JPH11345955A - Lens-integrated solid-state imaging device, lens mounting method and lens mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lens-integrated solid-state imaging device having a simple structure and low manufacturing cost, and a lens mounting method and a lens mounting device thereof. A lens (38) is positioned at a reference position, and the upper surface is positioned at a different reference position from the lens (38) by automatic focusing on the upper surface of a solid-state imaging device (33).
The solid-state imaging device 33 and the lens 38 are positioned relative to each other by relative movement, and fixed with an adhesive 54. For this reason,
The solid-state imaging device 3 can be automatically focused and moved by a known distance.
The distance between the upper surface of the lens 3 and the lens 38 can be set to a predetermined value, and variations in various dimensions can be absorbed by the thickness of the adhesive 54.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lens-integrated solid-state image pickup device in which a solid-state image pickup device and an imaging lens are fixed to each other, a method for mounting the same, and a lens mounting device.

[0002]

2. Description of the Related Art FIG. 4 shows a conventional example of a solid-state image pickup device integrated with a lens. In this prior art example of a lens-integrated solid-state imaging device 11, a substrate 13 is fixed on a printed board 12, and a solid-state imaging device 14 such as a CCD is
Glued inside. The solid-state imaging device 14 is covered with a seal glass 15, and the printed circuit board 12 is positioned at a position where a lens holding portion 16 provided with a female screw surrounds the substrate 13.
Fixed on top.

An infrared cut filter 21, an aperture stop 22, and a lens 23 are integrated as a movable lens block 24. The movable lens block 24 is provided with a male screw. The movable lens block 24 includes the lens holding unit 16.
And is fixed to the lens holding portion 16 with an adhesive or the like.

In order for the solid-state image pickup device 11 with a lens to clearly pick up an image, the distance between the upper surface of the solid-state image pickup device 14 and the lens 23 needs to be a predetermined value. Therefore, in the lens-integrated solid-state imaging device 11, the lens 2
At the time of mounting 3, the distance between the upper surface of the solid-state imaging device 14 and the lens 23 can be adjusted by adjusting the amount of screwing of the movable lens block 24 into the lens holding unit 16.

However, the substrate 13 and the height vary, the thickness of the adhesive for bonding the solid-state imaging device 14 to the substrate 13 also varies, and the refraction amount due to the variation in the thickness of the seal glass 15. There are also variations. For this reason,
Even if the height from the surface of the printed circuit board 12 to the movable lens block 24 has a predetermined value, the distance between the upper surface of the solid-state imaging device 14 and the lens 23 does not always have the predetermined value.

Therefore, conventionally, an image display device (not shown) is connected to the lens-integrated solid-state imaging device 11, and an image picked up by the lens-integrated solid-state imaging device 11 is actually displayed on the image display device. While checking the image, the amount of screwing of the movable lens block 24 into the lens holding unit 16 was adjusted so that the displayed image was the sharpest.

[0007]

However, in the lens-integrated solid-state imaging device 11 of the conventional example shown in FIG. 4, the lens holding portion 16 and the movable lens block 24 are separate members.
In addition, both of them are provided with screws. Therefore, the number of parts is large and the shape of the parts is complicated, that is, the structure is complicated, and as a result, the manufacturing cost is high. In addition, the method of mounting the lens 23 in which the screwed amount of the movable lens block 24 is adjusted while confirming the displayed image has low productivity, which also increases the manufacturing cost of the lens-integrated solid-state imaging device 11.

Accordingly, the invention of the present application provides a lens-integrated solid-state imaging device having a low manufacturing cost due to its simple structure, a lens mounting method of a lens-integrated solid-state imaging device having a low manufacturing cost of a lens-integrated solid-state imaging device, and a lens. It is intended to provide a mounting device.

[0009]

According to the first aspect of the present invention, the distance between the solid-state imaging device and the lens in the optical axis direction of the lens is determined by the thickness of the adhesive that fixes them to each other. Depends. For this reason, even if there is variation in the dimension in the optical axis direction in the part other than the adhesive,
This variation can be absorbed by the thickness of the adhesive, the distance between the upper surface of the solid-state imaging device and the lens in the optical axis direction of the lens can be set to a predetermined value, and a structure for adjusting this distance can be used. Is unnecessary.

