JPH1148109A5 - - Google Patents

Info

Publication number
JPH1148109A5
JPH1148109A5 JP1997260917A JP26091797A JPH1148109A5 JP H1148109 A5 JPH1148109 A5 JP H1148109A5 JP 1997260917 A JP1997260917 A JP 1997260917A JP 26091797 A JP26091797 A JP 26091797A JP H1148109 A5 JPH1148109 A5 JP H1148109A5
Authority
JP
Japan
Prior art keywords
main part
enlarged view
work edge
polished state
polished
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997260917A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1148109A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP26091797A priority Critical patent/JPH1148109A/ja
Priority claimed from JP26091797A external-priority patent/JPH1148109A/ja
Priority to US09/148,609 priority patent/US6159081A/en
Publication of JPH1148109A publication Critical patent/JPH1148109A/ja
Publication of JPH1148109A5 publication Critical patent/JPH1148109A5/ja
Pending legal-status Critical Current

Links

JP26091797A 1997-06-04 1997-09-09 ワークエッジの鏡面研磨方法及び装置 Pending JPH1148109A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP26091797A JPH1148109A (ja) 1997-06-04 1997-09-09 ワークエッジの鏡面研磨方法及び装置
US09/148,609 US6159081A (en) 1997-09-09 1998-09-04 Method and apparatus for mirror-polishing of workpiece edges

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP16188097 1997-06-04
JP9-161880 1997-06-04
JP26091797A JPH1148109A (ja) 1997-06-04 1997-09-09 ワークエッジの鏡面研磨方法及び装置

Publications (2)

Publication Number Publication Date
JPH1148109A JPH1148109A (ja) 1999-02-23
JPH1148109A5 true JPH1148109A5 (da) 2005-06-02

Family

ID=26487838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26091797A Pending JPH1148109A (ja) 1997-06-04 1997-09-09 ワークエッジの鏡面研磨方法及び装置

Country Status (1)

Country Link
JP (1) JPH1148109A (da)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11245151A (ja) * 1998-02-27 1999-09-14 Speedfam Co Ltd ワークの外周研磨装置
US6722954B2 (en) * 1999-12-27 2004-04-20 Shin-Etsu Handotai Co., Ltd. Wafer for evaluating machinability of periphery of wafer and method for evaluating machinability of periphery of wafer
JP2002313757A (ja) 2001-04-17 2002-10-25 Hitachi Ltd 半導体集積回路装置の製造方法
JP2003209075A (ja) 2002-01-15 2003-07-25 Speedfam Co Ltd ウェハエッジ研磨システム及びウェハエッジ研磨制御方法
JP2004031674A (ja) * 2002-06-26 2004-01-29 Disco Abrasive Syst Ltd コンタミネーション除去装置
US20070298687A1 (en) * 2006-06-22 2007-12-27 3M Innovative Properties Company Apparatus and method for modifying an edge
JP2009027198A (ja) * 2008-10-31 2009-02-05 Renesas Technology Corp 半導体集積回路装置の製造方法
CN114571313A (zh) * 2022-04-08 2022-06-03 广东石块链科技发展有限公司 一种石材磨边机压紧装置及其压紧方法、石材磨边机

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