JPH1148663A - Method and device for manufacture of ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device and a method for manufacturing an IC card whose tight IC chip seal properties are outstanding with high degree of planeness. SOLUTION: This IC card manufacturing device is equipped with a transversely traveling receiving jig 140 which has a rough face-like surface with fine protrusions set close to each other and also has energy directors formed protruding, between which an IC chip-embedded thermoplastic resin plate is placed, and a horn 121 which impairs an ultrasonic vibration to the thermoplastic resin plate. In addition, a drilling screw 150 to be engaged with the receiving jig 140 is supported, in a horizontally rotatable manner, on a base 130 and at the same time, is allowed to engage with a gyratory drive means 170.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention belongs to the field of ultrasonic welding technology for applying ultrasonic vibration to a thin resin plate or the like for welding.

[0002]

2. Description of the Related Art Various inventions have heretofore been made for an IC card in which an IC chip is sealed in a resin sheet and a method for manufacturing the same.
No. 86375 (known example).

According to the invention of this known example, two resin sheets are formed with concave and convex portions to be engaged with each other, an energy director is protruded from the convex portions, and an IC chip is interposed between the resin sheets. It was arranged on a fixed support means, applied with ultrasonic vibration, and integrally welded.

[0004]

It is needless to say that an IC card can be easily manufactured by the above-mentioned known invention. However, since the resin sheet has a thin leaf shape and is welded only by the energy director, the welding process is performed. The ultrasonic energy at the time of welding may be reduced to cause partial welding failure, and the welding strength is not sufficient because the welding is performed not locally but locally, and the IC after the welding is completed.
Irregularities were formed on the card, and there was concern about the stability of its flatness.

In this type of IC card, it is needless to say that high capacity data processing capability is required, but data communication is performed by loading (inserting) it into external processing hardware. The quality required for the sealing property of the IC chip and the flatness of the external appearance of the IC card has been high.

A first problem to be solved by the present invention is to provide a manufacturing apparatus and a manufacturing method which have a high welding strength and do not cause unevenness on an IC card.

A second problem to be solved by the present invention is to provide a manufacturing apparatus and a manufacturing method capable of continuously manufacturing an IC card which does not generate bubbles in a welded portion and has excellent sealing properties. .

[0008]

Means for solving the above problems are as follows.

(1) IC in which an IC chip is sealed between resin plates
A card manufacturing apparatus, comprising: a horizontally movable receiving jig on which a plurality of thermoplastic resin plates having an IC chip interposed can be placed; and a horn capable of applying ultrasonic vibration to the thermoplastic resin plate. An IC card manufacturing apparatus, comprising: a ball screw that engages with the receiving jig; a ball screw that is horizontally supported on a base;

(2) At least one side surface of the plurality of thermoplastic resin plates is a rough surface having fine projections formed thereon. ,
The IC card manufacturing apparatus according to the above (1), wherein the IC card is manufactured by interposing an IC chip in the meantime.

(3) The IC card manufacturing apparatus according to (2), wherein the thermoplastic resin plate has an energy director protruding in an outer peripheral area thereof.

(4) An IC chip is sealed between resin plates to form an IC.
A method for manufacturing a card, comprising: mounting a plurality of thermoplastic resin plates on which an IC chip has been refurbished on a receiving jig; and superimposing the thermoplastic resin plate on the thermoplastic resin plate by a horn while pushing the receiving jig in a lateral direction. A method of manufacturing an IC card in which sonic vibration is applied.

(5) At least one side of the plurality of thermoplastic resin plates is a rough surface having fine projections formed thereon. ,
The method for manufacturing an IC card according to the above (4), wherein the IC card is manufactured by interposing an IC chip and mounting the IC chip on a receiving jig.

(6) The method of manufacturing an IC card according to (5), wherein the thermoplastic resin plate has an energy director protruding in an outer peripheral area thereof.

That is, according to each of the above means, the resin plate is continuously welded in a high quality state, and an IC card having excellent flatness can be efficiently provided.

[0016]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.
The card manufacturing apparatus 1 and a welding method thereof will be described.

(Embodiment 1) 1. Welding device 100 The welding device 100 shown in FIGS.
A pair of ultrasonic welding machines 120 having a horn 121 fixedly mounted thereon suspended vertically and a receiving jig 140 movably disposed on a base 130 by a guide 141 are provided. The jig 140 is supported on a ball screw 150 horizontally supported by support frames 131 and 132 of the base 130.

The ball screw 150 is connected to an AC servomotor 170 serving as a turning drive means via a coupling 160 so that the ball screw 150 can be turned.

2. Upper and lower resin plates S1, S for IC card
2 The welding process is performed by the welding apparatus 100, and the lower resin plates S1 and S2 are configured as follows.

That is, each of the upper and lower resin plates S 1 and S 2 has a rectangular shape having a thermoplastic property and a thickness of about 0.4 mm, and as shown in FIGS. The opposite surface is subjected to graining, and fine projections SA1, SA2
The pockets P1 and P2 for receiving the IC chip C are recessed.

