JPH1177687A - Resin molded electronic component and method of manufacturing the same - Google Patents
Resin molded electronic component and method of manufacturing the sameInfo
- Publication number
- JPH1177687A JPH1177687A JP9245141A JP24514197A JPH1177687A JP H1177687 A JPH1177687 A JP H1177687A JP 9245141 A JP9245141 A JP 9245141A JP 24514197 A JP24514197 A JP 24514197A JP H1177687 A JPH1177687 A JP H1177687A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- metal terminal
- mold
- metal
- piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
(57)【要約】
【課題】組立作業性がよく、且つ、樹脂内部で金属端子
の変形がない樹脂成形型電子部品を提供する。
【解決手段】金属端子3は予め金型を用いて樹脂駒1に
固着され、図示されていない本成形する金型に金属端子
3が固着された樹脂駒1をセットし樹脂駒1の一部が露
出するように樹脂成形する。この樹脂駒1により、金属
端子3が注型圧力で変形することが防止される。
[PROBLEMS] To provide a resin-molded electronic component having good assembling workability and having no deformation of metal terminals inside the resin. A metal terminal (3) is fixed to a resin piece (1) using a mold in advance, and a resin piece (1) with the metal terminal (3) fixed to a metal mold (not shown) is formed by forming a part of the resin piece (1). Is molded so that is exposed. The resin piece 1 prevents the metal terminal 3 from being deformed by casting pressure.
Description
【0001】[0001]
【発明の属する技術分野】この発明は、筐体から外部に
導出される複数個の制御信号用金属端子を有するパワー
モジュールやインテリジェントパワーモジュール(以
下、IPMと称する)などの半導体装置および複数個の
金属端子を有するケースやコネクタなど、樹脂成形型電
子部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device such as a power module or an intelligent power module (hereinafter, referred to as IPM) having a plurality of control signal metal terminals led out of a housing and a plurality of such devices. The present invention relates to a resin-molded electronic component such as a case or a connector having metal terminals.
【0002】[0002]
【従来の技術】複数個の制御信号用金属端子を有するパ
ワーモジュールやIPMなどの半導体装置および複数個
の金属端子を有するケースやコネクタなど、樹脂成形さ
れた電子部品において、従来用いられている構造を図7
に示す。同図7(a)は全体斜視図、同図7(b)は信
号用金属端子部の部分拡大断面図である。金属端子23
は1本毎に樹脂ケース25の樹脂部24へ挿入され、熱
硬化性のエポキシ樹脂等で固定される。2. Description of the Related Art Structures conventionally used in resin-molded electronic components such as power modules having a plurality of metal terminals for control signals, semiconductor devices such as IPMs, and cases and connectors having a plurality of metal terminals. Figure 7
Shown in FIG. 7A is an overall perspective view, and FIG. 7B is a partially enlarged sectional view of a signal metal terminal portion. Metal terminal 23
Are inserted one by one into the resin portion 24 of the resin case 25 and fixed with a thermosetting epoxy resin or the like.
【0003】図8は、従来の成形された樹脂部と金属端
子を示しており、同図(a)は平面図、同図(b)は同
図(a)を矢印A方向から見た側面図である。この金属
端子43はIPM等の信号用金属端子部分をモデル化し
た図である。図8において、金属端子43は本成形時に
A部、B部で図示されていない金型に固定されるが、矢
印Fで示す金型に流入する樹脂(例えばPPS:Poly P
henyrene Sulfide ポリフェニレンサルファイト、PB
T:Poly Butylene Terephthalate ポリブチレン テレ
フタレートなど)の圧力(成形樹脂の注型圧力)によ
り、金属端子43は樹脂部44内のE部で曲げられてし
まう。この場合、樹脂より突出している外側部分の金属
端子は点線(43a)のように成形樹脂の注型時変形し
ない。しかし、その後、樹脂が硬化し、金型から取り出
された時に、金属端子43はスプリングバック(ばね作
用で戻ること)により、外側も斜めに曲がってしまう。FIG. 8 shows a conventional molded resin portion and a metal terminal. FIG. 8 (a) is a plan view, and FIG. 8 (b) is a side view of FIG. FIG. The metal terminal 43 is a model of a signal metal terminal portion such as an IPM. In FIG. 8, the metal terminal 43 is fixed to a mold (not shown) at the portions A and B at the time of the main molding, but the resin (for example, PPS: Poly P:
henyrene Sulfide polyphenylene sulfite, PB
Due to the pressure of T (Poly Butylene Terephthalate or the like) (the casting pressure of the molding resin), the metal terminal 43 is bent at the E portion in the resin portion 44. In this case, the metal terminal of the outer portion protruding from the resin does not deform when the molding resin is cast as indicated by a dotted line (43a). However, after that, when the resin hardens and is taken out of the mold, the outside of the metal terminal 43 also bends obliquely due to spring back (return by a spring action).
