JPH1134548A - Non-contact IC card and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve quality by adding filler to hot-melt resin, thereby dealing with a module and card of various type. SOLUTION: The non-contact IC card 10 comprises an IC card 3, hot-melt resin 16 and oversheet 11 provided on a substrate 11. In this case, filler is added into the resin 16 to improve the heat resistance of the card 10, to reduce the cooling shrinkage factor of the resin and to further improve the strength and rigidity of the card 10. As the filler, particulate inorganic material of titanium oxide is, for example, used. At this time, particulate filler having a mean particle size of 0.1 to 10 μm is used to easily disperse the filler in the resin 16 and does not affect the surface properties of the card 10. Incidentally, to improve the adhesive properties of the surface of the oversheet 13 to the resin 16 similarly to the material 11, it is preferable to execute easy adhesive treatment of the front side to the laminated with the resin 16.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a non-contact IC card and a method for manufacturing the same.

[0002]

2. Description of the Related Art Magnetic recording media such as floppy disks and cassette tapes have been widely used as external storage devices for computers and electronic devices utilizing computers. , R
Card-like or package-like recording media provided with semiconductor memories such as AM and ROM have been used. On the other hand, in the fields of credit cards, ID cards, cash cards, etc., as a card replacing magnetic cards, a very large information recording capacity and high security, etc. A so-called IC card equipped with an IC module including a semiconductor memory such as the one described above has been developed.

In such an IC card, a recording medium is a contact-type IC card (herein referred to as a contact IC card) and a non-contact type IC card (here is referred to as a non-contact IC card) depending on a method of accessing a terminal. There are two types of IC cards. When the contact IC card communicates with the terminal, it is necessary to match the contact of the recording medium with the contact of the terminal and make contact with each other, so that the communication work is troublesome and the communication speed is slow. Further, since the contacts of the recording medium are exposed on the surface of the recording medium, there is a disadvantage that the contacts are easily stained or broken. On the other hand, a non-contact IC card does not have a contact point because it communicates information with a terminal using electromagnetic coupling, electromagnetic induction, or microwaves. Therefore, the communication work is easy, and there is no fear that the contact is broken and communication becomes impossible. For this reason, non-contact IC cards have been actively developed.

[0004] As a method of manufacturing this type of IC card, a laminating method or a resin filling method has conventionally been adopted. In the laminating method, for example, as shown in FIG. 2, a plastic sheet 1 thinner than a predetermined card thickness is used.
In this method, a non-contact IC card 20 is manufactured by cutting out the shape of the IC module 3 to be loaded on the IC chip 2 in advance, embedding the IC module therein, and bonding and laminating the IC module 3 with the oversheet 13. This method has a complicated manufacturing process, and particularly, an IC on a plastic sheet 12.
There is a problem that it takes time to cut out the shape of the module and the manufacturing cost is increased. Further, in order to cope with IC modules having different shapes, it is necessary to cut each shape, which is very troublesome.

[0005] In the resin filling method, for example, as shown in FIG.
The spacer 15 and the IC module 3 which are completed to be the thickness of the card are arranged, the resin 14 is filled in the spacer 15, and the IC module 3 is filled, and then the oversheet 1 is filled.
3 is a method of manufacturing the non-contact IC card 30 by bonding the resin 3 and curing the resin with UV light or heat.

However, in this method, when a UV resin is used, a transparent substrate or an oversheet that transmits UV light must be used. Therefore, the finished card has a problem in that at least one of the card surfaces is made of a transparent sheet and cannot meet the demands for various surface picture cards. In addition, when a thermosetting resin is used, the time for curing the resin is long, and workability is poor. Further, although this method can be applied to various modules, manufacturing a single card requires a number of working steps. In addition, the production and arrangement of the spacer require time and cost. After all, the cost of the finished card is high.

[0007] In order to improve production efficiency and reduce costs, it has been proposed to use an injection molding machine to make a card. For example, JP-A-3-24000 discloses a method in which a base for fixing an IC module is formed by injection molding, the IC module is mounted and fixed on the base, and then injection-molded again to form a card. However, this method is not preferable in terms of production efficiency because it requires two injection molding steps to make a card. Also,
Modules may be damaged by heat or pressure during injection molding,
Since the completed card may warp, it cannot be said to be an appropriate method for manufacturing a non-contact IC card.

