JPS4959042A - - Google Patents
Info
- Publication number
- JPS4959042A JPS4959042A JP10209572A JP10209572A JPS4959042A JP S4959042 A JPS4959042 A JP S4959042A JP 10209572 A JP10209572 A JP 10209572A JP 10209572 A JP10209572 A JP 10209572A JP S4959042 A JPS4959042 A JP S4959042A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10209572A JPS5343890B2 (ja) | 1972-10-12 | 1972-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10209572A JPS5343890B2 (ja) | 1972-10-12 | 1972-10-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4959042A true JPS4959042A (ja) | 1974-06-07 |
| JPS5343890B2 JPS5343890B2 (ja) | 1978-11-24 |
Family
ID=14318205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10209572A Expired JPS5343890B2 (ja) | 1972-10-12 | 1972-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5343890B2 (ja) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4301196A (en) * | 1978-09-13 | 1981-11-17 | Kollmorgen Technologies Corp. | Electroless copper deposition process having faster plating rates |
| JPS6452081A (en) * | 1987-05-08 | 1989-02-28 | Nippon Denso Co | Chemical copper plating solution and its plating method |
| JPH01168871A (ja) * | 1986-11-06 | 1989-07-04 | Nippon Denso Co Ltd | 化学銅めっき液及びそれを用いた銅めっき皮膜の形成方法 |
| JPH0230770A (ja) * | 1988-07-20 | 1990-02-01 | Nippon Denso Co Ltd | 化学銅めっき液及びそれを用いた銅めっき皮膜の形成方法 |
| JPH036383A (ja) * | 1989-06-02 | 1991-01-11 | Nippondenso Co Ltd | 化学銅めっき液 |
-
1972
- 1972-10-12 JP JP10209572A patent/JPS5343890B2/ja not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4301196A (en) * | 1978-09-13 | 1981-11-17 | Kollmorgen Technologies Corp. | Electroless copper deposition process having faster plating rates |
| JPH01168871A (ja) * | 1986-11-06 | 1989-07-04 | Nippon Denso Co Ltd | 化学銅めっき液及びそれを用いた銅めっき皮膜の形成方法 |
| JPS6452081A (en) * | 1987-05-08 | 1989-02-28 | Nippon Denso Co | Chemical copper plating solution and its plating method |
| JPH0230770A (ja) * | 1988-07-20 | 1990-02-01 | Nippon Denso Co Ltd | 化学銅めっき液及びそれを用いた銅めっき皮膜の形成方法 |
| JPH036383A (ja) * | 1989-06-02 | 1991-01-11 | Nippondenso Co Ltd | 化学銅めっき液 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5343890B2 (ja) | 1978-11-24 |