JPH113738A - Terminal block for surface mounting, surface mounting board, and power supply device using the same - Google Patents

Abstract

[PROBLEMS] To provide a surface mounting terminal block that can securely solder connection terminal pins to a circuit board with a small amount of solder. A surface mount terminal block (3) according to the present invention includes a support section (5) of a base section (5) in which connection terminal pins (6) for connecting an external circuit are insulated.
a. The connection terminal pin 6 is provided with a substantially U-shaped curved portion 6b at the mounting end thereof.
A straight mounting portion 6a is formed at the tip of the curved portion 6b. The mounting portion 6a of the connection terminal pin 6 is formed in a direction orthogonal to the shaft portion 6c. The curved portion 6a of each connection terminal pin 6 is formed to be curved in the same direction along the arrangement direction of the connection terminal pins 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technology of a surface mounting terminal block for mounting, for example, a connection terminal for connecting an external circuit of a power supply device on a surface mounting circuit board.

[0002]

2. Description of the Related Art Conventionally, there has been used a surface mount board in which an insulating film is coated on one surface of a metal plate such as aluminum, a circuit pattern is formed thereon, and electric components are soldered on the surface. Have been.

In such a surface mount board, when mounting connection terminal pins for connecting to other external circuits,
A fixed connection means as in a normal insulating substrate, that is, a means for providing an insertion through hole in the circuit pattern portion of the substrate, inserting a connection pin there and temporarily fixing, and then soldering on the back surface of the substrate is employed. Can not do.

Therefore, in order to easily and reliably mount terminal pins for connecting an external circuit on the surface of such a surface mounting board,
The present applicant has already proposed a surface mounting terminal block in which connection terminal pins having a nail-shaped tip shape are vertically soldered to a surface mounting board (Japanese Utility Model Application Laid-Open No. 4-13336).
No. 2).

[0005]

When the connection terminal pins are mounted on the surface of the surface mounting board using the above-mentioned conventional surface mounting terminal block, the connection of the surface mounting board coated with cream solder is applied. The connection terminal pins are erected temporarily on the terminal lands, and soldering is performed by reflow soldering.However, the connection terminal pins and the surface mounting board are deformed due to thermal expansion and contraction due to thermal expansion. The amount of solder applied alone is not sufficient for the amount of solder attached to the connection terminal pins, and the tensile strength of the connection terminal pins is insufficient or the durability cannot be sufficiently satisfied. For this reason, conventionally, the amount of solder must be further increased by a dispenser or the like after printing, and as a result, the work time increases and the amount of solder varies, resulting in insufficient reliability. there were.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and is intended for a surface mounting device capable of reliably soldering connection terminal pins to a surface mounting substrate with a small amount of solder. An object of the present invention is to provide a terminal board and a highly reliable surface mount board and a power supply device using the same.

[0007]

According to a first aspect of the present invention, there is provided a surface mount terminal block for mounting connection terminal pins for connecting an external circuit on a surface of a printed circuit board. An approximately U-shaped curved portion is provided at one end side of the connection terminal pin, and a linear soldering portion is formed at a distal end portion of the curved portion. The surface mounting terminal block is characterized by being arranged in a plurality.

In the case of the first aspect of the present invention, since a substantially U-shaped curved portion is provided at the mounting end of the connection terminal pin, the connection terminal pin thermally expands and contracts during soldering. When this occurs, the curved portion bends and twists, and as a result, the deformation stress generated in the connection terminal pin is absorbed and can be reduced. Therefore, according to the first aspect of the present invention, it is not necessary to further increase the amount of solder by a dispenser or the like after printing and applying the cream solder.

Further, since a straight mounting portion is formed at the tip of the curved portion of the connection terminal pin, a large contact area between the mounting portion and the printed wiring board can be ensured, and soldering can be performed. The mounting strength is improved.

In this case, as in the second aspect of the present invention,
In the first aspect of the present invention, it is also effective that the connecting portion for connecting the connecting terminal pin to the external circuit is provided at a tip end portion of the shaft portion extending in a direction orthogonal to the mounting portion.

According to the second aspect of the present invention, when the connection terminal pins undergo thermal expansion and contraction during soldering, the bending stress sufficiently absorbed by the connection terminal pins is reduced by the curved portion. can do.

According to a third aspect of the present invention, in the first aspect of the present invention, the curved portions of the connection terminal pins are arranged in a direction along the arrangement direction of the connection terminal pins. 5. It is formed curved toward, in particular, claim 4.
It is also effective that they are formed so as to be curved in the same direction as in the invention described.

According to the third or fourth aspect of the present invention, since the curved portions of the connection terminal pins are aligned along the direction in which the connection terminal pins are arranged, there is no unnecessary projection, and the mounting of the surface mounting terminal block is eliminated. The area can be reduced.

