JPH1168366A - Electronic circuit package - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To improve the mounting density without lowering the heat radiation effect. A motherboard (1) and the motherboard (1)
A plurality of sub-boards 2 mounted vertically, a semiconductor device 4 mounted on one side of the sub-board 2, a radiating fin 5 provided on the other side of the sub-board 2, An electronic circuit package having an electric fan 6 for cooling the semiconductor device 4, wherein a curved blade 52 is formed on the heat radiation fin 5 from the upper part to the left and right side surfaces, and the electric fan 6 sends air from the upper part of the heat radiation fin 5. .

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit package which can be mounted at a high density by improving a heat radiation structure.

[0002]

2. Description of the Related Art FIG. 4 shows the structure of a conventional electronic circuit package having a heat dissipation structure. 1 is a motherboard (main printed wiring board) mounted on a card slot, 2 is a sub-board (sub-printed wiring board) which is vertically mounted on the motherboard 1 by a connector 3 and 4 is a sub-board 2
Is a semiconductor device such as a VLSI mounted on one side. The sub-board 2 is a small board having unit functions in consideration of expandability and the like. Reference numeral 8 denotes a radiating fin for receiving heat generated in the semiconductor device 4 through the sub-board 2 and dissipating heat, and an electric fan 9 is integrated therewith.

In this conventional heat radiating structure, the electric fan 9 sucks air from the back and hits the heat radiating fins 8 to cool the heat radiating fins 8 and thus the semiconductor device 4. This system is characterized in that it can be expanded from a small scale to a large scale with a small sub board, and the cooling function is relatively high.

[0004]

However, since the conventional structure has a structure in which air is sucked from a direction perpendicular to the surface of the sub-board 2, the separation pitch P 'between the adjacent sub-boards 2 is increased. However, there is a problem from the viewpoint of high-density mounting.

The present invention has been made in view of the above points, and an object of the present invention is to make it possible to reduce the pitch at which sub-boards are separated, thereby improving the mounting density without impairing the cooling effect. It is an object of the present invention to provide an electronic circuit package.

[0006]

According to a first aspect of the invention, there is provided a motherboard, a plurality of sub-boards mounted vertically on the motherboard, and a radiating fin provided on one side of each of the sub-boards. An electronic circuit package having the other surface of the sub-board or a semiconductor device mounted on the radiating fin, wherein the radiating fin is provided with a blade that curves from the opposite side to the side surface of the motherboard, On the opposite side, a blowing means for forcibly sending air is arranged. According to a second aspect of the present invention, in the first aspect, the air blowing means is individually provided on a side of the heat radiation fin of each of the sub boards opposite to the mother board.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION

[First Embodiment] FIG. 1 is a diagram showing a configuration of an electronic circuit package according to a first embodiment of the present invention. The same components as those shown in FIG. 4 are denoted by the same reference numerals. Reference numeral 5 denotes a radiation fin provided on the surface of the sub-board 2 opposite to the surface on which the semiconductor device 4 is mounted. The radiation fins 5 are shown in FIG.
As shown in (b), a plurality of blades 52 are formed on the left half so as to form a plurality of curved air passages 51 from the upper side to the left side, and the right half also has a curved air passage from the upper side to the right side. A plurality of blades 5 are formed such that a plurality of blades 51 are formed.
2 is formed, and the electric fan 6 is mounted on the upper portion.
The number of the blades 52 may be one of the left side and the right side.

The semiconductor device may be directly mounted on the radiation fin 5 by being positioned at the opening of the sub-board 2 'provided with the opening as shown by reference numeral 4'. In this case, the heat generated in the semiconductor device 4 'is directly transmitted to the radiating fins 5, and the radiating effect is increased.

As a result, the air blown by the electric fan 6 flows from the upper portion of the radiating fin 5 along the air passage 51 to cool the radiating fin 5 and is discharged from the left and right side surfaces. At this time, the semiconductor devices 4, 4 'mounted on the adjacent sub-board 2 are also cooled.

As described above, in this embodiment, the air intake side is the upper part of the radiating fins 5 and the exhaust side is the left and right side surfaces. Therefore, it is necessary to provide a special space on the back of the radiating fins 5. Disappears. For this reason, the separation pitch P between the adjacent sub-boards 2 can be reduced to the limit (to the extent that no contact occurs), and the mounting density can be increased.

[Second Embodiment] FIG. 3 is a diagram showing a configuration of an electronic circuit package according to a second embodiment. Here, an electric fan for cooling each radiating fin 5 and each semiconductor device 4, 4 ′ is a large common electric fan 7, and this electric fan 7 simultaneously connects each radiating fin 5 and each semiconductor device 4, 4 ′. It is designed to cool all at once. Other configurations are the same as those shown in FIGS.

[0012]

As described above, according to the electronic circuit package of the present invention, the separation pitch of the sub-boards can be reduced without lowering the heat radiation efficiency, the mounting density can be improved, and the size can be further reduced. Will be possible.

[Brief description of the drawings]

FIG. 1 is a side view of an electronic circuit package according to a first embodiment.

FIG. 2 is a view showing a radiation fin according to the embodiment;
(A) is a side view, (b) is a front view.

FIG. 3 is a side view of an electronic circuit package according to a second embodiment.

FIG. 4 is a side view of a conventional electronic circuit package.

[Explanation of symbols]

1: mother board, 2 ', sub board, 3: connector, 4, 4': semiconductor device, 5: radiating fin, 6, 7:
Electric fan, 8: radiation fin, 9: electric fan.

Claims (2)

[Claims] 1. A motherboard, a plurality of sub-boards mounted vertically on the motherboard, radiating fins provided on one side of each of the sub-boards, and a semiconductor device mounted on the other side of the sub-board or on the radiating fins. An electronic circuit package having: a fin that is curved from the side opposite to the motherboard to the side surface of the radiating fin; and a blowing unit that forcibly sends air to the side of the radiating fin opposite to the motherboard. Electronic circuit package featuring. 2. The electronic circuit package according to claim 1, wherein said air blowing means is individually provided on a side of said heat radiation fin of each of said sub-boards opposite to said mother board.