JPH117832A - Cryogenic insulation and epoxy adhesive - Google Patents

Abstract

(57) [Problem] To provide an insulating material for cryogenic use and an epoxy adhesive excellent in insulating properties and adhesiveness even at cryogenic temperatures. SOLUTION: A glass cloth and a polyimide resin film are provided via an epoxy resin composition containing 5% (by weight) or more of a polymer having a number average molecular weight of 10,000 or more.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cryogenic insulating material and an epoxy adhesive having excellent insulating properties and adhesiveness even at cryogenic temperatures.

[0002]

2. Description of the Related Art In order to secure and maintain a superconducting state at an extremely low temperature, such as when a superconducting coil is used, insulation capacity such as a dielectric breakdown voltage of an insulating material is important. The state of adhesion between the insulating material and the conductor is particularly important.

As a material of the insulating material, a glass fiber reinforced composite material composed of glass fiber and epoxy resin is often used. When the glass fiber reinforced composite material is cooled to an extremely low temperature, cracks occur in the resin portion. As a result, a phenomenon in which the glass fiber reinforced composite material peels off occurs. When the glass fiber reinforced composite material peels off, the superconducting material can be easily moved, the superconducting material vibrates and generates heat, and the temperature rise caused by the vibration causes a phenomenon (so-called quench phenomenon) in which the superconducting state is broken. Problem.

On the other hand, as a high-performance insulating material, a highly reliable polyimide resin film showing a dielectric breakdown voltage of about 10 times or more as compared with a general insulating material such as a glass fiber reinforced composite material has been used. I have. However, this polyimide resin film has a disadvantage that the adhesiveness is poor.

Therefore, when a polyimide resin film is joined to, for example, a conductive material, or when a polyimide resin film is joined via a glass cloth, a resin having a relatively high adhesive strength such as an epoxy resin is used as an adhesive. This makes up for the poor adhesion.

However, even with the above-described structure, distortion occurs due to the difference in the thermal shrinkage rate between the constituent materials in the cryogenic temperature range, and the adhesive strength becomes insufficient (in the normal temperature range, the adhesion is satisfactory). Is done.)

The present invention solves the above problems,
An object of the present invention is to provide a cryogenic insulating material and an epoxy-based adhesive capable of effectively exhibiting high insulation properties of a polyimide resin film even at cryogenic conditions.

[0008]

The present invention is characterized in that an inorganic base material and a polyimide resin film are provided via an epoxy resin composition containing 5% (by weight) or more of a polymer having a number average molecular weight of 10,000 or more. Cryogenic insulation material.

Further, the number average molecular weight of 10,000 is added to the inorganic base material.
A cryogenic insulation material comprising a polyimide resin film bonded to an inorganic base material prepreg impregnated with an epoxy resin composition containing at least 5% (by weight) of the above polymer. is there.

[0010] Further, a glass base material and a polyimide resin film are provided via an epoxy resin composition in which a polymer having a number average molecular weight of 10,000 or more is mixed in an amount of 5% (by weight) or more. It relates to an insulating material.

In addition, the number average molecular weight of 1000
A cryogenic insulating material characterized in that a polyimide resin film is bonded to a glass base prepreg impregnated with an epoxy resin composition containing 5% (by weight) or more of 0 or more polymers. It is.

Further, a glass cloth and a polyimide resin film are made of a polymer having a number average molecular weight of 10,000 or more by 5%.
The present invention relates to a cryogenic insulating material characterized by being provided with an epoxy resin composition mixed therein (by weight) or more.

The glass cloth has a number average molecular weight of 100
A cryogenic insulating material characterized in that a glass cloth prepreg impregnated with an epoxy resin composition containing at least 5% (by weight) of a polymer of at least 00 is impregnated with a polyimide resin film. is there.

Further, the glass cloth and elongation 80-160%
With a polyimide resin film of number average molecular weight 10,000
A cryogenic insulating material characterized by being provided with an epoxy resin composition containing 5% (by weight) or more of the above polymer mixed therein.