According to a second aspect of the present invention, there is provided a method for mounting a lens on a solid-state image pickup device integrated with a lens.
The upper surface of the solid-state imaging device is positioned at the third reference position in the optical axis direction by performing automatic focusing from the reference position to the upper surface of the solid-state imaging device. Is positioned at the third reference position.

Since the precision of the automatic focusing can be obtained with the precision of the depth of focus, the upper surface of the solid-state imaging device can be raised to the third reference position by using an optical system having a high resolution and a small depth of focus for the automatic focusing. Positioning can be performed with high accuracy. The lens is also positioned at the first reference position. For this reason, when the upper surface of the solid-state imaging device and the lens are aligned, the distance to move the solid-state imaging device and the lens relative to each other in the optical axis direction is known, and the automatic focusing and the movement of the known distance cause the lens to move. The distance between the upper surface of the solid-state imaging device and the lens in the optical axis direction can be set to a predetermined value.

Further, since the upper surface of the solid-state imaging device is irradiated with light for automatic focusing, even if the solid-state imaging device is covered with a seal glass or the like, automatic focusing can be performed through the seal glass or the like. Can be. For this reason, taking into consideration in advance the refraction of light due to the seal glass or the like at the time of imaging, and including any variation in the thickness of the seal glass or the like, the solid-state imaging device in the optical axis direction of the lens includes the variation. The distance between the upper surface and the lens can be set to a predetermined value.

In addition, since the solid-state imaging device and the lens are fixed to each other with an adhesive in the aligned state, even if there is a variation in the dimension in the optical axis direction in a portion other than the adhesive, the variation is reduced by the thickness of the adhesive. And there is no need to consider variations in dimensions in the optical axis direction in portions other than the adhesive.

According to the third aspect of the present invention, the automatic focusing is performed by maximizing the brightness of the entire visual field obtained by imaging the upper surface of the solid-state imaging device. Therefore, even if an on-chip lens is provided on the upper surface of the solid-state imaging device, automatic focusing on the upper surface of the solid-state imaging device can be performed with high accuracy without being affected by reflection or refraction by the on-chip lens. .

According to a fourth aspect of the present invention, there is provided a lens mounting method for a lens-integrated solid-state imaging device, wherein the second reference position is used as a reference for automatic focusing and the third reference position is used to position the upper surface of the solid-state imaging device in automatic focusing. Since the position apart from the optical axis of the lens is used, the positioning of the lens, the alignment between the upper surface of the solid-state imaging device and the lens, and the positioning of the upper surface of the solid-state imaging device can be performed independently of each other.

According to a fifth aspect of the present invention, in the lens mounting method for a lens-integrated solid-state imaging device, an adhesive is applied to a fixing portion between the solid-state imaging device and the lens before the alignment between the upper surface of the solid-state imaging device and the lens. Keep it. Therefore, the solid-state imaging device and the lens do not hinder each other when the adhesive is applied,
The adhesive can be easily applied.

In the lens mounting apparatus for a solid-state image pickup device integrated with a lens according to a sixth aspect, an automatic focusing mechanism is used.
By performing automatic focusing on the upper surface of the solid-state imaging device in the optical axis direction of the lens, the upper surface of the solid-state imaging device can be positioned in the optical axis direction. It can be positioned at a predetermined reference position in the optical axis direction.

Since the precision of the automatic focusing can be obtained with the precision of the depth of focus, by using an optical system having a high resolution and a small depth of focus for the automatic focusing mechanism, the upper surface of the solid-state imaging device can be moved in a predetermined direction in the optical axis direction. Positioning can be performed with high accuracy at the reference position. Further, the lens can be positioned at a predetermined reference position by the positioning mechanism. For this reason, the distance by which the solid-state imaging device and the lens should be relatively moved in the optical axis direction by the moving mechanism when the upper surface of the solid-state imaging device and the lens are aligned is known, and the automatic focusing and the movement of the known distance are performed. Thus, the distance between the upper surface of the solid-state imaging device and the lens in the optical axis direction of the lens can be set to a predetermined value.

