JPH1145867A - Method and device for preparation of semiconductor wafer polishing jig - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prepare a semiconductor wafer polishing jig of a large diameter having no crease in a backing pad and no air reservoir between the backing pad and a polishing plate by a simple and short-time work. SOLUTION: In a method for preparing a semiconductor wafer polishing jig having a structure such that a backing pad for holding a semiconductor wafer is adhered to an abrasive plate, after an adhesive 2 is applied to a backing pad adhesive surface of an abrasive plate 1, a sheet-like elastic member 4a is caused to have a flat state without having sagging or stretching. While this state is maintained and while the elastic member 4a and the adhesive coating surface of the polishing plate 1 are maintained in parallel to each other, the elastic member 4a is made to make contact with the polishing plate 1 under pressures. Thus, a polishing jig is formed. As the elastic member 4a, for example, a plastic porous film having a large number of fine bubbles which are continued three-dimensionally and extend to both the upper and lower surfaces of the film is used.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing a jig for polishing a semiconductor wafer in which a backing pad for holding a semiconductor wafer is bonded to a polishing plate.

[0002]

2. Description of the Related Art Recently, as a mirror polishing (chemical mechanical polishing) apparatus for a semiconductor wafer, a silicon wafer, GaAs and a GaAs wafer are provided on one side of a backing pad held by a polishing plate.
Semiconductor wafers, such as wafers, which have been held by water application and polished by a waxless method, have been employed.

FIG. 11 shows a conventional example of a mirror polishing apparatus. The polishing apparatus 71 includes a plurality of semiconductor wafers W.
Is a batch-type polishing apparatus for polishing simultaneously, and includes a polishing load (head) 72, a template 73, and a surface plate 75. The template 73 is formed by laminating a polishing plate 76, a backing pad 77, and a template blank 78. Reference numeral 77a denotes a wafer holding surface of the backing pad 77, and reference numeral 78a denotes a plurality of circular through holes for wafer insertion formed in the template blank 58.

[0004] The backing pad 77 is a polishing plate 76.
To form a polishing jig, and the polishing jig is fixed to the polishing load 72 (head) by an appropriate fixing member. The template blank 78 is fixed to the backing pad 77, and the polishing pad 74 is fixed to the surface plate 75 with an adhesive. The present invention relates to a method and an apparatus for manufacturing a jig for polishing a semiconductor wafer having a structure in which a backing pad is bonded to a polishing plate as described above.

[0005] When the mirror polishing of the semiconductor wafer is performed by the above-mentioned polishing apparatus, as a preparation operation, the semiconductor wafer W is inserted into the circular through hole 78a of the template blank 78 and held on the wafer holding surface 77a of the backing pad 77 by water bonding. I do. Then, polishing load (head)
72 is lowered, the surface to be polished of the semiconductor wafer W is pressed against the polishing pad 74, and in this state, a polishing liquid containing fine abrasive grains is supplied, and the polishing load (head) 72 is applied to the polishing pad 74. The plurality of semiconductor wafers W are simultaneously mirror-polished while rotating and revolving.

[0006] Not only in the batch type polishing apparatus but also in the single wafer type polishing apparatus, in the jig for polishing a semiconductor wafer, the backing pad is adhered to the polishing plate in a wrinkle-free state. It is important that an air layer does not remain between the plates and that the plates are in close contact.

If these conditions are not satisfied at the same time, it has been difficult to obtain a mirror-polished wafer with high flatness. That is, even if the upper and lower surfaces of the unpolished wafer almost coincide with one plane, and the upper and lower surfaces are parallel to each other (the thickness is uniform and there is no warpage or the like), this state is maintained and the mirror surface is maintained. It was difficult to polish.

[0008]

Conventionally, when manufacturing a jig for polishing a semiconductor wafer having the above structure, a double-sided tape is adhered to the surface of a sheet-like backing pad, and a gap between the double-sided tape and the surface of the polishing plate is formed. The backing pad was adhered to the polishing plate while the air was manually expelled little by little.

However, recently, there has been a tendency to grind large-diameter wafers in a batch manner, and the diameter of the backing pad has been increased to, for example, about 500 mm to 1 m. For this reason,
In addition to performing sufficient degassing and adhering the backing pad material without wrinkling, not only skill is required, but also the operation becomes troublesome and takes time.

The present invention has been made in view of the above problems, and has as its object to provide a backing pad that has no wrinkles,
It is an object of the present invention to provide a method and an apparatus capable of easily manufacturing a large-diameter semiconductor wafer polishing jig having no air pocket between a backing pad and a polishing plate in a short time.