【0004】図9は樹脂部で、変形量の大きい金属端子
部分を示した断面図である。樹脂の注型圧力により、金
属端子53が樹脂部54の内部で大きく変形して、金属
端子53同志が接触して短絡状態となっている。このよ
うに熱硬化性のエポキシ樹脂などで金属端子53が固定
される構造のものでは、樹脂の注型圧力で金属端子53
が曲がらないようにするために、位置決めの専用の固定
の治具が必要となり、組立作業性がよくない。FIG. 9 is a cross-sectional view showing a metal terminal portion having a large deformation amount in a resin portion. Due to the casting pressure of the resin, the metal terminals 53 are greatly deformed inside the resin portion 54, and the metal terminals 53 come into contact with each other to be in a short circuit state. In the case of such a structure in which the metal terminal 53 is fixed with a thermosetting epoxy resin or the like, the metal terminal 53 is fixed by the casting pressure of the resin.
In order not to bend, a dedicated fixing jig for positioning is required, and the assembling workability is not good.
【0005】[0005]
【発明が解決しようとする課題】前記のように、従来の
樹脂成形では、樹脂内部で金属端子が注型圧力により変
形する。この変形を抑えようとすると、金属端子の位置
決めのための治具が必要になり、治具を使った位置決め
は作業性が悪いという不具合があった。この発明の目的
は、前記の課題を解決して、組立作業性がよく、且つ、
樹脂内部で金属端子の変形がない樹脂成形型電子部品を
提供することにある。As described above, in the conventional resin molding, the metal terminal is deformed by the casting pressure inside the resin. In order to suppress this deformation, a jig for positioning the metal terminal is required, and positioning using the jig has a disadvantage that workability is poor. SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems, to improve the assembly workability, and
An object of the present invention is to provide a resin-molded electronic component in which a metal terminal is not deformed inside a resin.
【0006】[0006]
【課題を解決するための手段】前記の目的を達成するた
めに、金型に樹脂が注型されて樹脂成形された金属端子
を有する電子部品において、前記金属端子が支持体と該
支持体を覆う樹脂とで支持されている構成とする。前記
支持体の少なくとも一部が前記樹脂より露出していると
よい。また支持体で支持された金属端子を金型に入れ、
前記金型の一部に支持体の一部を嵌合させた上で樹脂を
注型することよい。さらに複数の金属端子が金型内に設
けられた該金型の複数の凸部に嵌め入まれて支持され、
樹脂が注型されるとよい。In order to achieve the above-mentioned object, in an electronic component having a metal terminal formed by molding a resin by casting a resin into a mold, the metal terminal forms a support and the support. It is configured to be supported by the covering resin. It is preferable that at least a part of the support is exposed from the resin. In addition, put the metal terminal supported by the support into the mold,
The resin may be cast after a part of the support is fitted to a part of the mold. Further, a plurality of metal terminals are supported by being fitted into a plurality of protrusions of the mold provided in the mold,
The resin may be cast.
【0007】前記のように、金型内に支持体を挿入して
図8のE部に相当する部分を固定することで、金属端子
の曲がりを防止する。金型に支持体が嵌合することで、
支持体と金属端子を所定の位置に固定できる。また支持
体の一部が外から見えるようにすることで、支持体を金
型に入れ忘れたり、位置ずれの有無を後からも検査でき
る。As described above, the bending of the metal terminal is prevented by inserting the support into the mold and fixing the portion corresponding to the portion E in FIG. By fitting the support to the mold,
The support and the metal terminal can be fixed at a predetermined position. In addition, by making a part of the support visible from the outside, it is possible to later check whether the support is left in the mold or whether there is any displacement.
【0008】前記のように、金属端子を押さえる支持体
の改良または金型の改良により、金属端子と支持体の正
確な位置決めができると同時に金属端子が樹脂部の内部
で変形することを防止できる。As described above, by improving the support for holding the metal terminal or the mold, it is possible to accurately position the metal terminal and the support, and at the same time, prevent the metal terminal from being deformed inside the resin portion. .