The glass cloth has a number average molecular weight of 100.
Characterized by laminating a glass cloth prepreg impregnated with an epoxy resin composition containing 5% (by weight) or more of a polymer of at least 00 and a polyimide resin film having an elongation of 80 to 160%. The present invention relates to an insulating material for use.

Further, a glass cloth and a polyimide resin film having the following structure are provided via an epoxy resin composition in which a polymer having a number average molecular weight of 10,000 or more is mixed in an amount of 5% (by weight) or more. The present invention relates to a low-temperature insulating material.

Embedded image Further, a glass cloth prepreg obtained by impregnating a glass cloth with an epoxy resin composition in which a polymer having a number average molecular weight of 10,000 or more is mixed at 5% (weight) or more is bonded to a polyimide resin film having the following structure. A cryogenic insulating material characterized by the following.

Embedded image The cryogenic insulating material according to any one of claims 1 to 10, wherein a polyvinyl formal resin is used as a polymer having a number average molecular weight of 10,000 or more. is there.

The cryogenic insulating material according to any one of claims 1 to 10, wherein a phenoxy resin is used as a polymer having a number average molecular weight of 10,000 or more. Things.

The cryogenic insulating material according to any one of claims 1 to 10, wherein a carboxylated NBR rubber is used as a polymer having a number average molecular weight of 10,000 or more. It is related to.

The cryogenic insulating material according to any one of claims 1 to 13, wherein the epoxy resin composition is mixed so as to be 30 to 60% (weight) with respect to the insulating material. A cryogenic insulating material characterized by the following.

The epoxy resin has a number average molecular weight of 10
5% (weight) or more of a polymer of 000 or more,
The present invention relates to an epoxy-based adhesive characterized by having a strong adhesive force under cryogenic conditions.

[0021] Further, an epoxy-based adhesive characterized by having a polyvinyl formal resin, a phenoxy resin, or a carboxylated NBR rubber mixed into an epoxy-based resin in an amount of 5% (by weight) or more, and having a strong adhesive force under cryogenic conditions. Pertaining to agents.

[0022]

The present invention summarizes the effects obtained by repeated experiments as claims.

A cryogenic insulation material in which a glass cloth and a polyimide resin film are attached via an epoxy resin composition containing 5% or more of a polymer having a number average molecular weight of 10,000 or more is used, for example, as an insulation material for a superconducting coil. In such a case, excellent adhesive strength and insulating strength are exhibited even under cryogenic conditions, and peeling or cracking of the cryogenic insulating material does not occur.

Since the present invention is constructed as described above, it has a sufficient adhesive force even at cryogenic conditions, and is excellent in practical use for cryogenic materials capable of effectively exhibiting high insulation properties of a polyimide resin film. It becomes an insulating material and an epoxy adhesive.

[0025]

BRIEF DESCRIPTION OF THE DRAWINGS The drawings illustrate one embodiment of the present invention.

FIGS. 1 and 2 show a superconducting coil 2 formed by winding a superconducting material 1 and an inner wall 5 of a cooling section 3 for cooling the superconducting coil 2, in which cryogenic insulating materials 4a and 4b are disposed. is there.

The cooling section 3 is provided with a cooling pipe 6 through which a coolant such as liquid helium for cooling the cooling section 3 passes.

The method of disposing the cryogenic insulating materials 4a and 4b will be described in detail.

Cryogenic low temperature insulating material 4a provided on superconducting material 1
First, an epoxy resin to which PBH is added (that is,
Epoxy resin composition. ) Is impregnated into a glass cloth to form a glass cloth prepreg, and a polyimide resin film is bonded to the glass cloth prepreg to form a prepreg-shaped insulating material for cryogenic use.

Subsequently, a prepreg-like insulating material for cryogenic temperature is spirally wound around the superconducting material 1 to form a prepreg-like insulating layer on the superconducting material 1.

On the other hand, as the cryogenic insulating material 4b disposed on the inner wall 5 of the cooling section 3, first, an epoxy resin to which PBH is added (that is, an epoxy resin composition) is impregnated into a glass cloth to prepare a glass cloth prepreg. Is formed, a polyimide resin film is bonded to the glass cloth prepreg, and a glass cloth prepreg is further bonded to the polyimide resin film to form a prepreg-shaped insulating material for cryogenic temperature.

