JPH06342989A - Power element fixing method - Google Patents

Power element fixing method

Info

Publication number
JPH06342989A
JPH06342989A JP5131653A JP13165393A JPH06342989A JP H06342989 A JPH06342989 A JP H06342989A JP 5131653 A JP5131653 A JP 5131653A JP 13165393 A JP13165393 A JP 13165393A JP H06342989 A JPH06342989 A JP H06342989A
Authority
JP
Japan
Prior art keywords
power element
insulating sheet
power
screw
fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5131653A
Other languages
Japanese (ja)
Inventor
Junshiro Inamura
潤四郎 稲村
Naoki Hatsutori
直幾 服部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5131653A priority Critical patent/JPH06342989A/en
Publication of JPH06342989A publication Critical patent/JPH06342989A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/073Connecting or disconnecting of die-attach connectors
    • H10W72/07351Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

(57)【要約】 【目的】ブラシレスモートル用コントローラ等のパワー
素子を放熱フィンに固定する方法に関し、パワー素子を
一括してバネ力で押え込む事により、絶縁抵抗がなく、
極めて作業性の良い方法を実現すること。 【構成】放熱フィンに、1枚の絶縁シート6をのせ、基
板1に半田付された複数のパワー素子8を、絶縁シート
上にのせ、押え金具4に、あらかじめ部組された押えバ
ネ3の切り起しが、パワー素子を押えこむ様、押え金具
を放熱フィンにネジ5にて固定する。 【効果】パワー素子取付時、あらかじめ他の部品と同時
に半田付され、又、一括して取付けられるから、作業性
が良く安価で有り、又、絶縁不良のない取付方法が出来
る。
(57) [Abstract] [Purpose] Regarding a method of fixing a power element such as a controller for a brushless motor to a radiation fin, by pressing the power elements together with a spring force, there is no insulation resistance,
Realize an extremely workable method. [Structure] One radiating fin is covered with one insulating sheet 6, a plurality of power elements 8 soldered to a substrate 1 is mounted on the insulating sheet, and a holding metal fitting 4 is provided with a holding spring 3 preassembled. The press fitting is fixed to the radiating fin with the screw 5 so that the cut and raised presses the power element. [Effect] When the power element is mounted, it is preliminarily soldered at the same time as other components or collectively mounted, so that workability is good and the cost is low, and a mounting method without insulation failure can be performed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ブラシレスモートル,
DCモートル等コントローラのパワー素子を放熱フィン
に固定する方法に係り、特に複数のパワー素子を簡単
に、確実に固定する方法に関する。
The present invention relates to a brushless motor,
The present invention relates to a method for fixing a power element of a controller such as a DC motor to a radiation fin, and more particularly to a method for easily and surely fixing a plurality of power elements.

【0002】[0002]

【従来の技術】図4に一例を示す如く、1ヶのパワー素
子と放熱フィン間に絶縁シートを入れて絶縁し、ネジも
絶縁ワッシャにて絶縁後、放熱フィンに設けられたネジ
穴で固定していた。
2. Description of the Related Art As shown in FIG. 4, an insulating sheet is inserted between one power element and a radiation fin to insulate the screw, and the screw is also insulated with an insulating washer, and then fixed with a screw hole provided in the radiation fin. Was.

【0003】[0003]

【発明が解決しようとする課題】従来のパワー素子固定
方法に於いては、ネジ固定方法で有るため、第一に、ネ
ジ穴部のバリ等により、絶縁シートが薄く、又ネジが通
る穴が必要な為、絶縁が保たれない場合が、取付後、耐
圧チェックが必要であった。第二に絶縁シートの穴とパ
ワー素子の穴,放熱フィンのネジ穴を一致させるのに時
間を要し作業性が悪くしたがって高価となった。第三
に、パワー素子を放熱フィンにネジで固定後、パワー素
子の足を基板に半田付する必要が有り極めて、作業性が
悪いものとなっていた。
Since the conventional power element fixing method is a screw fixing method, firstly, the insulating sheet is thin due to burrs in the screw holes, and holes through which screws pass are formed. If necessary, insulation could not be maintained, but it was necessary to check the pressure resistance after mounting. Secondly, it takes time to align the holes in the insulating sheet with the holes in the power element and the screw holes in the heat radiation fins, and the workability is poor and therefore expensive. Thirdly, after fixing the power element to the heat radiation fin with a screw, it is necessary to solder the legs of the power element to the substrate, which is extremely inferior in workability.

