片には攪拌しながら前
記したイソシアネート系接着剤を噴霧したものを、芯層
用の木片には、攪拌しながら前記した非イソシアネート
系接着剤を噴霧したものを用いる。イソシアネート系接
着剤及び非イソシアネート系接着剤の塗布量は、前述の
ように絶乾木片に対して４〜１０重量％、更に好ましく
は接着剤の種類にもよるが、５〜９重量％程度とする。[0008] As a raw material for the particle board, wood chips obtained by crushing wood and fibrillating are used. This wood piece is divided into a surface layer and a core layer, and the above-mentioned isocyanate-based adhesive is sprayed while stirring on the surface wood piece. Use a sprayed adhesive. As described above, the application amount of the isocyanate-based adhesive and the non-isocyanate-based adhesive is 4 to 10% by weight, and more preferably about 5 to 9% by weight, based on the type of the adhesive. I do.
【０００９】マット１０上にイソシアネート系接着剤を
噴霧した木片からなる木片層１１を形成し、その上に非
イソシアネート系接着剤を噴霧した木片からなる木片層
１２を形成し、更にその上にイソシアネート系接着剤を
噴霧した木片からなる木片層１３を形成する。この木片
層１１〜１３の厚みは、木片層１１が１に対して、木片
層１２を２〜４倍程度、木片層１３の厚みを１とする。
このようにして形成（フォーミング）された複合マット
を熱圧締すると、図２に示すようなパーティクルボード
１４が製造される。なお、熱圧締の条件は前述の通りで
ある。A wood chip layer 11 made of wood chips sprayed with an isocyanate-based adhesive is formed on a mat 10, a wood chip layer 12 made of wood chips sprayed with a non-isocyanate-based adhesive is formed thereon, and an isocyanate-based adhesive is further formed thereon. A wood piece layer 13 made of wood pieces sprayed with a system adhesive is formed. As for the thickness of the wood piece layers 11 to 13, the wood piece layer 12 is about 2 to 4 times the thickness of the wood piece layer 11 and the thickness of the wood piece layer 13 is 1.
When the composite mat thus formed (formed) is hot-pressed, a particle board 14 as shown in FIG. 2 is manufactured. Note that the conditions of the heat compression are as described above.
【００１０】なお、イソシアネート系接着剤は金属と良
く接着する性質を有しているので、金属製のプレス盤に
接着剤が付着しないように、プレス盤の表面をフッ素や
その他ワックス等で処理したり、プレス盤として酸化
（イソシアネート系接着剤は酸化部に付着しやすい）し
難いアルミニウムやステンレスを用いる等、既に確立さ
れた手段を採用しておく。以上の処理によって、パーテ
ィクルボード１４が製造されるが、上下の表層１５、１
６はホルムアルデヒドを放散しない接着剤が使用されて
いるので、このパーティクルボード１４からのホルムア
ルデヒドの放散量は著しく減少する。また、芯層１７に
は非イソシアネート系接着剤が使用されているので、吸
水や吸湿があっても寸法変化が生じ難いという利点があ
る。従来方法によるパーティクルボードの場合の吸湿吸
水による寸法の変化が０．６１％であったが、表層１
５、１６を接合する接着剤としてジフェニルメタンジイ
ソシアネートを使用したパーティクルボードにおいて
は、吸湿吸水による寸法の変化が０．４１％に押さえら
れる。Since the isocyanate-based adhesive has a property of adhering well to metal, the surface of the press plate is treated with fluorine or other wax to prevent the adhesive from adhering to the metal press plate. For example, aluminum or stainless steel, which does not easily oxidize (an isocyanate-based adhesive is likely to adhere to an oxidized portion), is used as a press plate, and a method that has already been established is adopted. By the above processing, the particle board 14 is manufactured.