Subsequently, a prepreg-shaped insulating material for cryogenic temperature is disposed on the inner wall 5 of the cooling unit 3 like wallpaper, and a prepreg-shaped insulating layer is formed on the inner wall 5 of the cooling unit 3.

The prepreg-shaped insulating layer provided in this manner is cured by heating, and the cryogenic insulating materials 4a and 4b are integrally provided in the gap between the superconducting material 1 and the cooling unit 3.

Since the present embodiment is constructed as described above, the cryogenic insulating materials 4a and 4b disposed in the gap between the superconducting material 1 and the cooling unit 3 do not peel or crack, and the quench is applied to the superconducting coil. It is a very low temperature insulation material with excellent practicability that does not cause phenomena.

[0035]

EXAMPLES Hereinafter, experimental examples supporting the effects of the present invention will be described.

The polyimide resin film is a polyimide resin film having a tensile elongation of 80 to 160% at room temperature, UPILEX R (manufactured by Ube Industries, Ltd .; see Chemical Formula 1 below. The average tensile elongation at room temperature is 130%; hereinafter, UPI)
LEX R. ), And UPIL manufactured by Ube Industries, Ltd. having an average tensile elongation at room temperature of 30% for comparison.
EXS (see below, hereinafter referred to as UPILEX S) and KAPTON H manufactured by DuPont with an average tensile elongation at room temperature of 70% (see below, hereinafter referred to as K3)
It is called APTON H. ).

Embedded image

Embedded image

Embedded image In addition, polymers having a number average molecular weight of 10,000 or more are vinylene E (manufactured by Chisso Corporation, see below) as a polyvinyl formal resin (number average molecular weight is about 1,000,000 in polyvinyl formal resin; hereinafter, referred to as PBH), and a phenoxy resin. YP-50 manufactured by Toto Kasei Co., Ltd.
reference. Number average molecular weight 58600. Hereinafter, it is referred to as a phenoxy resin. ) And Nippol 1072 manufactured by Nippon Zeon Co., Ltd. (see Chemical Formula 6 below) as a carboxylated NBR rubber.
A carboxyl-modified acrylonitrile / butadiene copolymer having a number average molecular weight of about 300,000. Hereinafter, it is called NBR rubber. ).

Embedded image

Embedded image Here, n indicates repetition, and generally n = 100 or more, and about 200 on average.

Embedded image In the above chemical formula, the symbols n, X, Y, Z, x, y,
z represents a natural number. Symbols described except n indicate the mixing ratio of structural formulas enclosed in square brackets.

The mixing ratio of the symbols X, Y, and Z in Chemical Formula 4 is as follows:
In general:

X = 78% or more Y = 4.5-8.5% Z = 9-13% The mixing ratio of the symbols x, y and z in Chemical Formula 6 is generally as follows.

X = 1 to 40% or more y = 52 to 98% z = 1 to 8%

The measuring conditions of the adhesive strength are JIS K6
850. The adherend is SUS304, and the shear breaking force between the adherend and the interposed insulating material is defined as the adhesive force. However, the temperature condition is liquid nitrogen temperature (about 77K or less). The withstand voltage measurement conditions are JIS K 6911.
According to.

<Experimental Example 1> In order to examine the relationship between the resin content of the epoxy resin composition and the adhesive strength, an epoxy resin containing a polymer (ie, an epoxy resin composition) was prepared by changing the resin content. The glass cloth was impregnated to form a glass cloth prepreg, and the adhesive strength and the withstand voltage of the glass cloth prepreg were measured. The thickness of the glass cloth prepreg was 50 μm, and the polymer used was PBH.

[Table 1] Thus, in the glass cloth prepreg having a resin content of 20 to 60% (by weight), the adhesive strength was 30 MPa or more, and good adhesive strength was exhibited. Note that the withstand voltage has a lower value than that of the configuration including the polyimide resin film.