【0004】[0004]

【課題を解決するための手段】本発明の一実施例に示す
如く、パワー素子の取付固定にはネジを使用しない方法
とした。従って絶縁シートもパワー素子1ヶ毎にする必
要がなく又ネジ用の穴も不要となった。
As shown in one embodiment of the present invention, a method is used in which screws are not used for mounting and fixing the power element. Therefore, it is not necessary to provide an insulating sheet for each power element, and holes for screws are not required.

【0005】パワー素子の押えは、バネによる圧接方式
とし、一括して複数のパワー素子を固定できる方法とし
た。
The pressing of the power elements is a pressure contact method using a spring, and a method of fixing a plurality of power elements at one time is adopted.

【0006】[0006]

【作用】絶縁シート6は、複数のパワー素子を一括して
絶縁する。又、放熱フィンの発起部に切欠けを合わせ、
作業時の絶縁シートのずれを防止している。押えバネは
両端の切欠け,曲げ部により、バネアクションをもって
押え金具に固着され作業時落ちない構造となっている。
又、押えバネの切り起し部により、パワー素子は、必要
な圧力にて絶縁シートを介して放熱フィンに固定され
る。
The insulating sheet 6 collectively insulates a plurality of power elements. Also, align the notch with the origin of the heat dissipation fin,
Prevents displacement of the insulation sheet during work. The presser spring has a structure in which it is fixed to the presser metal fitting with spring action due to the notches and bends at both ends so that it will not fall during work.
Further, the cut-and-raised portion of the pressing spring fixes the power element to the radiating fin with a necessary pressure via the insulating sheet.

【0007】[0007]

【実施例】図1により本発明の実施例を詳細に説明す
る。
Embodiments of the present invention will be described in detail with reference to FIG.

【0008】本発明に於けるパワー素子の固定方法は、
最初に図2に示す様に両端に切欠6a,6bが設けられ
た絶縁シート6を放熱フィン上に置く(図中破線で示
す。)。この時、放熱フィンの突起7a,7bと絶縁シ
ートの切欠け6a,6bで位置も決められる。
The method of fixing the power element in the present invention is as follows.
First, the insulating sheet 6 having notches 6a and 6b at both ends as shown in FIG. 2 is placed on the radiation fins (shown by broken lines in the figure). At this time, the position is also determined by the protrusions 7a and 7b of the heat radiation fin and the cutouts 6a and 6b of the insulating sheet.

【0009】次に、基板1にあらかじめ他の部品と同時
に半田付されたパワー素子8が、絶縁シート6の上にな
る様、基板取付ネジ2で取付けられる。この場合パワー
素子は、絶縁シート方向の寸法精度のみが重要で有り、
図1上の図に於ける上下,左右方向の寸法は、他の素子
間で接触しないで又、絶縁シート上より、はずれなけれ
ば、それほど必要ではない。パワー素子の絶縁シート方
向の取付精度は、部品挿入時には基板をパワー素子の下
まで伸ばしておき、この基板上にパワー素子をのせる
か、さらには上部より押さえつけて半田付する事によ
り、充分組立時に問題ない精度に取付可能で有り、半田
付後にはパワー素子下部の基板は、取除かれる(一般的
には、Vカットを設け、そこから切り離す。)。
Next, the power element 8 previously soldered to the board 1 at the same time as other components is attached by the board attaching screw 2 so as to be on the insulating sheet 6. In this case, for the power element, only the dimensional accuracy in the direction of the insulating sheet is important,
The dimensions in the upper and lower directions and the left and right directions in the upper diagram of FIG. 1 are not necessary so long as they do not come into contact with each other and do not deviate from the insulating sheet. The mounting accuracy of the power element in the direction of the insulating sheet can be sufficiently assembled by extending the board to the bottom of the power element at the time of component insertion and placing the power element on this board, or by pressing it from the top and soldering. Sometimes it can be mounted with no problem, and after soldering, the substrate under the power element is removed (generally, a V-cut is provided and separated from it).

