JPH116100A - Plating jig - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plating jig easy in the manufacture for conveying a short-sized lead frame by which the lead frame is firmly held without being deformed or dropped at the time of being attached and detached or during being conveyed. SOLUTION: A roller 3 is attached to one end of a shaft 5 consisting of a conductive metal in this plating jig and a pressing plate 8 provided with a leaf spring 7 on one surface is attached to another end. A backplate 12 having a through-hole 9 corresponding to the leaf spring 7 and a supporting pin 11 corresponding to the pilot hole of the lead frame are attached to the other surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame for a semiconductor device, and more particularly to a plating jig used for applying a solder plating for an exterior to a short lead frame.

[0002]

2. Description of the Related Art Conventionally, a lead frame of this type is formed in such a manner that a plurality of lead frames of each unit are connected to each other in a short shape, and a semiconductor element is mounted on each of the lead frames of each unit, and a peripheral area is formed. After resin sealing,
Exterior solder plating is applied to the entire area of the lead frame that is not resin-sealed.

FIGS. 7 to 9 show a conventional example of a solder plating apparatus and a solder plating method. Short lead frame 1
Are respectively mounted on a plating jig 2 for transporting a lead frame, and are transferred to a loader section 4 of an automatic feeder provided in a plating apparatus (not shown) via a roller 3 provided on the plating jig 2. It is sequentially charged, and after that, according to a plating process as roughly shown in FIG. 7, each of the processing tanks of the plating apparatus is transferred by an automatic feeder, and each processing is performed.

In the plating jig 2 described above, as shown in FIGS. 8 and 9, a roller 3 is attached to one end of a shaft 5 made of a conductive metal, and the other end is provided with a roller 3. A total of four deformable wires 6 are attached to the upper and lower sides. As shown in FIG. 8, the tips of these wires 6 are formed in the shape of a key in the downward direction in the upper part and in the upward direction in the lower part. The configuration is such that the lead frame 1 is sandwiched and the lead frame 1 is held from above and below by the elastic force of each wire 6. Each wire 6 also plays a role of energizing the lead frame 1.

[0005]

However, in such a plating jig 2, when the lead frame 1 is attached to or detached from the plating jig 2, the mounting displacement of the lead frame 1 and the uneven elasticity of the wires 6 are reduced. As a result, the lead frame 1 was deformed. Also, if the elastic force of the wire 6 is too strong, the lead frame 1 will be deformed, so that the elastic force of the wire 6 must be set somewhat weaker. There has been a problem that the lead frame 1 easily falls from the plating jig 2 due to contact or vibration with each part of the processing tank or each processing during the plating process, particularly, jetting of high-pressure water in the deburring step.

Further, since the lead frame 1 is merely held by the wires 6 from above and below, there is no pressing in the longitudinal direction of the frame, so that the lead frame 1 may be displaced in the longitudinal direction of the frame during attachment / detachment or transport. is there. When such displacement occurs, especially when the lead frame 1 is transferred to a processing tank requiring positional accuracy such as a deburring step or a solder plating step, the displaced lead frame 1 comes into contact with each part of the processing tank. Was deformed or dropped, and further, the plating jig 2 was sometimes dropped from the transfer device.

Further, since the adjustment of the positioning of each wire 6 at the time of assembling the plating jig 2 requires a high level of specialized skills, it is difficult and time-consuming to manufacture the plating jig 2. Further, there is also a problem that it is impossible to cope with a change in the type and size of the lead frame 1 and there is no versatility. The present invention has been made in view of such circumstances, and provides a plating jig that can prevent deformation and dropping of a lead frame during attachment / detachment or transportation of the lead frame, can firmly hold the lead frame, and can be easily manufactured. The purpose is to do so.

[0008]

In order to achieve the above object, a plating jig according to the present invention has a roller attached to one end of a shaft made of a conductive metal, and a roller attached to the other end. Is mounted on one surface with a holding plate having a leaf spring, and on the other surface is mounted a back plate having a through hole corresponding to the leaf spring and a support pin corresponding to a pilot hole of the lead frame. It is a configuration that has been done.

Preferably, the pressing plate and the back plate have a vertically movable structure, and more preferably, the back plate has an opening.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a plating jig of the present invention will be described in detail with reference to the drawings. 1A and 1B are views showing a plating jig of the present invention, wherein FIG. 1A is a front view thereof, and FIG.
Is a rear view. The plating jig 2 has a shaft 5 made of copper square material.
A roller 3 made of a SUS material is attached to one end, and two leaf springs 7 are integrally formed on one surface of the other end of the SUS material. A holding plate 8 is attached. Here, the leaf spring 7 also has a role of energizing the lead frame 1, and a contact portion of the tip with the lead frame 1 is slash cut to improve electrical characteristics.