<Experimental Example 2> In order to examine the relationship between the ratio of the polymer added to the epoxy resin composition and the adhesive strength, an epoxy resin containing a polymer (ie, an epoxy resin composition) was added to the epoxy resin composition. The glass cloth was impregnated with a glass cloth prepreg to form a glass cloth prepreg, and the adhesive strength and withstand voltage of the glass cloth prepreg were measured. The thickness of the glass cloth prepreg was 50 μm, and the polymer used was PBH.

[Table 2] Thus, in the epoxy resin composition having a polymer addition rate of 5 to 35% (weight), the adhesive strength becomes 30 MPa or more,
Good adhesion was exhibited. In addition, polymer addition rate is 40%
(Weight), the polymer cannot be impregnated into the glass cloth, and the glass cloth prepreg cannot be formed.

<Experimental Example 3> In order to examine the relationship between the resin content and the adhesive strength of an insulating material having a film-glass cloth bonded structure of a glass cloth and a polyimide resin film, epoxy resin to which a polymer was added (that is, epoxy resin) , Epoxy resin composition) is impregnated into a glass cloth by changing the resin content to form a glass cloth prepreg, and UPILEX R is bonded to the glass cloth prepreg to form an insulating material, and the insulating material is bonded. Force and withstand voltage were measured. The thickness of the glass cloth was 30 μm, the thickness of the polyimide resin film was 25 μm, and the polymer used was PB.
H.

[Table 3] Thus, in the glass cloth prepreg having a resin content of 20 to 60% (by weight), the adhesive strength was 30 MPa or more, and good adhesive strength was exhibited. Also, the withstand voltage was about four times the value of Experimental Example 1, and a good withstand voltage was obtained.

<Experimental Example 4> In order to examine the relationship between the polymer addition rate and the adhesive strength of an insulating material having a glass cloth and a polyimide resin film bonded to a film-glass cloth, an epoxy resin containing a polymer ( That is, an epoxy resin composition is impregnated into a glass cloth at a different polymer addition rate to form a glass cloth prepreg, and UPILEX R is bonded to the glass cloth prepreg to form an insulating material. Was measured for adhesive strength and withstand voltage. The thickness of the glass cloth was 30 μm, the thickness of the polyimide resin film was 25 μm, and the polymer used was PBH.

[Table 4] As described above, in the epoxy resin composition having the polymer addition rate of 10 to 35% (weight), the adhesive strength was 30 MPa or more, and good adhesive strength was exhibited. In addition, the withstand voltage was about four times as large as that of Example 1, and a good withstand voltage was obtained. Incidentally, when the polymer addition rate becomes 40% (weight),
A prepreg cannot be formed as in Experimental Example 2.

<Experimental Example 5> In order to examine the change in the adhesive strength and the withstand voltage by the polymer used in Experimental Example 4, the adhesive force and the resistance of the insulating material to which phenoxy resin and NBR rubber were added instead of PBH as the polymer were used. The voltage was measured.
The conditions other than the polymer used were the same as in Experimental Example 4.

[Table 5] Thus, the insulating material to which the phenoxy resin is added is PBH
Although the same adhesive strength and withstand voltage were obtained as in the above, the adhesive strength of the insulating material to which NBR rubber was added was insufficient at 30 MPa or less at a polymer addition rate of 30% (weight). Therefore,
It has been found that NBR rubber cannot provide the same adhesive strength as PBH or phenoxy resin.

This is because, at extremely low temperatures, the elasticity of the adhesive is remarkably reduced, and stress such as a difference in contraction between the adhesive and the adhesive cannot be alleviated. And PBH
The molecular structure of phenolic resin and phenoxy resin is easier to expand and contract than the molecular structure of NBR rubber, so that PBH and phenoxy resin have higher elasticity than NBR rubber at extremely low temperatures, and lower the elasticity of epoxy resin. Is presumed to be more easily supplemented.

<Experimental Example 6> In order to examine changes in the adhesive strength and the withstand voltage of the insulating material depending on the thickness of the polyimide resin film and the glass cloth, the resin content and the polymer addition rate were set to be constant, and The adhesive strength and withstand voltage of the insulating material of the film-glass cloth bonding structure in which the thickness and the thickness of the glass cloth prepreg were changed were measured. The polymer used was PBH and the polymer addition rate was 30.
% (Weight), and the resin content of the epoxy resin is 40% (weight).