Further, since light is applied to the upper surface of the solid-state image pickup device for automatic focusing, even if the solid-state image pickup device is covered with a seal glass or the like, automatic focusing can be performed through the seal glass or the like. Can be. For this reason, taking into consideration in advance the refraction of light due to the seal glass or the like at the time of imaging, and including any variation in the thickness of the seal glass or the like, the solid-state imaging device in the optical axis direction of the lens includes the variation. The distance between the upper surface and the lens can be set to a predetermined value.

Further, since the adhesive can be applied to the fixing portion between the solid-state image pickup device and the lens by the adhesive application mechanism, the solid-state image pickup device and the lens are fixed in a state where the upper surface of the solid-state image pickup device and the lens are aligned. Are fixed to each other with an adhesive, even if there is a variation in the dimension in the optical axis direction in the portion other than the adhesive, this variation can be absorbed by the thickness of the adhesive, and the light in the portion other than the adhesive can be absorbed. There is no need to consider axial dimensional variations.

According to a seventh aspect of the present invention, the automatic focusing mechanism performs the automatic focusing by maximizing the brightness of the entire visual field obtained by imaging the upper surface of the solid-state imaging device. Therefore, even if an on-chip lens is provided on the upper surface of the solid-state imaging device, automatic focusing on the upper surface of the solid-state imaging device can be performed with high accuracy without being affected by reflection or refraction by the on-chip lens. .

In the lens mounting apparatus for a solid-state image pickup device integrated with a lens according to the eighth aspect, the automatic focusing mechanism performs automatic focusing at a position separated from the optical axis of the lens. Alignment of the upper surface of the solid-state imaging device with the lens and positioning of the upper surface of the solid-state imaging device can be performed independently of each other.

According to the ninth aspect of the present invention, since the adhesive can be hardened by the adhesive hardening mechanism, it is possible to adjust the position of the lens between the upper surface of the solid-state image sensor and the lens. An adhesive can be applied to a fixed portion between the solid-state imaging device and the lens. Therefore, the solid-state imaging device and the lens do not hinder each other when the adhesive is applied, and the adhesive can be easily applied.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described.
This will be described with reference to FIGS. FIG. 1 shows a lens mounting method of a lens-integrated solid-state imaging device according to the present embodiment, FIG. 2 shows a lens-integrated solid-state imaging device of the present embodiment, and FIG. 1 shows a lens mounting device for a solid-state imaging device. The manufacturing of the lens-integrated solid-state imaging device 31 according to the present embodiment is substantially the same as that of the related art before mounting the imaging lens.

That is, as shown in FIGS. 1 and 2, a solid-state image pickup device 33 such as a CCD is
A chip 34 for signal processing is adhered to the lower surface of 2.
The solid-state imaging device 33 and the chip 34 are electrically connected via the substrate 32, and a seal glass 35 that covers the solid-state imaging device 33 and hermetically seals is also adhered to the upper surface of the substrate 32. The plurality of substrates 32 in such a state are stored in the substrate tray 37 of the lens mounting device 36. Further, a plurality of imaging lenses 38 having legs are stored in a lens tray 41 of the lens mounting device 36.

When the lens 38 is mounted on the substrate 32 by the lens mounting device 36, the optical axis direction of the lens 38 is
Lens tray 41 in the Y-axis direction when it is set in the axial direction
Is adjusted by the tray Y-axis table 42, the lens 38 in the lens tray 41 is picked up by the lens transfer head 43. The lens transfer head 43 moves in the X-axis direction along the transfer X-axis table 44, and transfers the lens 38 on the lens positioning table 45.

After the alignment chuck of the lens positioning table 45 positions the lens 38 in the X-axis direction and the Y-axis direction, the mount head 46 picks up the lens 38 from the lens positioning table 45. The mount head 46 moves in the X-axis direction along the transfer X-axis table 44, and transfers the lens 38 to a first reference position in the Z-axis direction above the substrate positioning table 47. The substrate positioning table 47 is mounted on the substrate Z-axis table 48, and the substrate Z-axis table 48 is mounted on the substrate Y-axis table 51.
Is placed on top.