On the other surface, through-holes 9 provided at locations corresponding to the leaf springs 7 and support pins 11 made of SUS material provided at locations corresponding to the pilot holes 10 of the lead frame 1 are provided at two locations. A back plate 12 made of glass epoxy is attached. Note that the holding plate 8 and the back plate 12 are attached to the shaft 5 with two bolts 18.

Next, a method of using the plating jig will be described with reference to FIGS. First, a method of mounting the lead frame 1 on the plating jig 2 will be described. FIG. 2 (a)
As shown in (1), the plating jig 2 is aligned with the mounting table 14 having the pins 13 with the back plate 12 facing down. Here, the pin 13 is a through-hole 9 provided in the back plate of the plating jig 2.
It is formed to correspond to. The positioning of the plating jig 2 on the mounting table 14 is performed by the pins 13.

Next, as shown in FIG.
Is lowered, and the pins 13 provided on the mounting table 14 are inserted into the through holes 9 of the plating jig 2, and the plating jig 2 is pressed down from above sufficiently, so that the plate corresponding to the through holes 9 is formed. The spring 7 is pushed upward by the pin 13. In this state, as shown in FIG. 2C, the lead frame 1 is inserted between the leaf spring 7 of the plating jig 2 and the back plate 12, and the pilot hole 10 of the lead frame 1 is inserted into the support pin of the plating jig 2. 11 through.

Then, as shown in FIG. 2D, the plating jig 2 is moved upward in this state to
Is pulled out from the through hole 9, and as a result, the leaf spring 7 pushed up by the pin 13 is restored to its original state by its elastic force, and the lead frame 1 is held by the elastic force of the support pin 11 and the leaf spring 7. It will be.

Thereafter, the plating jig 2 is loaded into a loader unit 4 of a plating apparatus (not shown) as in the prior art, and is transferred to each plating tank according to each plating step roughly shown in FIG. After each processing is performed, it is collected by the unloader unit.

As described above, according to the plating jig of the present invention,
The lead frame 1 can be easily mounted on the plating jig 2 and the lead frame 1 can be firmly fixed without uneven elasticity.
Therefore, it is possible to prevent the lead frame 1 from dropping from the plating jig 2 due to deformation of the lead frame 1 or contact or vibration during transportation, which has occurred when the lead frame 1 is mounted on the jig.

Further, the pilot hole 10 of the lead frame 1 is
Since the support pins 11 are inserted through the lead frame 1, the lead frame 1 is not displaced in the longitudinal direction of the frame due to vibration during mounting or transport. Further, since the plating jig 2 has a simple structure, its manufacture is easy.

Next, a method for removing the lead frame from the plating jig will be described. As shown in FIG. 3 (a), the detachment table 15 is inclined in the direction in which the leaf spring 7 extends, and the plating jig 2 is detached with the back plate 12 turned upside down when mounted. Set to 15. Also,
A punch 16 having a pin 13 corresponding to the through hole 9 provided in the back plate 12 of the plating jig 2 is set above the detachment stand 15.

Next, as shown in FIG.
The punch 16 is lowered in a state where is set on the detachment table 15, and the pin 13 is inserted into the through hole 9. As a result, the leaf spring 7 corresponding to the through hole 9 of the plating jig is pushed down, and the lead frame 1 is released from the elastic force of the leaf spring 7. As a result, the lead frame 1 falls out of the support pins 11 and falls on the removal base 15.

Since the detachment table 15 is previously inclined in the direction of extension of the leaf spring 7 as described above, the lead frame 1 on the table slides down by its own weight as shown in FIG. 3 (c). , And 15
It is stored in a lead frame stocker (not shown) provided below.

According to such a method, even when the lead frame 1 is detached from the plating jig 2, the worker hardly touches the lead frame 1 directly.
As a result, deformation and the like of the lead frame 1 can be minimized, and it is also advantageous for automation.

Next, a second embodiment of the present invention will be described. The feature of the second embodiment of the present invention resides in that the holding plate 8 and the back plate 12 of the plating jig 2 have a structure that can be moved up and down. As shown in FIG. 4, when the shaft 5, the holding plate 8 and the back plate 12 are attached by bolts 18, the shaft 5 is provided with a long hole 19, and the bolt 5 is positioned at an arbitrary position in the long hole 19. Thus, the holding plate 8 and the back plate 12 can be vertically movable.

With such a structure, even if there is a change in the type or size of the lead frame 1, it is possible to quickly and easily respond to the change without changing the transport device.

The variable structure is not limited to the above-mentioned method. For example, as shown in FIG. 5, a shaft is manufactured by stacking two types of materials 5 and 5a having different diameters, and these materials are slid. If possible, the height of the holding plate 8 and the back plate 12 may be adjusted by setting an arbitrary location and then positioning the location with the positioning bolt 20 at the location.