Therefore, the present inventors filled the space between the card substrate and the IC module with a hot-melt resin, thereby reducing the cost of the non-contact IC without breaking the IC module.
A method by which a C card can be manufactured is disclosed in Japanese Patent Application No. Hei 8-3.
No. 09200. By employing this method, a highly reliable non-contact IC card can be obtained.

The basic structure of this card mainly comprises a base material, a hot-melt resin as a filling resin and an oversheet, and the physical properties of the card are determined by the physical properties of the base material, the hot-melt resin and the oversheet. In addition, in order to make the surface of the card flat, the layer made of the hot melt resin usually needs to be formed thicker than the module.
When the IC module is thick, the filling amount of the hot melt resin is large. More than two thirds of the card configuration may be made of hot melt resin. Therefore, the physical properties of the card greatly depend on the material of the hot melt resin. However, hot melt resins generally have low heat resistance and may be deformed by heat. In addition, there are few hot melt resins having the rigidity and strength required for a card and a low processing temperature.

Also, since the cooling shrinkage of the hot melt resin and that of the IC module are different, the IC module is filled with the molten hot melt resin between the base material of the card and the oversheet, and the surface is leveled by hot pressing. When the card is cooled, there is a problem that unevenness occurs on the surface due to the difference in shrinkage.

Further, when a moisture-curable reactive hot melt resin having heat resistance and high strength is employed, a reactive gas is generated as the curing reaction of the resin progresses after the card is processed, which adversely affects the flatness of the card surface. There is a problem giving. In some cases, the surface of the card may be significantly uneven.

[0012]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and is applicable to various modules and cards, has good durability, is inexpensive and has good quality. An object of the present invention is to provide a contact IC card and a method for manufacturing the same.

[0013]

Means for Solving the Problems A first invention of the present invention is:
At least a non-contact IC card in which a base material, a non-contact IC module, a polymer resin, and an oversheet are stacked in this order, wherein the polymer resin is a hot melt resin, and a filler is added to the hot melt resin. Is a non-contact IC card.

According to a second aspect, in the first aspect, the filler is a non-contact filler having a thermal decomposition temperature of 150 ° C. or higher and an average particle diameter of 0.1 to 10 μm. It is an IC card.

According to a third aspect of the present invention, in the first and second aspects, the polymer resin is a reactive moisture-curable polyurethane resin, and a gas adsorbent is added to the reactive moisture-curable polyurethane resin. Is a non-contact IC card.

In a fourth aspect based on the third aspect, the gas adsorbent has an average particle diameter of 0.1 to 10 μm.
Is a non-contact IC card that is granular.

According to a fifth aspect of the present invention, there is provided a method for producing the non-contact IC card according to the first, second, third and fourth aspects, wherein the IC module and the average particles are provided on a base material. This is a method for manufacturing a non-contact IC card in which a hot-melt resin to which a filler or a gas absorbent having a diameter of 0.1 to 10 μm is added and an oversheet are stacked in this order and hot-pressed.

As described above, according to the present invention, since the filler is added to the hot melt resin, the heat resistance of the card is improved. Further, by adding a filler, the cooling shrinkage of the resin can be reduced. Further, since a filler having an average particle diameter of 0.1 to 10 μm is used, the filler can be easily dispersed in the resin, and does not adversely affect the surface properties of the card. Further, since the gas adsorbent is added to the reactive moisture-curable polyurethane resin, the heat resistance and strength of the card can be improved without deteriorating the surface properties of the card.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to embodiments. FIG. 1 is a sectional view of a non-contact IC card according to the present invention.

In FIG. 1, reference numeral 10 denotes a non-contact IC card, which has a configuration in which an IC module 3, a hot melt resin 16, and an oversheet 13 are stacked on a base material 11.

The base material 11 is made of strong paper or synthetic paper, polyethylene terephthalate (PET), polyvinyl chloride,
Polycarbonate, polymethyl methacrylate, polystyrene, polylactic acid, polycaprolactone, poly (3-hydroxybutyrate-3 hydroxyvalerate), synthetic resins such as polyvinyl alcohol, natural resins, metals, ceramics, etc. singly or in combination. Can be used as a body. And on one surface of this substrate,
An IC module and a hot melt resin layer are formed. In order to improve the adhesiveness between the substrate and the hot melt resin layer, the surface of the substrate may be subjected to an easy adhesion treatment such as a corona discharge treatment, a plasma treatment, and a resin application. Further, the other surface of the substrate becomes the surface of the card, and a normal functional thin film layer, for example, a protective layer, a magnetic recording layer, a visible recording layer, a picture layer, or the like may be provided on the entire surface or a part of the surface. .

