JPH11345842A - Lead frame for semiconductor device - Google Patents

Abstract

(57) [Problem] To provide a semiconductor device lead frame used for flip-chip mounting, in which a mounted chip is prevented from being displaced, and connection reliability and yield are improved. SOLUTION: A recess having a depth equal to or less than the height of the bump is provided at a portion of the tip of an inner lead of a lead frame for a semiconductor device where the bump of the semiconductor chip contacts, and the chip is mounted in such a manner as to fit the bump into the recess. I did it.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame for a semiconductor device in which a semiconductor chip and a lead frame are connected to each other by using a flip chip mounting technique via bumps on the surface of the semiconductor chip.

[0002]

2. Description of the Related Art In a conventional semiconductor device in which a semiconductor chip and a lead frame are connected by using a flip-chip mounting technique, the semiconductor chip is mounted on the tip of a flat inner lead via a bump and then heated in the next step. They were connected collectively by processing.

[0003]

However, in the case of the conventional mounting, the chip is temporarily fixed on the inner lead via a flux or the like during a period from being mounted on the lead frame to being connected collectively. there were. Therefore, during the process of mounting the chip on the lead frame or until the next connection process is completed, the phenomenon that the mounted chip shifts from the initial mounting position due to vibration applied to the lead frame occurs. As a result, there is a problem that the yield of the manufactured semiconductor device is reduced.

[0004] An object of the present invention is to solve the above-mentioned problems.

[0005]

In order to solve the above-mentioned problems, a semiconductor device lead frame according to the present invention has a semiconductor chip having a surface formed with a plurality of transistors and bumps made of solder or conductive adhesive. And the semiconductor device lead frame that electrically and mechanically secures the connection via the bumps, in the portion where the bumps on the inner leads are connected, a recess having a depth equal to or less than the height of the bump is formed. .

[0006]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a lead frame for a semiconductor device in which a depression 3 is formed at the tip of an inner lead 2 provided on a lead frame 1 so as to correspond to the arrangement of bumps of a semiconductor chip to be mounted.

FIG. 2 is a sectional view of the chip and the inner leads after the semiconductor chip is mounted. The bumps 5 on the semiconductor chip 4 fit into the recesses 3 provided on the chip mounting side of the inner leads 2, thereby increasing the strength of the temporarily mounted chip. The shape and size of the depression are
It can be arbitrarily changed depending on the shape of the mounted bump.
In the case of a hemispherical shape such as a bump using solder, a concave mirror shape is preferable, and in the case of a rectangular or columnar bump such as a bump made of gold or a conductive adhesive, a rectangular or cylindrical hollow is preferable. In any case, the size of the opening of the depression is desirably equal to or larger than the size of the bump. If the depth of the depression is greater than the height of the bump, the bottom surface of the chip may come into contact with the inner lead during mounting of the chip.

[0008]

As described above, the lead frame for a semiconductor device according to the present invention is provided with depressions corresponding to the positions, sizes and shapes corresponding to the bumps formed on the semiconductor chip to be mounted on the inner leads. Therefore, when the semiconductor chip is temporarily fixed on the inner leads, the bumps fit into the recesses. Therefore, the strength of the temporary fixing is increased as compared with the inner lead in which the bump is simply placed on the flat surface, and the occurrence of a connection failure due to a misalignment of the semiconductor chip occurring until the final fixing in the next process is suppressed, This has the effect of improving the yield.

[Brief description of the drawings]

FIG. 1 is a plan view of a lead frame for a semiconductor device of the present invention.

FIG. 2 is a sectional view showing a state in which a chip is mounted on a lead frame for a semiconductor device of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead frame 2 Inner lead 3 Connection recess 4 Semiconductor chip 5 Bump electrode

Claims (1)

[Claims] 1. A semiconductor device having a plurality of transistors and bumps made of solder or a conductive adhesive formed on a surface thereof, and a semiconductor device lead frame for ensuring electrical and mechanical connection through the bumps. A lead frame for a semiconductor device, wherein a recess having a depth equal to or less than the height of the bump is formed in a portion where the bump on the inner lead is connected.