Further, as in the invention according to the fifth aspect, in the invention according to any one of the first to fourth aspects, it is also effective that the connection terminal pin is provided with a plurality of curved portions.

According to the fifth aspect of the present invention, since the deformation stress generated in the connection terminal pins during soldering is dispersed to the plurality of curved portions, the deformation stress can be further absorbed and reduced. .

According to a sixth aspect of the present invention, the surface mount terminal block according to any one of the first to fifth aspects is mounted on a surface of a circuit board having a metal base. A surface mounting board characterized by the following.

According to the sixth aspect of the present invention, even when the circuit board undergoes significant thermal expansion and contraction due to a temperature change due to soldering, the curved portion is deformed in accordance with the thermal expansion and contraction. Can be absorbed.

According to a seventh aspect of the present invention, the terminal board for surface mounting according to any one of the first to fifth aspects is mounted on the input and output portions of a circuit board having a metal base. A power supply device characterized by the above-mentioned.

According to the seventh aspect of the present invention, a power supply unit having a compact configuration that is resistant to thermal deformation upon connection to an external circuit and has high reliability can be obtained.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is an exploded perspective view showing an example of a power supply device using a surface mounting terminal block according to an embodiment of the present invention. As shown in FIG. 1, the power supply device 1 includes a printed circuit board 2 as a rectangular circuit board having a component mounting area 2a on which various electric components are mounted, a surface mounting terminal block 3 described below,
And a case 4 for covering the mounted electric components.

The printed wiring board 2 is formed by forming, for example, a glass-epoxy resin layer on a rectangular plate-shaped metal base, and the component mounting area 2a excluding the edge thereof.
In addition, a wiring pattern (not shown) is formed so that electric components such as a power supply are mounted. At the four corners of the printed wiring board 2, holes 2b for fixing the surface mounting terminal block 3 are provided. A connection pattern 2c corresponding to a connection terminal pin 6 described later is formed on a pair of short edges of the printed wiring board 2, and a surface mounting having the same configuration is provided on each short edge of the printed wiring board 2. Terminal block 3 is attached.

FIG. 2 is a front view showing the overall configuration of the surface mounting terminal block 3. FIGS. 3A and 3B show the overall configuration of the connection terminal pins 6 provided on the surface mounting terminal block 3. FIG. 3A is a front view, and FIG. 3B is a side view.

As shown in FIG. 2, the surface mount terminal block 3
Is composed of an insulating base portion 5 formed by, for example, injection molding of plastic, and a plurality of connection terminal pins 6 pressed into the support portion 5a of the base portion 5 at equal intervals.

The base portion 5 has a long support portion 5a for supporting the connection terminal pins 6, and leg portions 5b are integrally provided at both ends. In addition, positioning protrusions 5c that fit into holes 2b provided at four corners of the printed wiring board 2 are provided below the legs 5b on both sides of the base 5. Also, the printed wiring board 2
A locking member 50 for locking the base portion 5 is provided.

On the other hand, between the two legs 5b of the base 5, a rib 5d is formed integrally with the support 5a and the legs 5b.
Thus, a space is formed below the support portion 5a.

As shown in FIGS. 3A and 3B, the connection terminal pin 6 is made of a metal material having high conductivity such as copper or brass, and is made of a thick (diameter of 0.8 mm or more) short rod-shaped wire. It is formed by bending. In the present embodiment, a substantially U-shaped curved portion 6b is provided at the mounting side (lower side in the drawing) end of the connection terminal pin 6, and the distal end of the curved portion 6b is parallel to the printed wiring board 2. Is formed with a straight mounting portion 6a which is to be soldered.

On the other hand, a shaft portion 6c extending in a direction perpendicular to the mounting portion 6a is provided at an end of the curved portion 6b on the side of the external circuit connection (upper side in the figure).

A crushed portion 6d is formed in the middle of the shaft portion 6c so that the connection terminal pin 6 is not easily removed when the connection terminal pin 6 is pressed into the base portion 5. Further, a connection portion 6e for connecting to another external circuit is provided at the tip of the shaft portion 6c.

As shown in FIG. 2, each connection terminal pin 6
The support portion 5a of the base portion 5 is press-fitted and fixed to the support portion 5a in a state where the curved portion 6b is directed in the longitudinal direction of the connection terminal pins 6, that is, in the arrangement direction. In this case, the curved portions 6b of the connection terminal pins 6 are respectively directed in the same direction. The connection terminal pin 6 is fixed to the support 5a such that the shaft 6c is orthogonal to the longitudinal direction of the support 5a of the base 5.