IC module 3 arranged on substrate 11
Is composed of a coil 2 for reception or transmission and a memory 1 for data storage, and in some cases, a CPU for data calculation or the like or a battery for energy supply. In order not to affect the appearance, shape, and the like of the completed card, it is preferable that the IC module 3 be as thin as possible. Further, an integrated module of a printed circuit board type may be used because the module is easy to handle and the cost is low.

As a polymer resin for embedding the IC module 3, a hot melt resin 16 is used. When the hot melt resin is heated at a relatively low temperature of 200 ° C. or less,
The resin is in a molten state and can be applied and processed, and the fluidity and surface leveling properties are further improved.
Therefore, if the hot melt resin 16 is applied thicker than the thickness of the IC module on the substrate 11 on which the IC module 3 is arranged, the IC module is buried in the resin, and a smooth resin surface is obtained. 13 and non-contact I having a smooth surface
The C card 10 is obtained. When applying the hot melt resin, while adjusting the thickness of the hot melt resin layer so that the thickness of the base material, the thickness of the hot melt resin layer and the thickness of the oversheet layer are equal to the thickness of the non-contact IC card. Apply.

The hot melt resin solidifies when cooled. If the melt viscosity of the resin is low, the fluidity of the resin is good and the resin can be easily applied. However, after coating, the thickness and shape of the coating layer may change due to the flow of the resin, and the control may not be possible. Therefore, the viscosity of the hot melt resin (120 ° C
Time) from 1000 cps to 20,000 cps,
It can be applied relatively easily, and the shape and thickness of the applied resin can be easily maintained.

As the hot melt resin, ethylene / vinyl acetate copolymer (EVA), polyolefin, polyester, polyamide, modified rubber, polyurethane and the like can be used. When applying these resins, they must be melted by heating to a temperature higher than the softening temperature of these resins. That is, the working temperature of the application is higher than the softening temperature of the resin. When a resin having low heat resistance is used for the base material, the base material may not be able to withstand heat and may be deformed at a high working temperature. Therefore, it is preferable to use a resin having a low softening temperature for the coating process. However, a hot melt resin having a low softening temperature has low heat resistance, and a processed card easily undergoes thermal deformation.

Therefore, as described in the first aspect of the present invention, the heat resistance of the card is improved by adding a filler to the hot melt resin. By adding the filler, the cooling shrinkage of the resin can be reduced. Further, the strength and rigidity of the card can be improved. Also, by reducing the amount of hot melt resin used,
The manufacturing cost of the card can be reduced.

As the filler, a durable and low-cost inorganic or organic substance can be used. Granular fillers (for example, calcium carbonate,
Barium sulfate, silica, china clay, diatomaceous earth,
Polyester beads, aluminum hydroxide, fine powder glass, etc.), layered fillers (eg, mica, wollastonite, aluminum flakes, glass flakes, etc.), fibrous fillers (eg, glass fiber, carbon fiber, alumina fiber, polymer fiber) Etc.). Generally, it is preferable to use an inorganic powder having heat stability. It is preferable to use a particulate filler from the viewpoint of easiness of flushing the surface of the card.

Therefore, as the filler according to the present invention,
For example, particulate inorganic substances such as talc, clay, calcium carbonate, barium carbonate, silica, barium sulfate, and titanium oxide can be used. On the other hand, if the particle size of the filler is too small, agglomeration is likely to occur and it is difficult to handle. Conversely, if the particle size is too large, the flatness of the card may be affected. Therefore, as described in the second aspect of the present invention, by using a particulate filler having an average particle size of 0.1 μm to 10 μm, the filler can be easily dispersed in a resin, and the surface properties of the card can be improved. Good effects can be obtained without affecting.

In order to improve the heat resistance and strength of the card, a moisture-curable reactive hot melt resin can be used. The reactive hot melt resin can be melted even at a relatively low temperature, but once applied, it reacts with water or the like in the air, is crosslinked, and is cured. The cured resin has a very good heat resistance, and the adhesive strength with the substrate further increases as the reaction proceeds. However, carbon dioxide as a reaction gas is generated as a by-product of the curing reaction. There is a problem that the reactive gas generated in the reactive hot melt resin sandwiched between the card base material and the oversheet swells the card base material or the oversheet and affects a flat card surface.

