JPH115629A - Pick and place equipment for semiconductor device test handler system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pick-and-place apparatus for a semiconductor device test handler system capable of shortening a tack time by precisely deciding a semiconductor device while moving a semiconductor device from a customer tray to a test tray. provide. A frame (104), a movable plate (114) provided in the frame (104), and a movable plate (114)
A first cylinder 107 for raising and lowering the movable plate 114, a number of second cylinders 112 which are raised and lowered in accordance with the raising and lowering of the movable plate 114, and a number of second cylinders for picking up the semiconductor device under test 109 stored in the customer tray 110. Vacuum adsorber 111, alignment means for aligning the vacuum adsorber 111 for precise orientation of the semiconductor device picked up by the vacuum adsorber 111, and separated from the vacuum adsorber 111 by the alignment means A direction determining means for determining a direction of the semiconductor device.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pick-and-place apparatus for a semiconductor device test handler system, and more particularly to a semiconductor device for transferring a large number of semiconductor devices picked up from a customer tray to a test tray. Put the device in the right position with respect to the handler system, orienting
The present invention relates to a pick-and-place device of a semiconductor device test handler system that can reduce the test time of a semiconductor device.

[0002]

2. Description of the Related Art In the electronics industry, there is a demand for lower cost and smaller size of electronic components such as integrated circuits and semiconductor chips. One of the ways to increase the productivity and reduce the cost of such electronic components is to increase the test speed by simultaneously testing a large number of electronic components.

[0003] Handler systems are used to test such semiconductor devices. When a semiconductor device under test is tested in a semiconductor device test handler, a tray containing a large number of semiconductor devices is transferred in one unit. Here, a tray used when inputting / outputting a semiconductor device on the user side is called a customer tray, and a standard tray used in the handler is called a test tray. The semiconductor device to be measured is transported between the customer tray and the test tray when the semiconductor device to be measured is supplied and discharged.

FIG. 1 shows US Pat.
7, a test process of a semiconductor device performed by the handler system disclosed in US Pat. No. 7,011 is shown.

[0005] A customer tray containing semiconductor devices to be tested is loaded on a magazine, which is lifted by an elevator. The load catcher picks up the customer tray from the raised magazine and places it on a buffer. The customer tray is transferred from the buffer to a load stage, and the load pick and place apparatus picks up the semiconductor device stored in the customer tray.

A load pick and place apparatus supplies a semiconductor device to a precisor, which performs the precise orientation required for testing the semiconductor device. The semiconductor device correctly located by the presizer is picked up again by the load pick and place device and placed on the test tray. The test tray is transferred to a soak chamber, and the semiconductor device is inspected by a test head while passing through the soak chamber.

The test tray containing the tested semiconductor devices undergoes environmental adaptation through an unsoak chamber, and the semiconductor devices placed on the test tray are picked up by an unload pick-and-place apparatus. The unload pick-and-place apparatus is used to unload the semiconductor device to the
age) is placed on the customer tray loaded thereon, and the customer trays are classified according to the test results and loaded into the classification magazine. Through these processes, the semiconductor devices are tested and classified according to the test results.

However, in the conventional handler system as described above, the load pick-and-place apparatus goes through a process of precisely deciding a direction by a separate pressurizer before supplying the semiconductor device to the test tray. There is a problem that takes a long time.

More specifically, the load pick and place apparatus picks up the semiconductor device, positions the semiconductor device on the tester so as to accurately position the semiconductor device with respect to the test tray, and then picks up the semiconductor device again from the presizer. A number of steps are performed, such as accurately positioning a semiconductor device on a test tray. Therefore, there is a problem that a long tack time is required.

[0010]

SUMMARY OF THE INVENTION Accordingly, the present invention has been devised to solve the above-described problems, and its object is to pick up a semiconductor device from a customer tray and move the semiconductor device to a test tray. An object of the present invention is to provide a pick-and-place apparatus for a semiconductor device test handler system which can shorten the tack time by precisely determining the direction of a picked-up semiconductor device.