[Table 6] Thus, it was confirmed that even if the thicknesses of the polyimide resin film and the glass cloth were changed, the adhesive strength of the insulating material was hardly affected.

When the thickness of the glass cloth increases, the withstand voltage decreases because the withstand voltage of the glass cloth laminate is lower than that of the polyimide resin film. This is because Therefore, when a polyimide resin film is adhered to a thin glass cloth, it becomes an insulating material having a high withstand voltage even if it is thin.

<Experimental Example 7> In order to examine the changes in the adhesive strength and the withstand voltage of the insulating material due to the elongation of the polyimide resin, UPILEX S and KAPT were used as polyimide resin films.
The adhesive strength and withstand voltage of the insulating material having the film-glass cloth bonded structure using ONH were measured. In addition, the thickness of the glass cloth is 30 μm.

[Table 7] As described above, the insulating material using the polyimide resin film with low elongation had lower adhesive strength than the insulating material using the polyimide resin film with high elongation. In addition, in UPIREX S having a lower elongation, the adhesive force was not more than 30 MPa, irrespective of the setting of the resin content and the polymer addition rate.

This is similar to Experimental Example 5 except that UPILEX
It is speculated that R may have a higher elongation than UPILEX S or KAPTON H, and that even if the epoxy resin has reduced elasticity under cryogenic conditions, UPILEX R itself can partially reduce the stress. You.

<Experimental Example 8> In order to investigate the relationship between the resin content and the adhesive strength of an insulating material having two glass cloth prepregs and a polyimide resin film in a glass cloth-to-glass cloth bonding structure, a polymer was used. A glass cloth prepreg is formed by impregnating a glass cloth with an epoxy resin (i.e., an epoxy resin composition) added with a different resin content, and a polyimide resin film is bonded to the glass cloth prepreg. The adhesive strength and the withstand voltage of the insulating material obtained by bonding the glass cloth prepreg on the film were measured. The thickness of the glass cloth was 50 μm × 2 = 100 μm, the thickness of the polyimide resin film was 25 μm, and the polymer used was PBH.
It is.

[Table 8] As described above, in the insulating material having a resin content of 30 to 60% (weight), the adhesive strength was 30 MPa or more, and good adhesive strength was exhibited. In addition, the withstand voltage was about three times as large as that of Experimental Example 1, and a good withstand voltage was obtained.

<Experimental Example 9> In order to investigate the relationship between the polymer addition rate and the adhesive strength of an insulating material having a structure in which two glass cloth prepregs and a polyimide resin film were bonded together in a glass cloth-film-glass cloth bonding method, A glass cloth prepreg is formed by impregnating a glass cloth with an epoxy resin to which a molecule is added (that is, an epoxy resin composition) while changing a polymer addition rate, and a polyimide resin film is bonded to the glass cloth prepreg. The adhesive strength and the withstand voltage of the insulating material obtained by bonding the glass cloth prepreg on the polyimide resin film were measured. The thickness of the glass cloth prepreg was 50 μm × 2 = 100 μm,
The thickness of the polyimide resin film is 25 μm, and the polymer used is PBH.

[Table 9] As described above, in the insulating material using the epoxy resin composition having the polymer addition rate of 10 to 30% (by weight), the adhesive strength is 30.
MPa or more, and good adhesion was exhibited. Also,
The withstand voltage was about three times the value of Experimental Example 1, and a good withstand voltage was obtained. When the polymer addition rate becomes 40% (weight), a prepreg cannot be formed as in Experimental Examples 2 and 4.

<Experimental Example 10> In order to examine the change in the adhesive force and the withstand voltage by the polymer used in Experimental Example 9, phenoxy resin and NBR were used instead of PBH as the polymer
The adhesive strength and withstand voltage of the insulating material to which rubber was added were measured.
The conditions other than the polymer used were the same as in Experimental Example 9.

[Table 10] Thus, the insulating material to which the phenoxy resin is added is PBH
Although the same adhesive strength and withstand voltage were obtained as in the case of PBH and the phenoxy resin, the adhesive strength of the insulating material to which NBR rubber was added was slightly reduced, although there was no problem in practicality.