[0011]

A method of manufacturing a jig for polishing a semiconductor wafer according to the present invention is directed to a method of manufacturing a jig for polishing a semiconductor wafer having a structure in which a backing pad for holding a semiconductor wafer is bonded to a polishing plate. An adhesive is applied to the backing pad bonding surface of the polishing plate, and the backing pad sheet is given a suitable tension without any slack or elongation, and in a highly flat state,
In this state, the backing pad sheet is pressed against and adhered to the polishing plate while maintaining the backing pad sheet and the adhesive-coated surface of the polishing plate parallel to each other (claim 1).

In the above-described manufacturing method, for example, the following steps, ie, a step of uniformly applying an adhesive to a backing pad bonding surface of a polishing plate, a step of feeding a backing pad sheet from a raw roll of the backing pad sheet, and a feeding operation Backing pad sheet, a step of applying appropriate tension to the backing pad sheet without any slack or elongation, and maintaining a high flat state, and the surface of the backing pad sheet and the adhesive-coated surface of the polishing plate, Moving the at least one of them and gradually approaching them, keeping the backing pad sheet in pressure contact with the polishing plate and bonding the backing pad sheet to the polishing plate; and A jig for polishing a semiconductor wafer, comprising: The method is preferably (claim 2).

As the backing pad sheet, 3
It is preferable that the backing pad sheet is made of a porous body having a large number of fine air bubbles extending in the upper and lower surfaces of the backing pad sheet. As such a backing pad sheet, a porous film made of a polyurethane resin, a fluorine resin or a silicone resin is desirable (claim 4).

An apparatus for manufacturing a jig for polishing a semiconductor wafer according to the present invention is an apparatus for carrying out the above-described manufacturing method, comprising: a work rotating mechanism for holding a polishing plate in a horizontal direction and rotating at a high speed; A feeding mechanism for feeding the backing pad sheet from the anti-roll, a flattening mechanism for maintaining the fed backing pad sheet in a horizontally flat state without any slack or elongation, and a fed backing pad sheet A cutting mechanism that separates the backing pad from the raw material, and an adhesive dropping mechanism that can be freely moved toward and away from the center of the work holding part of the work rotating mechanism. A clamping member for clamping both ends in the length direction of an appropriate length portion of the sheet; and a pair of members directly above and directly in front of the work rotating mechanism. And a backing pad sheet pressing plate having a highly flat surface, and the pressing plate presses the backing pad sheet between the pair of clamp members downward. Item 5).

The work rotating mechanism includes a motor, a vertical rotating shaft rotated at a high speed by the motor, and a vacuum chuck provided at an upper end of the vertical rotating shaft for sucking a lower surface of a polishing plate and holding the polishing plate in a horizontal direction. The feeding mechanism and the flattening mechanism are vertically movable vertically by a first driving mechanism, and the backing pad sheet pressing plate maintains the backing pad sheet highly flat. It is preferable that the backing pad sheet is gradually lowered by the second drive mechanism while being pressed to press the backing pad sheet against the polishing plate on the vacuum chuck.

In this manufacturing apparatus, the work rotating mechanism is provided on a ring-shaped vacuum chuck provided at an upper end of the vertical rotation shaft, and is provided at an upper end of the vertical rotation shaft so as to be surrounded by the vacuum chuck. A polishing plate supporting member, the polishing plate supporting member is vertically movable by a third drive mechanism, and is capable of protruding and immersing in the vacuum chuck. A load / unload conveyor having a pair of holding members for holding the peripheral surface of the polishing plate facing each other freely,
It is desirable that the polishing plate can be moved and retreated directly above the polishing plate supporting member (claim 7).

The first, second or third drive mechanism is an air cylinder, and in the first and second air cylinders, the maximum value of the piston back pressure when the piston is advanced (descent) is set to a predetermined value. It is preferable to set to.

[0018]

Embodiments of the present invention will be described below with reference to the drawings. Embodiment 1 FIG. 1 is a schematic sectional view showing a method and an apparatus for manufacturing a jig for polishing a semiconductor wafer. FIG. 2 is a view taken along line AA of FIG. 1, and FIG. 3 is an enlarged view of a portion B of FIG. FIG. 4 is a sectional view taken along line CC of FIG. FIG. 5 is a schematic perspective view showing a polishing plate to which a sheet-like elastic member is adhered, and FIG. 6 is a cross-sectional view taken along line DD of FIG.