On the other hand, after the tray Y-axis table 42 adjusts the position of the substrate tray 37 in the Y-axis direction,
The substrate transfer head 52 picks up the substrate 32 inside. The substrate transfer head 52 moves in the X-axis direction along the transfer X-axis table 44, and moves the substrate 3 onto the substrate positioning table 47.
Transfer 2 After the alignment chuck of the substrate positioning table 47 positions the lens 38 in the X-axis direction and the Y-axis direction, the substrate Y-axis table 51 moves the substrate positioning table 47 to a position below the UV dispenser 53 in the Y-axis direction.

As shown in FIG. 1A, the UV dispenser 53 descends from this state, and applies an ultraviolet curable adhesive 54 from inside the syringe to the lens 3 on the upper surface of the substrate 32.
After being applied to the fixing portion of No. 8, it rises. Then, the substrate Y-axis table 51 is moved to a position below the substrate positioning table 47 to a position below the high-magnification autofocus lens barrel 55 by the video signal method.
Is moved in the Y-axis direction.

As shown in FIG. 1B, the autofocus lens barrel 55 fixed at the second reference position in the Z-axis direction
Is performed by irradiating light 56 onto the upper surface of the solid-state imaging device 33 through the seal glass 35 and moving the substrate Z-axis table 48 to a position in the Z-axis direction where the brightness of the entire field of view is maximized. The upper surface of the solid-state imaging device 33 is positioned at the third reference position.

Thereafter, the substrate Z-axis table 48 is moved by a predetermined distance in the Z-axis direction to move the substrate positioning table 47 away from the autofocus lens barrel 55, and the substrate Y-axis table 51 is moved below the mount head 46 to the Y-axis. The substrate positioning table 47 is moved in the direction. Then, the substrate Z-axis table 48 moves the substrate positioning table 47 to the position where the distance between the upper surface of the solid-state imaging device 33 and the lens 38 becomes a predetermined value and the solid-state imaging device 31 can clearly capture an image. By moving the lens in the axial direction, the upper surface of the solid-state imaging device 33 and the lens 38 are aligned.

By the way, as described above, the mount head 46 positions the lens 38 at the first reference position in the Z-axis direction above the substrate positioning table 47, and the auto-focusing barrel 55 moves the Z-axis. The upper surface of the solid-state imaging device 33 was positioned at the third reference position in the direction.

For this reason, when the upper surface of the solid-state imaging device 33 and the lens 38 are aligned, the distance that the substrate Z-axis table 48 should move the substrate positioning table 47 in the Z-axis direction is determined by the first reference position and the third reference position. The difference from the reference position and the substrate positioning table 47
The substrate Z-axis table 48 moves the substrate positioning table 47 in the Z-axis direction to separate from the
This distance is known, and this distance is known.

As shown in FIG. 1C, the solid-state image sensor 33
When the upper surface of the lens 38 and the lens 38 are aligned, the adhesive 54 applied to the upper surface of the substrate 32 is in contact with the leg of the lens 38. Therefore, in this state, the adhesive 54
The solid-state imaging device 33 and the lens 38 are fixed to each other by irradiating ultraviolet rays 57 to the adhesive 54 to cure the adhesive 54.

When the adhesive 54 is cured, the mount head 46 moves in the X-axis direction along the transfer X-axis table 44 as it is, and transfers the fixed substrate 32 and the lens 38 into the substrate tray 37. . The lens mounting device 36
Are covered by a safety cover 63. After that,
As shown in FIG. 2, a cover 62 provided with an infrared cut filter 58 and provided with a diaphragm 61 is fixed to the substrate 32 by a conventionally known process to complete the lens-integrated solid-state imaging device 31. Let it.

In the present embodiment as described above, the autofocus lens barrel 55 is used, and the accuracy of the autofocus can be obtained by the accuracy of the depth of focus. If, for example, a 50 × objective lens is used for the auto-focusing barrel 55,
The upper surface of the solid-state imaging device 33 is positioned at a third reference position in the Z-axis direction with an accuracy of 0.001 mm.

Moreover, since the auto-focusing lens barrel 55 performs auto-focusing to maximize the brightness of the entire visual field, even if an on-chip lens is provided on the upper surface of the solid-state imaging device 33, the reflection by the on-chip lens and the Autofocusing on the upper surface of the solid-state imaging device 33 can be performed with high accuracy without being affected by refraction.

