JPS4944673A - - Google Patents

Info

Publication number
JPS4944673A
JPS4944673A JP48060984A JP6098473A JPS4944673A JP S4944673 A JPS4944673 A JP S4944673A JP 48060984 A JP48060984 A JP 48060984A JP 6098473 A JP6098473 A JP 6098473A JP S4944673 A JPS4944673 A JP S4944673A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48060984A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4944673A publication Critical patent/JPS4944673A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/70Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77Auxiliary members characterised by their shape
    • H10W40/778Auxiliary members characterised by their shape in encapsulations

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
JP48060984A 1972-06-14 1973-06-01 Pending JPS4944673A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US26284872A 1972-06-14 1972-06-14

Publications (1)

Publication Number Publication Date
JPS4944673A true JPS4944673A (de) 1974-04-26

Family

ID=22999323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48060984A Pending JPS4944673A (de) 1972-06-14 1973-06-01

Country Status (9)

Country Link
JP (1) JPS4944673A (de)
AU (1) AU467287B2 (de)
CA (1) CA974664A (de)
CH (1) CH557128A (de)
ES (1) ES415871A1 (de)
FR (1) FR2196570B1 (de)
GB (1) GB1416205A (de)
IT (1) IT981607B (de)
SE (1) SE401767B (de)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1414836A (fr) * 1963-08-08 1965-10-22 Ibm Composants fonctionnels
US3484534A (en) * 1966-07-29 1969-12-16 Texas Instruments Inc Multilead package for a multilead electrical device
FR1534329A (fr) * 1966-08-16 1968-07-26 Signetics Corp Procédé de montage de circuits intégrés

Also Published As

Publication number Publication date
CA974664A (en) 1975-09-16
DE2329052A1 (de) 1973-12-20
AU5695073A (en) 1974-12-19
AU467287B2 (en) 1975-11-27
FR2196570A1 (de) 1974-03-15
CH557128A (de) 1974-12-13
FR2196570B1 (de) 1976-11-12
IT981607B (it) 1974-10-10
GB1416205A (en) 1975-12-03
SE401767B (sv) 1978-05-22
DE2329052B2 (de) 1977-02-17
ES415871A1 (es) 1976-02-01

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