JPS4632550Y1 - - Google Patents
Info
- Publication number
- JPS4632550Y1 JPS4632550Y1 JP1968068024U JP6802468U JPS4632550Y1 JP S4632550 Y1 JPS4632550 Y1 JP S4632550Y1 JP 1968068024 U JP1968068024 U JP 1968068024U JP 6802468 U JP6802468 U JP 6802468U JP S4632550 Y1 JPS4632550 Y1 JP S4632550Y1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1968068024U JPS4632550Y1 (ja) | 1968-08-08 | 1968-08-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1968068024U JPS4632550Y1 (ja) | 1968-08-08 | 1968-08-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4632550Y1 true JPS4632550Y1 (ja) | 1971-11-10 |
Family
ID=42893225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1968068024U Expired JPS4632550Y1 (ja) | 1968-08-08 | 1968-08-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4632550Y1 (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60254643A (ja) * | 1984-05-31 | 1985-12-16 | Toshiba Corp | 樹脂封止型半導体装置 |
| JP2014207278A (ja) * | 2013-04-11 | 2014-10-30 | アンデン株式会社 | 電気機器装置 |
| WO2024190399A1 (ja) * | 2023-03-15 | 2024-09-19 | 住友電気工業株式会社 | 半導体装置 |
-
1968
- 1968-08-08 JP JP1968068024U patent/JPS4632550Y1/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60254643A (ja) * | 1984-05-31 | 1985-12-16 | Toshiba Corp | 樹脂封止型半導体装置 |
| JP2014207278A (ja) * | 2013-04-11 | 2014-10-30 | アンデン株式会社 | 電気機器装置 |
| WO2024190399A1 (ja) * | 2023-03-15 | 2024-09-19 | 住友電気工業株式会社 | 半導体装置 |