JPH1167802A - Molding equipment - Google Patents

Abstract

(57) Abstract: The present invention provides a molding apparatus for appropriately injecting a mold resin into a mold and appropriately sealing a semiconductor element with the mold resin. A molding apparatus sets a semiconductor element before molding in a cavity of a lower die, and
With the upper mold 11 and the lower mold 12 clamped, the mold resin 17 is injected into the cavity 13 from the gate 16. When the mold resin 17 is injected into the cavity 13, the ultrasonic vibrator 1 attached to the upper mold 11 is
4 and the ultrasonic vibrator 15 attached to the lower mold 12, and the upper mold 11 and the lower mold 12 are ultrasonically vibrated by the ultrasonic vibrator 14 and the ultrasonic vibrator 15, thereby forming a mold resin 17. To smooth the flow. As a result, the mold resin 17 is efficiently and appropriately injected into the cavity 13 to suppress the occurrence of unfilling and voids, and to improve the injection efficiency of the mold resin 17 and improve the molding performance. Can be.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molding apparatus, and more particularly, to a molding apparatus in which a mold resin is appropriately injected into a mold and a semiconductor element is sealed with the mold resin.

[0002]

2. Description of the Related Art Generally, a semiconductor element such as an IC or an LSI manufactured in a semiconductor device manufacturing process is resin-molded in a state where an IC chip, a wiring wire and the like are arranged on a lead frame.

Conventionally, in this molding, filling of a mold resin (sealing resin) into a mold is performed only by an injection pressure at the time of injecting the mold resin.

That is, in a conventional molding apparatus, as shown in FIG. 6, a mold 1 is fixed to a press machine 2, and molding is performed by injecting a mold resin into the pressed mold. The injection of the mold resin is performed only by the injection pressure.

[0005]

However, in such a conventional molding apparatus, the molding die is fixed to the press, and the molding resin is injected into the molding die only by the injection pressure. Because it was
There is a problem that molding resin is not filled in the mold, voids and the like occur, and molding defects occur.

That is, molding defects are not only sudden factors such as stains on a mold, stains on a material, deformation of a material, and the like. If the mold resin is injected into the mold only by the injection pressure, variations in molding parameters such as the mold temperature, injection speed, and injection pressure will also affect the mold resin. Cannot be properly filled with the mold resin, and molding defects occur.

Therefore, the invention according to claim 1 provides an ultrasonic vibration to the mold when the sealing material is injected into the mold, thereby smoothing the flow of the sealing material, and It is an object of the present invention to provide a molding apparatus capable of suppressing unfilling of a sealing material, generation of voids, and the like, and improving molding performance.

[0008]

According to a first aspect of the present invention, there is provided a molding apparatus for accommodating a pre-molded semiconductor element, such as an IC chip and a wiring wire, on a lead frame in a mold. In a molding apparatus for injecting a sealing material into the mold containing a semiconductor element and sealing the semiconductor element with the sealing material, when injecting the sealing material into the mold, The above object is achieved by applying a predetermined ultrasonic vibration to the mold.

According to the above configuration, when the sealing material is injected into the mold, ultrasonic vibration is applied to the mold, so that the flow of the sealing material is smooth and the sealing in the mold is performed. Unfilling of the stopper material, generation of voids, and the like can be suppressed, and molding performance can be improved.

[0010]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. It should be noted that the embodiments described below are preferred embodiments of the present invention, and therefore, various technically preferable limitations are added. However, the scope of the present invention is not limited to the following description. The embodiments are not limited to these embodiments unless otherwise specified.

FIGS. 1 to 3 are views showing an embodiment of a molding apparatus according to the present invention. FIG. 1 is a main part front view of a molding apparatus 10 to which an embodiment of the molding apparatus 10 of the present invention is applied.

Referring to FIG. 1, a molding apparatus 10 includes an upper mold 11 and a lower mold 12, and a cavity 13 having a predetermined shape is formed by the upper mold 11 and the lower mold 12. The upper mold 11 and the lower mold 12 are respectively provided with an ultrasonic vibrator 14,
15 are attached, and the ultrasonic vibrators 14, 15
Are connected to a drive unit (not shown). The ultrasonic vibrators 14 and 15 are energized from this drive unit,
Ultrasonic vibration and ultrasonic vibration of a predetermined frequency are transmitted to the upper mold 11
And the lower mold 12.