On the other hand, for example, in an auto focus that irradiates a laser beam, the peripheral portion which is a non-pixel area where the on-chip lens does not exist is irradiated with the laser beam because it is affected by reflection and refraction by the on-chip lens. In this case, it is necessary to irradiate two points passing through the center of the solid-state imaging device 33 with a laser beam in consideration of the inclination of the surface of the solid-state imaging device 33.

The height A from the upper surface to the lower end of the substrate 32 and the height B from the surface to which the solid-state imaging device 33 is bonded to the lower end vary, and the solid-state imaging device 33 is bonded to the substrate 32. There is also a variation in the thickness of the adhesive, and a variation in the amount of refraction due to a variation in the thickness C of the seal glass 35. However, in the above-described embodiment, as is clear from FIG. 1C, these variations are absorbed by the thickness of the adhesive 54, and the distance D between the upper surface of the solid-state imaging device 33 and the lens 38 is reduced. It becomes a predetermined value.

In the above embodiment, after the upper surface of the solid-state imaging device 33 is positioned by auto focus, the substrate Z-axis table 48 is
Is moved in the Z-axis direction so that the solid-state imaging device 3
The upper surface of the lens 3 and the lens 38 are aligned. However, the mount head 46 positioning the lens 38
By moving the lens 38 in the Z-axis direction, the upper surface of the solid-state imaging device 33 and the lens 38 may be aligned.

In the above embodiment, the first reference position at which the mount head 46 positions the lens 38,
The second reference position to which the autofocus lens barrel 55 is fixed and the third reference position at which the autofocus lens barrel 55 positions the upper surface of the solid-state imaging device 33 are arranged on different axes. . However, it is also possible to arrange these reference positions on the same axis. In this case, the alignment between the upper surface of the solid-state imaging device 33 and the lens 38 after positioning by autofocus is performed only on the same axis. It can be carried out.

In the above embodiment, after the adhesive 54 is applied to the substrate 32, positioning by auto-focusing and alignment between the upper surface of the solid-state image sensor 33 and the lens 38 are performed. Although the curing of the adhesive 54 is performed, the application and curing of the adhesive 54 may be performed after the alignment between the upper surface of the solid-state imaging device 33 and the lens 38.

[0043]

According to the first aspect of the present invention, there is no need for a structure for adjusting the distance between the upper surface of the solid-state imaging device and the lens in the optical axis direction of the lens. Good and therefore low manufacturing costs.

According to the second aspect of the present invention, the distance between the upper surface of the solid-state imaging device and the lens in the optical axis direction of the lens is determined by the automatic focusing and the movement of a known distance. Value, and there is no need to consider variations in dimensions in the optical axis direction in portions other than the adhesive, so that the productivity of mounting the lens is high, and therefore, the manufacturing cost of the lens-integrated solid-state imaging device is reduced. Low.

According to the third aspect of the present invention, even if an on-chip lens is provided on the upper surface of the solid-state imaging device, the solid-state imaging device is not affected by reflection or refraction by the on-chip lens. Since automatic focusing with respect to the upper surface of the solid-state imaging device can be performed with high accuracy, the manufacturing cost is low even with a lens-integrated solid-state imaging device provided with an on-chip lens.

According to a fourth aspect of the present invention, in the lens mounting method of the solid-state image pickup device integrated with the lens, the positioning of the lens, the alignment of the upper surface of the solid-state image pickup device with the lens, and the positioning of the upper surface of the solid-state image pickup device are performed independently of each other. Therefore, each process can be simplified, and the manufacturing cost of the lens-integrated solid-state imaging device is further reduced.

According to the lens mounting method of the lens-integrated solid-state image pickup device according to the fifth aspect, the solid-state image pickup device and the lens do not hinder each other when the adhesive is applied, and the adhesive can be easily applied. The manufacturing cost of the lens-integrated solid-state imaging device is further reduced.

According to a sixth aspect of the present invention, the distance between the upper surface of the solid-state imaging device and the lens in the optical axis direction of the lens is determined by the automatic focusing and the movement of a known distance. Value, and there is no need to consider variations in dimensions in the optical axis direction in portions other than the adhesive, so that the productivity of mounting the lens is high, and therefore, the manufacturing cost of the lens-integrated solid-state imaging device is reduced. Low.