【0009】[0009]
【発明の実施の形態】図1はこの発明の樹脂成形型電子
部品の第1実施例で、同図(a)は平面図、同図(b)
は矢印Aからみた側面図である。図1において、金属端
子3は予め金型を用いて樹脂駒1に貫通固着されてい
る。この場合、樹脂駒1は本成形される樹脂部4と比べ
容積が小さいため、注型圧力で金属端子3が曲がること
はない。次に、図示されていない本成形する金型に金属
端子3が固着された樹脂駒1をセットし樹脂駒1の一部
が露出するように樹脂成形される。この部分が露出部2
となる。樹脂駒1により、金属端子3は固定されている
ので注型圧力で樹脂部4の内部で金属端子が変形するこ
とが防止される。また露出部2を設けることで樹脂駒1
の入れ忘れおよび樹脂駒1や金属端子3の位置ずれを成
型後検査できる。また樹脂駒1に金属端子3を予め固着
する方法として前記のように金型を用いることで、図2
に述べる手作業で樹脂駒1に金属端子3を挿入する場合
に比べて、生産性が向上する。FIG. 1 shows a first embodiment of a resin-molded electronic component according to the present invention. FIG. 1 (a) is a plan view and FIG. 1 (b).
Is a side view as seen from arrow A. In FIG. 1, the metal terminal 3 is fixed to the resin piece 1 through a die in advance. In this case, since the volume of the resin piece 1 is smaller than that of the resin portion 4 to be completely molded, the metal terminal 3 is not bent by the casting pressure. Next, the resin piece 1 to which the metal terminal 3 is fixed is set in a metal mold (not shown) to be fully molded, and the resin piece 1 is molded so that a part of the resin piece 1 is exposed. This part is the exposed part 2
Becomes Since the metal terminal 3 is fixed by the resin piece 1, the metal terminal is prevented from being deformed inside the resin portion 4 by the casting pressure. Also, by providing the exposed portion 2, the resin piece 1
It is possible to inspect the resin pieces 1 and the metal terminals 3 for misplacement after the molding. As a method for previously fixing the metal terminal 3 to the resin piece 1 by using a mold as described above, FIG.
The productivity is improved as compared with the case where the metal terminal 3 is inserted into the resin piece 1 manually as described in (1).
【0010】また樹脂駒1の上下の厚さ寸法を図示され
ていない本成形する金型の上型と下型の間隔より0.0
1mm〜0.02mm大きめにすることで、本成形する
金型で樹脂駒1が確実に押さえられ、流入樹脂圧力に対
して樹脂駒1が動かないようにできる。このことで金属
端子3が樹脂部4の内部で変形することを防止できる。The upper and lower thicknesses of the resin piece 1 are set to 0.0
By increasing the size by 1 mm to 0.02 mm, the resin piece 1 can be reliably pressed by the mold to be completely molded, and the resin piece 1 can be prevented from moving with respect to the inflow resin pressure. This can prevent the metal terminal 3 from being deformed inside the resin portion 4.
【0011】図2は樹脂駒に金属端子を挿入する図であ
る。樹脂駒1に金属端子3を固着する方法には図1で説
明したように金型を用いて樹脂注型で行う方法の他に、
図2のように予め成形した穴9を有する樹脂駒1に金属
端子3を手作業にて挿入する方法もある。この場合は図
1に比べて組立性はよくない。尚、ここで図示した金属
端子3はIPMで実用されているものを例として挙げ
た。FIG. 2 is a view of inserting a metal terminal into a resin piece. As a method of fixing the metal terminal 3 to the resin piece 1, in addition to the method of performing resin casting using a mold as described in FIG.
As shown in FIG. 2, there is also a method of manually inserting the metal terminal 3 into the resin piece 1 having the hole 9 formed in advance. In this case, assemblability is not good as compared with FIG. The metal terminals 3 shown here are those used in IPM as an example.
【0012】図3はこの発明の第2実施例で、樹脂駒1
が金型にセットされた図である。樹脂駒1にテーパー状
の凸部7を設けて、相対する本成形する金型10(金型
の上型5と下型6をあわせたもの)にはテーパー状の凹
部8を設ける。このテーパー状の凸部7と凹部8がある
箇所C部(円内)で金型10と樹脂駒1とが正確に位置
合わせができる。FIG. 3 shows a second embodiment of the present invention.