The molding device 10 is configured such that an unmolded semiconductor element in which an IC chip, a wiring wire and the like are arranged on a lead frame is set in a cavity 13 of a lower mold 12, and then the upper mold 11 and the lower mold With the mold 12 bonded, the mold resin (sealing material) 17 is removed from the gate 16 in FIG.
As shown by the middle arrow, it is injected into the cavity 13.

Next, the operation of the present embodiment will be described. The molding apparatus 10 is characterized in that the injection of the mold resin 17 is performed by applying ultrasonic vibration to the dies 11 and 12 to improve the injection efficiency.

That is, when the semiconductor device before molding in which an IC chip, wiring wires, and the like are arranged on a lead frame is set in the cavity 13 of the lower mold 12, the molding apparatus 10 The mold resin 17 is injected into the cavity 13 from the gate 16 with the lower mold 12 joined and the mold clamped. When the mold resin 17 is injected into the cavity 13, the drive unit supplies electricity to the ultrasonic vibrator 14 attached to the upper mold 11 and the ultrasonic vibrator 15 attached to the lower mold 12, and the ultrasonic vibration is applied. The device 14 and the ultrasonic vibrator 15 are ultrasonically vibrated. The upper mold 11 is ultrasonically vibrated by the vibration of the ultrasonic vibrator 14, and the lower mold 12 is ultrasonically vibrated by the ultrasonic vibrator 15.

When the upper mold 11 and the lower mold 12 are ultrasonically vibrated, the flow of the mold resin 17 is smoothed. As shown in FIG. 2, the mold resin 17 is moved to the upper mold 1 shown in FIG.
As compared with the case where no ultrasonic vibration is applied to the lower mold 1 and the lower mold 12, the injection into the cavity 13 can be performed more efficiently and appropriately. Therefore, it is possible to suppress unfilling of the mold resin 17 and generation of voids and the like in the cavity 13, thereby improving the injection efficiency of the mold resin 17, and performing smooth and uniform injection of the mold resin 17. it can.

Accordingly, the dies 11 and 12 are
The mold resin 17 is appropriately placed in the cavity 13 even when it is thin and wide horizontally as shown in FIGS. 5 (a) and 5 (b) or when it is thin and long vertically as shown in FIGS. 5 (a) and 5 (b). The mold can be appropriately formed into a thin, horizontally wide shape or a thin, vertically long shape which has conventionally been considered difficult to mold. 4 and 5
Here, the same reference numerals as in FIG. 1 are used.

Although the invention made by the inventor has been specifically described based on the preferred embodiments, the invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the invention. It goes without saying that it is possible.

[0019]

According to the molding apparatus of the first aspect of the present invention, when the sealing material is injected into the mold, ultrasonic vibration is applied to the mold, so that the flow of the sealing material is smooth. And then
Unfilling of the sealing material into the mold, generation of voids, and the like can be suppressed, and molding performance can be improved.

[Brief description of the drawings]

FIG. 1 is a front view of a main part of a molding apparatus to which an embodiment of a molding apparatus according to the present invention is applied.

FIG. 2 is a front sectional view of a mold in a state where a mold resin is injected into a cavity while applying the ultrasonic vibration of FIG. 1;

FIG. 3 is a front sectional view of a mold in FIG. 1 in which a mold resin is injected into a cavity without applying ultrasonic vibration.

FIG. 4 is a front sectional view (a) and a top view (b) of a mold having a thin and wide cavity.

FIG. 5 is a front sectional view (a) and a top view (b) of a mold having a thin and vertically long cavity.

FIG. 6 is a schematic front view of a conventional molding apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Molding apparatus 11 Upper mold 12 Lower mold 13 Cavity 14, 15 Ultrasonic vibrator 16 Gate 17 Mold resin

Claims (1)

[Claims] An unmolded semiconductor element provided with an IC chip and wiring for wiring on a lead frame is housed in a mold, and a sealing material is placed in the mold in which the semiconductor element is housed. In a molding apparatus for injecting and sealing the semiconductor element with the sealing material, when the sealing material is injected into the mold, a predetermined ultrasonic vibration is applied to the mold. Molding equipment.