Therefore, as described in the third invention of the present invention, by adding a gas adsorbent to the reactive hot melt resin, the surface properties of the card are not deteriorated, and the heat resistance and the heat resistance of the card are improved. Strength and the like can be improved. Activated carbon, silica gel, activated clay, zeolite and the like can be used as the gas adsorbent. In order to maintain a flat surface of the card and provide selective adsorption,
The particle diameter is 10 μm or less, and the pore diameter is about 0.3 nm
It is more preferable to use synthetic silica or synthetic zeolite (molecular sieve) of 10 to 10 nm.

The above hot melt resin can be freely colored depending on the application. As a coloring method, a heat stable inorganic pigment, organic pigment, dye and phosphor can be used alone or in a mixture thereof. As the inorganic pigment, a compound such as a metal oxide such as a titanium oxide pigment, an iron oxide pigment, or a complex iron oxide pigment, or a metal salt such as navy blue, barium sulfate, or alumina white can be used. As the organic pigment, for example, an insoluble azo pigment, a phthalocyanine pigment, or a condensed polycyclic pigment can be used.

The IC module 3 is hot melt resin 16
After that, the oversheet 13 is laminated and laminated into a card within the open time of the resin. The oversheet 13 may be made of the same material as the base material 11 or may be made of a different material. For example, synthetic resin such as strong paper or synthetic paper, PET, polyvinyl chloride, polycarbonate, polymethyl methacrylate, polystyrene, polylactic acid, polycaprolactone, poly (3-hydroxybutyrate-3 hydroxyvalerate), polyvinyl alcohol, etc. , Natural resins, metals, ceramics, etc., alone or in combination.

The surface of the oversheet 13 is also preferably subjected to an easy-adhesion treatment on the surface side to be bonded to the resin in order to improve the adhesiveness with the hot melt resin as in the case of the base material. Further, on the other side, a normal functional thin film layer, for example, a protective layer, a magnetic recording layer, a visible recording layer, a picture layer, or the like may be provided on the entire surface or a part of the surface of the substrate according to required characteristics.

Further, after laminating the IC module and the hot melt resin on the base material 11, laminating by laminating an oversheet, and further hot pressing as described in the fifth invention of the present invention. Thereby, the surface smoothness of the card can be improved. In this case, if the temperature is 5
It is important to operate under press conditions of 0 to 200 ° C. and a pressure of 1 to 60 kg / cm ² , and if the temperature and pressure are too high, the thickness of the card cannot be controlled.

[0035]

EXAMPLES Examples of the present invention will be described below more specifically. <Embodiment 1> FIG. 1 is a sectional view showing the configuration of a non-contact IC card according to a first embodiment of the present invention. First, an EVA hot melt adhesive heated to 180 ° C. (softening temperature: 9
30 parts by weight of synthetic calcium carbonate having an average particle size of 5 μm was added to 100 parts by weight of 0 ° C., open time; 5 minutes) and kneaded with a kneader to obtain a hot melt resin mixture for filling.

As a substrate 11, a PET sheet having a size of 10 × 10 cm and a thickness of 0.1 mm is prepared, and one surface thereof is subjected to a plasma easy-adhesion treatment to have a maximum thickness of 0.5 mm.
An IC module 3 comprising a receiving and transmitting coil 2 and an IC memory 1 for storing data is disposed thereon, and the hot melt resin mixture prepared above is coated with a die coater with a thickness of 0.
The hot melt resin layer 16 is applied so as to have a thickness of 58 mm.
And

Immediately thereafter (within the open time of the hot melt resin), a PET sheet having the same size and the same thickness as the base material 11 as the oversheet 13 was laminated on the hot melt resin layer 16 by lamination. .

By the above operation, a sheet embedded with the IC module 3 having a thickness of 0.78 mm is obtained, cut into a card size, and cut into a non-contact IC card 10 according to the first embodiment.
And

<Embodiment 2> FIG. 1 is a sectional view of a non-contact IC card according to a second embodiment of the present invention. First, a gas adsorbent molecular sieve having a maximum particle diameter of 10 μm (Powder 4A manufactured by Union Showa Co., Ltd. having 3.5 mm pores) was dried at 200 ° C. for 5 hours, and then heated to 100 ° C. 10 parts by weight was added to 100 parts by weight of the obtained reactive polyurethane hot melt resin (softening temperature: 65 ° C., open time: 10 minutes), and kneaded with a roll to obtain a hot melt resin mixture.

