JPH1148109A - ワークエッジの鏡面研磨方法及び装置 - Google Patents
ワークエッジの鏡面研磨方法及び装置Info
- Publication number
- JPH1148109A JPH1148109A JP26091797A JP26091797A JPH1148109A JP H1148109 A JPH1148109 A JP H1148109A JP 26091797 A JP26091797 A JP 26091797A JP 26091797 A JP26091797 A JP 26091797A JP H1148109 A JPH1148109 A JP H1148109A
- Authority
- JP
- Japan
- Prior art keywords
- work
- polishing
- drums
- edge
- holding means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 163
- 238000000034 method Methods 0.000 title claims description 11
- 230000002093 peripheral effect Effects 0.000 claims abstract description 12
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 238000003754 machining Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 11
- 230000005484 gravity Effects 0.000 description 4
- 238000010276 construction Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26091797A JPH1148109A (ja) | 1997-06-04 | 1997-09-09 | ワークエッジの鏡面研磨方法及び装置 |
| US09/148,609 US6159081A (en) | 1997-09-09 | 1998-09-04 | Method and apparatus for mirror-polishing of workpiece edges |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9-161880 | 1997-06-04 | ||
| JP16188097 | 1997-06-04 | ||
| JP26091797A JPH1148109A (ja) | 1997-06-04 | 1997-09-09 | ワークエッジの鏡面研磨方法及び装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1148109A true JPH1148109A (ja) | 1999-02-23 |
| JPH1148109A5 JPH1148109A5 (mo) | 2005-06-02 |
Family
ID=26487838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26091797A Pending JPH1148109A (ja) | 1997-06-04 | 1997-09-09 | ワークエッジの鏡面研磨方法及び装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1148109A (mo) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999043467A1 (fr) * | 1998-02-27 | 1999-09-02 | Speedfam Co., Ltd. | Dispositif de polissage de pourtour de piece a travailler |
| WO2001048802A1 (en) * | 1999-12-27 | 2001-07-05 | Shin-Etsu Handotai Co., Ltd. | Wafer for evaluating machinability of periphery of wafer and method for evaluating machinability of periphery of wafer |
| WO2004003987A1 (ja) * | 2002-06-26 | 2004-01-08 | Disco Corporation | コンタミネーション除去装置 |
| US6840841B2 (en) | 2002-01-15 | 2005-01-11 | Speedfam Co., Ltd. | Wafer edge polishing system |
| US7250365B2 (en) | 2001-04-17 | 2007-07-31 | Renesas Technology Corp. | Fabrication method of semiconductor integrated circuit device |
| WO2007149705A3 (en) * | 2006-06-22 | 2008-02-14 | 3M Innovative Properties Co | Apparatus and method for modifying an edge |
| JP2009027198A (ja) * | 2008-10-31 | 2009-02-05 | Renesas Technology Corp | 半導体集積回路装置の製造方法 |
| CN114571313A (zh) * | 2022-04-08 | 2022-06-03 | 广东石块链科技发展有限公司 | 一种石材磨边机压紧装置及其压紧方法、石材磨边机 |
-
1997
- 1997-09-09 JP JP26091797A patent/JPH1148109A/ja active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999043467A1 (fr) * | 1998-02-27 | 1999-09-02 | Speedfam Co., Ltd. | Dispositif de polissage de pourtour de piece a travailler |
| WO2001048802A1 (en) * | 1999-12-27 | 2001-07-05 | Shin-Etsu Handotai Co., Ltd. | Wafer for evaluating machinability of periphery of wafer and method for evaluating machinability of periphery of wafer |
| US7250365B2 (en) | 2001-04-17 | 2007-07-31 | Renesas Technology Corp. | Fabrication method of semiconductor integrated circuit device |
| US7718526B2 (en) | 2001-04-17 | 2010-05-18 | Renesas Technology Corporation | Fabrication method of semiconductor integrated circuit device |
| US7977234B2 (en) | 2001-04-17 | 2011-07-12 | Renesas Electronics Corporation | Fabrication method of semiconductor integrated circuit device |
| US6840841B2 (en) | 2002-01-15 | 2005-01-11 | Speedfam Co., Ltd. | Wafer edge polishing system |
| WO2004003987A1 (ja) * | 2002-06-26 | 2004-01-08 | Disco Corporation | コンタミネーション除去装置 |
| WO2007149705A3 (en) * | 2006-06-22 | 2008-02-14 | 3M Innovative Properties Co | Apparatus and method for modifying an edge |
| JP2009027198A (ja) * | 2008-10-31 | 2009-02-05 | Renesas Technology Corp | 半導体集積回路装置の製造方法 |
| CN114571313A (zh) * | 2022-04-08 | 2022-06-03 | 广东石块链科技发展有限公司 | 一种石材磨边机压紧装置及其压紧方法、石材磨边机 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040816 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040816 |
|
| A977 | Report on retrieval |
Effective date: 20060615 Free format text: JAPANESE INTERMEDIATE CODE: A971007 |
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| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060627 |
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| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20061024 |