JPH1184672A5 - - Google Patents
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- Publication number
- JPH1184672A5 JPH1184672A5 JP1997265133A JP26513397A JPH1184672A5 JP H1184672 A5 JPH1184672 A5 JP H1184672A5 JP 1997265133 A JP1997265133 A JP 1997265133A JP 26513397 A JP26513397 A JP 26513397A JP H1184672 A5 JPH1184672 A5 JP H1184672A5
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- comparative example
- carboxyl group
- photopolymerizable resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Description
【0042】
【実施例】
比較例5
<ドライフィルム用組成物の調合及び銅張り積層板での評価>
以下の成分(A)〜(I)を混合して、ドライフィルムレジスト用組成物を調合した。
[0042]
[Example]
Comparative Example 5
<Formulation of dry film composition and evaluation on copper-clad laminate>
The following components (A) to (I) were mixed to prepare a dry film resist composition.
比較例6
比較例5に示した光重合性樹脂組成物に、更に2−(O−クロロフェニル)−4,5−ジフェニルイミダゾリル二量体を2重量部添加し、比較例5と同様に操作して評価用サンプルを作製して評価した。この評価結果を表1に示す。
Comparative Example 6
Two parts by weight of 2-(O-chlorophenyl)-4,5-diphenylimidazolyl dimer was further added to the photopolymerizable resin composition shown in Comparative Example 5 , and an evaluation sample was prepared and evaluated in the same manner as in Comparative Example 5. The evaluation results are shown in Table 1.
比較例1、2
比較例6に示した光重合性樹脂組成物の(e)成分トリス(アクリロキシエチル)イソシアヌレートの代わりに、トリメチロールプロパントリアクリレート(比較例1)、ノナプロピレングリコールジメタアクリレート(比較例2)を配合する以外は、比較例6と同様に操作して評価用サンプルを作製して評価した。この評価結果を表1に示す。
Comparative Examples 1 and 2
Evaluation samples were prepared and evaluated in the same manner as in Comparative Example 6 , except that trimethylolpropane triacrylate (Comparative Example 1) or nonapropylene glycol dimethacrylate (Comparative Example 2) was blended in place of tris(acryloxyethyl)isocyanurate, component (e) of the photopolymerizable resin composition shown in Comparative Example 6. The evaluation results are shown in Table 1.
比較例3、4、7、8、9、実施例1、2、3
イソシアヌル酸エステル化合物の種類と配合割合を表1の様にする以外は、比較例6と同様に操作して評価用サンプルを作製して評価した。この評価結果を表1に示す。
Comparative Examples 3, 4, 7, 8, 9, Examples 1, 2, 3
Samples for evaluation were prepared and evaluated in the same manner as in Comparative Example 6 , except that the types and blending ratios of the isocyanuric acid ester compounds were changed as shown in Table 1. The evaluation results are shown in Table 1.
比較例10
<銅合金金属箔基材でのリードフレームの作製>
厚さ150μmの銅合金基材に、比較例5と同様に操作して作製した光重合層の厚さが25μmの積層フィルム−1を、その光重合性樹脂層が基材に面するように105℃で両面をラミネートした。次に、光重合性樹脂積層体のベースフィルム上にリードフレームパターン(208ピン)を有するネガフィルムマスクを両面から上下一致するように重ね、真空にして両者を密着させ、露光量60mJ/cm2 で露光した。その後ベースフィルムを剥離除去して、現像液として1%炭酸ナトリウム水溶液(液温30℃)を用いて現像し、リードフレームパターンを形成した。
Comparative Example 10
<Fabrication of lead frame using copper alloy metal foil substrate>
A 150 μm thick copper alloy substrate was laminated on both sides at 105° C. with a photopolymerizable layer of 25 μm thick, prepared in the same manner as in Comparative Example 5 , with the photopolymerizable resin layer facing the substrate. Next, a negative film mask having a lead frame pattern (208 pins) was placed on both sides of the base film of the photopolymerizable resin laminate so that the top and bottom were aligned, and the two were brought into close contact under vacuum, followed by exposure at an exposure dose of 60 mJ/cm 2. The base film was then peeled off and removed, and the substrate was developed using a 1% aqueous sodium carbonate solution (liquid temperature 30° C.) as a developer to form a lead frame pattern.
比較例11
比較例1で作成したドライフィルムレジストを使用する以外は、比較例10と同様に操作してリードフレームを作成した。得られたリードフレームを電子顕微鏡により目視観察したところ、インナーリード部分のレジストラインの欠落・浮きや光重合性樹脂層と銅合金基材との界面から過度のエッチング液の浸食が観察された。
Comparative Example 11
A lead frame was produced in the same manner as in Comparative Example 10, except for using the dry film resist produced in Comparative Example 1. When the obtained lead frame was visually observed under an electron microscope, chipping and lifting of the resist line in the inner lead portion and excessive erosion by the etching solution from the interface between the photopolymerizable resin layer and the copper alloy substrate were observed.
Claims (1)
(b)少なくとも二つの末端エチレン不飽和基を持つ光重合性モノマー、5〜60重量部
(c)活性光線の照射により遊離ラジカルを発生する光重合開始剤、0.01〜20重量部
(d)ロイコ系染料、0.1〜5重量部
(e)下記式(A)で示されるイソシアヌル酸エステル化合物よりなる群から選ばれる一種以上の化合物、1〜40重量部
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26513397A JP3980132B2 (en) | 1997-09-12 | 1997-09-12 | Photopolymerizable resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26513397A JP3980132B2 (en) | 1997-09-12 | 1997-09-12 | Photopolymerizable resin composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH1184672A JPH1184672A (en) | 1999-03-26 |
| JPH1184672A5 true JPH1184672A5 (en) | 2005-06-16 |
| JP3980132B2 JP3980132B2 (en) | 2007-09-26 |
Family
ID=17413086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26513397A Expired - Lifetime JP3980132B2 (en) | 1997-09-12 | 1997-09-12 | Photopolymerizable resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3980132B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6630242B1 (en) * | 1999-07-30 | 2003-10-07 | Dsm N.V. | Radiation-curable composition with simultaneous color formation during cure |
| JP2007333900A (en) * | 2006-06-13 | 2007-12-27 | Hitachi Chem Co Ltd | Photosensitive colored resin composition and color filter using the same, color display device, color liquid crystal display device, colored image formation method, and method of manufacturing color filter |
-
1997
- 1997-09-12 JP JP26513397A patent/JP3980132B2/en not_active Expired - Lifetime
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