As shown in FIG. 1, a first air cylinder 51 is mounted on a portal frame 55, and a frame 56 is provided at the lower end of the piston rod of the first air cylinder 51. The second air cylinder 52 is attached to a lower central portion of the frame 56. On one side of the lower end of the frame 56,
A support member 10 for detachably and rotatably supporting the material roll 11 of the sheet-like elastic member (backing pad sheet) 4 is provided. In the vicinity of the support member 10 at the lower end of the frame 56, nip rollers 13 and 14, both of which are forcibly rotated by a drive mechanism (not shown), are provided so as to approach and separate from each other.

At the lower end of the frame 56, nip rollers 17a and 17b, both idle rollers, are provided so as to be able to approach and separate from each other.
To face. Support member 10 and nip roller 1
The nip rollers 17a and 17b are integrally formed along the lower end of the frame 56 by a driving mechanism and a running track (both not shown), while the nip rollers 17a and 17b are fixedly provided in the horizontal direction. 13 and 14, the nip rollers 17a, 1
The movable clamp 17 is constituted by 7b. In the movable clamp 17, the forward limit position and the retreat limit position are set to fixed positions. The nip rollers 13 and 14, the nip rollers 17a and 17b, the drive mechanism and the running track constitute a feeding mechanism for intermittently feeding the raw material, that is, the sheet-shaped elastic member 4 from the raw material roll 11 by a predetermined length. You.

Further, at the lower end of the piston load of the second air cylinder 52, a disc-shaped backing pad sheet pressing plate 15 (hereinafter, sometimes referred to as a pressing plate) is provided horizontally from the nip rollers 13, 14 in the horizontal direction. It is provided at a position separated by an appropriate distance and directly above and directly above the disk-shaped polishing plate 1. That is, just above the support member 16 that holds the polishing plate 1 in the horizontal direction, and facing the front directly,
The pressing plate 15 is provided so as to be vertically movable in the vertical direction. The upper surface of the polishing plate 1 and the pressing surface (lower surface) of the pressing plate 15 are finished to be flat and flat. The second air cylinder 52 is for raising and lowering the lower surface of the pressing plate 15 while keeping the lower surface along the horizontal direction. A second air cylinder 52,
The pressing plate 15, the nip rollers 13, 14, and the nip rollers 17a, 17b constitute a mechanism for tensioning the fed sheet-like elastic member 4 without any slack or elongation, that is, the flattening mechanism. You.

In the first air cylinder and the second air cylinder, the maximum value of the back pressure of the piston when the piston is advanced (in FIG. 1, when it is lowered) is set to a predetermined value. In this manner, for the first air cylinder, the pressing force when the backing pad sheet is pressed against the polishing plate by the pressing plate 15 can be controlled to a predetermined value. Further, the backing pad sheet can be maintained in this state as a highly flat state without any slack or elongation of the backing pad sheet by the pressing plate 15 with respect to the second air cylinder.

A method of manufacturing a jig for polishing a semiconductor wafer will be described in the order of steps with reference to FIGS. Note that the order of the following steps can be appropriately changed. For example,
(3) may be performed after (4). (1) The pressing plate 15 is made to stand by at an appropriate distance above the supporting member 16. (2) The polishing plate 1 is held in the horizontal direction by the support member 16 so that the upper surface of the polishing plate 1 and the lower surface of the pressing plate 15 face each other in front of and parallel to each other. (3) The adhesive 2 is applied to the upper surface of the polishing plate 1 by an appropriate method, for example, spin coating.

(4) The sheet-like elastic member 4 is
1 and the extended portion is located immediately below the pressing plate 15,
And, it is set directly above the polishing plate 1. First, the material roll 11 is rotatably supported by the support member 10, and the movable clamp 17 is moved to a predetermined position (forward limit position) near the nip rollers 13, 14. Then, the sheet-like elastic member 4 is manually drawn out and clamped by the nip rollers 13 and 14, and the nip rollers are rotated to draw out the sheet-like elastic member 4 as appropriate.
The extended sheet-like elastic member 4 is moved to a movable clamp 17.
Is clamped, and the sheet-like elastic member 4 between the nip rollers 13, 14 and the movable clamp 17 is set in a state where there is almost no slack. Next, the nip roller 13 is rotated by a predetermined number of revolutions to further extend the sheet-like elastic member 4 by an appropriate length (this length is made constant by each feeding operation), and the movable clamp 17 is moved to the position shown in FIG. (Retreat limit position). Thereby, the nip rollers 13, 1
4. The sheet-like elastic member 4 between the movable clamps 17 is slightly slackened.