[0011]

SUMMARY OF THE INVENTION The object of the present invention is to connect a frame, a movable plate provided in the frame, an elevating cylinder for elevating the movable plate, and the movable plate. A large number of vacuum suction cylinders which are moved up and down in response to the movement of the movable plate, and a pickup for picking up a semiconductor device under test which is moved up and down by being connected to the vacuum suction machine cylinder and which is placed in a customer tray. A number of vacuum suction machines, alignment means for aligning the vacuum suction machines for precise orientation of semiconductor devices picked up by the vacuum suction machines, and the vacuum suction machines aligned by the alignment means and separated from the vacuum suction machines. A direction determining means for determining a direction of the semiconductor device. It is achieved by providing a pick-and-place device Dora system.

Preferably, the aligning means is connected to the vacuum suction machine, and is extended and contracted along a longitudinal direction thereof to change a distance between the vacuum suction machines, and extends and contracts the development section. A telescopic cylinder.

[0013] The deployment section includes a number of links connected in a zigzag fashion so as to be able to rotate relative to each other. The developing unit includes a roller that is accommodated in a groove formed in the movable plate, and the groove guides movement of the roller and the link when the developing unit expands and contracts.

On the other hand, the direction determining means is provided between the movable member, a pair of movable members provided slidably on the frame, each having a cam follower, a spring for pressing the movable members toward each other. A cam member having a cam surface with which the cam follower contacts, a direction determining cylinder connected to the cam member and moving the movable member by driving the cam member, and a movable member connected to the movable member. And a pair of rod members approached and separated from each other by the movement of the rod.

[0015] The pair of rod members are formed with a direction determining groove for receiving and determining the direction of the semiconductor device separated from the vacuum suction machine in a state where they are brought close to each other.

An inclined surface for guiding the semiconductor device into the direction determining groove is formed above the direction determining groove.

[0017]

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 2 is a perspective view of a pick-and-place apparatus of the semiconductor device test handler system according to the present invention, and FIG. 3 is a front view of FIG.

The pick-and-place apparatus 100 of the semiconductor device test handler system according to the present invention comprises:
It can be driven along an axis (horizontal direction) and a Y axis (vertical direction). An X-axis drive system (Y-axis drive system is not shown) for movement along the X-axis includes a guide rail 102 provided on an X-axis support table 101 and a guide block 103 moving along the guide rail 102. The guide block 103 is driven by an X-axis drive motor (not shown) connected thereto by a connecting member 106 and a timing belt (not shown). The X-axis support 101 is connected to a Y-axis drive system and is driven along the Y-axis, so that the pick and place device 100 is driven along the X-axis and the Y-axis.

A plate-like frame member (frame) 104 is provided below the connecting member 106, and an elevating cylinder 107 (hereinafter, referred to as a first cylinder) is provided on the front surface. A pair of side wall members 105 are provided on both sides of the frame member 104. Frame member 104
Of the piston rod 10 of the first cylinder 107
An incision 115 through which 7a penetrates is formed.

The piston rod 10 of the first cylinder 107
A bracket 116 is connected to a lower portion of 7a.
The bracket 116 is slidable along the piston rod 107a. A buffer spring 113 that elastically presses the bracket 116 toward the lower end of the piston rod 107a is disposed on the piston rod 107a. The buffer spring 113 absorbs a shock generated when the first cylinder 107 moves up and down.

Below the bracket 116, a pair of connecting rods 117 extend downward. Bracket 11
6 is connected by a connecting rod 117 to a movable plate 114 below it. Therefore, the movable plate 114 moves up and down by the operation of the first cylinder 107.
The side wall member 105 guides the movable plate 114 to move up and down.

Below the movable plate 114, a guide bar 127 having a guide rail 127a is provided at a predetermined distance from the movable plate 114. The movable plate 114 and the guide bar 127 are fixed to each other.
Thereby, the movable plate 1 is moved by the first cylinder 107.
When the 14 moves down, the guide bar 127 moves the movable plate 1
It descends with 14.

A lower plate 108 is provided below the pick-and-place device 100, and the lower plate 108 is provided with a number of positioning pins 130. The positioning pin 130 contacts the main body of the handler system when the lower plate 108 is lowered. When the positioning pin 130 comes into contact with the main body of the handler system, the lowering operation of the movable plate 114 by the first cylinder 107 is prevented. As a result, the pick-and-place apparatus 100 moves the semiconductor device 1 from the customer tray 110 disposed thereunder.
09 will stop exactly where it is suitable for picking up.