【0010】次に、図3に示すように、両端に切欠け3
a,曲げ部3cを持ち必要パワー素子と同数の切り起し
3bを持った押えバネ3を、押え金具4に取付ける。押
え金具4には、前記押えバネ3の切欠け3aと曲げ部3
cに対応して、突起4a,穴4bが設けられており、曲
げ部3cを穴4bに挿入し、押えバネ3を図の左右方向
に押して、押え金具の突起4aに押えバネ3の切欠け3
aをひっかけ、固定する。従って押えバネ3は、落ちる
事なく決まった位置に固着される。
Next, as shown in FIG. 3, notches 3 are formed at both ends.
a, the holding spring 3 having the bent portion 3c and the same number of cut-and-raised portions 3b as the necessary power elements are attached to the holding metal fitting 4. The presser fitting 4 includes a notch 3a and a bent portion 3 of the presser spring 3.
A protrusion 4a and a hole 4b are provided corresponding to c, the bent portion 3c is inserted into the hole 4b, and the presser spring 3 is pushed in the left-right direction in the figure, so that the protrusion 4a of the presser fitting has a cutout of the presser spring 3. Three
Hook and fix a. Therefore, the presser spring 3 is fixed to a fixed position without dropping.

【0011】そして前記押え金具を図1に示す様に、押
え金具取付ネジ5で、放熱フィンのネジ穴9にて固定す
る。この時押えバネ3の切り起し3bが、各々のパワー
素子を、あらかじめ設計された圧力によって押えつけ
る。
Then, as shown in FIG. 1, the holding metal fitting is fixed with the holding metal fitting mounting screw 5 in the screw hole 9 of the radiating fin. At this time, the cut-and-raised portion 3b of the presser spring 3 presses each power element by a predesigned pressure.

【0012】以上の如く、本発明によれば絶縁シート6
は従来例の絶縁シート10と異なり1枚にて全パワー素
子を絶縁し、ネジ用の穴も不要で有るから、従来例の如
く、耐圧不良の発生がなく、パワー素子取付後の耐圧チ
ェックは不要となる。又、複数個のパワー素子を一括し
て押え込み固定出来るので、従来例の1個のパワー素子
ネジ止め方式に比較し、極めて作業性が良く、従って安
価にすることが出来る。
As described above, according to the present invention, the insulating sheet 6 is used.
Unlike the conventional insulating sheet 10, all the power elements are insulated with one sheet, and holes for screws are not required. Therefore, unlike the conventional example, there is no failure of withstand voltage, and the withstand voltage check after mounting the power element is not required. It becomes unnecessary. In addition, since a plurality of power elements can be pressed and fixed together, the workability is extremely good and the cost can be reduced as compared with the conventional single power element screw fixing method.

【0013】更には、パワー素子8は、他の部品を半田
付時に同時に半田付されるので、従来例の如く、パワー
素子取付後半田付する必要がなく、いっそう作業性が良
いもので有り、その実用効果は極めて大きい。
Furthermore, since the power element 8 is soldered at the same time as other components are soldered, it is not necessary to solder after mounting the power element as in the conventional example, and the workability is further improved. The practical effect is extremely large.

【0014】[0014]

【発明の効果】本発明によれば、パワー素子を放熱フィ
ン取付時、耐圧不良の発生がなく、従って取付後のチェ
ックが不要となり、又、一括して複数のパワー素子を取
付けられ、その上に、他の部品と同時に半田付可能で有
り、取付信頼性が高く、極めて作業性が良く、従って安
価な、パワー素子取付法が実現出来る。
According to the present invention, when the heat dissipation fins of the power elements are mounted, there is no failure in withstand voltage, and therefore, it is not necessary to check after mounting, and a plurality of power elements can be mounted in a lump. In addition, it is possible to solder with other parts at the same time, and the mounting reliability is high, the workability is extremely good, and the cost is low, so that the power element mounting method can be realized.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例を示すパワー素子取付法説明
図である。
FIG. 1 is an explanatory view of a power element mounting method showing an embodiment of the present invention.

【図2】本発明の絶縁シート取付詳細図である。FIG. 2 is a detailed view of mounting an insulating sheet of the present invention.

【図3】本発明の押えバネ取付詳細図である。FIG. 3 is a detailed view of attachment of a presser spring of the present invention.

【図4】従来のパワー素子取付法の一実施例を示す説明
図である。
FIG. 4 is an explanatory diagram showing an example of a conventional power element mounting method.