(5) The pressing plate 15 is lowered by an appropriate distance by the second air cylinder 52, and the nip rollers 13, 14
-The elastic member 4 between the movable clamps 17 is tensioned without any slack or elongation. 1 to 3 show the state at this time. In this case, the second air cylinder 52
Since the maximum value of the piston back pressure at the time of piston advance (at the time of descent) is set to a predetermined value, the tension of the elastic member 4 does not become too large or too small, and therefore there is no slack or elongation. become. It should be noted that the length of the elastic member 4 between the nip rollers 13, 14 and the movable clamp 17 is slightly different in each feeding operation, but this difference in length is compensated by the second air cylinder 52. The tension of the elastic member 4 is set to a predetermined value.

(6) The frame 56 is gradually lowered by the first air cylinder 51, and finally the elastic member 4a is pressed between the pressing plate 15 and the polishing plate 1, whereby the elastic member 4a is attached to the polishing plate 1. It is pressed for a predetermined time to adhere. In this case, as apparent from the above description, the lowering of the frame 56 causes the material roll 11, the nip rollers 13 and 14, the movable clamp 17, and the second air cylinder 52.
And the pressing plate 15 is integrally lowered in the vertical direction. In addition, in each bonding operation, it is unavoidable that a slight difference occurs in the height of the pressing plate 15 at the start of the downward movement, and hence the distance between the pressing plate 15 and the polishing plate 1. Since the maximum value of the piston back pressure at the time of forward movement (at the time of descent) is set to a predetermined value, the elastic member 4a can be pressed with a constant pressing force in each bonding operation. Thus, the state of adhesion to the polishing plate can be made constant.

(7) The portion immediately after the nip rollers 13 and 14 of the elastic member 4 bonded by pressing is cut, and
6, a polishing plate 1 with an elastic member 4 is obtained. 4b shows a cut surface. (8) The flange-shaped elastic member 4c protruding from the outer peripheral end of the polishing plate 1 is cut off to obtain a jig for polishing a semiconductor wafer. Thereby, the sheet-like elastic member 4 becomes a backing pad for holding a semiconductor wafer.

In the pressure bonding step, since the elastic member 4 is not slackened or stretched as shown in FIG. 4, even if the backing pad has a large diameter, there is no wrinkle, and the backing pad and the polishing pad are not polished. The jig for polishing a semiconductor wafer, in which the plate 1 is in close contact with the entire surface and air does not accumulate therebetween, can be easily manufactured.

As the polishing plate 1, a known one, for example, one made of ceramics, glass, metal or the like can be adopted. Known methods can be employed for the method of applying the adhesive to the polishing plate, the type and thickness of the adhesive, and the like. As an adhesive application method, spin coating is preferable. As the adhesive, for example, “SC10 manufactured by Sony Bond”
8 "can be used.

Embodiment 2 FIG. 7 is a schematic sectional view showing a method and apparatus for manufacturing a jig for polishing a semiconductor wafer. FIG. 8 is a view taken along line EE of FIG. Since the structure and operation of the upper half of this device are the same as those of the manufacturing device of FIG. 1, the structure of the lower half member will be mainly described here. In FIG. 7, reference numeral 20 denotes a support member,
21 is a raw roll, 22 and 23 are nip rollers, 2
4 is a movable clamp, 25 is a pressing plate, and 27 is a film cutter.

As shown in FIG. 7, a work lifting / lowering / rotating mechanism 35 is provided which holds the polishing plate 1 in a horizontal direction (maintains the upper surface thereof in a horizontal direction) and raises / lowers and rotates at a high speed. This work lifting / lowering / rotating mechanism 35
A motor (not shown) and a vertical rotating shaft 36 which is rotated at high speed by a rotary joint 39 by the motor;
And a ring-shaped vacuum chuck (chuck table) 37 provided at the upper end of the vertical rotation shaft 36 in a horizontal direction.
Similarly, a third air cylinder 53 provided at the upper end of the vertical rotary shaft 36 and surrounded by the vacuum chuck 37, and a polishing device attached to the upper end of the piston rod of the third air cylinder 53 A push-up plate 40 for holding the plate is provided. This push-up plate 40
Allows the upper end to protrude above the vacuum chuck 37. A large number of vacuum suction holes (not shown) formed on the surface of the vacuum chuck 37 are connected to a vacuum pump 38 via a flow path formed on the rotating shaft 36. The rotating shaft 36 is provided with a brake (not shown).