Is a diagram set in a mold. A tapered convex portion 7 is provided on the resin piece 1, and a tapered concave portion 8 is provided on a mold 10 (a combination of the upper mold 5 and the lower mold 6) of the main molding which is opposed thereto. The mold 10 and the resin piece 1 can be accurately positioned at a portion C (in the circle) where the tapered convex portion 7 and concave portion 8 are located.
【0013】さらに図1で説明したように、金型10の
凹部8と樹脂駒1の凸部7とのクリアランスをマイナス
0.01mm〜0.02mmとすることで、金型の上型
5、下型6により樹脂駒1がしっかり押さえられ、流入
樹脂圧力に対して樹脂駒1が動かないようにできる。こ
うすることで、金属端子3の変形が防止される。また成
形後の樹脂部4は点線で示されている。Further, as described with reference to FIG. 1, by setting the clearance between the concave portion 8 of the mold 10 and the convex portion 7 of the resin piece 1 to be −0.01 mm to 0.02 mm, the upper mold 5, The resin block 1 is firmly pressed by the lower die 6, and the resin block 1 can be prevented from moving with respect to the inflow resin pressure. By doing so, the deformation of the metal terminal 3 is prevented. The resin portion 4 after molding is indicated by a dotted line.
【0014】図4は、この発明の第3実施例で、金型に
金属端子がセットされた状態の断面図である。金型の下
型6に凸部11を設け、金型の上型5に凸部11に対向
する凹部12を設け、互いにかみ合うようにする。金型
の下型6の凸部11間に金属端子3を挟むことで、矢印
Fの方向から樹脂が注入されてもその注型圧力で金属端
子3が動かない構造となっている。こうすることで、樹
脂駒を用いなくても金属端子3が樹脂部4の内部で変形
することを防止できる。尚、成形後の樹脂部4は点線で
示されている。FIG. 4 is a sectional view showing a third embodiment of the present invention, in which metal terminals are set in a mold. The convex portion 11 is provided on the lower mold 6 of the mold, and the concave portion 12 facing the convex portion 11 is provided on the upper mold 5 of the mold so that they engage with each other. By sandwiching the metal terminal 3 between the protrusions 11 of the lower mold 6 of the mold, the metal terminal 3 does not move due to the casting pressure even when the resin is injected from the direction of arrow F. By doing so, it is possible to prevent the metal terminal 3 from being deformed inside the resin portion 4 without using a resin piece. In addition, the resin part 4 after molding is shown by a dotted line.
【0015】図5は、図4で成形した完成品で、同図
(a)は全体の側面図、同図(b)は同図(a)のD部
拡大図、同図(c)は同図(b)をY−Y線で切断した
側面図である。同図(a)は図4を矢印Aから見た完成
品の側面図である。また同図(c)の斜線部は樹脂部の
切断部分である。金型から外した樹脂部4には金型に設
けられた凸部11が穴13(貫通孔)として金属端子3
間に形成される。しかし、この穴13は製品構造上は支
障がなく、完成品は十分実用できる。FIG. 5 shows the finished product molded in FIG. 4. FIG. 5 (a) is a side view of the whole, FIG. 5 (b) is an enlarged view of a portion D in FIG. 4 (a), and FIG. FIG. 3B is a side view cut along the line YY. FIG. 4A is a side view of the completed product when FIG. The hatched portion in FIG. 3C is a cut portion of the resin portion. In the resin portion 4 removed from the mold, a convex portion 11 provided in the mold is provided as a hole 13 (through hole) in the metal terminal 3.
Formed between them. However, this hole 13 does not hinder the product structure, and the finished product can be used sufficiently.
【0016】図6はこの発明の第4実施例で、自動機に
よる金属端子を樹脂駒に挿入する概念図である。レール
16にセットされた金属端子3が上部の押し出し棒15
で一個毎に搬送台17に乗っている樹脂駒1の穴9に挿
入される。例えばレール16に振動を与える装置を設置
することで金属端子3を揃えたり、押し出し棒の動きを
自動化するなど、一連の動作を自動化することで生産性
を大幅に向上できる。FIG. 6 is a schematic view showing a fourth embodiment of the present invention, in which a metal terminal is inserted into a resin piece by an automatic machine. The metal terminal 3 set on the rail 16 is the upper push rod 15
Is inserted one by one into the hole 9 of the resin piece 1 on the carrier 17. For example, the productivity can be greatly improved by automating a series of operations such as aligning the metal terminals 3 by installing a device that applies vibration to the rail 16 and automating the movement of the push rod.