6 uses an adhesive that does not emit formaldehyde, so that the amount of formaldehyde emitted from the particle board 14 is significantly reduced. In addition, since a non-isocyanate-based adhesive is used for the core layer 17, there is an advantage that dimensional change hardly occurs even when water or moisture is absorbed. In the case of the particle board according to the conventional method, the dimensional change due to moisture absorption and absorption was 0.61%.
In a particle board using diphenylmethane diisocyanate as an adhesive for joining the layers 5 and 16, the change in dimensions due to moisture absorption is suppressed to 0.41%.
【００１１】[0011]
【発明の効果】請求項１記載のパーティクルボード、及
び請求項２記載のパーティクルボードの製造方法におい
ては、パーティクルボードの表層用木片の接合にはホル
ムアルデヒドを放散しないイソシアネート系接着剤が使
用され、パーティクルボードの芯層用木片の接合には非
イソシアネート系接着剤が使用されているので、ホルム
アルデヒドの放散量が少なく、吸水、吸湿等による寸法
変化が少なく、更には、低コストなパーティクルボード
を提供することができる。In the particle board according to the first aspect and the method for manufacturing the particle board according to the second aspect, an isocyanate-based adhesive which does not emit formaldehyde is used for bonding the surface layer wood chips of the particle board. Since non-isocyanate-based adhesive is used for bonding the core layer wood pieces, the amount of formaldehyde emission is small, the dimensional change due to water absorption, moisture absorption, etc. is small, and furthermore, a low-cost particle board is provided. be able to.
【図１】本発明の一実施の形態に係るパーティクルボー
ドの製造方法の説明図である。FIG. 1 is an explanatory diagram of a method for manufacturing a particle board according to an embodiment of the present invention.
【図２】本発明の一実施の形態に係るパーティクルボー
ドの製造方法によって製造されたパーティクルボードの
断面図である。FIG. 2 is a cross-sectional view of a particle board manufactured by a method of manufacturing a particle board according to one embodiment of the present invention.
１０ マット １１ 木片層 １２ 木片層 １３ 木片層 １４ パーティクルボード １５ 表層 １６ 表層 １７ 芯層 Reference Signs List 10 mat 11 wood piece layer 12 wood piece layer 13 wood piece layer 14 particle board 15 surface layer 16 surface layer 17 core layer
Claims (2)
接着剤が、芯層用木片に非イソシアネート系接着剤が使
用されたことを特徴とするパーティクルボード。1. A particle board wherein an isocyanate-based adhesive is used as an adhesive for a surface layer wood piece and a non-isocyanate-based adhesive is used as a core layer wood piece.
を、芯層用木片に非イソシアネート系接着剤を塗布して
フォーミングし、熱圧締成形することを特徴とするパー
ティクルボードの製造方法。2. A method for producing a particle board, which comprises applying an isocyanate-based adhesive to a surface-layer wood piece and applying a non-isocyanate-based adhesive to a core-layer wood piece, and forming and hot-pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20713197A JPH1134018A (en) | 1997-07-15 | 1997-07-15 | Particle board and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20713197A JPH1134018A (en) | 1997-07-15 | 1997-07-15 | Particle board and its production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1134018A true JPH1134018A (en) | 1999-02-09 |
Family
ID=16534714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20713197A Pending JPH1134018A (en) | 1997-07-15 | 1997-07-15 | Particle board and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1134018A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005125737A (en) * | 2003-10-02 | 2005-05-19 | Koyo Sangyo Co Ltd | Recycled woody board and its production method |
| JP2011056858A (en) * | 2009-09-11 | 2011-03-24 | Eidai Co Ltd | Woody plate material |
-
1997
- 1997-07-15 JP JP20713197A patent/JPH1134018A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005125737A (en) * | 2003-10-02 | 2005-05-19 | Koyo Sangyo Co Ltd | Recycled woody board and its production method |
| JP2011056858A (en) * | 2009-09-11 | 2011-03-24 | Eidai Co Ltd | Woody plate material |
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