Further, the polishing plate 1 is
A load / unload conveyor 31 for mounting on the suction surface of the vacuum chuck 37 is provided above the vacuum chuck 37 at a fixed height. As shown in FIG. 8, the conveyor 31 has a pair of holding members 3 for holding the peripheral surface of the polishing plate 1.
2, 33 are provided. Each of the holding members 32 and 33 is reciprocally movable in the horizontal direction (the left-right direction in FIG. 7) by an air cylinder (not shown).
2, 33 polishing plate sandwiching surfaces, that is, opposing tip surfaces,
As shown in FIG. 8, when the air cylinder is formed in an arcuate concave surface and the distance between them is minimized by the air cylinder, a substantially circular through-hole is formed from the opposite end surface, and the disk-shaped polishing plate 1 is formed. To be able to hold the peripheral surface. Further, the load / unload conveyor 31 is reciprocally movable in a direction perpendicular to the plane of FIG. 7 by a driving mechanism (not shown).

Further, an adhesive storing / dropping device 28 is provided above the vacuum chuck 37. The adhesive storing and dropping device 28 includes an arm 30 that is rotatable by a motor and a main body 29 provided at the tip of the arm 30. The main body 29 is composed of a liquid adhesive storage container and a fixed amount dropping mechanism, and can be freely moved toward and away from the center of the vacuum chuck 37 (directly above the plate push-up plate 40) by the rotation of the arm 30. Furthermore, immediately near the nip rollers 22 and 23,
A film cutter 27 for cutting the elastic member 4 is provided to be vertically movable and rotatable in a direction perpendicular to the plane of FIG.

Next, a method of manufacturing a polishing jig using the above-described apparatus will be described in the order of steps. Note that the order of the following steps can be appropriately changed. (1) The pressing plate 25 is made to stand by above the work elevating / rotating mechanism 35 at an appropriate distance. (2) In the same manner as in Embodiment 1, the sheet-like elastic member 4
From the material roll 21, and this extended portion is set immediately below the pressing plate 25. (3) The pressing plate 25 is lowered by an appropriate distance by the second air cylinder 52, and the elastic member 4 between the nip rollers 22, 23 and the movable clamp 24 is tensioned without any slack or elongation. FIG. 7 shows the state at this time. (4) The load / unload conveyor 31 is moved up / down
It is made to stand by at a polishing plate set / collection position, which is appropriately separated from the rotation mechanism 35. Here, an air cylinder (not shown) is operated to hold the polishing plate 1 to the holding members 32, 3.
3 (see FIG. 8). At this time, a concave portion 34 having a substantially circular shape in a bottom view is formed just below the polishing plate 1 by the opposing distal end surfaces of the holding members 32 and 33 (see FIG. 7). Next, the conveyor 31 is moved horizontally (moved in a direction perpendicular to the plane of FIG. 7) to position the conveyor 31 directly above the work lifting / lowering mechanism 35.

(5) By performing the following operation, the polishing plate 1
Is sucked by the vacuum chuck 37 in the horizontal direction. The plate push-up plate 40 is raised (projected above the vacuum chuck 37) by the third air cylinder 53, and inserted into the recess 34 formed by the sandwiching members 32, 33, so that the plate push-up plate 40 is polished. After being brought into contact with the lower surface of the polishing plate 1, the air cylinder (not shown) is operated to release the holding of the polishing plate 1 by the holding members 32 and 33. Thereby, the polishing plate 1 is transferred onto the plate push-up plate 40. The holding members 32, 3 are held by the air cylinder.
3 is sufficiently retracted, and then the plate push-up plate 40 is lowered by the third air cylinder 53 so that the vacuum chuck 37 is moved.
The polishing plate 1 is positioned below the vacuum chuck 3
7 and adsorbed by a vacuum pump 38.