On the guide rail 127a formed on the guide bar 127, a large number of support members 118 are provided movably along the longitudinal direction of the guide rail 127a. The support member 118 is provided with a large number of vacuum suction machine elevating cylinders (vacuum suction machine cylinders) 112 (hereinafter, referred to as second cylinders). Therefore, the movable plate 11
When the guide bar 127 is moved up and down by moving up and down 4, the second cylinder 112 provided on the support member 118 is moved up and down.

The piston rod 11 of the second cylinder 112
A bracket 118a is connected to 2a, and a vacuum suction device 111 is fixed to the bracket 118a.
The bracket 118a is slidable along the piston rod 112a. The piston rod 112a is provided with a buffer spring 112b that elastically presses the bracket 118a toward the lower end of the piston rod 112a. The buffer spring 112b absorbs a shock generated when the second cylinder 112 moves up and down. The second cylinder 112 raises and lowers the bracket 118a to raise and lower the vacuum suction device 111. The vacuum suction device 111 suctions the semiconductor device 109 placed on the customer tray 110 while being lowered by the second cylinder 112.

As shown in FIGS. 4 and 5, the support members 118 are arranged alternately in front of and behind the pick-and-place apparatus 100. The upper part of the support member 118 is connected to the developing part 121 as shown in FIG. Deployment unit 121
Is disposed between the movable plate 114 and the guide bar 127.

The developing unit 121 is composed of a number of links 119. The link 119 is a link 1 having different ends.
19 and a connecting pin 120 are connected to each other in a zigzag manner so as to be rotatable relative to each other.
1 is configured. As a result, the deploying portion 121 can freely expand and contract along its longitudinal direction. The length of the deploying portion 121 is extended and contracted by a telescopic cylinder (telescopic cylinder) 122 (hereinafter, referred to as a third cylinder).

The expansion and contraction movement of the deploying portion 121 will be described more specifically with reference to the drawings. A connecting piece 124 is provided at the end of the piston rod 122 a of the third cylinder 122, and the connecting piece 124 is attached to the movable plate 114. It is connected to a pin 123 provided at an intermediate portion of the developing portion 121 through the formed long hole 125.

The support member 118 is connected to a fulcrum 120a where a link 119 constituting the deploying portion 121 intersects. The support members 118 are connected to each other by a tension spring 126, thereby preventing the unfolding portion 121 from swinging.

The developing portion 121 is connected to a pair of rollers 129 housed in a guide groove (groove) 128 formed in the lower part of the center of the movable plate 114. During the expansion and contraction movement of the developing unit 121, the rollers 129 are moved closer to or away from each other by the rotation of the link 119, and the movement of the rollers 129 is guided by the guide grooves 128. Thereby, the developing unit 121
Elongation and shrinkage are efficiently performed.

The piston rod 12 of the third cylinder 122
When 2a moves forward, the deploying section 121 is extended as shown in FIG. As a result, the support member 118 and the second cylinder 112 fixed to the support member 118 are connected to the guide bar 1.
27 are expanded so as to increase the distance between each other.
When the cylinder 112 is deployed, the vacuum adsorber 11
The spacing between the ones also widens.

When the piston rod 122a of the third cylinder 122 retreats with the support member 118 expanded, the expanding portion 121 is contracted as shown in FIG. As a result, the support members 118 are moved along the guide bars 127 so that the distance between the support members 118 is reduced, and the vacuum suction device 111 is moved.
The gap between them also becomes smaller.

The pick-and-place apparatus 100 of the semiconductor device test handler system according to the present invention includes a means for orienting a large number of semiconductor devices 109 picked up from the customer tray to the test tray.

As shown in the drawing, the direction determining means includes a pair of movable members 133, a direction determining cylinder 136,
It includes a cam member 134 and a presizer 138.

The movable member 133 is slidably provided along a guide rail 140 provided on the support plate 131.
Each movable member 133 has a cam follower 132.
The movable member 133 receives an elastic force in a direction approaching each other by a tension spring (spring) 141.

The direction determining cylinder 136 is fixed to the support plate 131. The piston rod 136a of the direction determining cylinder 136 and the cam member 134 are connected by a connecting member 150. Therefore, when the direction determination cylinder 136 operates, the cam member 134 moves up and down with respect to the support plate 131.