According to the lens mounting apparatus of the solid-state image pickup device integrated with the lens according to the seventh aspect, even if an on-chip lens is provided on the upper surface of the solid-state image pickup device, the solid-state image pickup device is not affected by reflection or refraction by the on-chip lens. Since automatic focusing with respect to the upper surface of the solid-state imaging device can be performed with high accuracy, the manufacturing cost is low even with a lens-integrated solid-state imaging device provided with an on-chip lens.

In the lens mounting apparatus for a solid-state image pickup device integrated with a lens according to claim 8, the positioning of the lens, the alignment between the upper surface of the solid-state image pickup device and the lens, and the positioning of the upper surface of the solid-state image pickup device are performed independently of each other. Therefore, each mechanism can be simple, and the manufacturing cost of the lens-integrated solid-state imaging device is further reduced.

According to the lens mounting apparatus of the ninth aspect, the solid-state imaging device and the lens do not hinder each other when the adhesive is applied, and the adhesive can be easily applied. The manufacturing cost of the lens-integrated solid-state imaging device is further reduced.

[Brief description of the drawings]

FIG. 1 is a side sectional view showing a lens mounting method of a lens-integrated solid-state imaging device according to an embodiment of the present invention in the order of steps.

FIG. 2 is a side sectional view of a lens-integrated solid-state imaging device according to an embodiment.

FIG. 3 is a perspective view of a lens mounting device for a lens-integrated solid-state imaging device according to an embodiment.

FIG. 4 is a side sectional view of a lens-integrated solid-state imaging device according to a conventional example of the present invention.

[Explanation of symbols]

31: lens-integrated solid-state imaging device, 33: solid-state imaging device, 38: lens, 46: mount head (positioning mechanism), 48: substrate Z-axis table (moving mechanism), 53: U
V dispenser (adhesive application mechanism), 54 ... adhesive, 5
5. Auto focus lens barrel (auto focus mechanism)

Claims (9)

[Claims] 1. A solid-state imaging device and a lens are fixed to each other via an adhesive, and a distance between the solid-state imaging device and the lens in an optical axis direction of the lens depends on a thickness of the adhesive. A lens-integrated solid-state imaging device, comprising: 2. A step of positioning a lens at a first reference position; and performing automatic focusing on a top surface of the solid-state imaging device from a second reference position in the optical axis direction of the lens. Positioning the upper surface at a third reference position, and relative moving the solid-state imaging device having the upper surface at the third reference position and the lens at the first reference position in the optical axis direction. A step of performing alignment between the upper surface and the lens by moving the solid-state imaging device and the lens in the alignment state with an adhesive. A lens mounting method for an integrated solid-state imaging device. 3. The method according to claim 2, wherein the automatic focusing is performed by maximizing the brightness of the entire visual field in which the upper surface is imaged. 4. The method according to claim 2, wherein a position apart from the optical axis is used as the second and third reference positions. 5. The lens according to claim 2, wherein the adhesive is applied to a fixing portion between the solid-state imaging device and the lens before the alignment. Mounting method. 6. A positioning mechanism for positioning a lens, and an automatic focusing mechanism for positioning the upper surface in the optical axis direction by performing automatic focusing on the upper surface of the solid-state imaging device in the optical axis direction of the lens. A moving mechanism for relatively moving the solid-state imaging device and the lens in the optical axis direction; and an adhesive application mechanism for applying an adhesive to a fixing portion between the solid-state imaging device and the lens. A lens mounting device for a lens-integrated solid-state imaging device, characterized by: 7. The apparatus according to claim 6, further comprising the automatic focusing mechanism for performing the automatic focusing by maximizing the brightness of the entire visual field in which the upper surface is imaged.
A lens mounting device for the lens-integrated solid-state imaging device according to Claim 1. 8. The lens mounting device for a lens-integrated solid-state imaging device according to claim 6, further comprising the automatic focusing mechanism for performing the automatic focusing at a position apart from the optical axis. 9. The lens mounting apparatus according to claim 6, further comprising an adhesive curing mechanism for curing the adhesive.