(6) The adhesive is spin-coated on the upper surface of the polishing plate 1 by the following operation. After the main body 29 of the adhesive storing and dropping device 28 is positioned just above the center position of the polishing plate 1 by the rotation of the arm 30, a predetermined amount of the liquid adhesive is dropped on the upper surface of the polishing plate 1. Next, the polishing plate 1 is rotated at high speed (the vertical rotation shaft 36 is rotated) integrally with the vacuum chuck 37 by the motor. Thus, the adhesive is applied to the entire upper surface of the polishing plate 1 with a uniform thickness. (7) After leaving the main body 29, a backing pad is manufactured in the same manner as in the first embodiment. The frame 56 is gradually lowered by the first air cylinder 51, and finally the elastic member 4a is pressed between the pressing plate 25 and the polishing plate 1, so that the elastic member 4a is pressed against the polishing plate 1 for a predetermined time and adhered. Let it. Next, the portion immediately after the nip rollers 22 and 23 in the elastic member 4 that has been pressure-bonded is cut by a film cutter 27 to obtain the polishing plate 1 with the elastic member 4. Hereinafter, a jig for polishing a semiconductor wafer is obtained in the same manner as in the first embodiment.

[0037]

Next, examples of manufacturing a polishing jig according to the present invention and comparative examples will be described. Example 1 The apparatus shown in FIG. 7 was used as an apparatus for manufacturing a polishing jig. As the polishing plate, a disk made of ceramic and having a diameter of 565 mm and a thickness of 15 mm was used. As the (sheet-like) elastic member, a backing pad sheet (trade name: DF200) manufactured by Rodelnita was used.

This backing pad sheet has a large number of fine air bubbles, as schematically shown in FIG.
A multi-layer polyurethane resin film that is three-dimensionally communicated and extends on the upper and lower surfaces of the backing pad sheet, and has a thickness of 0.5 mm and a width of 665 mm (100 mm larger than the diameter of the polishing plate). . "SC108" manufactured by Sony Bond was used as the liquid adhesive. The adhesive coating thickness was 20 μm. Operations such as adhesive application were performed according to the above-described procedure.

As a result, wrinkles appear on the backing pad in appearance.
A large-diameter polishing jig without any air pockets could be produced. One of the reasons for obtaining such a polishing jig is that when the backing pad sheet is sandwiched between the pressing plate and the polishing plate, the gap between the backing pad sheet and the polishing plate (more precisely, the adhesive layer) is removed. It is conceivable that this air entered the inside of the backing pad sheet through the hole on the surface of the sheet and was finally discharged from the hole on the side surface of the sheet.

Comparative Example 1 An elastic member was manually bonded to a polishing plate according to a conventional method. The polishing plate, the elastic member, and the liquid adhesive were the same as in Example 1. In the apparatus shown in FIG. 7, a polishing plate is placed on a vacuum chuck 37 and fixed by suction.
The adhesive was spin-coated by the same method as in the above. Then
One worker grips one end in the longitudinal direction of the elastic member (FIG. 7).
Nip rollers 22 and 22), and another worker grasps the other end in the longitudinal direction (corresponding to clamping with the movable clamp 24 in FIG. 7). The elastic member is tensioned to a state where there is no slack or elongation, and the elastic member is gradually lowered in this state while maintaining the elastic member and the surface of the polishing plate almost parallel to each other to cover the entire surface of the polishing plate. I put it on. Then, a wide cylindrical roller was pressed and rolled on the elastic member by hand to obtain an external appearance of Example 1.
A polishing jig almost identical to the polishing jig according to the above was produced.

FIG. 9 is a schematic cross-sectional view showing a polishing apparatus 61 composed of the jig for polishing a semiconductor wafer obtained in Example 1 and holding a wafer by a waxless method of applying water. The overall structure of the polishing apparatus 61 is shown in FIG.
It is the same as that of No. 1. In FIG. 9, 62 is a polishing load,
63 is a template, 64 is a polishing pad, and 65 is a surface plate. The jig 66 for polishing a semiconductor wafer is a polishing plate 1
And a backing pad 67 made of the elastic member 4. 2a is an adhesive layer, and 68 is a template blank. FIG. 10 is a bottom view of the jig for polishing a semiconductor wafer obtained in Example 1, and shows a semiconductor wafer holding surface of the backing pad 69. A circle drawn by a dashed line indicates a state when a plurality of semiconductor wafers W are held.

The polishing jigs of Example 1 and Comparative Example 1 were individually fixed to the polishing load of the same mirror polishing apparatus, and a silicon wafer having a diameter of 200 mm and a thickness of 750 μm was held on a backing pad with water. Then, mirror polishing (5 wafers were simultaneously polished) was performed batchwise by a chemical mechanical polishing method. Polishing conditions were the same as usual conditions.

The flatness of the polished surface of the polished wafer obtained in Example 1 and Comparative Example 1 was evaluated by LTVmax. LTVmax (unit: μm) is 15 mm for wafer
The maximum value of the difference between the maximum value and the minimum value of the thickness in the cell when divided into cells of × 15 mm, that is, LTV (Local
Thickness Distribution). Table 1 shows the LTVmax measurement results obtained by a general-purpose thickness measuring instrument.