The cam member 134 has a cam surface 135 which comes into contact with a cam follower 132 provided on the movable member 133. When the cam member 134 moves up and down, the movable member 133 is moved.
Performs an opening and closing operation.

The presizer 138 is connected to the lower part of the movable member 133. A groove 139 is formed between the support plate 131 and the lower plate 108, and the presser 138 moves in the groove 139 in the horizontal direction when the movable member 133 moves horizontally.

As shown in FIG. 6, the pressurizer 138 includes a pair of rod members 138 in which a plurality of direction determining grooves 137 are formed.
a, 138b, and the direction determining groove 137 is formed at a position corresponding to the position of the vacuum suction device 111 deployed by the deployment section 121. The direction determining groove 137 has an inclined surface 142 inclined at a predetermined angle. The semiconductor device 109 is easily accommodated in the direction determining groove 137 by the inclined surface 142.

The cam surface 135 of the cam member 134 has an upper narrow portion and a lower wide portion.
When the thirty-eight bar members 138a and 138b approach each other, they have a size such that the semiconductor device 109 can be placed in the direction determining groove 137.

When the cam member 134 moves up and down by the operation of the direction determining cylinder 136, the movable member 133 reciprocates by the cam follower 132 and the tension spring 141 to alternately approach and separate from each other. The rod members 138a and 138b connected to the movable member 133 approach each other to a size that determines the direction of the semiconductor device 109 by the reciprocating motion of the movable member 133, or are separated from each other by a size through which the semiconductor device 109 passes.

The operation of the pick and place apparatus of the semiconductor device test handler system according to the present invention having the above-described configuration will be described below. First, in order to pick up the semiconductor device 109 stored in the customer tray 110, the first cylinder 107 operates to lower the movable plate 114. Thereby, the guide bar 127 and the lower plate 108 descend. The support member 11 provided on the guide bar 127
8 and second cylinder 112 fixed to support member 118
Also descends. Movable plate 1 by positioning pin 130
If the downward movement of the first cylinder 107 is stopped, the operation of the first cylinder 107 stops.

At this time, the developing unit 121 is provided with the vacuum suction device 111
The distance between the semiconductor devices 109 is shrunk so that the distance between them coincides with the distance between the semiconductor devices 109 stored in the customer tray 110.
In this state, the second cylinder 112 operates to lower the vacuum suction device 111 to the upper part of the semiconductor device 109.

The vacuum suction device 111 is connected to the semiconductor device 109
, The vacuum suction device 111 picks up the semiconductor device 109 stored in the customer tray 110, and the second cylinder 112 raises the vacuum suction device 111 picking up the semiconductor device 109. Then, the first cylinder 107 raises the movable plate 114 and raises the second cylinder 112.

As described above, when the semiconductor device 109 is picked up by the vacuum suction device 111 and rises to a predetermined position, the pick and place apparatus 100 moves to the test tray along the Y axis (vertical direction). While moving to the test tray, the third cylinder 122 extends the deploying portion 121 and deploys the support member 118 connected to the deploying portion 121. As a result, the vacuum suction devices 111 are moved so as to be separated from each other, and the plurality of semiconductor devices 109 picked up by the vacuum suction devices 111 respectively correspond to the plurality of direction determining grooves 137 formed in the presizer 138. It is arranged as follows.

Then, the direction determining cylinder 136 operates to lower the cam member 134. When the cam member 134 descends, the movable member 133 approaches each other by the tension spring 141, and the bar members 138a and 138b of the presser 138 connected to the lower portion of the movable member 133 also approach each other at a predetermined distance.

When the rod members 138a and 138b approach a predetermined distance, the vacuum suction device 111 stops the vacuum suction and blows out air, whereby the semiconductor device 109 is moved along the inclined surface 142 into the direction determining groove 137. Be dropped.
With this operation, the orientation of the large number of semiconductor devices 109 to be tested on the test tray is performed.

When the operation for determining the direction of the semiconductor device 109 is completed, the vacuum suction device 111 is lowered again by the operation of the second cylinder 112. The vacuum suction device 111 picks up the semiconductor device 109 mounted on the presizer 138 again by its vacuum force. When the semiconductor device 109 is picked up by the vacuum adsorber 111, the vacuum adsorber 111 moves up again by the operation of the second cylinder 112. When the pick and place device 100 moves to a predetermined position on the test tray, the vacuum suction device 111
The cylinder 112 is moved down to the test tray by the operation of the cylinder 112, and the semiconductor device 109 is placed on the test tray.