As the substrate 11, a vinyl chloride sheet having a size of 10 × 10 cm and a thickness of about 0.1 mm was prepared, and one surface thereof was subjected to an easy adhesion treatment by corona discharge. A receiving and transmitting coil 2 having a maximum thickness of 0.5 mm, an IC memory 1 for storing data, and an IC module 3 including a CPU are arranged on the base material, and the molecular sieve previously prepared thereon is reactive with the molecular sieve. Hot melt resin mixture (temperature 100
° C) by a T-die coater so as to have a film thickness of 0.60 mm, to form a hot melt resin layer 16.

Immediately thereafter (within the open time of the hot melt resin), a vinyl chloride sheet having the same size and thickness as the base material 11 as the oversheet 13 is laminated on the hot melt resin layer 16 and laminated. did. Further, the laminated sheet was hot-pressed under the conditions of a temperature of 180 ° C. and a pressure of 50 kg / cm ² .

By the above operation, a sheet embedded with an IC module 3 having a thickness of 0.78 mm is obtained, cut into a card size, and cut into a non-contact IC card 10 according to the second embodiment.
And

The softening temperature of the non-contact IC card of Example 1 thus produced was higher by 10 ° C. or more than that of the conventional card without calcium carbonate. In addition, a communication test was performed, but communication was successful.

Further, the non-contact IC card of Example 2 was heated at a temperature of 40 ° C., a humidity of 90% RH. After curing for 100 hours in the above environment, the card had good surface properties and a very good appearance. Further, when a lamination test according to JIS X6301 was performed, no gap was generated between the laminations of the cards. A communication test was performed, but communication was successful.

[0045]

As described above, according to the present invention, a method of manufacturing a non-contact IC card in which an IC module disposed on a base material is filled and embedded using a hot melt resin and bonded to an oversheet. In Table 1, the heat resistance and rigidity of the card could be improved by adding a filler to the hot melt resin. Further, when a reactive hot melt resin was used, the addition of an adsorbent could adsorb the reaction gas, thereby solving the problem of the card surface becoming uneven due to the generation of the reaction gas. According to the present invention, a non-contact IC card having heat resistance and good surface smoothness can be manufactured efficiently, at low cost and easily.

[Brief description of the drawings]

FIG. 1 is an explanatory sectional view showing one embodiment of a non-contact IC card of the present invention.

FIG. 2 is an explanatory sectional view showing one embodiment of a conventional non-contact IC card.

FIG. 3 is an explanatory sectional view showing another embodiment of the conventional non-contact IC card.

[Explanation of symbols]

 1 IC memory 2 Coil 3 IC module 10, 20, 30 Non-contact IC card 11 Base material 12 Plastic sheet 13 Over sheet 14 Resin 15 Spacer 16 ‥ Hot melt resin (layer)

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code FI G06K 19/07 G06K 19/00 H

Claims (5)

[Claims] 1. A non-contact IC card in which at least a base material, a non-contact IC module, a polymer resin, and an oversheet are stacked in this order, wherein the polymer resin is a hot melt resin, A non-contact IC card, wherein a filler is added to the IC card. 2. The non-contact IC card according to claim 1, wherein the filler has a thermal decomposition temperature of 150 ° C. or higher and a granular shape having an average particle diameter of 0.1 to 10 μm. . 3. The method according to claim 1, wherein the polymer resin is a reactive moisture-curable polyurethane resin, and a gas adsorbent is added to the reactive moisture-curable polyurethane resin. Non-contact IC card. 4. The gas adsorbent has an average particle size of 0.1 to 0.1.
4. The non-contact IC card according to claim 3, wherein the non-contact IC card has a particle size of 10 [mu] m. 5. A non-contact I according to claim 1, 2, 3 or 4.
A method for producing a C card, wherein an IC module and an average particle diameter are 0.1 to 10 on a substrate.
A method for producing a non-contact IC card, comprising: stacking a hot melt resin to which a filler or a gas absorbent of μm is added, and an oversheet in this order, and hot-pressing them.