【符号の説明】[Explanation of symbols]

1…基板、2…基板取付ネジ、3…押えバネ、4…押え
金具、5…押え金具取付ネジ、6…絶縁シート、7…放
熱フィン、8…パワー素子、9…ネジ穴、10…絶縁シ
ート、11…絶縁ワッシャ、12…ネジ、13…ネジ
穴。
1 ... Board, 2 ... Board mounting screw, 3 ... Holding spring, 4 ... Holding metal fitting, 5 ... Holding metal mounting screw, 6 ... Insulating sheet, 7 ... Radiating fin, 8 ... Power element, 9 ... Screw hole, 10 ... Insulation Sheet, 11 ... Insulation washer, 12 ... Screw, 13 ... Screw hole.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】パワー素子(8)を、放熱フィン(7)に
固定する方法に於いて、放熱フィンの突起(7a,7
b)に絶縁シートの切欠(6a,6b)を合わせてのせ
ると共に、あらかじめ基板に固定されたパワー素子
(8)を前記絶縁シート上にのせ、あらかじめ押えバネ
(3)が固定された、押え金具部組を、前記パワー素子
の上側(反絶縁シート側)より、押えバネの切り起し
(3b)が、パワー素子を押えこむ様にした事を特徴と
するパワー素子の固定方法。
1. A method of fixing a power element (8) to a radiation fin (7), the projections (7a, 7a) of the radiation fin.
(b) with the cutouts (6a, 6b) of the insulating sheet aligned, and the power element (8) previously fixed to the substrate is placed on the insulating sheet, and the pressing spring (3) is fixed in advance. A method of fixing a power element, characterized in that the metal part assembly is configured such that the cut-and-raised portion (3b) of the pressing spring presses the power element from above the power element (opposite to the insulating sheet).
JP5131653A 1993-06-02 1993-06-02 Power element fixing method Pending JPH06342989A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5131653A JPH06342989A (en) 1993-06-02 1993-06-02 Power element fixing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5131653A JPH06342989A (en) 1993-06-02 1993-06-02 Power element fixing method

Publications (1)

Publication Number Publication Date
JPH06342989A true JPH06342989A (en) 1994-12-13

Family

ID=15063089

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5131653A Pending JPH06342989A (en) 1993-06-02 1993-06-02 Power element fixing method

Country Status (1)

Country Link
JP (1) JPH06342989A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8077476B2 (en) 2007-09-12 2011-12-13 Denso Corporation Electronic device mounting structure
JP2014013884A (en) * 2012-06-07 2014-01-23 Toyota Industries Corp Semiconductor device
EP4362618A1 (en) * 2022-10-26 2024-05-01 MAHLE International GmbH Electronic control unit
WO2025083852A1 (en) * 2023-10-19 2025-04-24 三菱電機株式会社 Power conversion apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8077476B2 (en) 2007-09-12 2011-12-13 Denso Corporation Electronic device mounting structure
JP2014013884A (en) * 2012-06-07 2014-01-23 Toyota Industries Corp Semiconductor device
EP4362618A1 (en) * 2022-10-26 2024-05-01 MAHLE International GmbH Electronic control unit
WO2025083852A1 (en) * 2023-10-19 2025-04-24 三菱電機株式会社 Power conversion apparatus

Similar Documents

Publication Publication Date Title
US9698506B2 (en) Electric connection structure
JP2854785B2 (en) Semiconductor device and manufacturing method thereof
JPS601828B2 (en) Multiphase full wave rectifier assembly
JPH05259334A (en) Semiconductor device
JPH06342989A (en) Power element fixing method
CN114071874B (en) Circuit carrier arrangement and method for producing such a circuit carrier arrangement
JP4743536B2 (en) Semiconductor mounting structure
JPH08331865A (en) Inverter device
US7185425B2 (en) Method for connecting printed circuit boards
JPH09283682A (en) Composite semiconductor device
JPH0593075U (en) Mounting structure for electrical components
CN1233036C (en) Assebly of seiconductor radiator
JPH10209670A (en) Shield case
JP2546304Y2 (en) Device for fixing semiconductor elements
JP2003133681A (en) Fixture of semiconductor device and fixing structure thereof
JPH1065371A (en) Electric part attaching structure
JP2004179492A (en) Semiconductor device and its mounting body
JP3508521B2 (en) Power module terminal connector and terminal connection method
JP3076976U (en) Terminal block mounting structure
JP3534360B2 (en) Socket for electrical components
JPH113738A (en) Terminal block for surface mounting, surface mounting board, and power supply device using the same
JPS62282456A (en) Manufacture of hybrid ic
JP2000174196A (en) Semiconductor device
JP3016159U (en) Grounding structure of heat sink
JPH0539648Y2 (en)