The connection terminal pin 6 has a mounting portion 6a.
Is fixed so that the lower surface thereof is located slightly above the lower portion of the leg 5b of the base portion 5, so that when the connection terminal pins 6 are mounted on the printed wiring board 3, a slight gap is formed between the connection terminal pins 6 and the connection pattern 2c. Is formed.

When the surface mounting terminal block 3 of the present embodiment having the above-described configuration is mounted on the printed wiring board 2, cream solder is printed and applied on the connection pattern 2c of the printed wiring board 2, and The positioning projections 5c at the lower portions of both legs 5b of the base 5 are fitted into the holes 2b at the four corners of the printed wiring board 2. As a result, the surface mount terminal block 3 is temporarily fixed on the printed wiring board 2 in a state where the mounting portion 6a of the connection terminal pin 6 and the cream solder on the connection pattern 2c of the printed wiring board 2 are in contact with each other.

Then, in this state, the surface mounting terminal block 3 is introduced into a reflow furnace (not shown), and heated at a predetermined temperature to perform reflow soldering, thereby connecting the connection terminal pins 6 of the surface mounting terminal block 3. Is soldered to the connection pattern 2c of the printed wiring board 2, and the power supply device 1 having the above configuration is obtained.

The power supply device 1 thus obtained is connected to each connection terminal pin 6 with respect to a connection terminal of an external circuit (not shown).
Is electrically connected to external circuits of various devices.

As described above, in this embodiment, a substantially U-shaped curved portion 6 is provided on the mounting end side of the connection terminal pin 6.
Since the connection portion b is provided, when the connection terminal pin 6 undergoes thermal expansion and contraction during soldering to an external circuit, the bent portion 6b is bent and twisted, so that the connection terminal pin 6 is generated. The deformation stress is absorbed and can be reduced.

Particularly, in the case of the present embodiment, since the shaft portion 6c is configured to extend in the vertical direction with respect to the mounting portion 6a, the connection terminal pins 6 undergo thermal expansion and thermal shrinkage during soldering. In this case, the bending stress generated in the connection terminal pin 6 is sufficiently absorbed by the bending portion 6b, and the bending stress can be reduced.

Further, since the straight mounting portion 6a is formed at the tip of the curved portion 6b of the connection terminal pin 6, a large contact area between the mounting portion 6a and the printed wiring board 2 can be ensured. Therefore, the mounting strength by soldering can be improved.

As described above, according to the present embodiment, even when the printed wiring board 2 having the metal base that greatly expands and contracts thermally due to the temperature change accompanying the soldering is used. In addition, by deforming the curved portion 6b, the deformation stress can be absorbed, so that it is not necessary to increase the amount of solder as in the related art, and soldering can be reliably performed with a small amount of solder. As a result, the work time can be shortened by omitting the solder increasing step, and the reliability can be improved by avoiding a variation in the amount of solder.

Further, in the case of the present embodiment, the curved portions 6b of the connection terminal pins 6 are formed in the same direction along the direction in which the connection terminal pins 6 are arranged. The curved portions 6b are aligned along the arrangement direction of the connection terminal pins 6, so that there is no unnecessary protrusion.
The mounting area of the terminal block for surface mounting can be reduced,
A compact power supply device 1 is obtained.

FIG. 4A shows the equivalent stress at the interface between the mounting portion 6a and the solder in the connection terminal pin 6 according to the embodiment of the present invention, and FIG. 4B shows the conventional connection terminal pin. The equivalent stress at the interface between the mounting portion 106a and the solder at 106 is shown. Here, the graphs shown in FIGS. 4A and 4B show the results of stress analysis at the respective interface element portions.

As shown in FIGS. 4A and 4B, the curved portion 6
In the case of the connection terminal pin 6 according to the present embodiment having the b.
It can be understood that the equivalent stress is reduced at each interface element between the solder and the solder 7, and in particular, the value of the maximum equivalent stress is about half.

As described above, according to the present invention, it has been found that the bending stress and the torsional stress generated in the connection terminal pins 6 at the time of soldering can be sufficiently absorbed.

Note that the present invention is not limited to the above-described embodiment, and various changes can be made. For example,
In the above-described embodiment, the connection terminal pin is manufactured using the rod-shaped wire. However, the present invention is not limited to this. For example, the connection terminal pin can be manufactured using a plate-shaped member. .

Further, in the above-described embodiment, the case where the surface mounting terminal block is mounted on the surface of the substrate mainly made of a metal material has been described. However, the present invention is not limited to this. The present invention is also applicable to a substrate made of. However, the present invention is particularly effective when a surface mounting terminal block is mounted on a surface of a substrate mainly made of a material such as a metal which largely expands and contracts due to heat.

