JPS49105489A - - Google Patents

Info

Publication number
JPS49105489A
JPS49105489A JP48014731A JP1473173A JPS49105489A JP S49105489 A JPS49105489 A JP S49105489A JP 48014731 A JP48014731 A JP 48014731A JP 1473173 A JP1473173 A JP 1473173A JP S49105489 A JPS49105489 A JP S49105489A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48014731A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48014731A priority Critical patent/JPS49105489A/ja
Publication of JPS49105489A publication Critical patent/JPS49105489A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • H10W72/921Structures or relative sizes of bond pads
    • H10W72/922Bond pads being integral with underlying chip-level interconnections
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/90Bond pads, in general
    • H10W72/931Shapes of bond pads
    • H10W72/934Cross-sectional shape, i.e. in side view

Landscapes

  • Bipolar Transistors (AREA)
  • Wire Bonding (AREA)
JP48014731A 1973-02-07 1973-02-07 Pending JPS49105489A (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP48014731A JPS49105489A (2) 1973-02-07 1973-02-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48014731A JPS49105489A (2) 1973-02-07 1973-02-07

Publications (1)

Publication Number Publication Date
JPS49105489A true JPS49105489A (2) 1974-10-05

Family

ID=11869260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48014731A Pending JPS49105489A (2) 1973-02-07 1973-02-07

Country Status (1)

Country Link
JP (1) JPS49105489A (2)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5472466U (2) * 1977-10-31 1979-05-23
JPS5643175U (2) * 1979-09-12 1981-04-20
JPH03229457A (ja) * 1990-02-05 1991-10-11 Matsushita Electron Corp 半導体集積回路装置およびその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4530332Y1 (2) * 1967-06-19 1970-11-20

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4530332Y1 (2) * 1967-06-19 1970-11-20

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5472466U (2) * 1977-10-31 1979-05-23
JPS5643175U (2) * 1979-09-12 1981-04-20
JPH03229457A (ja) * 1990-02-05 1991-10-11 Matsushita Electron Corp 半導体集積回路装置およびその製造方法

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