Next, a third embodiment of the present invention will be described. A feature of the third embodiment of the present invention is that an opening 17 is provided in the back plate 12 as shown in FIG. With such a structure, when the plating jig 2 and the lead frame 1 are transferred to each processing tank, it is possible to prevent the removal of the liquid from each processing tank.

Although three openings 17 are provided in FIG. 6, the present invention is not limited to this.
The number of locations may be two, four, or the like. When the opening 17 is provided in the back plate 12 as described above, the through hole 9
May not be particularly provided. Further, the shape of the opening 17 is not limited to a square as shown in FIG. 6, but may be a circle, for example.

By the way, in the above-described embodiment, a copper square bar is used as the shaft 5 of the plating jig 2, but this is
Another conductive metal such as US material may be used, and the shape may be, for example, a column. In addition, although the SUS material is used as the material of the roller 3, the holding plate 8, and the support pin 11, it may be, for example, titanium. Furthermore, the holding plate 8 and the back plate 12 are attached to the shaft 5 by the bolts 18, but this may be performed by, for example, an adhesive, welding, or caulking.

Further, in the present embodiment, the leaf spring 7 is
And formed at two places in the holding plate 8,
In this case, the plate spring 7 may be formed separately from the holding plate 8, and the number thereof may be changed as appropriate to one, three, four, five, or six places depending on the size of the lead frame. It is. Further, the shape of the leaf spring 7 is not limited to the present embodiment, and can be appropriately changed within a range that does not hinder the support and energization of the lead frame. In this case, it goes without saying that the through holes 9 provided in the back plate 12 can be changed according to the change in the number of the leaf springs 7.

The material of the back plate 12 is not limited to the glass epoxy used in the present embodiment, but may be a metal material such as SUS or titanium. Further, the support pins 11 provided on the back plate 12 are also provided at one, three, four, five,
It can be changed as appropriate, for example, provided at six locations. In the present embodiment, the support pins 11 are provided in a fixed state. However, the support pins 11 may be formed in a variable shape so that they can be adjusted according to a change in the type or size of the lead frame 1.

Further, in the present embodiment, the inclination of the lead frame removing table 15 is set to the extending direction of the leaf spring 7, but it may be set to the orthogonal direction of the leaf spring 7. Since the lead frame 1 is usually mounted with the longitudinal direction orthogonal to the leaf spring 7, the lead frame 1 slides down in the longitudinal direction, so that the lead frame 1 can be stored in the stocker more smoothly. .

[0031]

As described above, according to the plating jig of the present invention, the lead frame can be easily attached to and detached from the plating jig, and the lead frame is firmly supported without uneven elasticity. Therefore, it is possible to prevent the lead frame from dropping from the plating jig due to the deformation of the lead frame, the contact during transportation, the vibration, and the like, which have conventionally occurred when the lead frame is attached to or detached from the plating jig.

Further, since the support pins are inserted into the pilot holes of the lead frame, the lead frame does not shift in the longitudinal direction of the frame due to vibrations during mounting and transport. Further, since the plating jig has a simple structure, its manufacture is easy.

Further, according to the second and third aspects of the present invention, it is possible to easily cope with a change in the type and size of the lead frame, and also to transfer the plating jig and the lead frame between the processing tanks. The removal of the processing liquid from each processing tank can be prevented.

[0034]

[Brief description of the drawings]

FIG. 1 is a view showing a plating jig of the present invention.

FIG. 2 is a view showing a method of mounting a lead frame on a plating jig according to the present invention.

FIG. 3 is a view showing a method of removing a lead frame from a plating jig according to the present invention.

FIG. 4 is a diagram showing another embodiment of the present invention.

FIG. 5 is a diagram showing another embodiment of the present invention.

FIG. 6 is a diagram showing another embodiment of the present invention.

FIG. 7 is a view schematically showing a plating step.

FIG. 8 is a diagram showing a method of mounting a lead frame on a conventional plating jig.

FIG. 9 is a view showing a conventional plating jig.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead frame 2 Plating jig 3 Roller 4 Loader part 5, 5a shaft 6 Wire 7 Leaf spring 8 Holding plate 9 Through hole 10 Pilot hole 11 Support pin 12 Back plate 13 Pin 14 Mounting stand 15 Removal table 16 Punch 17 Opening 18 Bolt 19 Long hole 20 Positioning bolt

Claims (3)

[Claims] A roller is attached to one end of a shaft made of a conductive metal, and a holding plate having a leaf spring is attached to one surface of the other end, and another is provided. A plating jig, wherein a back plate having a through hole corresponding to the leaf spring and a support pin corresponding to a pilot hole of a lead frame is attached to one surface. 2. The plating jig according to claim 1, wherein the holding plate and the back plate are vertically movable. 3. The plating jig according to claim 1, wherein said back plate is provided with an opening.