[0044]

[Table 1]

As is clear from Table 1, in Comparative Example 1, the variation in LTVmax between silicon wafers is large, and the average value of LTVmax is large.
In the first embodiment, conversely, the variation in LTVmax and the average value of LTVmax are small. As described above, by polishing a semiconductor wafer in a batch manner using the polishing jig manufactured according to the present invention, compared with the case of polishing using a polishing jig manufactured by a conventional manual operation. ,
It can be seen that a mirror-polished wafer having a high flatness and a uniform flatness between the wafers can be obtained.

[0046]

As is apparent from the above description, the method for manufacturing a jig for polishing a semiconductor wafer according to the present invention is characterized in that, when a sheet-like elastic member is bonded to a polishing plate, the elastic member is not loosened or stretched. Nervous without any, and
By gradually approaching the adhesive coating surface of the polishing plate relatively gradually while keeping the surface highly flat, the air in the opposing gap between the sheet-like elastic member and the adhesive coating surface of the polishing plate is deaerated. And a sheet-like elastic member is bonded to the polishing plate. Therefore, according to the present invention, a jig for polishing a semiconductor wafer having a large diameter without wrinkles on the backing pad and having no air between the backing pad and the polishing plate can be easily manufactured in a short time. . Therefore, a semiconductor wafer having a large diameter can be polished to a high degree of flatness by forming a mirror polishing apparatus for a semiconductor wafer with this polishing jig and polishing the wafer by a waxless method. Further, according to the apparatus for manufacturing a jig for polishing a semiconductor wafer according to the present invention,
The above-described manufacturing method can be accurately performed, and the polishing jig manufacturing operation can be easily automated.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing Embodiment 1 of the present invention.

FIG. 2 is a view taken along the line AA of FIG. 1;

FIG. 3 is an enlarged view of a portion B in FIG. 1;

FIG. 4 is a sectional view taken along line CC of FIG. 2 ;

FIG. 5 is a schematic perspective view showing a polishing plate to which a sheet-like elastic member is adhered.

FIG. 6 is a sectional view taken along line DD of FIG. 5;

FIG. 7 is a schematic sectional view showing a second embodiment of the present invention.

8 is a view taken in the direction of the arrows EE in FIG. 7;

FIG. 9 is a schematic sectional view showing a polishing apparatus constituted by the jig for polishing a semiconductor wafer obtained in Example 1 of the present invention.

FIG. 10 is a bottom view of the jig for polishing a semiconductor wafer obtained in Example 1 of the present invention, showing a semiconductor wafer holding surface of a backing pad.

FIG. 11 is a schematic sectional view showing a conventional example of a semiconductor wafer polishing apparatus using a waxless method.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Polishing plate 2 Adhesive 2a Adhesive layer 4, 4a Sheet-like elastic member (backing pad sheet) 4b Cut surface 4c Flange-like elastic member 5 Opposed gap 10 Support member 11 Raw material roll 13, 14 Nip roller 15 Backing pad sheet pressing plate Reference Signs List 16 support member 17 movable clamp 20 support member 21 material roll 22, 23 nip roller 24 movable clamp 25 backing pad pressing plate 27 film cutter 28 adhesive storage / dropping device 29 main body 30 arm 31 load / unload conveyor 32, 33 sandwiching Member 34 Recess 35 Work lifting / lowering / rotating mechanism 36 Vertical rotating shaft 37 Vacuum chuck (chuck table) 38 Vacuum pump 39 Rotary joint 40 Plate push-up plate 51 First air cylinder 52 Second air cylinder 53 Third d A cylinder 55, 56 Frame 61 Polishing device 62 Polishing load 63 Template 64 Polishing pad 65 Surface plate 66 Semiconductor wafer polishing jig 67 Backing pad 68 Template blank 69 Backing pad W Semiconductor wafer

Continuing on the front page (72) Inventor Shigeyoshi Netsu, Selangor, Malaysia, Section 27, Sementa Street 27/91, Lot 8, Lot 8 S.H.S.H. Sharam Sendilean Bhad (72) Invention Person Koichi Saito 1909-1 Gunma-cho, Gunma-gun, Gunma Prefecture Sanhan Hansen Engineering Co., Ltd. Engineering Division (72) Inventor Koji Morita 1909-1 Gunma-cho, Gunma-gun Gunma Gunma Prefecture Gunma Prefecture Sanmasan Hansan Kogyo Co., Ltd. Within the business division