This is because, similarly to Experimental Example 5, the elasticity of the adhesive significantly decreases at extremely low temperatures, and stress such as displacement due to a difference in contraction between the adhesive and the adhesive cannot be alleviated. Cracking and peeling may occur at the adhesive or the bonding interface, and the molecular structure of PBH or phenoxy resin is more easily expanded and contracted than the molecular structure of NBR rubber. It is speculated that the phenoxy resin and the phenoxy resin have higher elasticity than the NBR rubber, and may more easily compensate for the decrease in the elasticity of the epoxy resin.

<Experimental Example 11> Adhesive strength of insulating material based on thickness of glass cloth and insulating polyimide resin film in which two glass cloth prepregs and a polyimide resin film were bonded together in a glass cloth-to-glass cloth bonding structure In order to examine the change in withstand voltage and the withstand voltage, the resin content and the polymer addition rate were set to be constant, and the adhesive strength and withstand voltage of the insulating material with the thickness of the polyimide resin film and glass cloth changed were measured. In addition, the thickness of the glass cloth is the thickness of two sheets, the polymer used is PBH, the polymer addition rate is 30% (weight), and the resin content of the epoxy resin is 40%. (Weight).

[Table 11] Thus, it was confirmed that even if the thicknesses of the polyimide resin film and the glass cloth were changed, the adhesive strength of the insulating material was hardly affected. As in the case of Experimental example 6, when the thickness of the glass cloth increases, the withstand voltage decreases.

<Experimental Example 12> Adhesive strength and withstand voltage of insulating material based on elongation of polyimide resin film of insulating material having two glass cloth prepregs and polyimide resin film bonded together in a glass cloth-film-glass cloth bonding structure In order to investigate the change in the adhesive strength, the adhesive strength and the withstand voltage of the insulating material using UPILEX S and KAPTON H as the polyimide resin film were measured. The thickness of the glass cloth is 50 μm × 2 = 100 μm.

[Table 12] Thus, UPILEX S and KAPTO with low elongation
The insulating material using NH is UPILEX with high elongation
The adhesive strength was lower than that of the insulating material using R. still,
In UPILEX S, which has a lower elongation, the adhesive strength is 30 regardless of the resin content or the polymer addition rate.
MPa or less, which was insufficient.

<Experimental Example 13> A prepreg was prepared by impregnating a polyimide resin film having poor adhesion to a conductive material with an epoxy resin composition containing a polymer, and the adhesive strength and withstand voltage were measured. In addition, UPIL is used as a polyimide resin film.
Use EXR and set the polyimide resin film thickness to 5
It was set to 0 μm.

[Table 13] Thus, when the polymer addition rate was 30% (weight) and the resin content was 5 to 30% (weight), the adhesive strength of the polyimide resin film prepreg was 30 MPa or more, and good adhesive strength was exhibited. The withstand voltage is about 1 for glass cloth.
It became 0 times.

The results of the above experimental examples show that UPILEX R having high elongation was used as a polyimide resin film, an epoxy resin having a strong adhesive force was used as an adhesive, and the epoxy resin had a large molecular weight and elasticity. It is suggested that the inclusion of a high polymer results in a cryogenic insulating material having good adhesive strength even at cryogenic conditions.

The results of the above experimental examples can be summarized as follows. A cryogenic material obtained by attaching a glass cloth and a polyimide resin film via an epoxy resin composition containing 5% (by weight) or more of a polymer having a number average molecular weight of 10,000 or more. The insulating material has good adhesive strength and insulating strength even under extremely low temperature conditions.

When a polyimide resin film having a tensile elongation at room temperature of 80 to 160% is used as the polyimide resin film, the adhesive strength is further increased.

The use of a polymer having high elasticity at extremely low temperatures (polyvinyl formal resin or phenoxy resin) as a polymer further increases the adhesive strength. However, there is no problem in practicality even if a carboxylated NBR rubber having slightly inferior elasticity is used.

When the epoxy resin composition is mixed with the insulating material so as to be 30 to 60% (weight), the adhesive strength is further increased.