【0017】尚、前記の一連の説明では支持体は樹脂製
の駒(樹脂駒)で説明したが、樹脂以外の絶縁性のある
材料で製作した駒であっても勿論よい。In the above series of explanations, the support is described as a piece made of resin (resin piece), but may be a piece made of an insulating material other than resin.
【0018】[0018]
【発明の効果】この発明によれば、本成形の金型に金属
端子を固着した樹脂駒をセットして、樹脂成形すること
で、樹脂部内の金属端子が変形することを防止できる。
樹脂駒に凸部を設け、金型に凹部を設けて互いに合わせ
る(嵌合する)ことで、樹脂駒の位置決めができる。そ
れにより金属端子を樹脂部の所定の箇所に位置決めでき
る。また樹脂駒の一部を露出させることで、樹脂駒の入
れ忘れを防止できる。また樹脂駒に金属端子を金型で貫
通固着させたり、自動機で樹脂駒に金属端子を挿入する
ことで組立性を向上できる。また金型に複数の凸部を設
けその凸部間に金属端子を挟むことで、樹脂駒を使用せ
ずに金属端子が樹脂部で変形することを防止できる。こ
のように、樹脂駒の改良または金型の改良により製品の
品質と生産性の向上を図ることができる。According to the present invention, it is possible to prevent the metal terminal in the resin portion from being deformed by setting the resin piece having the metal terminal fixed to the mold for the main molding and molding the resin.
The resin piece can be positioned by providing a protrusion on the resin piece and providing a recess on the mold and fitting (fitting) each other. Thereby, the metal terminal can be positioned at a predetermined position of the resin portion. Further, by exposing a part of the resin piece, it is possible to prevent forgetting to insert the resin piece. In addition, the metal terminal can be penetrated and fixed to the resin piece by a mold, or the metal terminal can be inserted into the resin piece by an automatic machine to improve the assemblability. Further, by providing a plurality of protrusions on the mold and holding the metal terminals between the protrusions, it is possible to prevent the metal terminals from being deformed at the resin portion without using a resin piece. Thus, the quality of the product and the productivity can be improved by improving the resin piece or the mold.
【図1】この発明の第1実施例で、同図(a)は平面
図、同図(b)は矢印Aからみた側面図FIG. 1A is a plan view of the first embodiment of the present invention, and FIG.
【図2】樹脂駒に金属端子を挿入する状態を示した図FIG. 2 is a diagram showing a state where a metal terminal is inserted into a resin piece;
【図3】この発明の第2実施例で、樹脂駒が金型にセッ
トされた状態を示す図FIG. 3 is a view showing a state in which a resin piece is set in a mold according to a second embodiment of the present invention;
【図4】この発明の第3実施例で、金型に金属端子がセ
ットされた状態を示す断面図FIG. 4 is a sectional view showing a state in which a metal terminal is set in a mold according to a third embodiment of the present invention;
【図5】図4で成形した完成品で、(a)は全体の側面
図、(b)は(a)のD部拡大図、(c)は(b)をY
−Y線で切断した側面図5 (a) is an overall side view, FIG. 5 (b) is an enlarged view of a D portion of FIG. 4 (a), and FIG.
-Side view cut along the Y line
【図6】この発明の第4実施例で、自動機による金属端
子を樹脂駒に挿入する概念図FIG. 6 is a conceptual diagram of inserting a metal terminal into a resin piece by an automatic machine according to a fourth embodiment of the present invention.
【図7】従来用いられている構造で、(a)は全体斜視
図、(b)は信号用金属端子部の断面図FIGS. 7A and 7B show a conventionally used structure, wherein FIG. 7A is an overall perspective view and FIG. 7B is a cross-sectional view of a signal metal terminal portion.
【図8】従来の成形された樹脂部と金属端子で、(a)
は平面図、(b)は(a)を矢印Aから見た側面図FIG. 8 shows a conventional molded resin portion and metal terminal, (a)
Is a plan view, and (b) is a side view of (a) viewed from an arrow A.
【図9】従来の方法で成形した場合の変形量の大きい金
属端子と樹脂部とを示した断面図FIG. 9 is a cross-sectional view showing a metal terminal and a resin portion having a large deformation amount when molded by a conventional method.
