JPH1158435A5 - - Google Patents

Info

Publication number
JPH1158435A5
JPH1158435A5 JP1997224720A JP22472097A JPH1158435A5 JP H1158435 A5 JPH1158435 A5 JP H1158435A5 JP 1997224720 A JP1997224720 A JP 1997224720A JP 22472097 A JP22472097 A JP 22472097A JP H1158435 A5 JPH1158435 A5 JP H1158435A5
Authority
JP
Japan
Prior art keywords
resin molding
pressing
cavity
resin
molding apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997224720A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1158435A (ja
JP3746357B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP22472097A priority Critical patent/JP3746357B2/ja
Priority claimed from JP22472097A external-priority patent/JP3746357B2/ja
Publication of JPH1158435A publication Critical patent/JPH1158435A/ja
Publication of JPH1158435A5 publication Critical patent/JPH1158435A5/ja
Application granted granted Critical
Publication of JP3746357B2 publication Critical patent/JP3746357B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP22472097A 1997-08-21 1997-08-21 樹脂モールド装置 Expired - Fee Related JP3746357B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22472097A JP3746357B2 (ja) 1997-08-21 1997-08-21 樹脂モールド装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22472097A JP3746357B2 (ja) 1997-08-21 1997-08-21 樹脂モールド装置

Publications (3)

Publication Number Publication Date
JPH1158435A JPH1158435A (ja) 1999-03-02
JPH1158435A5 true JPH1158435A5 (de) 2005-06-02
JP3746357B2 JP3746357B2 (ja) 2006-02-15

Family

ID=16818199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22472097A Expired - Fee Related JP3746357B2 (ja) 1997-08-21 1997-08-21 樹脂モールド装置

Country Status (1)

Country Link
JP (1) JP3746357B2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100533067B1 (ko) * 1999-12-16 2005-12-02 다이-이치 세이코 가부시키가이샤 수지봉지용 금형장치
JP4503391B2 (ja) * 2004-08-06 2010-07-14 株式会社ルネサステクノロジ 半導体装置の製造方法
JP4778751B2 (ja) * 2004-08-26 2011-09-21 アピックヤマダ株式会社 樹脂モールド金型
JP5325933B2 (ja) * 2004-08-26 2013-10-23 アピックヤマダ株式会社 樹脂モールド金型
NL2001818C2 (nl) * 2008-07-17 2010-01-19 Fico Bv Werkwijze voor het met een beheersbare sluitkracht omhullen van elektronische componenten.
KR101160887B1 (ko) 2010-02-25 2012-06-29 한미반도체 주식회사 압축 성형 장치 및 방법
JP5625673B2 (ja) * 2010-09-24 2014-11-19 日本電気株式会社 射出成形方法及び装置
JP6076117B2 (ja) * 2013-02-13 2017-02-08 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5777660B2 (ja) * 2013-05-17 2015-09-09 アサヒ・エンジニアリング株式会社 樹脂成形装置及び半導体装置の製造方法
CN108858999A (zh) * 2018-07-04 2018-11-23 芜湖万向新元环保科技有限公司 一种橡胶成型加工用防溢出装置
JP7068148B2 (ja) * 2018-12-05 2022-05-16 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP7803129B2 (ja) * 2021-12-28 2026-01-21 Ｉ－Ｐｅｘ株式会社 樹脂封止金型

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