An epoxy resin composition that satisfies the above conditions can impart high adhesive strength to a polyimide resin film having low adhesive strength.

[Brief description of the drawings]

FIG. 1 is an explanatory perspective view of this embodiment.

FIG. 2 is an explanatory sectional view of the present embodiment.

[Explanation of symbols]

 None

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI C09J 163/00 C09J 163/00 H01B 3/40 H01B 3/40 E 13/00 561 13/00 561Z 17/60 17/60 C // (C09J 163/00 113: 00)

Claims (16)

[Claims] 1. A cryogenic material comprising an inorganic base material and a polyimide resin film attached via an epoxy resin composition containing 5% (by weight) or more of a polymer having a number average molecular weight of 10,000 or more. Insulating material. 2. A polyimide resin film bonded to an inorganic base material prepreg obtained by impregnating an inorganic base material with an epoxy resin composition in which a polymer having a number average molecular weight of 10,000 or more is mixed in an amount of 5% (by weight) or more. A cryogenic insulation material characterized by the following. 3. A glass base material and a polyimide resin film are mixed with a polymer having a number average molecular weight of 10,000 or more by 5% (weight).
A cryogenic insulating material characterized by being provided with an epoxy resin composition mixed therein. 4. A polyimide resin film bonded to a glass base material prepreg obtained by impregnating a glass base material with an epoxy resin composition containing 5% (weight) or more of a polymer having a number average molecular weight of 10,000 or more. A cryogenic insulation material characterized by the following. 5. An insulating material for cryogenic use, wherein a glass cloth and a polyimide resin film are provided via an epoxy resin composition containing 5% (by weight) or more of a polymer having a number average molecular weight of 10,000 or more. Wood. 6. A glass cloth having a number average molecular weight of 10,000.
An insulating material for cryogenic use, wherein a polyimide resin film is bonded to a glass cloth prepreg impregnated with an epoxy resin composition containing 5% (by weight) or more of the above polymer. 7. A glass cloth and a tensile elongation at room temperature of 8
An insulating material for cryogenic use, comprising a polyimide resin film of 0 to 160% and an epoxy resin composition containing 5% (by weight) or more of a polymer having a number average molecular weight of 10,000 or more. 8. A glass cloth having a number average molecular weight of 10,000.
A glass cloth prepreg impregnated with an epoxy resin composition containing at least 5% (by weight) of the above polymer is bonded to a polyimide resin film having a tensile elongation at room temperature of 80 to 160%. Cryogenic insulation. 9. An electrode wherein a glass cloth and a polyimide resin film having the following structure are provided via an epoxy resin composition in which a polymer having a number average molecular weight of 10,000 or more is mixed in an amount of 5% (by weight) or more. Low temperature insulation. Embedded image 10. A glass cloth having a number average molecular weight of 1,000.
A glass cloth prepreg impregnated with an epoxy resin composition containing 5% (weight) or more of 0 or more polymers,
An insulating material for cryogenic use, which is obtained by laminating a polyimide resin film having the following structure. Embedded image 11. The cryogenic insulation material according to claim 1, wherein a polyvinyl formal resin is used as the polymer having a number average molecular weight of 10,000 or more. 12. The cryogenic insulating material according to claim 1, wherein a phenoxy resin is used as the polymer having a number average molecular weight of 10,000 or more. 13. The cryogenic insulation material according to claim 1, wherein a carboxylated NBR rubber is used as the polymer having a number average molecular weight of 10,000 or more. . 14. The cryogenic insulating material according to claim 1, wherein the epoxy resin composition is mixed so as to be 30 to 60% (weight) with respect to the insulating material. A cryogenic insulation material characterized by the following. 15. An epoxy resin having a number average molecular weight of 100.
An epoxy adhesive comprising at least 5% (by weight) of a polymer having a molecular weight of 00 or more and having a strong adhesive force under extremely low temperature conditions. 16. An epoxy-based adhesive comprising a polyvinyl formal resin, a phenoxy resin, or a carboxylated NBR rubber mixed into an epoxy-based resin in an amount of 5% (by weight) or more, and having a strong adhesive force under cryogenic conditions. Agent.