Claims (8)

[Claims] In a method of manufacturing a jig for polishing a semiconductor wafer having a structure in which a backing pad for holding a semiconductor wafer is bonded to a polishing plate, an adhesive is applied to a backing pad bonding surface of the polishing plate, and the backing pad sheet is formed. By applying an appropriate tension thereto, there is no slack or elongation, and a highly flat state is maintained, and this state is maintained, and the backing pad sheet and the adhesive-coated surface of the polishing plate are maintained parallel to each other. A method for fabricating a jig for polishing a semiconductor wafer, wherein the backing pad sheet is pressed against and adhered to a polishing plate while being kept. 2. The method according to claim 1, wherein an adhesive is uniformly applied to a backing pad bonding surface of the polishing plate, and a step of feeding the backing pad sheet from a raw roll of the backing pad sheet. Backing pad sheet, a step of applying appropriate tension to the backing pad sheet without any slack or elongation, and maintaining a high flat state, and the surface of the backing pad sheet and the adhesive-coated surface of the polishing plate, Moving the at least one of them and gradually approaching them, keeping the backing pad sheet in pressure contact with the polishing plate and bonding the backing pad sheet to the polishing plate; and A method for producing a jig for polishing a semiconductor wafer, comprising a cutting step of separating. 3. The backing pad sheet according to claim 1, wherein the backing pad sheet is formed of a porous body having a large number of fine air bubbles that are three-dimensionally communicated and extend on upper and lower surfaces of the backing pad sheet. A method for manufacturing a jig for polishing a semiconductor wafer, comprising the steps of: 4. The method for producing a jig for polishing a semiconductor wafer according to claim 3, wherein the backing pad sheet is a porous film made of a polyurethane resin, a fluororesin, or a silicone resin. 5. An apparatus for carrying out the method for producing a jig for polishing a semiconductor wafer according to claim 2, wherein the polishing plate is held in a horizontal direction and is rotated at a high speed. And a feeding mechanism for feeding the backing pad sheet from the raw roll, and a flattening mechanism for maintaining the fed backing pad sheet without any slack or elongation and in a highly flat state in the horizontal direction. It is provided with a cutting mechanism for separating the backing pad sheet from the raw material, and an adhesive dropping mechanism that can be freely moved toward and away from the center of the work holding part of the work rotating mechanism, and the flattening mechanism is fed out. A clamp member for clamping both ends of the backing pad sheet in the length direction at an appropriate length, and directly above and directly in front of the work rotating mechanism. And a backing pad sheet pressing plate having a flat surface and a flat surface, and the pressing plate presses the backing pad sheet between the pair of clamp members downward. Wafer polishing jig manufacturing equipment. 6. The manufacturing apparatus according to claim 5, wherein the work rotating mechanism includes a motor, a vertical rotating shaft rotated at a high speed by the motor, and a lower surface of a polishing plate provided at an upper end of the vertical rotating shaft. A vacuum chuck for sucking and holding this in a horizontal direction, wherein the feeding mechanism and the flattening mechanism are vertically movable vertically by a first drive mechanism, and the backing pad sheet presses. The wafer is gradually lowered by a second driving mechanism while the backing pad sheet is kept highly flat, and the backing pad sheet is pressed against a polishing plate on the vacuum chuck. Jig manufacturing equipment. 7. The manufacturing apparatus according to claim 6, wherein the workpiece rotation mechanism includes a ring-shaped vacuum chuck provided at an upper end of the vertical rotation shaft, and a vacuum chuck provided at an upper end of the vertical rotation shaft. And a polishing plate supporting member provided so as to be surrounded by the vacuum chuck. The polishing plate supporting member is vertically movable by a third driving mechanism, and is capable of protruding and retracting with respect to the vacuum chuck. Yes,
Further, a load / unload conveyor having a pair of sandwiching members for sandwiching the peripheral surface of the polishing plate so as to be able to approach and separate from each other so as to freely move and retreat directly above the polishing plate support member. Characteristic equipment for manufacturing jigs for polishing semiconductor wafers. 8. The manufacturing apparatus according to claim 6, wherein the first, second, or third drive mechanism is an air cylinder, and the first and second air cylinders are configured to move the piston when the piston is moved forward. An apparatus for manufacturing a jig for polishing a semiconductor wafer, wherein the maximum value of the back pressure is set to a predetermined value.