The upper and lower resin plates S1 and S2 are preferably made of, for example, ABS resin, acrylic resin, polyethylene, polypropylene, polyester, or the like, but are not necessarily limited to the above-described materials. It goes without saying that any resin material may be used as long as it is easily softened by frictional heat due to vibration and has a property of being quickly solidified after stopping vibration.

3. Manufacturing Process of IC Card As shown in FIG. 7, the IC chips C are received in the pockets P1 and P2, and the lower resin plates S1 and S2 are sandwiched between the pockets P1 and P2. Are arranged on the receiving jig 140 so as to be in contact with each other.

Although detailed description is omitted, it is needless to say that it is desirable that the above-described steps be automatically or semi-automatically and sequentially performed by a factory automation system or the like.

Next, the horn 121 of the ultrasonic welding machine 120 is controlled to about 20 to 40 KHz by a control means (not shown).
The ultrasonic vibration of the ultrasonic frequency is generated, and the ultrasonic vibration is lowered and brought into contact with the upper resin plate S1 to apply ultrasonic vibration between the upper and lower resin plates S1 and S2.

At the same time, the AC servomotor 170 is started to drive the ball screw 150 to rotate, so that the propulsion speed is about 2
The lower resin plates S1 and S2 are propelled while being arranged on the upper surface thereof together with the receiving jig 140 at a very low speed of about cm / sec.

By the above process, the upper and lower resin plates S1, S
A relative displacement is induced between the two, and the protrusions SA1,
SA2 is heated by ultrasonic vibration in a state where it is in contact with each other, is softened and welded, but during this time, the upper and lower resin plates S1 are attached to the horn 121 by the receiving jig 140.
, S2 are propelled at a very low speed while holding the IC chip C therebetween, and are sequentially welded in a point contact manner so that the ultrasonic energy does not decrease and is stably supplied to the upper and lower resin plates S1, S2. The upper and lower resin plates S1 and S2 after natural cooling are not curved or uneven, and have a high flatness of about ± 0.002 mm. IC cards can be manufactured.

(Embodiment 2) FIG. 8 shows that the upper and lower resin plates S10 (S20) are different from the above and lower resin plates S1 and S2 in the second embodiment described below. As described above, in addition to the projections SA10 (SA20) having a rough surface, an energy director (ED) is protruded on one of the upper and lower resin plates S10 (S20), whereby the welding strength is further improved. An IC card having excellent sealing properties can be manufactured.

[0028]

According to the present invention described above, the following effects are exhibited.

The resin plate is a manufacturing apparatus and method in which the entire surface of the IC card is welded and the flatness of the completed IC card is excellent.

This is an apparatus and a method for continuously producing an IC card with high airtightness without generating bubbles in a welded portion.

[Brief description of the drawings]

FIG. 1 is a front view of a welding device according to a first embodiment of the present invention.

FIG. 2 is a side view of FIG. 1;

FIG. 3 is a rear view of an upper resin plate used in the present invention.

FIG. 4 is a transverse sectional view of FIG. 3;

FIG. 5 is a plan view of a lower resin plate used in the present invention.

FIG. 6 is a transverse sectional view of FIG. 5;

FIG. 7 is an explanatory view of a manufacturing process of the IC card of the present invention.

FIG. 8 is a partial cross-sectional view of the upper (lower) resin of the second embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC card manufacturing apparatus 100 Welding apparatus 120 Ultrasonic welding machine 121 Horn 130 Base 140 Jig 150 Ball screw 170 Rotation drive means (AC servomotor) S1, S2 Upper and lower resin plates SA1, SA2 Projection P1, P2 Pocket ED Energy director

Claims (6)

[Claims] An apparatus for manufacturing an IC card in which an IC chip is sealed between resin plates, comprising: a horizontally movable receiving jig on which a plurality of thermoplastic resin plates having an IC chip interposed can be placed; A horn capable of applying ultrasonic vibration to the thermoplastic resin plate, and a ball screw engaged with the receiving jig is horizontally supported on a base so as to be rotatable, and is linked to a rotation driving means. IC card manufacturing equipment. 2. The plurality of thermoplastic resin plates have at least one side surface as a rough surface having fine projections formed thereon, and each of the rough surfaces has a contact shape, 2. The IC card manufacturing apparatus according to claim 1, wherein the IC card is manufactured by interposing an IC chip therebetween. 3. The IC card manufacturing apparatus according to claim 2, wherein the thermoplastic resin plate has an energy director protruding in an outer peripheral area thereof. 4. A method of manufacturing an IC card by enclosing an IC chip between resin plates, wherein a plurality of thermoplastic resin plates having the IC chips remodeled are placed on a receiving jig, and the receiving jig is provided. A method for manufacturing an IC card, wherein ultrasonic waves are applied to the thermoplastic resin plate by a horn while the horn is propelled in a lateral direction. 5. The plurality of thermoplastic resin plates have at least one side surface formed as a rough surface having fine projections formed thereon, and each of the projections on the rough surface is in contact with each other. In the meantime, an IC chip is interposed and placed on a receiving jig.
The method for manufacturing an IC card according to claim 4, wherein the C card is manufactured. 6. The IC card manufacturing method according to claim 5, wherein the thermoplastic resin plate has an energy director protruding in an outer peripheral region thereof.