FIG. 5A shows the overall structure of a connection terminal pin according to another embodiment of the present invention.
FIG. 5B shows an equivalent stress at the interface between the mounting portion and the solder in the connection terminal pin shown in FIG. 5A. In FIG. 5A, portions corresponding to those in the above embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. The connection terminal pins of the present embodiment are manufactured by, for example, punching. And the two curved portions 6b and 6f
Are continuously formed in a substantially S-shape, and a linear attachment portion 6a is formed at the tip of the curved portion 6b on the mounting side. on the other hand,
The same shaft portion 6c as in the above embodiment is provided on the external circuit connection side.
Is provided.

According to the present embodiment having the above configuration, the deformation stress generated in the connection terminal pin 6 during soldering is dispersed to the two curved portions 6b and 6f, so that the deformation stress is further absorbed. And can be reduced. This means that, as shown in FIG. 5B, the equivalent stress at each interface element between the mounting portion 6a and the solder 7 is as shown in FIG.
It can also be understood from the fact that the curved portion 6b shown in (a) is much smaller than in the case of the one embodiment.

[0046]

As described above, according to the surface mounting terminal block of the present invention, when soldering to an external circuit, it is possible to reduce the deformation stress generated in the connection terminal pins, and to further reduce Even when using a metal substrate that is greatly deformed by the accompanying temperature change, the deformation stress can be reduced, so there is no need to increase the amount of solder as in the past, and a smaller amount of solder is required for the circuit board. The connection terminal pins can be securely soldered. As a result, according to the present invention, the work time can be shortened by omitting the step of increasing the amount of solder, and the reliability can be improved by avoiding variations in the amount of solder, and a high-quality surface-mounted substrate can be obtained. And a power supply device.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an example of a power supply device using a surface mounting terminal block according to an embodiment of the present invention.

FIG. 2 is a front view showing the overall configuration of the surface mounting terminal block in the embodiment.

FIG. 3A is a front view showing the entire configuration of the connection terminal pin according to the embodiment; FIG. 3B is a side view showing the entire configuration of the connection terminal pin according to the embodiment;

FIG. 4A is an explanatory diagram showing equivalent stress at an interface between a mounting portion and a solder in the connection terminal pin according to the embodiment.
(B): explanatory drawing showing the equivalent stress at the interface between the mounting portion and the solder in the conventional connection terminal pin

FIG. 5A is a front view showing the overall configuration of a connection terminal pin according to another embodiment of the present invention. FIG. 5B is a view showing the interface between the mounting portion and the solder in the connection terminal pin shown in FIG. Explanatory diagram showing equivalent stress

[Explanation of symbols]

1. Power supply device 2. Printed wiring board (circuit board)
2a ... Component mounting area 2b ... Hole 2c ... Connection terminal land 3 ... Surface mounting terminal block 4 ... Case 5 ... Base part 5a ... Support part 5b ... Leg part 5c ...
Positioning protrusion 6: Connection terminal pin 6a: Mounting part
6b: curved portion 6c: shaft portion 6d: collapsed portion
6e ... connection part

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Masahiro Takita 10-13 Minamimachi, Hanno City, Saitama Prefecture Inside Hanno Plant of Shindengen Kogyo Co., Ltd. (72) Kiichi Tanaka 3-6-3 Kitano Kitano, Niiza City, Saitama Prefecture No. Sanken Electric Co., Ltd.

Claims (7)

[Claims] 1. A surface mounting terminal block for mounting a connection terminal pin for connecting an external circuit on a surface of a circuit board, wherein the connection terminal pin has a substantially U-shaped curve at an end on the mounting side. A surface mounting terminal block, wherein a plurality of connection terminal pins are arranged on an insulating support base, and wherein a plurality of connection terminal pins are arranged on an end of the curved portion. 2. The surface mounting according to claim 1, wherein a connection portion for connecting the connection terminal pin to an external circuit is provided at a tip end of a shaft portion extending in a direction orthogonal to the mounting portion. Terminal block. 3. The surface according to claim 1, wherein the curved portion of each connection terminal pin is formed to be curved in a direction along the arrangement direction of the connection terminal pins. Terminal block for mounting. 4. The connection terminal pin according to claim 3, wherein the bending portions are formed to bend in the same direction.
The surface mount terminal block described. 5. The surface mount terminal block according to claim 1, wherein a plurality of curved portions are provided on the connection terminal pins. 6. A surface of a circuit board having a metal base,
A surface mounting board, on which the surface mounting terminal block according to any one of claims 1 to 5 is mounted. 7. A power supply device, wherein the surface mounting terminal block according to claim 1 is mounted on input and output portions of a circuit board having a metal base.