[0049]

As described above, according to the present invention, the orientation of the semiconductor device is completed in the pick-and-place apparatus while the pick-and-place apparatus transports the semiconductor device from the customer tray to the test tray. The tack time is reduced by about 20% compared to the conventional handler system.

Although the present invention has been shown and described with respect to a specific preferred embodiment, the present invention is not limited to the above-described embodiment, and does not depart from the gist of the present invention described in the claims. Anyone who has ordinary knowledge in the field to which he belongs can make various modifications.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a test process of a semiconductor device by a conventional handler system.

FIG. 2 is a perspective view of a pick and place device of the handler system according to the present invention.

FIG. 3 is a front view of FIG. 2;

FIG. 4 is a plan view showing an extended state of a deployment section of the pick and place device shown in FIG. 2;

FIG. 5 is a plan view showing a contracted state of a developing unit of the pick and place device shown in FIG. 2;

FIG. 6 is an enlarged perspective view of a presizer in the pick-and-place apparatus shown in FIG. 2, showing a semiconductor device arranged on the presizer.

[Explanation of symbols]

 REFERENCE SIGNS LIST 100 Pick-and-place device 101 X-axis support 102 Guide rail 103 Guide block 104 Frame member 106 Connecting member 107 Lifting cylinder 107a Piston rod 110 Customer tray 111 Vacuum suction machine 112 Vacuum suction machine lifting cylinder 114 Movable plate 116 Bracket 117 Connecting rod 119 Link 121 Expansion part 122 Telescopic cylinder 127 Guide bar 128 Guide groove 129 Roller 132 Cam follower 133 Movable member 134 Cam member 135 Cam surface 136 Orientation cylinder 137 Orientation groove 138a Rod member 138b Rod member 141 Tension spring 142 Slope

Claims (6)

[Claims] 1. A frame, a movable plate provided in the frame, an elevating cylinder for raising and lowering the movable plate, and a number of members connected to the movable plate and raised and lowered according to the elevation of the movable plate A number of vacuum suction machines for picking up semiconductor devices to be tested that are lifted and lowered by being connected to the vacuum suction machine cylinder and stored in a customer tray; and Alignment means for aligning the vacuum suction machine for precise orientation of the picked-up semiconductor device; and orientation means for orienting the semiconductor device aligned by the alignment means and separated from the vacuum suction machine. Pick-and-place for a handler system for semiconductor device testing, characterized by comprising: apparatus. 2. The aligning means includes: a developing unit connected to the vacuum suction machine and extending and contracting along a longitudinal direction thereof to change a distance between the vacuum suction machines; and a telescopic unit for expanding and contracting the developing unit. The pick-and-place apparatus for a semiconductor device test handler system according to claim 1, further comprising: a cylinder. 3. The semiconductor device test handler system according to claim 2, wherein the developing unit includes a plurality of links connected in a zigzag shape so as to be relatively rotatable with respect to each other. Place equipment. 4. The developing unit includes a roller that is accommodated in a groove formed in the movable plate, and the groove guides the movement of the roller and the link when the developing unit expands and contracts. The pick-and-place apparatus for a semiconductor device test handler system according to claim 3. 5. The apparatus according to claim 5, wherein the direction determining means is slidably provided on the frame and includes a pair of movable members each having a cam follower; a spring for pressing the movable members in a direction approaching each other; A cam member having a cam surface with which the cam follower contacts, a direction determining cylinder connected to the cam member and moving the movable member by driving the cam member, and a movable member connected to the movable member, A pair of rod members which are mutually approached and separated by the movement of the semiconductor device. The pair of rod members receive and orient the semiconductor device separated from the vacuum suction machine in a state where they are mutually approached. 2. The pick-and-place apparatus for a semiconductor device test handler system according to claim 1, wherein a direction determining groove is formed. . 6. The semiconductor device test according to claim 5, wherein an inclined surface for guiding the semiconductor device into the direction determining groove is formed above the direction determining groove. Pick-and-place device for a handler system.