1 樹脂駒 2 露出部 3 金属端子 4 樹脂部 5 金型の上型 6 金型の下型 7 凸部 8 凹部 9 穴 10 金型 11 凸部 12 凹部 13 穴 15 押し出し棒 16 レール 17 搬送台 23 金属端子 24 樹脂部 25 樹脂ケース 43 金属端子 43a 金属端子 44 樹脂部 53 金属端子 54 樹脂部 F 樹脂の流れ方向 REFERENCE SIGNS LIST 1 resin piece 2 exposed part 3 metal terminal 4 resin part 5 mold upper mold 6 mold lower mold 7 convex part 8 concave part 9 hole 10 mold 11 convex part 12 concave part 13 hole 15 push rod 16 rail 17 carrier 23 Metal terminal 24 Resin part 25 Resin case 43 Metal terminal 43a Metal terminal 44 Resin part 53 Metal terminal 54 Resin part F Resin flow direction
Claims (4)
属端子を有する電子部品において、前記金属端子が支持
体と該支持体を覆う樹脂とで支持されていることを特徴
とする樹脂成形型電子部品。1. An electronic component having a metal terminal formed by molding a resin by casting a resin into a mold, wherein the metal terminal is supported by a support and a resin covering the support. Resin molding electronic parts.
り露出していることを特徴とする請求項1記載の樹脂成
形型電子部品。2. The resin-molded electronic component according to claim 1, wherein at least a part of said support is exposed from said resin.
れ、前記金型の一部に支持体の一部を嵌合させた上で樹
脂を注型することを特徴とする樹脂成形型電子部品の製
造方法。3. A resin molding, wherein a metal terminal supported by a support is put into a mold, a part of the support is fitted into a part of the mold, and a resin is cast. Method of manufacturing electronic components.
型の複数の凸部に嵌め入まれて支持され、樹脂が注型さ
れることを特徴とする樹脂成形型電子部品の製造方法。4. A resin-molded electronic component according to claim 1, wherein a plurality of metal terminals are fitted into and supported by a plurality of convex portions of the mold provided in the mold, and a resin is cast. Production method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24514197A JP4063361B2 (en) | 1997-09-10 | 1997-09-10 | Manufacturing method of resin mold electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24514197A JP4063361B2 (en) | 1997-09-10 | 1997-09-10 | Manufacturing method of resin mold electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1177687A true JPH1177687A (en) | 1999-03-23 |
| JP4063361B2 JP4063361B2 (en) | 2008-03-19 |
Family
ID=17129241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24514197A Expired - Lifetime JP4063361B2 (en) | 1997-09-10 | 1997-09-10 | Manufacturing method of resin mold electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4063361B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116512491A (en) * | 2023-05-17 | 2023-08-01 | 斯图(镇江)智能电气有限公司 | Casting material oscillation filling structure for casting bus |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6448212U (en) * | 1987-09-22 | 1989-03-24 | ||
| JPH04263913A (en) * | 1991-02-18 | 1992-09-18 | Nippondenso Co Ltd | Resin insertion molding method of metallic material |
| JPH0716874A (en) * | 1993-06-30 | 1995-01-20 | Sumitomo Wiring Syst Ltd | Method and apparatus for molding resin |
| JPH0976282A (en) * | 1995-09-20 | 1997-03-25 | Mitsubishi Eng Plast Kk | Resin encapsulation molding method for electric / electronic parts and mold used therefor |
| JPH09286040A (en) * | 1996-04-23 | 1997-11-04 | Yazaki Corp | Insert molding method and connector manufacturing method |
-
1997
- 1997-09-10 JP JP24514197A patent/JP4063361B2/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6448212U (en) * | 1987-09-22 | 1989-03-24 | ||
| JPH04263913A (en) * | 1991-02-18 | 1992-09-18 | Nippondenso Co Ltd | Resin insertion molding method of metallic material |
| JPH0716874A (en) * | 1993-06-30 | 1995-01-20 | Sumitomo Wiring Syst Ltd | Method and apparatus for molding resin |
| JPH0976282A (en) * | 1995-09-20 | 1997-03-25 | Mitsubishi Eng Plast Kk | Resin encapsulation molding method for electric / electronic parts and mold used therefor |
| JPH09286040A (en) * | 1996-04-23 | 1997-11-04 | Yazaki Corp | Insert molding method and connector manufacturing method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116512491A (en) * | 2023-05-17 | 2023-08-01 | 斯图(镇江)智能电气有限公司 | Casting material oscillation filling structure for casting bus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4063361B2 (en) | 2008-03-19 |
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